JP2000223876A5 - - Google Patents
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- JP2000223876A5 JP2000223876A5 JP1999021297A JP2129799A JP2000223876A5 JP 2000223876 A5 JP2000223876 A5 JP 2000223876A5 JP 1999021297 A JP1999021297 A JP 1999021297A JP 2129799 A JP2129799 A JP 2129799A JP 2000223876 A5 JP2000223876 A5 JP 2000223876A5
- Authority
- JP
- Japan
- Prior art keywords
- housing
- circuit board
- exhaust passage
- intake passage
- fan
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 description 14
- 238000001816 cooling Methods 0.000 description 6
- 238000000638 solvent extraction Methods 0.000 description 3
- 238000007664 blowing Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Description
【特許請求の範囲】
【請求項１】 筐体と、
上記筐体に収容され、この筐体の内部を吸気通路と排気通路とに仕切る回路基板と、
上記回路基板のうち、上記吸気通路又は上記排気通路の少なくともいずれか一方に面する側に設けられた発熱体と、
上記筐体に収容され、上記吸気通路に連なる吸込口および上記排気通路に連なる送風口を有するとともに、これら吸気通路および排気通路に空気を流通させるファン装置と、
を備えていることを特徴とする電子機器。
【請求項２】 請求項１の記載において、上記回路基板は、上記吸気通路又は上記排気通路の少なくともいずれか一方に向けて突出する放熱突起を有することを特徴とする電子機器。
【請求項３】 請求項２の記載において、上記回路基板は、上記吸気通路側に位置する第１の面と、上記排気通路側に位置する第２の面とを有し、これら第１の面および第２の面の少なくともいずれか一方にパッドが形成されているとともに、上記放熱突起は、上記パッドに半田付けすることで上記回路基板に面実装されていることを特徴とする電子機器。
【請求項４】 請求項１の記載において、上記ファン装置は、上記吸込口と上記送風口とを有するファンケーシングと、このファンケーシングに収容されるファンとを有し、
上記ファン装置と上記回路基板とは、上記筐体の内部において互いに並べて配置されていることを特徴とする電子機器。
【請求項５】 請求項１の記載において、上記発熱体は、ヒートシンクに熱的に接続されていることを特徴とする電子機器。
【請求項６】 筐体と、
上記筐体に収容され、上記筐体の内部を吸気通路と排気通路とに仕切る回路基板と、
上記回路基板のうち、上記吸気通路又は上記排気通路のいずれか一方に面する表面に実装された発熱体と
上記筐体の内部において上記回路基板と並べて配置され、上記吸気通路に連なる吸込口および上記排気通路に連なる送風口を有するケーシングと、このケーシングの内部に設けられるファンとを有し、上記吸込口および上記送風口を介して上記吸気通路および上記排気通路に空気を流通させるファン装置と、
を備えていることを特徴とする電子機器。
【請求項７】 請求項６の記載において、上記発熱体に熱的に接続されるヒートシンクをさらに備えており、
上記発熱体は、上記回路基板の上記排気通路側に位置する面に実装され、上記ヒートシンクは、上記発熱体に熱的に接続される受熱部と、この受熱部から上記ファン装置に向って延びる導風ガイドとを有し、この導風ガイドは、上記ファン装置の送風口と向かい合うことを特徴とする電子機器。
【請求項８】 請求項１又は請求項６の記載において、上記筐体は、上記吸気通路に連なる吸気口と、上記排気通路に連なる排気口と、を備えていることを特徴とする電子機器。
[Claims]
And 1. A casing,
A circuit board housed in the above housing and partitioning the inside of the housing into an intake passage and an exhaust passage ,
Of the circuit board, and a heating element provided on at least the side facing the one of the intake passage or the exhaust passage,
Housed in the housing, and having a suction port and blow port communicating with the exhaust passage communicating with the intake passage, and a fan device for circulating the air in the intake and exhaust passages,
An electronic device characterized by being equipped with.
2. A device according to claim 1, said circuit board, electronic apparatus characterized by having a heat dissipation protrusions protruding toward the at least one of the intake passage or the exhaust passage.
3. A device according to claim 2, said circuit board has a first surface located on the intake passage side and a second surface located on the exhaust passage side, the first of these An electronic device characterized in that a pad is formed on at least one of a surface and a second surface, and the heat radiation protrusion is surface-mounted on the circuit board by soldering to the pad.
