Nothing Special   »   [go: up one dir, main page]

EP2705874B1 - MRI- und HF-kompatible Leitungen - Google Patents

MRI- und HF-kompatible Leitungen Download PDF

Info

Publication number
EP2705874B1
EP2705874B1 EP13151461.4A EP13151461A EP2705874B1 EP 2705874 B1 EP2705874 B1 EP 2705874B1 EP 13151461 A EP13151461 A EP 13151461A EP 2705874 B1 EP2705874 B1 EP 2705874B1
Authority
EP
European Patent Office
Prior art keywords
lead
conductor
conductors
length
electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
EP13151461.4A
Other languages
English (en)
French (fr)
Other versions
EP2705874A1 (de
Inventor
Paul A. Bottomley
Parag V. Karmarkar
Justin M. Allen
William A. Edelstein
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Boston Scientific Neuromodulation Corp
ClearPoint Neuro Inc
Original Assignee
Boston Scientific Neuromodulation Corp
MRI Interventions Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Boston Scientific Neuromodulation Corp, MRI Interventions Inc filed Critical Boston Scientific Neuromodulation Corp
Publication of EP2705874A1 publication Critical patent/EP2705874A1/de
Application granted granted Critical
Publication of EP2705874B1 publication Critical patent/EP2705874B1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/16Screening or neutralising undesirable influences from or using, atmospheric or terrestrial radiation or fields
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/02Details
    • A61N1/04Electrodes
    • A61N1/05Electrodes for implantation or insertion into the body, e.g. heart electrode
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/02Details
    • A61N1/08Arrangements or circuits for monitoring, protecting, controlling or indicating
    • A61N1/086Magnetic resonance imaging [MRI] compatible leads
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/18Applying electric currents by contact electrodes
    • A61N1/32Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/362Heart stimulators
    • A61N1/37Monitoring; Protecting
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/18Applying electric currents by contact electrodes
    • A61N1/32Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/362Heart stimulators
    • A61N1/37Monitoring; Protecting
    • A61N1/3718Monitoring of or protection against external electromagnetic fields or currents
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B18/00Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body
    • A61B18/04Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating
    • A61B18/12Surgical instruments, devices or methods for transferring non-mechanical forms of energy to or from the body by heating by passing a current through the tissue to be heated, e.g. high-frequency current
    • A61B18/14Probes or electrodes therefor
    • A61B18/1492Probes or electrodes therefor having a flexible, catheter-like structure, e.g. for heart ablation
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B90/00Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
    • A61B90/36Image-producing devices or illumination devices not otherwise provided for
    • A61B90/37Surgical systems with images on a monitor during operation
    • A61B2090/374NMR or MRI
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/05Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves 
    • A61B5/055Detecting, measuring or recording for diagnosis by means of electric currents or magnetic fields; Measuring using microwaves or radio waves  involving electronic [EMR] or nuclear [NMR] magnetic resonance, e.g. magnetic resonance imaging
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/02Details
    • A61N1/04Electrodes
    • A61N1/05Electrodes for implantation or insertion into the body, e.g. heart electrode
    • A61N1/056Transvascular endocardial electrode systems
    • A61N1/0565Electrode heads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing

Definitions

  • the present invention relates to conductors and leads and may be particularly suitable for implantable medical leads.
  • Linear leads comprising conductors can couple with radio frequency (RF) fields, such as those used in magnetic resonance imaging (MRI) and magnetic resonance spectroscopy (MRS).
  • RF radio frequency
  • Examples of such leads include guidewires and/or interventional leads such as, for example, implantable pacemaker leads, spinal cord stimulator leads, deep brain stimulator leads, electrophysiology or other cardiac leads, leads used for implanted monitors, and leads used to administer a therapy during a surgical procedure.
  • the coupling can sometimes result in local heating of tissue adjacent the lead(s) due to RF power deposition during the MRI/MRS procedure, potentially leading to undesired tissue damage.
  • MRI is a non-invasive imaging modality with excellent soft tissue contrast and functional imaging capabilities.
