JP2000243277A - Gastight container and manufacture of the gastight container - Google Patents

Abstract

PROBLEM TO BE SOLVED: To accurately perform sealing of the upper and lower plates of a gastight container and to perform efficiency production to increase the throughput of manufacturing. SOLUTION: In this manufacturing method of a gastight container that is made to face a first and second boards 271, 273 to each other at a prescribed distance and seals them by using a sealing material, each one side of multiple thin plates 2 is bonded to the first board 271 by the use of an adhesive 3a, 3c, a seating on which each of other one sides of the thin plates abuts is bonded to the second board 273 by the use of an adhesive 4a, 4c, horizontal positioning of the first and second boards is carried out, and thereafter, the other one sides of the thin plates are tentatively bonded to the abutting parts of the seating by the use of a resin adhesive 5a, 5c and thereafter bonded by the use of a heat-resistant adhesive 23a, 23c, the temperature is raised to the melting temperature of the sealing member, the first and second boards are pressed and the temperature is lowered.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an airtight container and a method for manufacturing an airtight container, and more particularly to a method for manufacturing an airtight container suitably used for manufacturing an airtight container for a flat panel display and an airtight container using the same. About.

[0002]

2. Description of the Related Art Image display devices using electron beams include:
For example, an electron emission source for generating an electron beam is provided in a vacuum vessel sandwiched between a face plate (substrate) and a rear plate (substrate), and the electron beam emitted from the electron emission source is accelerated to irradiate a phosphor. Accordingly, a thin flat-panel image display device that emits light to display an image has been developed.

FIG. 11 is an exploded schematic view showing the structure of an image display device, and FIGS. 12 (a) and 12 (b) are views showing a state where the image display device shown in FIG. 11 is assembled.
12A is a perspective view, and FIG. 12B is a side view.

[0004] In FIG. 11, an image display device has a face plate 271 in which red, blue, and green luminous bodies 271c for displaying an image are formed on a surface facing an electron emission source.
And the rear plate 27 on which the electron emission source 273c is formed.
3, the face plate 271, and the rear plate 2
An outer frame 272 made of hollow glass, for example, constitutes a vacuum container sandwiched between 73. Further, in order to prevent the vacuum vessel from being destroyed due to the atmospheric pressure applied to the vacuum vessel, a spacer 74 shown in FIG.
May be placed.

A luminous body 271 is provided on the face plate 271.
Alignment marks 271a and 271b for matching the positional relationship between the electron emission source 273c and the electron emission source 273c are formed, and the alignment mark 273 is similarly formed on the rear plate 273.
a, 273b are formed. Note that these alignment marks are provided by the light emitting body 271c and the electron emission source 273.
It is formed at a position that does not interfere with c.

[0008] The fusion surfaces 272 a and 27 of the outer frame 272 in contact with the face plate 271 and the rear plate 273.
Frit glass 272c, 272d is applied to 2b in advance, and pre-baked. In addition, the face plate 271, the outer frame 272, and the rear plate 273 are made of blue plate glass of the same material having the same coefficient of thermal expansion.

[0007]

In such a configuration, as shown in FIGS. 12A and 12B, a face plate 271 and a rear plate 273 are formed by an outer frame 272.
Frit glass 272c, 272d applied to both sides of
Respectively to form a sealed container. At this time, the alignment marks 271a of the face plate 271 and the alignment marks 273a of the rear plate 273, and the alignment marks 271b of the face plate 271 and the alignment marks 273b of the rear plate 273 are arranged so as to have a predetermined positional relationship. Light emitting body 271c and electron emission source 27
The relationship of 3c is accurately positioned. This prevents color shifts and uneven brightness of characters and images. In addition,
Generally, frit glass is in a solidified state at room temperature (room temperature), and is often in a molten state at 400 ° C. or higher. Therefore, in order to fuse each glass with the frit glass, a temperature cycle of raising and lowering the temperature is required.

