FR2949776B1 - Element en couches pour l'encapsulation d'un element sensible - Google Patents
Element en couches pour l'encapsulation d'un element sensibleInfo
- Publication number
- FR2949776B1 FR2949776B1 FR0956207A FR0956207A FR2949776B1 FR 2949776 B1 FR2949776 B1 FR 2949776B1 FR 0956207 A FR0956207 A FR 0956207A FR 0956207 A FR0956207 A FR 0956207A FR 2949776 B1 FR2949776 B1 FR 2949776B1
- Authority
- FR
- France
- Prior art keywords
- encapsulating
- layered
- sensitive
- sensitive element
- layered element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/02—Pretreatment of the material to be coated
- C23C16/0227—Pretreatment of the material to be coated by cleaning or etching
- C23C16/0245—Pretreatment of the material to be coated by cleaning or etching by etching with a plasma
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/22—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of inorganic material, other than metallic material
- C23C16/30—Deposition of compounds, mixtures or solid solutions, e.g. borides, carbides, nitrides
- C23C16/34—Nitrides
- C23C16/345—Silicon nitride
-
- G02B1/105—
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/111—Anti-reflection coatings using layers comprising organic materials
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/11—Anti-reflection coatings
- G02B1/113—Anti-reflection coatings using inorganic layer materials only
- G02B1/115—Multilayers
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
- G02B1/14—Protective coatings, e.g. hard coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/042—PV modules or arrays of single PV cells
- H01L31/048—Encapsulation of modules
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02S—GENERATION OF ELECTRIC POWER BY CONVERSION OF INFRARED RADIATION, VISIBLE LIGHT OR ULTRAVIOLET LIGHT, e.g. USING PHOTOVOLTAIC [PV] MODULES
- H02S40/00—Components or accessories in combination with PV modules, not provided for in groups H02S10/00 - H02S30/00
- H02S40/20—Optical components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/86—Arrangements for improving contrast, e.g. preventing reflection of ambient light
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/52—PV systems with concentrators
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Inorganic Chemistry (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Plasma & Fusion (AREA)
- Photovoltaic Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Laminated Bodies (AREA)
Priority Applications (9)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0956207A FR2949776B1 (fr) | 2009-09-10 | 2009-09-10 | Element en couches pour l'encapsulation d'un element sensible |
PCT/EP2010/062999 WO2011029787A1 (fr) | 2009-09-10 | 2010-09-03 | Élément stratifié pour encapsulation d'un élément sensible |
EP10747904A EP2476147A1 (fr) | 2009-09-10 | 2010-09-03 | Élément stratifié pour encapsulation d'un élément sensible |
JP2012528331A JP5607166B2 (ja) | 2009-09-10 | 2010-09-03 | 感受性要素を封入するための層状要素 |
BR112012005447A BR112012005447A2 (pt) | 2009-09-10 | 2010-09-03 | elemento em camadas para encapsular um elemento que é sensível ao ar e/ou umidade, dispositivo, e, processo para a fabricação de um elemento em camadas |
CN201080050934.6A CN102714280B (zh) | 2009-09-10 | 2010-09-03 | 用于封装敏感元件的分层元件 |
MX2012002892A MX2012002892A (es) | 2009-09-10 | 2010-09-03 | Elemento en capas para encapsular un elemento sensible. |