  • MRI can be a contraindication for patients with implanted electrically conducting devices and wires, including cardiac pacemakers and/or defibrillators with leads connecting implantable pulse generators (IPGs), deep brain stimulation (DBS) electrodes, spinal cord stimulators, physiological monitors, etc..., for several reasons.
  • IPGs implantable pulse generators
  • DBS deep brain stimulation
  • the electronics of the IPG/ICD may fail when in presence of the high magnetic fields, or the RF used in MRI may damage the circuitry of the IPG/ICD.
  • the implanted lead may couple to local electric fields induced in the body during transmission of RF excitation pulses whereby the lead can unduly heat tissue adjacent the lead, or may propagate the RF to electrodes at the distal end of the lead or to the device or IPG to which it is connected, potentially causing local temperature rise to unsafe levels and/or damage to the implanted device.
  • the heating problem has been reported in the scientific literature by researchers.
  • Luechinger et al. reported a local temperature rise of 20°C in tissue adjacent to pacemaker leads implanted in pigs during an MRI scan. See, Luechinger et al. In vivo heating of pacemaker leads during magnetic resonance imagine, Eur Heart J 2005; 26(4):376-383 .
  • Rezai et al. reported in vitro tissue heating in excess of 20°C adjacent to DBS (deep brain stimulation) leads during an MRI scan.
  • Rezai et al. Is magnetic resonance imaging safe for patients with neurostimulation systems used for deep brain stimulation? Neurosurgery 2005;57(5):1056-1062 .
  • Even external leads such as those used for measuring and monitoring physiological signals (electrocardiograms, EKG, electroencephalograms, blood pressure, sonography) during MRI may be subject to heating.
  • RF diathermy or ablation or cauterization of tissue can sometimes employ implanted or intra-body leads that may also couple to the applied RF EM field and cause unsafe tissue heating, such as that reported for a patient undergoing RF diathermy.
  • Embodiments of the present invention are directed to RF/MRI compatible leads and/or conductors.
  • the leads and/or conductors are configured to inhibit, limit and/or prevent undesired heating of local tissue and/or the propagation of RF to an attached electronic device by the leads when exposed to certain levels of RF.
  • Particular embodiments of the present invention are directed to flexible implantable leads with one or multiple conductors that can be safely used in an external RF field, such as those used for MRI or MRS.
  • the configuration of the conductor(s) can reduce unwanted coupling to RF-induced electric fields generated in the body and may reduce, minimize and/or inhibit common mode current/voltage.
  • the leads can be configured so that RF power deposition from the leads to adjacent tissue is reduced, permitting patients implanted with such leads, to benefit from MRI/MRS under safer conditions and/or permitting the use of elongate leads, cables and the like to be used in magnet bores associated with MR Scanners during MRI procedures.
  • Some embodiments are directed to RF/MRI compatible medical devices that include an elongate electrical medical lead having at least one conductor with opposing proximal and distal portions.
  • the at least one conductor turns back on itself at least twice so that it has a first section that extends in a first lengthwise direction for a first physical length, then turns to define at least one reverse section that extends in a substantially opposing lengthwise direction for a second physical length, then turns again to define a third section that extends in the first lengthwise direction for a third physical length.
  • the first, second and third physical lengths can be a minor sub-portion of an overall length of the at least one conductor, and may include a plurality of sets of turns.
  • the conductor can be configured with a single set of longer turns forming the first, second and third lengths may occupy substantially the entire length of the conductor.
  • the at least one electrical lead may be configured so that the lead heats local tissue less than about 10 degrees Celsius (typically about 5 degrees Celsius or less) or does not heat local tissue when a patient is exposed to target RF frequencies at an input peak SAR of at least about 4 W/kg and/or whole body average SAR of about 2 W/kg.
  • the electrical lead heats local tissue less than about 2 degrees Celsius when exposed to target RF frequencies associated with MR Scanners at a peak input SAR of about 4 W/kg and/or whole body average SAR of about 2 W/kg.
  • the electrical lead can be configured to heat local tissue less than about 5 degrees Celsius when exposed to target RF frequencies associated with MR Scanners generating a peak input SAR of between about 4-10 W/kg and/or a whole body average SAR of between about 2-5 W/kg.