Further, in order to ensure airtightness as a vacuum vessel, frit glass 272 applied to outer frame 272 is required.
It is required to apply a load and crush the c and 272d in a molten state.

The frit glass 272c, 2 is attached to the outer frame 272.
In a state where 72d is applied and pre-baked, the frit glasses 272c and 272d are raised in a convex state.
Therefore, when the outer frame and the spacer are at the same height, the gap between the lower end of the spacer 74 and the upper surface of the rear plate 273 rises to the melting (softening) temperature of the frit, and the frit glass of 272c, 272d It is required that a load be applied between the plates 271 and 273 in a molten state (the frit glass does not become watery even when melted and has viscosity) to crush the frit glass. The lower end of the spacer 74 contacts the upper surface of the rear plate 273 by crushing. The frit glass 272c, 272d spreads over the upper and lower surfaces 272a, 272b of the outer frame 272, and
The state of (b) is reached, and the airtightness is ensured.

In this case, the squash (Z
Direction; vertical direction), and the horizontal position (x, y, θ) of the face plate 271 and the face plate 273 must be maintained.

A conventional method of manufacturing an image display apparatus in which a plurality of plates are aligned and assembled is disclosed in Japanese Patent Application Laid-Open No. 58-2.
There is a method proposed in Japanese Patent No. 14245. These publications disclose a method of aligning a plurality of plates constituting a flat panel image display device with holes formed in the plates and positioning pins. However, in the method of performing alignment using the positioning pin, due to the hole of the plate and the accuracy of the positioning pin,
There was a problem that the alignment accuracy was deteriorated.

Further, there is a problem that the sliding between the pin and the hole is bad and the frit cannot be lowered in the Z direction for crushing.

In addition, alignment between a rear plate on which an electron emission source is formed and a face plate as a display surface is performed.
A method of performing alignment using a microscope or the like so that alignment marks formed outside the effective surface of the image display match can be considered, but in the method of performing alignment using alignment marks, a microscope is used for alignment. After heating at room temperature for sealing (bonding) with frit glass, the plates 271 and 273 are displaced in the horizontal direction (x, y, θ) due to the thermal expansion (about 1 mm) of the plate. There was a case where it would wake up.

[0014]

The method of manufacturing an airtight container according to the present invention is directed to a method of manufacturing an airtight container in which a first substrate and a second substrate are opposed to each other at a predetermined interval and sealed using a sealing material. Bonding one side of the plurality of thin plates to the first substrate with an adhesive, and bonding a pedestal on which the other side of the thin plate abuts to the second substrate with an adhesive; After performing the horizontal alignment of the substrate, the other side of the thin plate and the corresponding portion of the pedestal are temporarily joined with a resin adhesive, and then permanently fixed with a heat-resistant adhesive, and the sealing is performed. The temperature is raised to the melting temperature of the material, and the first and second substrates are pressurized to lower the temperature.

Further, the method for producing an airtight container of the present invention comprises the following steps:
And a method for manufacturing an airtight container in which a second substrate is opposed at a predetermined interval and sealed using a sealing material, wherein one side of the plurality of thin plates is temporarily joined to the first substrate with a resin adhesive, The pedestal where the other side of the thin plate is in contact with the second substrate is temporarily fixed with a resin adhesive, and is permanently fixed with a heat-resistant adhesive. After performing horizontal alignment of the substrate, the other side of the thin plate and the abutting portion of the pedestal are temporarily joined with a resin adhesive, and then permanently fixed with a heat-resistant adhesive, and the sealing is performed. The temperature is raised to the melting temperature of the adhesive, and the first and second substrates are pressurized and cooled.

The airtight container of the present invention is manufactured by the method for manufacturing an airtight container of the present invention.

FIG. 1 shows a method of manufacturing an airtight container according to the present invention.
When described using, the plates 271 and 273
It has elasticity in the downward direction (vertical direction) and horizontal (x, y,
In the direction θ), glass or metal thin plates 1 a, 1 b, 1 c, 1 d having a fixed function are joined via a pedestal 2. After the joining, the temperature is raised to a temperature (for example, 400 ° C.) at which the frit glasses 272c and 272d are melted (softened), pressurized and cooled, and sealing is performed.

