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MY110114A - Printed wiring board - Google Patents

Printed wiring board

Info

Publication number
MY110114A
MY110114A MYPI93001901A MYPI19931901A MY110114A MY 110114 A MY110114 A MY 110114A MY PI93001901 A MYPI93001901 A MY PI93001901A MY PI19931901 A MYPI19931901 A MY PI19931901A MY 110114 A MY110114 A MY 110114A
Authority
MY
Malaysia
Prior art keywords
terminals
solder
wiring board
printed wiring
smd
Prior art date
Application number
MYPI93001901A
Inventor
Onodera Kiyotaka
Hara Saihei
Yamamoto Takeshi
Original Assignee
Victor Company Of Japan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Victor Company Of Japan filed Critical Victor Company Of Japan
Publication of MY110114A publication Critical patent/MY110114A/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

A PRINTED WIRING BOARD OF THE PRESENT INVENTION HAS A CONPONENT SIDE FOR MOUNTING ELECTRONIC DEVICES WITH TERMINALS BY CAUSING THE TERMINALS TO PROTRUDE THROUGH THROUGH HOLES PROVIDED IN THE PRINTED WIRING BOARD, AND A SOLDER SIDE HAVING CONDUCTIVE LANDS FOR SOLDERING THE TERMINALS OF THE ELECTRONIC DEVICES THEREON AND PLURALITY OF TERMINALS OF A SURFACE MOUNTED DEVICE (SMD) WHICH IS MOUNTED ON THE SOLDER SIDE. THE PRINTED WIRING BOARD IS TRANSFERRED IN A TRANSFERRING DIRECTION BY CAUSING THE SOLDER SIDE TO CONTACT WITH A MOLTEN SOLDER SPOUTING OUT OF A SOLDER NOZZLE IN A FLOW-SOLDER DEVICE IN A SOLDERING PROCESS. FURTHER, AT LEAST A DUMMY CONDUCTIVE LAND IS PROVIDED ON THE SOLDER SIDE OF THE PRINTED WIRING BOARD SO AS TO BE DISPOSED ADJACENT TO THE TERMINALS POSITIONED AT A TRAILING PORTION OF THE SMD WITH RESPECT TO THE TRANSFERRING DIRECTION AMONG THE PLURALITY OF TERMINALS OF THE SMD. FURTHERMORE, A 3-DIMENSIONAL STRUCTURE HAVING A WETTABILITY FOR THE MOLTEN SOLDER IS PROVIDED ON THE DUMMY LAND SO AS TO COLLECT THE SURPLUS MOLTEN SOLDER HAVING CONTACTED TO THE TERMINALS OF THE SMD.(FIG.6)
MYPI93001901A 1992-09-22 1993-09-20 Printed wiring board MY110114A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27783192 1992-09-22

Publications (1)

Publication Number Publication Date
MY110114A true MY110114A (en) 1998-01-27

Family

ID=17588879

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI93001901A MY110114A (en) 1992-09-22 1993-09-20 Printed wiring board

Country Status (4)

Country Link
JP (1) JPH06164120A (en)
KR (1) KR940008543A (en)
CN (1) CN1038807C (en)
MY (1) MY110114A (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3633505B2 (en) * 2001-04-27 2005-03-30 松下電器産業株式会社 Printed circuit board and printed circuit board soldering method
JP4670199B2 (en) * 2001-08-03 2011-04-13 富士電機システムズ株式会社 Mounting board and mounting method thereof
US7860378B2 (en) * 2005-01-18 2010-12-28 Hakko Corporation Baffle device, hot air blower for solder treatment, and nozzle for same
CN102744488A (en) * 2011-04-22 2012-10-24 鸿富锦精密工业（深圳）有限公司 Welding assisting device
JP6646841B2 (en) * 2015-11-20 2020-02-14 パナソニックＩｐマネジメント株式会社 Printed wiring board, power supply device, lighting fixture, and method of manufacturing power supply device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396072A (en) * 1989-09-07 1991-04-22 Tokyo Electric Co Ltd Multilevel image encoding system

Also Published As

Publication number Publication date
CN1089423A (en) 1994-07-13
CN1038807C (en) 1998-06-17
JPH06164120A (en) 1994-06-10
KR940008543A (en) 1994-04-29

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