IN2015DN02361A - - Google Patents
Info
- Publication number
- IN2015DN02361A IN2015DN02361A IN2361DEN2015A IN2015DN02361A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A IN 2361DEN2015 A IN2361DEN2015 A IN 2361DEN2015A IN 2015DN02361 A IN2015DN02361 A IN 2015DN02361A
- Authority
- IN
- India
- Prior art keywords
- copper
- aluminum
- intermetallic
- bonding
- interface
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/017—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of aluminium or an aluminium alloy, another layer being formed of an alloy based on a non ferrous metal other than aluminium
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/02—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating by means of a press ; Diffusion bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/22—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded
- B23K20/233—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer
- B23K20/2333—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating taking account of the properties of the materials to be welded without ferrous layer one layer being aluminium, magnesium or beryllium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/10—Aluminium or alloys thereof
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
- B23K2103/12—Copper or alloys thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/1266—O, S, or organic compound in metal component
- Y10T428/12667—Oxide of transition metal or Al
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Laminated Bodies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012208578 | 2012-09-21 | ||
| PCT/JP2013/075158 WO2014046130A1 (ja) | 2012-09-21 | 2013-09-18 | アルミニウム部材と銅部材との接合構造 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| IN2015DN02361A true IN2015DN02361A (de) | 2015-09-04 |
Family
ID=50341440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| IN2361DEN2015 IN2015DN02361A (de) | 2012-09-21 | 2013-09-18 |
Country Status (8)
| Country | Link |
|---|---|
| US (1) | US10011093B2 (de) |
| EP (1) | EP2898979B1 (de) |
| JP (1) | JP5549958B2 (de) |
| KR (1) | KR102051697B1 (de) |
| CN (1) | CN104661785B (de) |
| IN (1) | IN2015DN02361A (de) |
| TW (1) | TWI589382B (de) |
| WO (1) | WO2014046130A1 (de) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IN2015DN02361A (de) * | 2012-09-21 | 2015-09-04 | Mitsubishi Materials Corp | |
| IN2015DN03283A (de) | 2012-10-16 | 2015-10-09 | Mitsubishi Materials Corp | |
| JP6428327B2 (ja) * | 2015-02-04 | 2018-11-28 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板、パワーモジュール、及び、ヒートシンク付パワーモジュール用基板の製造方法 |
| JP6572810B2 (ja) * | 2016-03-15 | 2019-09-11 | 三菱マテリアル株式会社 | 接合体の製造方法、及び、パワーモジュール用基板の製造方法 |
| US9875933B2 (en) | 2016-06-24 | 2018-01-23 | Infineon Technologies Ag | Substrate and method including forming a via comprising a conductive liner layer and conductive plug having different microstructures |
| CN106077937B (zh) * | 2016-06-24 | 2018-08-03 | 西安理工大学 | 一种铝-铜双金属复合材料的制备方法 |
| US9960229B2 (en) | 2016-06-24 | 2018-05-01 | Infineon Technologies Ag | Semiconductor device including a LDMOS transistor |