US13/395,412 US9246131B2 (en) | 2009-09-10 | 2010-09-03 | Layered element for encapsulating a senstive element |
AU2010294305A AU2010294305B2 (en) | 2009-09-10 | 2010-09-03 | Layered element for encapsulating a sensitive element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0956207A FR2949776B1 (fr) | 2009-09-10 | 2009-09-10 | Element en couches pour l'encapsulation d'un element sensible |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2949776A1 FR2949776A1 (fr) | 2011-03-11 |
FR2949776B1 true FR2949776B1 (fr) | 2013-05-17 |
Family
ID=42072793
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0956207A Active FR2949776B1 (fr) | 2009-09-10 | 2009-09-10 | Element en couches pour l'encapsulation d'un element sensible |
Country Status (9)
Country | Link |
---|---|
US (1) | US9246131B2 (fr) |
EP (1) | EP2476147A1 (fr) |
JP (1) | JP5607166B2 (fr) |
CN (1) | CN102714280B (fr) |
AU (1) | AU2010294305B2 (fr) |
BR (1) | BR112012005447A2 (fr) |
FR (1) | FR2949776B1 (fr) |
MX (1) | MX2012002892A (fr) |
WO (1) | WO2011029787A1 (fr) |
Families Citing this family (34)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7874125B2 (en) | 2007-03-08 | 2011-01-25 | Lrm Industries International, Inc | Molded support beam |
FR2949776B1 (fr) | 2009-09-10 | 2013-05-17 | Saint Gobain Performance Plast | Element en couches pour l'encapsulation d'un element sensible |
FR2949775B1 (fr) | 2009-09-10 | 2013-08-09 | Saint Gobain Performance Plast | Substrat de protection pour dispositif collecteur ou emetteur de rayonnement |
KR20120109083A (ko) * | 2011-03-24 | 2012-10-08 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 유기 발광 표시 장치의 제조 방법 |
FR2973946B1 (fr) * | 2011-04-08 | 2013-03-22 | Saint Gobain | Dispositif électronique a couches |
FR2973939A1 (fr) * | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
FR2973940A1 (fr) * | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
FR2987122B1 (fr) * | 2012-02-16 | 2014-03-21 | Commissariat Energie Atomique | Ecran d'affichage et son procede de fabrication |
KR20150003200A (ko) * | 2012-03-16 | 2015-01-08 | 오스람 오엘이디 게엠베하 | 수분 장벽 층을 갖는 전자 컴포넌트 |
KR101502206B1 (ko) * | 2012-11-20 | 2015-03-12 | 삼성디스플레이 주식회사 | 발광효율이 향상된 유기발광 표시장치 |
CN103904248B (zh) * | 2012-12-25 | 2016-08-03 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
US20140183498A1 (en) * | 2012-12-31 | 2014-07-03 | Saint-Gobain Performance Plastics Corporation | Thin Film Silicon Nitride Barrier Layers On Flexible Substrate |
CN104078579A (zh) * | 2013-03-29 | 2014-10-01 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
CN104078607A (zh) * | 2013-03-29 | 2014-10-01 | 海洋王照明科技股份有限公司 | 有机电致发光器件及其制备方法 |
WO2015061656A1 (fr) * | 2013-10-24 | 2015-04-30 | Universal Display Corporation | Système de barrière anti-perméation flexible déposé au cours d'un processus unique et présentant une perméabilité ultra basse et un faible effort mécanique pendant toute sa durée de vie |
JP2015133247A (ja) * | 2014-01-14 | 2015-07-23 | 日東電工株式会社 | 有機エレクトロルミネッセンス装置 |
JP2016001526A (ja) * | 2014-06-11 | 2016-01-07 | 株式会社ジャパンディスプレイ | 表示装置 |
KR20160036722A (ko) * | 2014-09-25 | 2016-04-05 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
WO2016059843A1 (fr) * | 2014-10-16 | 2016-04-21 | 凸版印刷株式会社 | Film de protection de points quantiques, film de points quantiques l'utilisant, et unité de rétroéclairage |