According to the above-described manufacturing method, even when heating at the time of sealing, the relative position between the face plate and the rear plate is displaced in the x, y, and θ (horizontal) directions while being positioned at room temperature. Nothing. Further, since the thin plate is allowed to move in the Z (vertical) direction, the above-described frit can be crushed, and as a result, an airtight used as a flat panel display or the like which is positioned and sealed with high precision can be obtained. A container is made.

The manufacturing method of the present invention comprises the first and second methods.
Is used to manufacture an airtight container for sealing a substrate and a support frame held between the first and second substrates by using a sealing material, and the use of the flat panel display is not particularly limited. For example, it can be suitably used for an image display device, a plasma display device, a fluorescent display tube and the like using an electron-emitting device described later as an electron-emitting source.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(First Embodiment) FIG. 1 is an explanatory view showing a method of manufacturing an airtight container of the present invention. FIG. 1 (a) is a perspective view,
FIG. 1B is a sectional view. In the drawing, reference numeral 271 denotes a face plate made of glass, 273 denotes a rear plate made of glass, 272 denotes an outer frame, and 74 denotes a spacer.

1a, 1b, 1c, 1d are thin plates having a thickness,
The width, length, and material are appropriately set depending on the size of the airtight container to be manufactured. For example, the thickness t = 0.05 to 0.2 m
m, a width of 10 to 20 mm, and a length of 20 to 50 mm, and glass or metal ceramics is suitably used. In this embodiment, a soda lime glass having t = 0.1 mm, width 20 mm, and length 50 mm was used. In addition, the number of thin plates is appropriately set according to the size of the airtight container to be manufactured.

The thin plates 1a to 1d were previously bonded to the outer periphery of the face plate 271 at two to four places with an adhesive. FIG.
In (a), 3a, 3b, 3c, 3d are thin plates 1a,
1 shows an adhesive portion for bonding 1b, 1c, 1d. FIG.
(A) shows a perspective view thereof. 2a, 2b, 2c, and 2d are pedestal blocks (higher than the outer frame, and 6 mm in height in the present embodiment) with which the thin plates 1a, 1b, 1c, and 1d abut, and are made of glass (or a metal or metal similar to a thin plate). Ceramics), which is previously bonded to the rear plate 273 (FIG. 2).
(C)). In FIG. 2C, 4a, 4b, 4c, 4
"d" indicates an adhesive portion for bonding the pedestal blocks 2a, 2b, 2c and 2d. The pedestal block according to the present embodiment is made of soda lime glass like a thin plate.

FIG. 2 (a) shows a face plate + thin plate, FIG. 2 (b) shows an outer frame + (frit), FIG. 2 (c)
The rear plate + pedestal block shown in FIG. 12 is aligned with the alignment marks 271a, 271b, 273a, 273 shown in FIG.
According to b, the alignment is performed by the apparatus of FIG. 3 at room temperature.
Then, the pedestal blocks 2a, 2b, 2c, 2d and the thin plate 1
a, 1b, 1c, 1d are adhered and fixed (FIG. 4).
Thereafter, the frit is melted and fixed (400 ° C. in this example) by the apparatus shown in FIG. In this manufacturing process, the following conditions are satisfied.

(1). The adhesive used for joining the thin plate 1 and the pedestal 2 is a frit melting temperature (400 ° C. in this embodiment).
A heat-resistant adhesive that can provide adhesive strength.

(2). The thin plate 1 is composed of plates 271 and 27
Consider the dimensional change due to thermal expansion at the melting temperature of No. 3 and the frit (400 ° C. in this example) and the dimensional change due to crushing of the frit thickness (2 mm in this example). When the thin plate 1 is long and slack, the horizontal accuracy is deteriorated, and when the thin plate 1 is short, the adhesive is peeled off or the thin plate 1 is damaged.