4. In the description of claim 1, the fan device has a fan casing having the suction port and the air outlet, and a fan housed in the fan casing .
An electronic device characterized in that the fan device and the circuit board are arranged side by side inside the housing.
5. The electronic device according to claim 1, wherein the heating element is thermally connected to a heat sink.
6. A casing,
Housed in the housing, a circuit board for partitioning the interior of the housing into an intake passage and an exhaust passage,
Of the circuit board, inside the heating element and the housing that is mounted on either one face surface of the intake passage or the exhaust passage are disposed side by side with the circuit board, inlet connected to the intake passage and A fan device having a casing having an air outlet connected to the exhaust passage and a fan provided inside the casing, and allowing air to flow to the intake passage and the exhaust passage through the suction port and the air outlet. ,
An electronic device characterized by being equipped with.
7. The heat sink according to claim 6 is further provided, which is thermally connected to the heating element.
The heating body is mounted on a surface located on the exhaust passage side of the circuit board, the heat sink includes a heat receiving portion that will be thermally connected to the heating body, extending toward from the heat receiving portion to the fan device and a air guide, the air guide is an electronic device, characterized in that faces the air blowing port of the fan device.
8. The electronic device according to claim 1 or 6, wherein the housing includes an intake port connected to the intake passage and an exhaust port connected to the exhaust passage. ..
本発明は、このような事情にもとづいてなされたもので、ファン装置に吸入される空気およびファン装置から吐出される空気を利用して回路基板や発熱体を冷却することができ、発熱体の冷却効率を高めることができる電子機器の提供を目的とする。 The present invention has been made based on such circumstances, and the circuit board and the heating element can be cooled by using the air sucked into the fan device and the air discharged from the fan device, and the heating element can be cooled. The purpose is to provide electronic devices that can improve cooling efficiency.
【００１１】
【課題を解決するための手段】
上記目的を達成するため、本発明の一つの形態に係る電子機器は、
筐体と、
上記筐体に収容され、この筐体の内部を吸気通路と排気通路とに仕切る回路基板と、
上記回路基板のうち、上記吸気通路又は上記排気通路の少なくともいずれか一方に面する側に設けられた発熱体と、
上記筐体に収容され、上記吸気通路に連なる吸込口および上記排気通路に連なる送風口を有するとともに、これら吸気通路および排気通路に空気を流通させるファン装置と、
を備えていることを特徴としている。
0011
[Means for solving problems]
In order to achieve the above object, the electronic device according to one embodiment of the present invention is
A housing,
A circuit board housed in the above housing and partitioning the inside of the housing into an intake passage and an exhaust passage ,
Of the circuit board, and a heating element provided on at least the side facing the one of the intake passage or the exhaust passage,
Housed in the housing, and having a suction port and blow port communicating with the exhaust passage communicating with the intake passage, and a fan device for circulating the air in the intake and exhaust passages,
It is characterized by having.
このような構成によれば、筐体の吸気通路を流れる空気と、筐体の排気通路を流れる空気との双方を発熱体や回路基板の冷却用として利用することができる。したがって、格別なヒートパイプを付加したりファン装置の回転数を増大させることなく、発熱体の冷却効率を高めることができる。 According to such a configuration, the air flowing through the intake passage of the housing, Ru can be used both with the air flowing through the exhaust passage of the housing for cooling of the heating element and the circuit board. Therefore, the cooling efficiency of the heating element can be improved without adding a special heat pipe or increasing the rotation speed of the fan device.
筐体４の上壁９は、パームレスト１３とキーボード装着口１４とを有している。パームレスト１３は、上壁９の前半部において筐体４の幅方向に延びている。キーボード装着口１４は、図２に示すように、パームレスト１３の後方において筐体４の内部に向けて開口されており、このキーボード装着口１４にキーボード１５が配置されている。 The upper wall 9 of the housing 4 has a palm rest 13 and a keyboard mounting port 14. The palm rest 13 extends in the width direction of the housing 4 at the front half of the upper wall 9. As shown in FIG. 2, the keyboard mounting port 14 is opened behind the palm rest 13 toward the inside of the housing 4, and the keyboard 15 is arranged in the keyboard mounting port 14.