KR102313361B1 (ko) * | 2014-11-17 | 2021-10-18 | 삼성디스플레이 주식회사 | 유기 발광 표시 장치, 이를 포함하는 전자 기기, 및 유기 발광 표시 장치의 제조 방법 |
KR102373437B1 (ko) | 2015-03-05 | 2022-03-14 | 삼성디스플레이 주식회사 | 유기발광표시장치 및 그 제조방법 |
CN105552247B (zh) * | 2015-12-08 | 2018-10-26 | 上海天马微电子有限公司 | 复合基板、柔性显示装置及其制备方法 |
EP3196013A1 (fr) * | 2016-01-20 | 2017-07-26 | AGC Glass Europe | Ensemble photovoltaïque organique et procédé de fabrication |
JP2017147191A (ja) * | 2016-02-19 | 2017-08-24 | 株式会社ジャパンディスプレイ | 表示装置、及び表示装置の製造方法 |
US11751426B2 (en) * | 2016-10-18 | 2023-09-05 | Universal Display Corporation | Hybrid thin film permeation barrier and method of making the same |
CN108269827A (zh) * | 2017-01-03 | 2018-07-10 | 昆山工研院新型平板显示技术中心有限公司 | 薄膜封装结构、柔性显示面板、及薄膜封装结构制作方法 |
US10920139B2 (en) * | 2017-06-30 | 2021-02-16 | Sharp Kabushiki Kaisha | Phosphor layer composition, phosphor member, light source device, and projection device |
CN110785866B (zh) * | 2017-07-25 | 2022-07-19 | 应用材料公司 | 改良的薄膜包封 |
JP6805099B2 (ja) | 2017-09-08 | 2020-12-23 | 株式会社Joled | 有機el表示パネル、有機el表示装置、およびその製造方法 |
US11038153B2 (en) * | 2019-01-15 | 2021-06-15 | Applied Materials, Inc. | Methods for HMDSO thermal stability |
US11456438B2 (en) | 2019-11-12 | 2022-09-27 | Samsung Display Co., Ltd. | Display apparatus with thin film encapsulation layer and method of manufacturing the same |
CN110970572A (zh) * | 2019-11-14 | 2020-04-07 | 京东方科技集团股份有限公司 | 封装结构、显示面板及显示装置 |
KR20210146482A (ko) | 2020-05-26 | 2021-12-06 | 삼성디스플레이 주식회사 | 표시 장치 |
CN114551607B (zh) * | 2022-02-25 | 2023-12-12 | 陕西迪泰克新材料有限公司 | 一种遮光层、复合膜层及其制备方法 |
Family Cites Families (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0782996B2 (ja) | 1986-03-28 | 1995-09-06 | キヤノン株式会社 | 結晶の形成方法 |
JPH07111484B2 (ja) | 1989-06-26 | 1995-11-29 | 松下電器産業株式会社 | プラスチック製光学部品の反射防止膜とその形成方法 |
FR2673633B1 (fr) | 1991-03-06 | 1993-06-11 | Air Liquide | Revetement multicouche pour substrat polycarbonate. |
US5254904A (en) | 1991-05-21 | 1993-10-19 | U.S. Philips Corporation | Antireflective coating layer in particular for a cathode ray tube |
US5234748A (en) | 1991-06-19 | 1993-08-10 | Ford Motor Company | Anti-reflective transparent coating with gradient zone |
FR2748743B1 (fr) | 1996-05-14 | 1998-06-19 | Saint Gobain Vitrage | Vitrage a revetement antireflet |
JPH11218603A (ja) | 1997-11-27 | 1999-08-10 | Sony Corp | 反射防止膜およびその製造方法 |
US6335479B1 (en) | 1998-10-13 | 2002-01-01 | Dai Nippon Printing Co., Ltd. | Protective sheet for solar battery module, method of fabricating the same and solar battery module |
US6268695B1 (en) | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
JP2000211053A (ja) | 1999-01-22 | 2000-08-02 | Sony Corp | 光学薄膜デバイス |
AU7451600A (en) | 1999-09-30 | 2001-04-30 | Nikon Corporation | Optical device with multilayer thin film and aligner with the device |
US6573652B1 (en) | 1999-10-25 | 2003-06-03 | Battelle Memorial Institute | Encapsulated display devices |
US20100330748A1 (en) | 1999-10-25 | 2010-12-30 | Xi Chu | Method of encapsulating an environmentally sensitive device |
FR2800998B1 (fr) | 1999-11-17 | 2002-04-26 | Saint Gobain Vitrage | Substrat transparent comportant un revetement antireflet |
US20020090521A1 (en) | 2000-09-29 | 2002-07-11 | Tatsuji Nakajima | Silica layers and antireflection film using same |
CA2424746C (fr) | 2000-09-29 | 2011-03-29 | Nippon Sheet Glass Co., Ltd. | Stratifie transparent a faible pouvoir emissif |