| US10050139B2 (en) | 2016-06-24 | 2018-08-14 | Infineon Technologies Ag | Semiconductor device including a LDMOS transistor and method |
| US10622284B2 (en) * | 2016-06-24 | 2020-04-14 | Infineon Technologies Ag | LDMOS transistor and method |
| US10242932B2 (en) | 2016-06-24 | 2019-03-26 | Infineon Technologies Ag | LDMOS transistor and method |
| CN106475679B (zh) * | 2016-11-30 | 2018-07-27 | 山东大学 | 一种铜与铝合金的无中间层非连续加压真空扩散连接工艺 |
| CN106583914B (zh) * | 2016-12-23 | 2019-03-05 | 浙江康盛股份有限公司 | 一种铜铝连接件面-面渗溶接工艺 |
| KR101925119B1 (ko) * | 2016-12-23 | 2019-02-27 | 저지앙 캉성 컴퍼니 리미티드 | 구리 알루미늄 연결부재의 면-면 삼투용접 공정 및 제조방법 |
| JP6819385B2 (ja) * | 2017-03-17 | 2021-01-27 | 三菱マテリアル株式会社 | 半導体装置の製造方法 |
| WO2018180159A1 (ja) * | 2017-03-29 | 2018-10-04 | 三菱マテリアル株式会社 | ヒートシンク付き絶縁回路基板の製造方法 |
| JP6972627B2 (ja) * | 2017-04-05 | 2021-11-24 | 株式会社アイシン | カーボンナノチューブ複合体の製造方法及び積層体 |
| US11322424B2 (en) * | 2018-03-28 | 2022-05-03 | Mitsubishi Materials Corporation | Insulation circuit board with heat sink |
| JP7342371B2 (ja) * | 2019-02-14 | 2023-09-12 | 三菱マテリアル株式会社 | 絶縁回路基板、及び、絶縁回路基板の製造方法 |
| JP2022169003A (ja) | 2021-04-27 | 2022-11-09 | 三菱マテリアル株式会社 | ヒートシンク、および、ヒートシンク一体型絶縁回路基板 |
| TWI800244B (zh) * | 2022-01-28 | 2023-04-21 | 奇鋐科技股份有限公司 | 具有熱管之散熱器總成 |
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| JPH04315524A (ja) | 1991-04-10 | 1992-11-06 | Kobe Steel Ltd | 銅材とアルミニウム材との接合用部材及びその製造方法 |
| JP3240211B2 (ja) | 1993-04-12 | 2001-12-17 | 旭化成株式会社 | 銅−アルミニウム異種金属継手材 |
| TW252061B (en) | 1994-07-20 | 1995-07-21 | Dong-Hann Chang | Process of undergoing diffusion bonding under low pressure |
| JPH08255973A (ja) | 1995-03-17 | 1996-10-01 | Toshiba Corp | セラミックス回路基板 |
| US6033787A (en) | 1996-08-22 | 2000-03-07 | Mitsubishi Materials Corporation | Ceramic circuit board with heat sink |
| US6124635A (en) | 1997-03-21 | 2000-09-26 | Honda Giken Kogyo Kabushiki Kaisha | Functionally gradient integrated metal-ceramic member and semiconductor circuit substrate application thereof |
| JPH11156995A (ja) | 1997-09-25 | 1999-06-15 | Daido Steel Co Ltd | クラッド板とこれを用いた電池用ケース並びにこれらの製造方法 |
| JP3752830B2 (ja) | 1998-03-31 | 2006-03-08 | マツダ株式会社 | 接合金属部材及び該部材の接合方法 |
| JP2001148451A (ja) | 1999-03-24 | 2001-05-29 | Mitsubishi Materials Corp | パワーモジュール用基板 |
| JP2001252772A (ja) | 2000-03-10 | 2001-09-18 | Showa Denko Kk | アルミニウム−銅クラッド材およびその製造方法 |
| JP2002064169A (ja) | 2000-08-21 | 2002-02-28 | Denki Kagaku Kogyo Kk | 放熱構造体 |
| JP2002203942A (ja) | 2000-12-28 | 2002-07-19 | Fuji Electric Co Ltd | パワー半導体モジュール |
| JP2002231865A (ja) | 2001-02-02 | 2002-08-16 | Toyota Industries Corp | ヒートシンク付絶縁基板、接合部材及び接合方法 |
| JP2003078086A (ja) * | 2001-09-04 | 2003-03-14 | Kubota Corp | 半導体素子モジュール基板の積層構造 |
| JP2003092383A (ja) | 2001-09-19 | 2003-03-28 | Hitachi Ltd | パワー半導体装置およびそのヒートシンク |
| JP2003258170A (ja) | 2002-02-26 | 2003-09-12 | Akane:Kk | ヒートシンク |
| JP3917503B2 (ja) | 2002-04-05 | 2007-05-23 | 住友精密工業株式会社 | アルミニウム部材と銅部材の接合方法及びその接合構造物 |
| TW540298B (en) | 2002-09-04 | 2003-07-01 | Loyalty Founder Entpr Co Ltd | Composite board forming method for heat sink |
| JP3938079B2 (ja) | 2003-03-20 | 2007-06-27 | 三菱マテリアル株式会社 | パワーモジュール用基板の製造方法 |