With respect to the condition (1), the following measures can be taken.

The use of a ceramics adhesive as a heat-resistant adhesive is a countermeasure. In this case, a ceramic adhesive having a certain degree of thermal expansion with the plates 271 and 273 to be joined is used. This is because the relative position adjusted at room temperature may be shifted or the bonding may be peeled off due to the difference in thermal expansion. Next, the hardening of the ceramic adhesive is performed by half-curing by natural drying and main curing (in the present embodiment, 150 ° C., 1 hour). The semi-curing by natural drying generally requires several hours, and the bonding strength is weak. Therefore, if the alignment is performed by the alignment device (FIG. 3) using a ceramic adhesive after alignment, the device is occupied for several hours. This is disadvantageous for mass production.

Therefore, it is more efficient to temporarily fix the plate and the thin plate with another adhesive that can withstand the main curing temperature of the ceramic adhesive (150 ° C. in this embodiment) and cures quickly.

Therefore, it is preferable to perform temporary fixing within a few seconds by applying a UV adhesive and irradiating UV light after alignment by the alignment apparatus shown in FIG. After temporarily fixing with a UV adhesive, the plate is removed from the alignment device shown in FIG. 3, the ceramic adhesive is applied at a temporary place, and a large number of batch adhesives are put into a batch type furnace, and full curing is performed at 150 ° C. for one hour. By doing so, it can respond to mass production.

With respect to the condition (2), the following measures can be taken.

The coefficient of thermal expansion of the glass plate of the soda lime glass used in this embodiment is 85 × 10 ^-7 . The length of the free portion of the thin plate 1 is 40 mm in this embodiment (see FIG. 2).
(A)). The frit glass used is a low-melting frit glass that melts at 400 ° C. Temperature change is room temperature (20
° C) to 400 ° C, which is a rise of 380 ° C. At this time, the thermal expansion amount of the thin plate 1 is 40 mm × 85 × 10 ⁻⁷ × 3.
There is a thermal expansion of 80 ° C. = 0.129 mm to 0.129 mm. Since the coefficient of thermal expansion of stainless steel or the like is 200 × 10 ^−7, 40 × 200 × 10 ⁻⁷ × 380 ° C. = 0.304 mm, and 0.304−0.129 = 0.175 mm.
The 75 mm thin plate becomes longer and sags. as a result,
The fixing force in the horizontal direction is lost, and the accuracy is deteriorated. Therefore, it is desirable to use a thin plate of an alloy, ceramics, or glass having the same expansion coefficient as the members (glass in this embodiment) used for the face plate and the rear plate. In this embodiment, the same blue glass sheet as the plates 271 and 273 was used.

In this embodiment, the face plate 271 made of glass and the thin plate 1 shown in FIG. 2 (a) are adhered by a ceramic adhesive in a separate step and have been fully cured in advance. The rear plate 273 and the pedestal 2 were also bonded with a ceramic adhesive, and were fully cured. However, in both of these steps, after temporarily fixing with a UV adhesive, a ceramic adhesive may be applied again and fully cured. The apparatus used in this embodiment for aligning the plates 271 and 273 will be described below with reference to FIG.

In FIG. 3, reference numeral 10 denotes an assembling / joining apparatus;
Is a stand. Reference numeral 12 denotes a Z table which is installed above the gantry 11 and moves the vacuum hand 13 up and down. The vacuum hand 13 vacuum sucks the face plate 271. Reference numeral 14 denotes an x, y, θ table which is installed on the gantry 11, and the upper surface of which is a table on which a rear plate 273 is placed. Reference numerals 15a and 15b denote CCD cameras for recognizing images of the alignment marks 271a, 271b, 273a and 273b. Reference numerals 16a to 16d denote dispensers for applying the UV adhesive, which are installed on the bars 17a and 17b and are mounted on the forward stages 18a and 18b. 22a-2
2d is a UV fiber for UV irradiation.