JP4147008B2 (ja) | 2001-03-05 | 2008-09-10 | 株式会社日立製作所 | 有機el素子に用いるフィルム及び有機el素子 |
US7071613B2 (en) * | 2001-10-10 | 2006-07-04 | Lg.Philips Lcd Co., Ltd. | Organic electroluminescent device |
JP4016178B2 (ja) | 2001-11-06 | 2007-12-05 | ソニー株式会社 | 表示装置及び反射防止用基体 |
JP2005510757A (ja) | 2001-11-29 | 2005-04-21 | デウ・エレクトロニクス・サービス・カンパニー・リミテッド | プラスチック基板の製造方法 |
US6589658B1 (en) | 2001-11-29 | 2003-07-08 | Guardian Industries Corp. | Coated article with anti-reflective layer(s) system |
JP3650366B2 (ja) | 2002-03-08 | 2005-05-18 | 株式会社エイコー・エンジニアリング | 無機材料封止された有機発光装置 |
US20030203210A1 (en) | 2002-04-30 | 2003-10-30 | Vitex Systems, Inc. | Barrier coatings and methods of making same |
JP4062981B2 (ja) | 2002-06-14 | 2008-03-19 | 株式会社デンソー | 有機el素子 |
CN1176565C (zh) | 2002-11-25 | 2004-11-17 | 清华大学 | 一种有机电致发光器件的封装层及其制备方法和应用 |
JP2004198590A (ja) * | 2002-12-17 | 2004-07-15 | Konica Minolta Holdings Inc | 薄膜有するを物品、その製造方法及び低反射体並びに透明導電性体 |
US7807225B2 (en) | 2003-01-31 | 2010-10-05 | Sharp Laboratories Of America, Inc. | High density plasma non-stoichiometric SiOxNy films |
US20080171184A9 (en) | 2003-04-17 | 2008-07-17 | Minoru Komada | Barrier film and laminated material, container for wrapping and image display medium using the saw, and manufacturing method for barrier film |
JP2004345223A (ja) | 2003-05-22 | 2004-12-09 | Dainippon Printing Co Ltd | 光学機能性フィルム、および画像表示装置 |
FR2858975B1 (fr) | 2003-08-20 | 2006-01-27 | Saint Gobain | Substrat transparent revetu d'un empilement de couches minces a proprietes de reflexion dans l'infrarouge et/ou dans le domaine du rayonnement solaire |
JP4703108B2 (ja) | 2003-09-10 | 2011-06-15 | 三星モバイルディスプレイ株式會社 | 発光素子基板およびそれを用いた発光素子 |
US6842288B1 (en) | 2003-10-30 | 2005-01-11 | 3M Innovative Properties Company | Multilayer optical adhesives and articles |
US20050093437A1 (en) * | 2003-10-31 | 2005-05-05 | Ouyang Michael X. | OLED structures with strain relief, antireflection and barrier layers |
EP1719192A2 (fr) | 2004-02-20 | 2006-11-08 | OC Oerlikon Balzers AG | Couche barriere de diffusion et procede pour produire une couche barriere de diffusion |
US20050207016A1 (en) | 2004-03-15 | 2005-09-22 | Fuji Photo Film Co., Ltd. | Antireflection film, polarizing plate and liquid crystal display |
KR101279914B1 (ko) | 2004-06-25 | 2013-07-01 | 어플라이드 머티어리얼스, 인코포레이티드 | 밀봉 필름의 차수 성능 개선 방법 및 장치 |
JP4837271B2 (ja) | 2004-10-04 | 2011-12-14 | 株式会社アルバック | 反射防止膜の形成方法 |
JP2006338947A (ja) * | 2005-05-31 | 2006-12-14 | Sanyo Electric Co Ltd | 保護膜形成方法および保護膜 |
JP2007017668A (ja) | 2005-07-07 | 2007-01-25 | Konica Minolta Holdings Inc | 光学フィルム |
JP2007038529A (ja) | 2005-08-03 | 2007-02-15 | Konica Minolta Holdings Inc | ガスバリア性薄膜積層体、ガスバリア性樹脂基材および有機エレクトロルミネッセンスデバイス |
JP2007098931A (ja) | 2005-09-09 | 2007-04-19 | Seiko Epson Corp | スクリーン印刷装置、発光装置の製造方法および製造装置 |
WO2007037525A1 (fr) | 2005-09-28 | 2007-04-05 | Fujifilm Corporation | Film antireflet, plaque polarisante et dispositif d'affichage d'image |
JP2007090702A (ja) | 2005-09-29 | 2007-04-12 | Fujifilm Corp | 水蒸気バリアフィルムおよび有機エレクトロルミネッセンス素子 |
US8153282B2 (en) | 2005-11-22 | 2012-04-10 | Guardian Industries Corp. | Solar cell with antireflective coating with graded layer including mixture of titanium oxide and silicon oxide |
US20090128916A1 (en) | 2006-01-16 | 2009-05-21 | Masaki Noro | Curable composition and cured product, laminate film and antireflective film using the same and polarizing plate and image display device using the antireflective film |
