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FR2623661A1 - Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation - Google Patents

Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation Download PDF

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Publication number
FR2623661A1
FR2623661A1 FR8716091A FR8716091A FR2623661A1 FR 2623661 A1 FR2623661 A1 FR 2623661A1 FR 8716091 A FR8716091 A FR 8716091A FR 8716091 A FR8716091 A FR 8716091A FR 2623661 A1 FR2623661 A1 FR 2623661A1
Authority
FR
France
Prior art keywords
power components
cooling device
container
protection network
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
FR8716091A
Other languages
English (en)
French (fr)
Other versions
FR2623661B1 (de
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alstom SA
Original Assignee
Alstom SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alstom SA filed Critical Alstom SA
Priority to FR8716091A priority Critical patent/FR2623661A1/fr
Publication of FR2623661A1 publication Critical patent/FR2623661A1/fr
Application granted granted Critical
Publication of FR2623661B1 publication Critical patent/FR2623661B1/fr
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR8716091A 1987-11-20 1987-11-20 Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation Granted FR2623661A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR8716091A FR2623661A1 (en) 1987-11-20 1987-11-20 Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR8716091A FR2623661A1 (en) 1987-11-20 1987-11-20 Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation

Publications (2)

Publication Number Publication Date
FR2623661A1 true FR2623661A1 (en) 1989-05-26
FR2623661B1 FR2623661B1 (de) 1991-06-07

Family

ID=9356999

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8716091A Granted FR2623661A1 (en) 1987-11-20 1987-11-20 Device for cooling high-power components of the protection network for a semi-conductor cooled by vaporisation

Country Status (1)

Country Link
FR (1) FR2623661A1 (de)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972063A (en) * 1973-10-19 1976-07-27 Mitsubishi Denki Kabushiki Kaisha Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope
JPS59217349A (ja) * 1983-05-26 1984-12-07 Mitsubishi Electric Corp 沸騰冷却装置

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3972063A (en) * 1973-10-19 1976-07-27 Mitsubishi Denki Kabushiki Kaisha Vapor cooled semiconductor device enclosed in an envelope having a compression mechanism for holding said device within said envelope
JPS59217349A (ja) * 1983-05-26 1984-12-07 Mitsubishi Electric Corp 沸騰冷却装置

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN, vol. 9, no. 85 (E-308)[1808], 13 avril 1985; & JP-A-59 217 349 (MITSUBISHI DENKI K.K.) 07-12-1984 *

Also Published As

Publication number Publication date
FR2623661B1 (de) 1991-06-07

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Legal Events

Date Code Title Description
ER Errata listed in the french official journal (bopi)

Free format text: 21/89

ST Notification of lapse