The operation of the above device will be described below. FIG.
The face plate 271 to which the thin plate is adhered is manually sucked to the vacuum hand 13.

The rear plate 273 to which the pedestal block shown in FIG. 2C is adhered is placed on the x, y, θ table 14. The outer frame 272 of FIG. 2B is placed on the rear plate 273.
Thus, the setting of the work is completed, and the joining controller 21 is automatically operated. The Z table 12 is lowered to a position where the thin plate 1 contacts the pedestal block 2, and the alignment marks 271a and 271b of the face plate 271 are
Read by CD cameras 15a and 15b.

Next, the alignment marks 273a and 273b of the rear plate 273 are transferred to the CCD cameras 15a and 15b.
Read in.

The image controller 20 calculates the amount of displacement, and the joining controller 21 moves the x, y, θ table 14 to align the face plate 271 and the rear plate 273. After alignment is completed,
From the joining controller 21, the forward stages 18a, 1
8b is issued a forward command via the coating controller 19, and the UV adhesive dispensers 16a, 16b, 16
The needle tips c and 16d advance near the thin plates 1a, 1b, 1c and 1d, and retreat after applying the UV adhesive. When UV light is irradiated from the UV fibers 22a, 22b, 22c and 22d, the UV adhesives 5a, 5b, 5c and 5d are solidified, and the temporary fixing of the face plate 271 and the rear plate 273 is completed.

FIG. 4 is a sectional view showing this state. The thin plate 1 is bonded to the pedestal block 2 with a UV adhesive 5. Also, frit glass 272c and 272d applied to outer frame 272 in advance have a convex shape. The face plate 271 includes an outer frame 272, a frit glass 272c,
272d, or may be supported by the thin plate 1 and have a clearance between the convex portion of the frit glass 272c and the face plate 271. When a spacer is used, it is bonded to the face plate in advance similarly to the bonding of a thin plate. However, the bonding of the spacer to the face plate is performed by using amorphous frit glass having a higher softening temperature than frit glass of 272c and 272d or crystalline frit glass. In the present embodiment, the bonding was performed using crystalline frit glass. The lower end of the spacer 74 and the upper surface of the rear plate 273
The gap is made.

Thereafter, the suction of the vacuum hand 13 of the assembling and joining apparatus 10 is stopped, and the Z axis of the Z table 12 is raised. The work 200 is taken out, and ceramic adhesives 23a, 23b, 23c and 23d are applied in another process.
A large number of works 200 are put in a curing furnace (not shown),
Full curing in 1 hour. The work 200 is taken out, and FIG.
The frit bonding is performed in the firing furnace shown in FIG. Reference numeral 30 denotes a firing furnace main body, reference numeral 34 denotes a firing furnace controller, reference numeral 31 denotes a pressurizing weight 40 kg.

The work 200 is put into the firing furnace 30, and
The temperature is raised from room temperature (10 ° C./min). At 400 ° C., the frit glasses 272c and 272d melt. During this time, the plates 271 and 273 thermally expand (about 1 mm). However, due to the bonding between the thin plate 1 and the pedestal block 2, the horizontal (x, y,
Since θ) is constrained, the position does not shift.

After the inside of the furnace reaches a temperature at which the frit glass melts (400 ° C. in this example), the pressurizing weight 31 is lowered to the face plate 271 by the elevating device 32 and pressurized. The frit glass 272c, 272d is crushed by pressurization, and covers the upper and lower surfaces of the outer frame evenly.
This is shown in FIG.

At this time, the thin plate 1 is elastically deformed upward and downward, the gap ΔZ as shown in FIG. 4 is eliminated, and the spacer 74 is in contact with the upper surface of the rear plate 273. Thereafter, the temperature is lowered to harden the frit glass and is taken out at room temperature.

Thus, the upper and lower plates 271 and 271
While keeping the position of 73, the frit 272c, 272d
To produce a flat display with high vacuum tightness.

Next, another embodiment of the present invention is shown in FIG.

