FR2623661B1 - - Google Patents
Info
- Publication number
- FR2623661B1 FR2623661B1 FR8716091A FR8716091A FR2623661B1 FR 2623661 B1 FR2623661 B1 FR 2623661B1 FR 8716091 A FR8716091 A FR 8716091A FR 8716091 A FR8716091 A FR 8716091A FR 2623661 B1 FR2623661 B1 FR 2623661B1
- Authority
- FR
- France
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8716091A FR2623661A1 (en) | 1987-11-20 | 1987-11-20 | Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8716091A FR2623661A1 (en) | 1987-11-20 | 1987-11-20 | Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| FR2623661A1 FR2623661A1 (en) | 1989-05-26 |
| FR2623661B1 true FR2623661B1 (de) | 1991-06-07 |
Family
ID=9356999
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| FR8716091A Granted FR2623661A1 (en) | 1987-11-20 | 1987-11-20 | Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation |
Country Status (1)
| Country | Link |
|---|---|
| FR (1) | FR2623661A1 (de) |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3972063A (en) * | 1973-10-19 | 1976-07-27 | Mitsubishi Denki Kabushiki Kaisha | Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope |
| JPS59217349A (ja) * | 1983-05-26 | 1984-12-07 | Mitsubishi Electric Corp | 沸騰冷却装置 |
-
1987
- 1987-11-20 FR FR8716091A patent/FR2623661A1/fr active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2623661A1 (en) | 1989-05-26 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| ER | Errata listed in the french official journal (bopi) |
Free format text: 21/89 |
|
| ST | Notification of lapse |