FR2001146A1 - - Google Patents

Info

Publication number: FR2001146A1
Authority: FR; France
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Withdrawn

Application number

FR6902171A

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

3M Co

Original Assignee

Minnesota Mining and Manufacturing Co

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1968-02-01

Filing date

1969-01-31

Publication date

1969-09-26

1969-01-31 Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co

1969-09-26 Publication of FR2001146A1 publication Critical patent/FR2001146A1/fr

Status Withdrawn legal-status Critical Current

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
- H05K3/4664—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders
- H05K3/4667—Adding a circuit layer by thick film methods, e.g. printing techniques or by other techniques for making conductive patterns by using pastes, inks or powders characterized by using an inorganic intermediate insulating layer
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
Inorganic Chemistry (AREA)
Manufacturing & Machinery (AREA)
Microelectronics & Electronic Packaging (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

FR6902171A 1968-02-01 1969-01-31 Withdrawn FR2001146A1 (fr)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
US70242168A	1968-02-01	1968-02-01

Publications (1)

Publication Number	Publication Date
FR2001146A1 true FR2001146A1 (fr)	1969-09-26

Family

ID=24821173

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
FR6902171A Withdrawn FR2001146A1 (fr)	1968-02-01	1969-01-31

Country Status (7)

Country	Link
US (1)	US3549784A (fr)
JP (1)	JPS5519076B1 (fr)
CA (1)	CA918815A (fr)
DE (1)	DE1903819A1 (fr)
FR (1)	FR2001146A1 (fr)
GB (1)	GB1255253A (fr)
NL (1)	NL6901074A (fr)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US3626259A (en) *	1970-07-15	1971-12-07	Trw Inc	High-frequency semiconductor package
US4293513A (en) *	1970-11-02	1981-10-06	Engelhard Minerals & Chemicals Corporation	Method of making honeycomb structures
US3730969A (en) *	1972-03-06	1973-05-01	Rca Corp	Electronic device package
US3872583A (en) *	1972-07-10	1975-03-25	Amdahl Corp	LSI chip package and method
JPS509757A (fr) *	1973-06-02	1975-01-31
JPS5152531A (ja) *	1974-10-31	1976-05-10	Kyoto Ceramic	Hatsunetsusoshi
US4038488A (en) *	1975-05-12	1977-07-26	Cambridge Memories, Inc.	Multilayer ceramic multi-chip, dual in-line packaging assembly
US4303480A (en) *	1977-08-01	1981-12-01	General Dynamics, Pomona Division	Electroplating of thick film circuitry
JPS5820160B2 (ja) *	1978-06-17	1983-04-21	日本碍子株式会社	メタライズ層を備えたセラミツクス体
US4271426A (en) *	1978-08-10	1981-06-02	Minnesota Mining And Manufacturing Company	Leaded mounting and connector unit for an electronic device
JPS5563900A (en) *	1978-11-08	1980-05-14	Fujitsu Ltd	Multilyaer ceramic circuit board
US4224493A (en) *	1978-12-22	1980-09-23	Siegfried Pretzsch	Contact switch arrangement
US4331700A (en) *	1979-11-30	1982-05-25	Rca Corporation	Method of making a composite substrate
US4296272A (en) *	1979-11-30	1981-10-20	Rca Corporation	Composite substrate
US4975762A (en) *	1981-06-11	1990-12-04	General Electric Ceramics, Inc.	Alpha-particle-emitting ceramic composite cover
JPS5858965U (ja) *	1981-10-16	1983-04-21	三菱自動車工業株式会社	倍力装置付ブレ−キの安全装置
US4682414A (en) *	1982-08-30	1987-07-28	Olin Corporation	Multi-layer circuitry
JPS59111987A (ja) *	1983-11-18	1984-06-28	株式会社日立製作所	複合焼結体の製造方法
US4577056A (en) *	1984-04-09	1986-03-18	Olin Corporation	Hermetically sealed metal package
US4645552A (en) *	1984-11-19	1987-02-24	Hughes Aircraft Company	Process for fabricating dimensionally stable interconnect boards
FR2575331B1 (fr) *	1984-12-21	1987-06-05	Labo Electronique Physique	Boitier pour composant electronique
US4828961A (en) *	1986-07-02	1989-05-09	W. R. Grace & Co.-Conn.	Imaging process for forming ceramic electronic circuits
US4707313A (en) *	1986-07-02	1987-11-17	A. O. Smith Corporation	Method of making a laminated structure for use in an electrical apparatus
JPS6323394A (ja) *	1987-03-20	1988-01-30	株式会社日立製作所	複合焼結体の製造法
US5051811A (en) *	1987-08-31	1991-09-24	Texas Instruments Incorporated	Solder or brazing barrier
JPH0272695A (ja) *	1988-09-07	1990-03-12	Toshiba Lighting & Technol Corp	混成集積回路
JP2988603B2 (ja) *	1992-08-20	1999-12-13	株式会社豊田自動織機製作所	半導体パッケージ
DE4230732C1 (fr) *	1992-09-14	1993-09-09	Schott Glaswerke, 55122 Mainz, De
US20080131673A1 (en) *	2005-12-13	2008-06-05	Yasuyuki Yamamoto	Method for Producing Metallized Ceramic Substrate

1968
- 1968-02-01 US US702421A patent/US3549784A/en not_active Expired - Lifetime
1969
- 1969-01-22 DE DE19691903819 patent/DE1903819A1/de active Pending
- 1969-01-22 NL NL6901074A patent/NL6901074A/xx unknown
- 1969-01-31 FR FR6902171A patent/FR2001146A1/fr not_active Withdrawn
- 1969-01-31 GB GB5296/69A patent/GB1255253A/en not_active Expired
- 1969-01-31 JP JP676669A patent/JPS5519076B1/ja active Pending
- 1969-01-31 CA CA041703A patent/CA918815A/en not_active Expired

Also Published As

Publication number	Publication date
GB1255253A (en)	1971-12-01
DE1903819A1 (de)	1969-09-11
CA918815A (en)	1973-01-09
NL6901074A (fr)	1969-08-05
JPS5519076B1 (fr)	1980-05-23
US3549784A (en)	1970-12-22

Publication	Publication Date	Title
JPS5519076B1 (fr)	1980-05-23
AU428130B2 (fr)	1972-09-14
AU5184069A (fr)	1970-07-17
AU6168869A (fr)	1971-04-08
AU6171569A (fr)	1971-04-08
AU429879B2 (fr)	1972-11-09
AU416157B2 (fr)	1971-08-23
AU4811568A (fr)	1974-08-01
AU421558B1 (fr)	1970-01-29
AU4744468A (fr)	1970-06-18
AU3789668A (fr)	1968-06-20
AU3224368A (fr)	1969-07-17
AU463027A (fr)	1971-03-04
BE728748A (fr)	1969-08-21
BE581157A (fr)
BE630165A (fr)
BE642636A (fr)
AU479894A (fr)	1973-08-30
AU479393A (fr)	1974-02-07
BE708888A (fr)	1968-07-03
BE712587A (fr)	1968-07-31
AU4558658A (fr)	1970-05-07
AU4503667A (fr)	1970-04-23
AU4464266A (fr)	1970-04-16
BE708933A (fr)	1968-05-16

Legal Events

Date	Code	Title	Description
1977-03-18	ST	Notification of lapse