このような構成のポータブルコンピュータ１において、ＭＰＵ３２のＩＣチップ３４が発熱すると、このＩＣチップ３４の熱の一部は、回路基板３０への熱伝導によりこの回路基板３０全体に拡散される。また、ＩＣチップ３４の熱の一部は、座部４６の受熱面６０を経て受熱部５５に伝えられるとともに、この受熱部５５から導風ガイド５４への熱伝導によりヒートシンク５３全体に拡散される。 In the portable computer 1 having such a configuration, when the IC chip 34 of the MPU 32 generates heat, a part of the heat of the IC chip 34 is diffused to the entire circuit board 30 by heat conduction to the circuit board 30. Further, a part of the heat of the IC chip 34 is transferred to the heat receiving portion 55 through the heat receiving surface 60 of the seat portion 46, and is diffused to the entire heat sink 53 by heat conduction from the heat receiving portion 55 to the air guide 54. ..
このような本発明の第１の実施の形態によると、ＭＰＵ３２が実装された回路基板３０は、筐体４の内部を吸気通路３６と排気通路３７とに上下に仕切っており、この吸気通路３６にファン装置４３に向けて吸い込まれる冷却用空気の流れが形成されるとともに、排気通路３７には、ファン装置４３から吐出された冷却用空気の流れが形成される。 According to the first embodiment of the present invention as described above, in the circuit board 30 on which the MPU 32 is mounted, the inside of the housing 4 is divided into an intake passage 36 and an exhaust passage 37 in the upper and lower directions, and the intake passage 36 is divided into upper and lower parts. A flow of cooling air sucked toward the fan device 43 is formed, and a flow of cooling air discharged from the fan device 43 is formed in the exhaust passage 37.
【００６６】
【発明の効果】
以上詳述した本発明によれば、格別なヒートシンクを付加したりファン装置の回転数を増大させることなく、発熱体の冷却効率を高めることができ、発熱体の動作環境を適正に保つことができる。
[0066]
【Effect of the invention】
According to the present invention described in detail above , the cooling efficiency of the heating element can be increased without adding a special heat sink or increasing the rotation speed of the fan device, and the operating environment of the heating element can be maintained appropriately. it can.
【符号の説明】
４…筐体、３０…回路基板、３２…発熱体（ＭＰＵ）、３６…吸気通路、３７…排気通路、４３…ファン装置、４４…ケーシング（ファンケーシング）、４５…ファン、５０…吸込口、５１…送風口。
[Explanation of symbols]
4 ... Housing, 30 ... Circuit board, 32 ... Heating element (MPU), 36 ... Intake passage, 37 ... Exhaust passage, 43 ... Fan device, 44 ... Casing (fan casing), 45 ... Fan, 50 ... Suction port, 51 ... Blower.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11021297A JP2000223876A (en) | 1999-01-29 | 1999-01-29 | Electronic apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11021297A JP2000223876A (en) | 1999-01-29 | 1999-01-29 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000223876A JP2000223876A (en) | 2000-08-11 |
| JP2000223876A5 true JP2000223876A5 (en) | 2005-12-02 |
Family
ID=12051222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11021297A Pending JP2000223876A (en) | 1999-01-29 | 1999-01-29 | Electronic apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000223876A (en) |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002102500A (en) * | 2000-10-02 | 2002-04-09 | Heiwa Corp | Game machine |
| JP4675666B2 (en) * | 2005-04-15 | 2011-04-27 | 株式会社東芝 | Electronics |
| JP4607170B2 (en) * | 2007-12-17 | 2011-01-05 | 富士通株式会社 | Electronics |
| US8705233B2 (en) * | 2008-03-29 | 2014-04-22 | Dell Products L.P. | System and method for portable information handling system thermal shield |
| US8553409B2 (en) * | 2008-06-27 | 2013-10-08 | Dell Products L.P. | System and method for portable information handling system parallel-wall thermal shield |
| JP5299205B2 (en) * | 2009-10-01 | 2013-09-25 | 株式会社デンソー | Electronic device and its cooling device |
| JP4892078B2 (en) | 2010-05-11 | 2012-03-07 | 株式会社東芝 | Electronics |
| JP4823374B1 (en) * | 2010-05-11 | 2011-11-24 | 株式会社東芝 | Electronics |
| US8953313B2 (en) * | 2010-09-24 | 2015-02-10 | Intel Corporation | Method and apparatus for enhanced cooling of mobile computing device surfaces |
| JP7440622B2 (en) * | 2020-04-28 | 2024-02-28 | 日立Astemo株式会社 | electronic control unit |
-
1999
- 1999-01-29 JP JP11021297A patent/JP2000223876A/en active Pending
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