  • the lead systems include a lead comprising at least one conductor. Each of the at least one conductors is configured with a plurality of (RF-induced) current suppression modules.
  • the lead systems also include at least one electrode in communication with the at least one conductor.
  • the medical lead system may be configured so that the reverse segment has a physical length that is shorter than that of the forward segment, and wherein the forward and reverse segments have an electrical length that is about ⁇ /4 or less of an electromagnetic wavelength of interest of the at least one conductor in a target body.
  • the lead system may be configured to heat local tissue less than about 10 degrees Celsius (typically about 5 degrees Celsius or less) when exposed to RF associated with an MRI Scanner at a peak input SAR of between about 4 W/kg to about 10 W/kg and/or a whole body average SAR of between about 2 W/kg to about 5 W/kg.
  • the second physical distance being less than the first and/or third physical distance.
  • the first forward and first rearward portions can have a substantially equal electrical length when exposed to RF frequencies associated with an MRI Scanner.
  • Still other embodiments are directed to medical leads with at least one conductor having spaced apart current suppression modules. At least one of the current suppression modules comprising a length of conductor having a plurality of closely spaced conductor portions in a serpentine shape.
  • the serpentine shaped closely spaced conductor portions can include conductor segments that extend in a lengthwise direction with bend portions therebetween that reside substantially within a substantially common localized lengthwise extending region of the lead.
  • Additional embodiments are directed to MRI/RF safe lead systems that include: (a) an elongate flexible lead with a plurality of conductors having a length with opposing proximal and distal end portions, the conductors each having a plurality of current suppression modules extending along the length of the conductor, each current suppression module comprising at least one coiled segment; and (b) a plurality of electrodes, one or more of the conductors in communication with a respective one of the electrodes.
  • the lead system may be configured to inhibit undesired temperature rise in local tissue to less than about 10 degrees Celsius (typically about 5 degrees Celsius or less) when exposed to RF frequencies associated with the MRI scanner at a peak SAR input of between about 4 W/kg to at least about 10W/kg and/or at a whole body average SAR of between about 2 W/kg to at least about 5 W/kg.
  • the lead system may be configured with corresponding pairs of the forward and rearward portions having substantially the same electrical length, and with the forward portions have a lengthwise physical length of between about 2-50 cm, and wherein the rearward portions have a lengthwise physical length of between about 1-25 cm.
  • Yet other embodiments are directed to implantable flexible leads that have a plurality of conductors extending between opposing proximal and distal end portions of the lead.
  • One or more of the conductors is connected to at least one or a plurality of electrodes at the distal end portion thereof and at least some of the plurality of conductors are configured with at least one coiled conductor portion and at least one closely spaced serpentine shaped conductor portion.
  • the implantable flexible lead system may be configured so that at least one of the conductors is configured so that at least some of the serpentine shaped portion resides inside the coiled portion of the respective conductor.
  • Some embodiments are directed to an implantable flexible lead that includes at least first and second conductors extending between opposing proximal and distal end portions of the lead. One or more of the conductors is connected to at least one of a plurality of electrodes at the distal end portion thereof.
  • the first and second conductors include a substantially straight portion and a coiled portion. The straight portion of the first conductor extends in a lengthwise direction outside and proximate to the second conductor coiled portion or inside and through the second conductor coiled portion.
  • Yet other embodiments are directed to methods of fabricating a medical lead
  • the methods include: (a) providing a length of at least one elongate conductor; and (b) turning the at least one conductor back on itself at least twice to define two forward portions that extend lengthwise in a forward direction and at least one rearward portion that travels in substantially opposing rearward direction for a second lengthwise physical distance.
  • the methods may optionally also include, after the turning step, forming a flexible implantable lead body and sterilizing and packaging the implantable lead body.
  • Still other embodiments are directed to lead systems with an elongate electrical conductor adapted to reside in a patient with a first forward extending segment having a corresponding first electrical and physical length and a second reversed segment of the electrical conductor in close proximity to the first segment and extending in a substantially opposing lengthwise direction from the first forward segment.