In the embodiment described above, the UV adhesive for temporary fixing of the thin plate 1 to the pedestal 2 and the ceramic adhesive for permanent fixing are located at the same position, but the ceramic adhesive for permanent fixing is replaced with the UV adhesive. Adhesion strength is more stable when applied to different positions.

Therefore, in this embodiment, new pedestal blocks 25a and 25b are provided, and the thin plates 26a and 26b
Temporarily fix with UV adhesives 27a, 27b, and separate from pedestal blocks 2a, 2b, 2c, 2d. As a result, the pedestals 25a and 25b and the thin plates 26a and 26b are temporarily fixed with UV adhesives 27a and 27b, and the thin plate 1
a, 1b, 1c, 1d and pedestal blocks 2a, 2b, 2
c and 2d are ceramic adhesives 23a, 23b and 23
The main fixing is performed in steps c and 23d.

As shown in FIG. 7, the pedestal block 2 and the thin plate 1 are fixed a little longer in the longitudinal direction, and a portion 5a is temporarily fixed with a UV adhesive, and a portion 23a is permanently fixed with a ceramic adhesive. The location may be divided.

Examples of the electron emission source that can be used in the above-mentioned image display device include a surface conduction electron-emitting device (hereinafter referred to as a surface conduction electron-emitting device), a field emission device (hereinafter referred to as an FE device), Metal / insulating layer / metal-type emission element (hereinafter referred to as MIM type) or the like can be used. However, since the present invention can be used for a method for manufacturing an airtight container in which substrates are opposed to each other and sealed using a sealing material, in addition to an image display device using an electron-emitting device as an electron-emitting source, a plasma display device And a fluorescent display tube.

As the surface conduction type emission element, for example,
MIElinson, Radio Eng. Electron Phys., 10, 1290, (196
5) and other examples described later are known.

The surface conduction electron-emitting device utilizes the phenomenon that electron emission occurs when a current flows in a small-area thin film formed on a substrate in parallel with the film surface. As this surface conduction type emission element, Sn described by Elinson et al.
In addition to those using O ₂ thin films, those using Au thin films [G.
Dittmer: “Thin Solid Films”, 9,317 (1972)]
₂ O ₃ / SnO ₂ thin film [M. Hartwell and C.
G. Fonstad: “IEEE Trans. ED Conf.”, 519 (1975)], and those using carbon thin films [Hisashi Araki et al .: Vacuum, Vol. 26, No. 1, 22 (1983)], etc., have been reported. .

FIG. 8 shows a plan view of a device by M. Hartwell et al. As a typical example of the device configuration of these surface conduction electron-emitting devices. In the figure, 3001 is a substrate,
Reference numeral 3004 denotes a conductive thin film made of a metal oxide formed by sputtering. The conductive thin film 3004 is H
It is formed in the shape of a letter. The conductive thin film 300
The electron emission portion 3005 is formed by applying an energization process called energization forming to be described later. The interval L in the figure is 0.5-1 [mm], and W is 0.1 [mm].
Is set with Note that, for convenience of illustration, the electron emitting unit 3
Although 005 is shown in a rectangular shape at the center of the conductive thin film 3004, this is a schematic shape, and does not faithfully represent the actual position or shape of the electron-emitting portion.

In the above-described surface conduction electron-emitting device including the device by M. Hartwell et al., An electron-emitting portion 3005 is formed by applying an energization process called energization forming to the conductive thin film 3004 before electron emission. Was common. That is, energization forming means that a constant DC voltage is applied to both ends of the conductive thin film 3004,
Alternatively, a current is applied by applying a direct current voltage that is boosted at a very slow rate of, for example, about 1 V / min, and locally destroys, deforms, or alters the conductive thin film 3004, and the electrons in an electrically high resistance state That is, forming the emission part 3005. Note that a crack is generated in a part of the conductive thin film 3004 that is locally broken, deformed, or altered. After the energization forming, the conductive thin film 3004
When an appropriate voltage is applied to the above, electrons are emitted in the vicinity of the crack.