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| KR101108454B1 (ko) | 2004-04-05 | 2012-01-31 | 미쓰비시 마테리알 가부시키가이샤 | Ａｌ／ＡｌＮ 접합체, 전력 모듈용 기판 및 전력 모듈, 그리고 Ａｌ／ＡｌＮ 접합체의 제조 방법 |
| JP2006100770A (ja) | 2004-09-01 | 2006-04-13 | Toyota Industries Corp | 回路基板のベース板の製造方法及び回路基板のベース板並びにベース板を用いた回路基板 |
| JP4759384B2 (ja) | 2005-12-20 | 2011-08-31 | 昭和電工株式会社 | 半導体モジュール |
| JP5518339B2 (ja) * | 2007-10-25 | 2014-06-11 | 三菱レイヨン株式会社 | スタンパとその製造方法、成形体の製造方法、およびスタンパ用のアルミニウム原型 |
| JP5067187B2 (ja) | 2007-11-06 | 2012-11-07 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びヒートシンク付パワーモジュール |
| JP4747315B2 (ja) | 2007-11-19 | 2011-08-17 | 三菱マテリアル株式会社 | パワーモジュール用基板及びパワーモジュール |
| JP5163199B2 (ja) | 2008-03-17 | 2013-03-13 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板及びヒートシンク付パワーモジュール |
| JP2010034238A (ja) * | 2008-07-28 | 2010-02-12 | Shin Kobe Electric Mach Co Ltd | 配線板 |
| JP2010137251A (ja) | 2008-12-11 | 2010-06-24 | Mitsubishi Electric Corp | 金属接合体およびその製造方法 |
| US8159821B2 (en) | 2009-07-28 | 2012-04-17 | Dsem Holdings Sdn. Bhd. | Diffusion bonding circuit submount directly to vapor chamber |
| KR101690820B1 (ko) | 2009-09-09 | 2016-12-28 | 미쓰비시 마테리알 가부시키가이샤 | 히트 싱크 부착 파워 모듈용 기판의 제조 방법, 히트 싱크 부착 파워 모듈용 기판 및 파워 모듈 |
| JP4971524B2 (ja) | 2009-10-26 | 2012-07-11 | 株式会社Ｎｅｏｍａｘマテリアル | アルミニウム接合合金、その合金で形成された接合合金層を有するクラッド材及びアルミニウム接合複合材 |
| CN102742008B (zh) | 2010-02-05 | 2015-07-01 | 三菱综合材料株式会社 | 功率模块用基板及功率模块 |
| KR101276496B1 (ko) | 2010-06-08 | 2013-06-18 | 가부시키가이샤 네오맥스 마테리아르 | 알루미늄 구리 클래드재 |
| CN101947689B (zh) | 2010-09-21 | 2012-10-03 | 河南科技大学 | 铜铝复合板的连续复合成形方法及其复合成形装置 |
| DE102010041714A1 (de) | 2010-09-30 | 2011-08-25 | Infineon Technologies AG, 85579 | Leistungshalbleitermodul und Verfahren zur Herstellung eines Leistungshalbleitermoduls |
| JP5736807B2 (ja) | 2011-02-02 | 2015-06-17 | 三菱マテリアル株式会社 | ヒートシンク付パワーモジュール用基板、ヒートシンク付パワーモジュール用基板の製造方法及びパワーモジュール |
| JP5403129B2 (ja) | 2012-03-30 | 2014-01-29 | 三菱マテリアル株式会社 | パワーモジュール用基板、ヒートシンク付パワーモジュール用基板、パワーモジュール、及びパワーモジュール用基板の製造方法 |
| IN2015DN02361A (de) | 2012-09-21 | 2015-09-04 | Mitsubishi Materials Corp |
-
2013
- 2013-09-18 IN IN2361DEN2015 patent/IN2015DN02361A/en unknown
- 2013-09-18 JP JP2013193431A patent/JP5549958B2/ja active Active
- 2013-09-18 TW TW102133870A patent/TWI589382B/zh active
- 2013-09-18 EP EP13839672.6A patent/EP2898979B1/de active Active
- 2013-09-18 KR KR1020157004288A patent/KR102051697B1/ko active IP Right Grant
- 2013-09-18 CN CN201380048500.6A patent/CN104661785B/zh active Active
- 2013-09-18 US US14/428,776 patent/US10011093B2/en active Active
- 2013-09-18 WO PCT/JP2013/075158 patent/WO2014046130A1/ja active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20150251382A1 (en) | 2015-09-10 |
| JP5549958B2 (ja) | 2014-07-16 |
| EP2898979B1 (de) | 2019-03-06 |
| KR102051697B1 (ko) | 2019-12-03 |
| CN104661785B (zh) | 2017-05-03 |
| CN104661785A (zh) | 2015-05-27 |
| US10011093B2 (en) | 2018-07-03 |
| TW201433392A (zh) | 2014-09-01 |
| WO2014046130A1 (ja) | 2014-03-27 |
| JP2014076486A (ja) | 2014-05-01 |
| TWI589382B (zh) | 2017-07-01 |
| EP2898979A4 (de) | 2016-06-08 |
| EP2898979A1 (de) | 2015-07-29 |
| KR20150056534A (ko) | 2015-05-26 |
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