FR2838817B1 - Caloduc - Google Patents
CaloducInfo
- Publication number
- FR2838817B1 FR2838817B1 FR0212087A FR0212087A FR2838817B1 FR 2838817 B1 FR2838817 B1 FR 2838817B1 FR 0212087 A FR0212087 A FR 0212087A FR 0212087 A FR0212087 A FR 0212087A FR 2838817 B1 FR2838817 B1 FR 2838817B1
- Authority
- FR
- France
- Prior art keywords
- heat pipe
- pipe
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/506—Heat pipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64G—COSMONAUTICS; VEHICLES OR EQUIPMENT THEREFOR
- B64G1/00—Cosmonautic vehicles
- B64G1/22—Parts of, or equipment specially adapted for fitting in or to, cosmonautic vehicles
- B64G1/46—Arrangements or adaptations of devices for control of environment or living conditions
- B64G1/50—Arrangements or adaptations of devices for control of environment or living conditions for temperature control
- B64G1/503—Radiator panels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/10—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses
- F28F1/12—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element
- F28F1/24—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely
- F28F1/26—Tubular elements and assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with projections, with recesses the means being only outside the tubular element and extending transversely the means being integral with the element
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Biodiversity & Conservation Biology (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Sustainable Development (AREA)
- Thermal Sciences (AREA)
- Environmental Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Remote Sensing (AREA)
- Aviation & Aerospace Engineering (AREA)
- Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002119299A JP3680040B2 (ja) | 2002-04-22 | 2002-04-22 | ヒートパイプ |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2838817A1 FR2838817A1 (fr) | 2003-10-24 |
FR2838817B1 true FR2838817B1 (fr) | 2007-04-20 |
Family
ID=28786744
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0212087A Expired - Lifetime FR2838817B1 (fr) | 2002-04-22 | 2002-09-30 | Caloduc |
Country Status (3)
Country | Link |
---|---|
US (1) | US6942016B2 (fr) |
JP (1) | JP3680040B2 (fr) |
FR (1) | FR2838817B1 (fr) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6824305B1 (en) * | 2002-08-16 | 2004-11-30 | The Texas A & M University System | Local wall heat flux/temperature meter for convective flow and method of utilizing same |
FI20030550A0 (fi) * | 2003-04-11 | 2003-04-11 | Pajunen Petri | Menetelmä numeerisen ratkaisun tarkkuuden arvioimiseksi |
CN2705893Y (zh) * | 2004-05-26 | 2005-06-22 | 鸿富锦精密工业(深圳)有限公司 | 相变化散热器 |
TWM259940U (en) * | 2004-05-31 | 2005-03-21 | Glacialtech Inc | Heat dissipating device |
JP4141462B2 (ja) * | 2005-07-07 | 2008-08-27 | 日本ペイント株式会社 | 熱量予測方法及び熱量予測システム並びに熱量予測プログラム |
EP1937774A2 (fr) | 2005-09-16 | 2008-07-02 | General Electric Company | Melanges polymeres de polyaryl-ether-cetone ameliores |
US9006348B2 (en) | 2005-09-16 | 2015-04-14 | Sabic Global Technologies B.V. | Poly aryl ether ketone polymer blends |
US20070066740A1 (en) * | 2005-09-16 | 2007-03-22 | Odle Roy R | Annular or tubular shaped articles of novel polymer blends |
