IT1156375B - High speed plating of planar workpieces - Google Patents
High speed plating of planar workpiecesInfo
- Publication number
- IT1156375B IT1156375B IT67807/82A IT6780782A IT1156375B IT 1156375 B IT1156375 B IT 1156375B IT 67807/82 A IT67807/82 A IT 67807/82A IT 6780782 A IT6780782 A IT 6780782A IT 1156375 B IT1156375 B IT 1156375B
- Authority
- IT
- Italy
- Prior art keywords
- receptacle
- workpieces
- plated
- high speed
- soln
- Prior art date
Links
- 238000007747 plating Methods 0.000 title abstract 2
- 238000009713 electroplating Methods 0.000 abstract 2
- 239000002184 metal Substances 0.000 abstract 1
- 238000005507 spraying Methods 0.000 abstract 1
Landscapes
- Electroplating Methods And Accessories (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Electroplating appts. comprises workpiece-supporting racks which are transported along a path through a receptacle contg. an electrolytic soln. A pressure manifold is provided at the bottom of the receptacle and supplies nozzle defining towers for spraying soln. onto the surfaces of the workpieces. Plating metal is supported in the receptacle adjacent the transport path. Used electroplating flat planar workpieces for PCB's. Cu can be plated in holes in the printed circuit boards to a thickness at least approx. equal to that of the Cu plated on the planar surface portions.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/277,192 US4378282A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
US06/277,191 US4394241A (en) | 1981-06-25 | 1981-06-25 | High speed plating of flat planar workpieces |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8267807A0 IT8267807A0 (en) | 1982-06-24 |
IT1156375B true IT1156375B (en) | 1987-02-04 |
Family
ID=26958359
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT67807/82A IT1156375B (en) | 1981-06-25 | 1982-06-24 | High speed plating of planar workpieces |
Country Status (1)
Country | Link |
---|---|
IT (1) | IT1156375B (en) |
-
1982
- 1982-06-24 IT IT67807/82A patent/IT1156375B/en active
Also Published As
Publication number | Publication date |
---|---|
IT8267807A0 (en) | 1982-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
HK1002869A1 (en) | Printed circuit board manufacture | |
GB1247991A (en) | Improvements in the electroless metallizing of substrates | |
EP0177686A3 (en) | Process for bonding metals to electrophoretically deposited coatings, and printed circuit with plated through holes produced thereby | |
DE3864526D1 (en) | GALVANIZATION DEVICE FOR PANEL-SHAPED WORKPIECES, ESPECIALLY PCB. | |
IT1156375B (en) | High speed plating of planar workpieces | |
DE3568594D1 (en) | Method for plating from an electroless plating bath | |
GB2069905B (en) | Method of soldering connection pins on carrier strips to printed circuit boards and a dip soldering bath for performing this method | |
MY110114A (en) | Printed wiring board | |
IL85006A0 (en) | Methods for removing stringers appearing in plated through-holes in copper-containing multi-layer printed wiring boards | |
JPS57157173A (en) | Electronic watch | |
DE3563075D1 (en) | Process for maintaining the solderability of lead-tin coatings, and plated holes printed circuit board | |
JPS57200598A (en) | Plating apparatus | |
GB2017416A (en) | Circuit board manufacturing method | |
Jawitz et al. | Operation of Copper Pyrophosphate Circuit-Board Plating Baths at High Additive Concentrations | |
Bunning | Metal electrodeposition using continuous, horiztontal plant. The basics | |
IES950715A2 (en) | A printed circuit board production process | |
Pellegrino | Electroforming Circuit Board Process | |
Vidal | Preparation of Multilayer Circuit Boards Before Metallization With a Thick Electroless Copper Deposit | |
Muller | Electrodeposition of copper by pulse plating | |
GB829263A (en) | Method of making printed circuits | |
JPS5763693A (en) | Partial plating method | |
GB1531454A (en) | Electroplated copper foil | |
JPS6453592A (en) | Conductive substrate for transfer of conductor circuit | |
Hosten | Apparatus for Electroplating Plate-Like Workpieces, Particularly Circuit Boards | |
Denys | Continuous vertical plant for metal electrodeposition |