GB1411599A - Device for making and testing electrical connections - Google Patents
Device for making and testing electrical connectionsInfo
- Publication number
- GB1411599A GB1411599A GB5970972A GB5970972A GB1411599A GB 1411599 A GB1411599 A GB 1411599A GB 5970972 A GB5970972 A GB 5970972A GB 5970972 A GB5970972 A GB 5970972A GB 1411599 A GB1411599 A GB 1411599A
- Authority
- GB
- United Kingdom
- Prior art keywords
- board
- studs
- boards
- probe
- raised portions
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/02—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for soldered or welded connections
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0053—Soldering by means of radiant energy soldering by means of I.R.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manufacturing Of Electrical Connectors (AREA)
Abstract
1411599 Connecting and testing miniature circuit boards MISHIMA KOSAN CO Ltd 27 Dec 1972 [31 Dec 1971] 59709/72 Heading G1U [Also in Division B3] In an apparatus for connecting and testing two miniature circuit boards 17, 17', Fig. 12, by a coupling board 39, the circuit boards 17, 17' carrying raised studs 18, Fig. 7, which have to be mated with, and soldered to, corresponding studs 39a on the coupling board 39, first an element 13, Fig. 4, carrying a series of raised portions 19, Fig. 5, at its end 13a, alternate ones of the raised portions 19 being electrically connected together and to the two pins 14A of a plug 14, is clamped with its raised portions in contact with the studs 18 of one of the boards 17, 17', and the plug 14 is inserted into a socket 15, Fig. 1, so connected that if a connection exists (because of a fault in the board) between the two pins 14A a lamp 16 is lit, secondly if the test just described is passed by both boards 17, 17', the coupling board 39 is correctly positioned (test probe 13 having been removed of course) above the boards 17, 17' with solder between the studs, and heat is applied from an infrared source moved over the board to melt the solder and effect the required connection, and thirdly and finally, a common terminal (not shown) on board 17' and a probe 40, Fig. 1 are connected into one arm of a bridge 45 and the probe 40 is moved across the faned-out terminals 79, Fig. 10, of an intermediate connecting board 70, 77, connected to the board 17 so that if any of the soldered connections has an excessively high or low resistance one of two indicating lamps 56, 57 is lit.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP47000825A JPS4873785A (en) | 1971-12-31 | 1971-12-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1411599A true GB1411599A (en) | 1975-10-29 |
Family
ID=11484415
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB5970972A Expired GB1411599A (en) | 1971-12-31 | 1972-12-27 | Device for making and testing electrical connections |
Country Status (5)
Country | Link |
---|---|
US (1) | US3868488A (en) |
JP (1) | JPS4873785A (en) |
CA (1) | CA977832A (en) |
DE (1) | DE2263231A1 (en) |
GB (1) | GB1411599A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2157006A (en) * | 1984-04-05 | 1985-10-16 | Int Computers Ltd | Testing printed circuit board assemblies |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4268739A (en) * | 1978-03-09 | 1981-05-19 | United Wiring & Manufacturing Co. | Automated wiring apparatus |
US4356384A (en) * | 1980-03-03 | 1982-10-26 | Arnon Gat | Method and means for heat treating semiconductor material using high intensity CW lamps |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3289046A (en) * | 1964-05-19 | 1966-11-29 | Gen Electric | Component chip mounted on substrate with heater pads therebetween |
BE757111A (en) * | 1969-10-07 | 1971-03-16 | Western Electric Co | PROCESS FOR HANDLING MICROBUSH DEVICES AT A TEST STATION |
-
1971
- 1971-12-31 JP JP47000825A patent/JPS4873785A/ja active Pending
-
1972
- 1972-12-23 DE DE2263231A patent/DE2263231A1/en active Pending
- 1972-12-27 GB GB5970972A patent/GB1411599A/en not_active Expired
- 1972-12-29 US US319713A patent/US3868488A/en not_active Expired - Lifetime
- 1972-12-29 CA CA160,240A patent/CA977832A/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2157006A (en) * | 1984-04-05 | 1985-10-16 | Int Computers Ltd | Testing printed circuit board assemblies |
Also Published As
Publication number | Publication date |
---|---|
CA977832A (en) | 1975-11-11 |
DE2263231A1 (en) | 1973-07-12 |
JPS4873785A (en) | 1973-10-04 |
US3868488A (en) | 1975-02-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed [section 19, patents act 1949] | ||
PLNP | Patent lapsed through nonpayment of renewal fees |