TW200728673A (en) * | 2006-01-27 | 2007-08-01 | Mitac Technology Corp | Heat pipe having directing groove section |
US7423877B2 (en) * | 2006-09-01 | 2008-09-09 | Fu Zhun Precision Industry (Shen Zhen) Co., Ltd. | Heat dissipation device |
TW200824833A (en) * | 2007-12-18 | 2008-06-16 | Asia Vital Components Co Ltd | Forming method and structure of heat pipe |
US8912272B2 (en) | 2008-12-19 | 2014-12-16 | Sabic Innovative Plastics Ip B.V. | Moisture resistant polyimide compositions |
JP4558086B1 (ja) * | 2009-06-22 | 2010-10-06 | 株式会社東芝 | 電子機器 |
US8305761B2 (en) * | 2009-11-17 | 2012-11-06 | Apple Inc. | Heat removal in compact computing systems |
CN102079386A (zh) * | 2009-11-30 | 2011-06-01 | 上海卫星工程研究所 | 一种用于空间飞行器单机散热的简易热传输装置 |
CN102092483A (zh) * | 2009-12-11 | 2011-06-15 | 上海卫星工程研究所 | 用于空间飞行器单机散热的热传输装置 |
US9091489B2 (en) * | 2010-05-14 | 2015-07-28 | Paragon Space Development Corporation | Radiator systems |
BR112012030443A2 (pt) * | 2010-05-31 | 2016-08-09 | Sanden Corp | trocador de calor , e, bomba térmica |
JP5254416B2 (ja) * | 2011-09-30 | 2013-08-07 | 株式会社東芝 | 電子機器 |
CN102592024B (zh) * | 2012-01-06 | 2013-04-03 | 北京航空航天大学 | 一种确定径向热传导稳态温度极大值的热网络建模方法 |
US9238513B2 (en) * | 2012-03-06 | 2016-01-19 | The Boeing Company | Spacecraft radiator panels |
CN102914042B (zh) * | 2012-10-13 | 2015-12-02 | 万建红 | 辐射平板空调系统 |
US9868551B2 (en) | 2015-03-30 | 2018-01-16 | Worldvu Satellites Limited | Passive thermal system comprising combined heat pipe and phase change material and satellites incorporating same |
US10392135B2 (en) * | 2015-03-30 | 2019-08-27 | Worldvu Satellites Limited | Satellite radiator panels with combined stiffener/heat pipe |
CN105702641B (zh) * | 2016-03-18 | 2018-06-26 | 中国科学院长春光学精密机械与物理研究所 | 空间飞行器可变大功率器件散热装置 |
US10780998B1 (en) * | 2017-03-22 | 2020-09-22 | Space Systems/Loral, Llc | Spacecraft design with multiple thermal zones |
US11781814B2 (en) * | 2020-03-16 | 2023-10-10 | The Boeing Company | Tapered groove width heat pipe |
CN116390443A (zh) * | 2020-08-17 | 2023-07-04 | 中国科学院微小卫星创新研究院 | 基于流体回路的地面散热方法 |
BE1029461B1 (fr) * | 2021-05-31 | 2023-01-10 | Sonaca Sa | Structure régulatrice de chaleur par caloduc optimisée pour panneaux supports d'équipements électroniques |
US20230322419A1 (en) * | 2022-04-11 | 2023-10-12 | Maxar Space Llc | Radiating coupling heat pipe |
Family Cites Families (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57122551A (en) | 1981-01-10 | 1982-07-30 | Sumitomo Light Metal Ind Ltd | Manufacture of heat sink for semiconductor device |
US4470451A (en) * | 1981-03-16 | 1984-09-11 | Grumman Aerospace Corporation | Dual axial channel heat pipe |
JPS60235989A (ja) | 1984-05-09 | 1985-11-22 | Hitachi Ltd | ル−ムエアコンの熱交換器 |
JPS60238681A (ja) | 1985-04-26 | 1985-11-27 | Hitachi Ltd | フイン管式熱交換器 |
JPH0650761B2 (ja) * | 1986-08-12 | 1994-06-29 | 富士通株式会社 | 半導体装置 |
GB8623178D0 (en) * | 1986-09-26 | 1987-01-14 | Raychem Ltd | Circuit protection device |
JPS6383586A (ja) * | 1986-09-29 | 1988-04-14 | Nippon Telegr & Teleph Corp <Ntt> | ヒ−トパイプ埋め込みパネル |
JPS6431370A (en) | 1987-07-27 | 1989-02-01 | Matsushita Electric Ind Co Ltd | Cooling fin for semiconductor component |