JP5135753B2 (ja) | 2006-02-01 | 2013-02-06 | セイコーエプソン株式会社 | 光学物品 |
US20070212498A1 (en) | 2006-02-24 | 2007-09-13 | Fujifilm Corporation | Optical film, antireflection film, polarizing plate, display apparatus and method for manufacturing optical film |
US20100326429A1 (en) * | 2006-05-19 | 2010-12-30 | Cumpston Brian H | Hermetically sealed cylindrical solar cells |
JP4722746B2 (ja) | 2006-03-29 | 2011-07-13 | 京セラ株式会社 | El装置 |
JP2007277631A (ja) * | 2006-04-06 | 2007-10-25 | Konica Minolta Holdings Inc | ガスバリア性薄膜積層体の製造方法、ガスバリア性薄膜積層体、ガスバリア性樹脂基材及び有機エレクトロルミネッセンスデバイス |
EP2047302A1 (fr) | 2006-07-28 | 2009-04-15 | ILFORD Imaging Switzerland GmbH | Matériaux flexibles pour applications optiques |
US20080049431A1 (en) | 2006-08-24 | 2008-02-28 | Heather Debra Boek | Light emitting device including anti-reflection layer(s) |
PL2082619T3 (pl) | 2006-11-06 | 2023-03-13 | Agency For Science, Technology And Research | Nanocząstkowy enkapsulujący stos barierowy |
US7781031B2 (en) | 2006-12-06 | 2010-08-24 | General Electric Company | Barrier layer, composite article comprising the same, electroactive device, and method |
JP2008216429A (ja) | 2007-03-01 | 2008-09-18 | Toppan Printing Co Ltd | 防眩フィルム |
JP2008288012A (ja) | 2007-05-17 | 2008-11-27 | Seiko Epson Corp | エレクトロルミネッセンス装置とその製造方法 |
US8586189B2 (en) | 2007-09-19 | 2013-11-19 | Fujifilm Corporation | Gas-barrier film and organic device comprising same |
JP5139153B2 (ja) | 2007-09-19 | 2013-02-06 | 富士フイルム株式会社 | ガスバリア性フィルムおよびこれを用いた有機デバイス |
JP5417698B2 (ja) | 2007-09-21 | 2014-02-19 | 凸版印刷株式会社 | 機能性フィルムの製造方法 |
WO2009046060A2 (fr) | 2007-10-01 | 2009-04-09 | Davis, Joseph And Negley | Appareils et procédés pour produire de l'énergie électrique renforcée de photons par conversion-abaissement |
US8987039B2 (en) | 2007-10-12 | 2015-03-24 | Air Products And Chemicals, Inc. | Antireflective coatings for photovoltaic applications |
US20090096106A1 (en) | 2007-10-12 | 2009-04-16 | Air Products And Chemicals, Inc. | Antireflective coatings |
JP2009133000A (ja) | 2007-10-30 | 2009-06-18 | Fujifilm Corp | シリコン窒化物膜及びそれを用いたガスバリア膜、薄膜素子 |
DE102008031405A1 (de) | 2008-07-02 | 2010-01-07 | Osram Opto Semiconductors Gmbh | Verfahren zur Herstellung eines organischen elektronischen Bauelements und organisches elektronisches Bauelement |
WO2009098793A1 (fr) * | 2008-02-07 | 2009-08-13 | Fuji Electric Holdings Co., Ltd. | Dispositif d'affichage électroluminescent organique et son procédé de fabrication |
US20090199901A1 (en) * | 2008-02-08 | 2009-08-13 | Applied Materials, Inc. | Photovoltaic device comprising a sputter deposited passivation layer as well as a method and apparatus for producing such a device |
KR20090107882A (ko) | 2008-04-10 | 2009-10-14 | 삼성전자주식회사 | 고정층을 포함하는 경사 조성 봉지 박막 및 그의 제조방법 |
KR20090126863A (ko) | 2008-06-05 | 2009-12-09 | 삼성전자주식회사 | 광학적 기능성을 갖는 다층 봉지 박막의 형성방법 및 그에 의해 제조된 다층 봉지 박막 |
KR101084267B1 (ko) | 2009-02-26 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
DE102009024411A1 (de) | 2009-03-24 | 2010-09-30 | Osram Opto Semiconductors Gmbh | Dünnschichtverkapselung für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement |
JP5424091B2 (ja) | 2009-03-31 | 2014-02-26 | コニカミノルタ株式会社 | 紫外反射膜を有するフィルムミラー |
KR101560234B1 (ko) | 2009-06-29 | 2015-10-15 | 엘지디스플레이 주식회사 | 유기전계발광 표시장치 및 그 제조방법 |
JP5562955B2 (ja) | 2009-07-07 | 2014-07-30 | クラレクラフレックス株式会社 | 積層シート及びその製造方法 |