Examples of the FE type are, for example, WPDyke &
WWDolan, “Field emission”, Advance in Electron Ph
ysics, 8, 89 (1956) or CASpindt, “Physica
lproperties of thin-film field emission cathodes w
ith molybdenium cones ", J. Appl. Phys., 47, 5248 (1976)
Etc. are known.

FIG. 9 is a cross-sectional view of a device according to CASpindt et al. Described above as a typical example of the FE type device configuration. In the figure, reference numeral 3010 denotes a substrate; 3011, an emitter wiring made of a conductive material; 3012, an emitter cone;
13 is an insulating layer and 3014 is a gate electrode. The present device applies an appropriate voltage between the emitter cone 3012 and the gate electrode 3014, thereby forming the emitter cone 3
Field emission is caused from the tip of the 012.

As another element structure of the FE type, FIG.
There is also an example in which an emitter and a gate electrode are arranged on a substrate almost in parallel with the substrate plane instead of the laminated structure as described above.

Examples of the MIM type include, for example, C.I.
A. Mead, “Operation of tunnel-emission Devices, J. Ap
pl.Phys., 32, 646 (1961). FIG. 10 shows a typical example of the MIM type element configuration. The figure is a sectional view, in which 3020 is a substrate, 3021 is a lower electrode made of a metal, 3022 is a thin insulating layer having a thickness of about 100 Å, and 3023 is an upper layer made of a metal having a thickness of about 80 to 300 Å. Electrodes. MI
In the M-type, by applying an appropriate voltage between the upper electrode 3023 and the lower electrode 3021, electrons are emitted from the surface of the upper electrode 3023.

The above-mentioned surface conduction type emission device has a particularly simple structure and is easy to manufacture among cold cathode devices.
There is an advantage that a large number of elements can be formed over a large area. Therefore, for example, as disclosed in Japanese Patent Application Laid-Open No. 64-31332 by the present applicant, a method for arranging and driving a large number of elements has been studied.

For applications of the surface conduction electron-emitting device, for example, image forming apparatuses such as image display apparatuses and image recording apparatuses, charged beam sources, and the like have been studied. In particular, as an application to an image display device, for example, as disclosed in U.S. Pat.No. 5,066,883, Japanese Unexamined Patent Application Publication No. 2-257551 and Japanese Unexamined Patent Application Publication No. An image display device using a combination of a phosphor and a phosphor that emits light by irradiation with an electron beam has been studied. An image display device using a combination of a surface conduction electron-emitting device and a phosphor is expected to have better characteristics than other conventional image display devices. For example, compared to a liquid crystal display device that has become widespread in recent years, it can be said that it is superior in that it does not require a backlight because it is a self-luminous type and that it has a wide viewing angle.

A method of driving a plurality of FE types in a row is disclosed in, for example, US Pat. No. 4,904,895 by the present applicant. As an example of applying the FE type to an image display device, for example, a flat panel display device [R. Meyer: “Recent Development on Micr” reported by R. Meyer et al.
o-tips Display at LETI ", Tech.Digest of 4th Int.Vac
uum Microelectronics Conf., Nagahama, pp. 6-9 (199
1)] is known.

An example in which a number of MIM types are arranged and applied to an image display device is disclosed in, for example, Japanese Patent Application Laid-Open No.
No. 738.

Among the image forming apparatuses using the above-described electron-emitting devices, a flat display device having a small depth has attracted attention as a replacement for a cathode ray tube display device because of its space saving and light weight. .

[0063]

As described above, according to the present invention,
In sealing the upper and lower plates of the airtight container, at room temperature,
Align the upper and lower plates with high precision, temporarily fix with a resin adhesive such as UV adhesive, and permanently fix with a heat-resistant adhesive.
Even when heated to the melting temperature of the sealing material, the position does not shift due to thermal expansion.In addition, since the upper and lower plates are fixed with thin plates, the sealing material is crushed while maintaining the horizontal position. In addition, the container can be moved in the upward and downward directions to ensure airtightness of a high vacuum in the airtight container, and to perform sealing while keeping the horizontal position with high accuracy. In addition, there is an effect that the occupation time of the expensive alignment apparatus can be reduced to several seconds and the production throughput can be increased and efficient production can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view and a sectional view showing a structure of a flat display according to the present invention.