US4880050A (en) * | 1988-06-20 | 1989-11-14 | The Boeing Company | Thermal management system |
JP2828234B2 (ja) | 1992-01-10 | 1998-11-25 | 住友金属工業株式会社 | ピンフィン型ヒートシンクとその製造方法 |
JPH06213588A (ja) | 1992-12-04 | 1994-08-02 | American Teleph & Telegr Co <Att> | 回路パックとそのヒートシンクの構造を最適化する方法 |
JP3424692B2 (ja) | 1993-12-28 | 2003-07-07 | 昭和電工株式会社 | 熱交換器 |
US5649310A (en) * | 1994-06-15 | 1997-07-15 | Space Systems/Loral, Inc. | Signal translation and amplification system including a thermal radiation panel coupled thereto |
JPH0853100A (ja) | 1994-08-10 | 1996-02-27 | Mitsubishi Electric Corp | ヒートパイプ埋め込みハニカムサンドイッチパネル |
US5625280A (en) * | 1995-10-30 | 1997-04-29 | International Business Machines Corp. | Voltage regulator bypass circuit |
US5806803A (en) * | 1995-11-30 | 1998-09-15 | Hughes Electronics Corporation | Spacecraft radiator cooling system |
US5721656A (en) * | 1996-06-10 | 1998-02-24 | Winbond Electronics Corporation | Electrostatc discharge protection network |
JP3268734B2 (ja) * | 1996-11-15 | 2002-03-25 | 古河電気工業株式会社 | ヒートパイプを用いた電子機器放熱ユニットの製造方法 |
JP2954153B1 (ja) * | 1998-04-07 | 1999-09-27 | 日本電気アイシーマイコンシステム株式会社 | 半導体集積回路 |
JP3772559B2 (ja) * | 1998-12-02 | 2006-05-10 | 三菱電機株式会社 | ヒートパイプ埋め込みハニカムサンドイッチパネル |
DE19908683C2 (de) * | 1999-02-26 | 2001-03-01 | Dornier Gmbh | Radiatorstruktur eines Satelliten |
US6189601B1 (en) * | 1999-05-05 | 2001-02-20 | Intel Corporation | Heat sink with a heat pipe for spreading of heat |
KR19990064907A (ko) | 1999-05-20 | 1999-08-05 | 주재훈 | 고효율 열전도 히트씽크의 방열핀구조 |
JP3345855B2 (ja) | 1999-07-14 | 2002-11-18 | 古河電気工業株式会社 | ヒートシンク |
US20010028239A1 (en) * | 2000-03-10 | 2001-10-11 | Henri Vanderhenst | Triac controller having soft start speed regulation |
US6382309B1 (en) * | 2000-05-16 | 2002-05-07 | Swales Aerospace | Loop heat pipe incorporating an evaporator having a wick that is liquid superheat tolerant and is resistant to back-conduction |
KR100363095B1 (ko) * | 2000-12-06 | 2002-12-05 | 삼성전자 주식회사 | 정전기 방전 보호를 위한 액정 표시 장치 드라이버 회로 |
-
2002
- 2002-04-22 JP JP2002119299A patent/JP3680040B2/ja not_active Expired - Lifetime
- 2002-09-06 US US10/235,641 patent/US6942016B2/en not_active Expired - Lifetime
- 2002-09-30 FR FR0212087A patent/FR2838817B1/fr not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
US20030196778A1 (en) | 2003-10-23 |
JP3680040B2 (ja) | 2005-08-10 |
FR2838817A1 (fr) | 2003-10-24 |
JP2003314978A (ja) | 2003-11-06 |
US6942016B2 (en) | 2005-09-13 |
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Legal Events
Date | Code | Title | Description |
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PLFP | Fee payment |
Year of fee payment: 15 |
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PLFP | Fee payment |
Year of fee payment: 16 |
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PLFP | Fee payment |
Year of fee payment: 17 |
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PLFP | Fee payment |
Year of fee payment: 18 |
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PLFP | Fee payment |
Year of fee payment: 19 |
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PLFP | Fee payment |
Year of fee payment: 20 |