FR2949776B1 (fr) | 2009-09-10 | 2013-05-17 | Saint Gobain Performance Plast | Element en couches pour l'encapsulation d'un element sensible |
FR2949775B1 (fr) | 2009-09-10 | 2013-08-09 | Saint Gobain Performance Plast | Substrat de protection pour dispositif collecteur ou emetteur de rayonnement |
JP2011100111A (ja) | 2009-10-09 | 2011-05-19 | Seiko Epson Corp | 光学物品、光学物品の製造方法、電子機器 |
FR2973940A1 (fr) | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
FR2973939A1 (fr) | 2011-04-08 | 2012-10-12 | Saint Gobain | Element en couches pour l’encapsulation d’un element sensible |
-
2009
- 2009-09-10 FR FR0956207A patent/FR2949776B1/fr active Active
-
2010
- 2010-09-03 BR BR112012005447A patent/BR112012005447A2/pt not_active IP Right Cessation
- 2010-09-03 EP EP10747904A patent/EP2476147A1/fr not_active Withdrawn
- 2010-09-03 AU AU2010294305A patent/AU2010294305B2/en not_active Ceased
- 2010-09-03 JP JP2012528331A patent/JP5607166B2/ja not_active Expired - Fee Related
- 2010-09-03 WO PCT/EP2010/062999 patent/WO2011029787A1/fr active Application Filing
- 2010-09-03 CN CN201080050934.6A patent/CN102714280B/zh not_active Expired - Fee Related
- 2010-09-03 US US13/395,412 patent/US9246131B2/en not_active Expired - Fee Related
- 2010-09-03 MX MX2012002892A patent/MX2012002892A/es active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
EP2476147A1 (fr) | 2012-07-18 |
FR2949776A1 (fr) | 2011-03-11 |
BR112012005447A2 (pt) | 2016-04-12 |
JP2013504863A (ja) | 2013-02-07 |
WO2011029787A1 (fr) | 2011-03-17 |
CN102714280B (zh) | 2016-01-13 |
MX2012002892A (es) | 2012-06-01 |
CN102714280A (zh) | 2012-10-03 |
US20120228668A1 (en) | 2012-09-13 |
AU2010294305A1 (en) | 2012-03-29 |
AU2010294305B2 (en) | 2013-10-10 |
US9246131B2 (en) | 2016-01-26 |
JP5607166B2 (ja) | 2014-10-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2949776B1 (fr) | Element en couches pour l'encapsulation d'un element sensible | |
FR2953990B1 (fr) | Dispositif d'encapsulation a etancheite amelioree | |
GB0812732D0 (en) | Fluid encapsulation | |
GB2451596B (en) | Semiconductor electrochemical sensors | |
EP2184576A4 (fr) | Capteur de déformation à semi-conducteur | |
IL218708A0 (en) | Encapsulated semiconductor nanoparticle-based materials | |
GB2488688B (en) | Recessed and embedded die coreless package | |
TWI341577B (en) | Semiconductor chip embedding structure | |
EP2329380A4 (fr) | Informations de mappage intégrées destinées à des dispositifs de mémoire | |
DK3217152T3 (da) | Vandtæt beklædning til en flowmåler | |
SE0850083L (sv) | Funktionell inkapsling | |
SG10201401960RA (en) | Semiconductor device bonding wire | |
BRPI0924146A2 (pt) | encapsulados | |
EP2149884A4 (fr) | Mémoire semi-conductrice | |
GB0722016D0 (en) | A semiconductor layer structure | |
EP2120261A4 (fr) | Boitier de semi-conducteur | |
EP2109451A4 (fr) | Picoplatine encapsulé | |
DE602008004858D1 (de) | Halbleiterpaket | |
EP2225648A4 (fr) | Dispositif de mémoire à semi-conducteurs | |
TWI370541B (en) | Semiconductor memory | |
BRPI1010178A2 (pt) | "válvula" | |
TWI339881B (en) | Chip package | |
FR2965258B1 (fr) | Organe d'accrochage a memoire | |
TWI358731B (en) | Semiconductor memory device | |
FR2955252B1 (fr) | Materiau d'insertion destine a elargir le sillon gingival |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 8 |
|
PLFP | Fee payment |
Year of fee payment: 9 |