FIG. 2 is an exploded view of a flat display according to the present invention.

FIG. 3 is a perspective view showing a flat display assembling / joining apparatus according to the present invention;

FIG. 4 is an assembly view of a flat display according to the present invention;

FIG. 5 is a schematic perspective view showing a sealing furnace.

FIG. 6 is a diagram showing another embodiment according to the present invention.

FIG. 7 is a diagram showing still another embodiment according to the present invention.

FIG. 8 is a plan view showing a device configuration example of a surface conduction electron-emitting device.

FIG. 9 is a cross-sectional view illustrating an example of an FE-type element configuration.

FIG. 10 is a cross-sectional view illustrating an example of a configuration of an MIM-type element.

FIG. 11 is an exploded view of a flat display.

FIG. 12 is a perspective view and a sectional view of a flat display.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Thin plate 2 Pedestal block 3, 4 Ceramics adhesive 5 UV adhesive 10 Assembling and joining apparatus 11 Mount 12 Z table 13 Vacuum hand 14 x, y, theta table 15 CCD camera 16 UV adhesive dispenser 17 Adhesive table 18 Advance stage 19 Coating controller 20 Image controller 21 Assembly controller 22 UV light source fiber 23 Ceramic adhesive 30 Firing furnace 31 Weight 32 Weight applying mechanism 34 Firing controller 74 Spacer 271 Face plate 272 Outer frame 273 Rear plate

Claims (7)

[Claims] 1. A method for manufacturing an airtight container in which a first substrate and a second substrate are opposed to each other at a predetermined interval and sealed using a sealing material, wherein one side of a plurality of thin plates is attached to the first substrate with an adhesive. And a pedestal on which the other side of the thin plate is in contact with the second substrate is bonded with an adhesive, and the first and second substrates are aligned in the horizontal direction. Temporarily joined one side of the pedestal and the corresponding portion of the pedestal with a resin adhesive, then permanently fixed with a heat-resistant adhesive, heated to the melting temperature of the sealing material,
A method for manufacturing an airtight container in which the first and second substrates are pressurized and cooled. 2. A method for manufacturing an airtight container in which a first substrate and a second substrate are opposed to each other at a predetermined interval and sealed using a sealing material, wherein one side of the plurality of thin plates is bonded to the first substrate with a resin adhesive. And temporarily fixed with a heat-resistant adhesive, temporarily bonded with a resin adhesive a pedestal with which the other side of the thin plate is in contact with the second substrate, and permanently fixed with a heat-resistant adhesive. After the horizontal alignment of the first and second substrates is performed, another side of the thin plate is temporarily bonded to a corresponding portion of the pedestal with a resin adhesive. A method for manufacturing an airtight container, wherein the temperature is raised to the melting temperature of the sealing material, the first and second substrates are pressurized, and the temperature is lowered. 3. The airtight container according to claim 1, wherein the resin adhesive is a UV adhesive, and the heat resistant adhesive is a ceramic adhesive. Manufacturing method. 4. The method for manufacturing an airtight container according to claim 1, wherein the thin plate has a thermal expansion coefficient substantially equal to a thermal expansion coefficient of the first and second substrates. Method. 5. The method for manufacturing an airtight container according to claim 1, wherein the thin plate is made of an alloy, ceramics, or glass. 6. The method for manufacturing an airtight container according to claim 1 or 2, wherein the other side of the thin plate and the abutment portion of the pedestal are bonded to a resin bonding portion for the temporary bonding. A method for manufacturing an airtight container, wherein a heat-resistant bonding part for the main fixing is different from the above. 7. An airtight container manufactured by the method for manufacturing an airtight container according to claim 1.