  • the second reversed segment has substantially the same or a shorter physical length than the first forward segment with substantially the same, less or greater electrical length as the first forward segment when exposed to RF in the range of between about 1 MHz to at least about 200 MHz.
  • Additional embodiments are directed to methods of inhibiting heating local tissue and/or suppressing or offsetting common mode RF currents in an electrical lead configured to reside in a patient, the electrical lead comprising at least one conductor having a first forward section with a first physical forward length and at least one reversed section extending in a substantially opposing lengthwise direction from the first forward section, the at least one reversed section has a second physical reverse length that is shorter than that of the first forward section and with an electrical length that is substantially the same or greater than that of the first forward section.
  • the method includes: (a) generating RF induced common mode current in the first forward section and the at least one reversed section of the electrical conductor, whereby common mode current flows in the first forward section and the reversed section in substantially the same direction; and (b) offsetting the current in the first forward section and the reversed section at a localized region of the conductor between the first forward and the reversed section.
  • the method may include placing the patient in an MRI scanner to carry out the generating step, then transmitting an electrical output to local tissue via an electrode in communication with the at least one conductor first forward and reverse sections thereby inhibiting the electrode from unduly heating local tissue whereby the first forward and reverse sections suppress common mode current propagated to the electrode by the electrical lead.
  • inventions are directed to lead systems adapted to connect two electronic devices and provide substantial immunity to signals induced by virtue of proximity to an electromagnetic radiation source.
  • the lead systems include at least one elongate conductor having a first elongate forward section that extends in a forward lengthwise direction for a first forward physical length, then turns to define at least one reverse section that extends in a substantially opposing reverse lengthwise direction for a reverse physical length, then turns again to define another forward physical length.
  • the at least one conductor is configured to be substantially immune (inhibit or not propagate) to RF induced current and/or common mode signals induced by proximity to an electromagnetic radiation source.
  • Yet other embodiments are directed to an RF compatible medical lead that includes at least one continuous length of conductor having at least one segment with the lead configured to turn back on itself at least twice in a lengthwise direction.
  • Still other embodiments are directed to a conductive medical cable with at least one conductor configured for use in an MR Scanner bore, the conductor configured to turn back on itself at least twice in a lengthwise direction to define an RF-induced heat resistant cable.
  • phrases such as “between X and Y” and “between about X and Y” should be interpreted to include X and Y.
  • phrases such as “between about X and Y” mean “between about X and about Y.”
  • phrases such as “from about X to Y” mean “from about X to about Y.”
  • the term "lead” refers to an elongate assembly that includes one or more conductors.
  • the lead typically connects two spaced apart components, such as, for example, a power source and/or input at one end portion and an electrode and/or sensor at another position, such as at a distal end portion or electrodes at both end portions.
  • the lead is typically flexible.
  • the lead can be substantially tubular with a cylindrical shape, although other shapes may be used.
  • the lead can have a solid or hollow body and may optionally include one or more lumens.
  • a lead can be a relatively long implantable lead having a physical length of greater than about 10 cm (up to, for example, 1 m or even longer).
  • the term "physical length” refers to a length that and can be measured in units of length or distance, e.g ., millimeters, inches and the like, and is typically constant and does not vary when exposed to different electromagnetic fields (unlike electrical wavelengths), recognizing that a physical length may shrink or expand when exposed to low or high temperatures.
  • the lead can include at least one electrode, and in some embodiments, a plurality of electrodes (which may be both on proximal and distal end portions), and in some particular embodiments, at least one electrode can be a recording or sensing electrode or both a recording and stimulating and/or ablating electrode.
  • conductor and derivatives thereof refer to a conductive trace, filar, wire, cable, flex circuit or other electrically conductive member.
  • a conductor may also be configured as a closely spaced bundle of filars or wires.
  • the conductor can be a single continuous length.
  • the conductor can be formed with one or more of discrete filars, wires, cables, flex circuits, bifilars, quadrafilars or other filar or trace configuration, or by plating, etching, deposition, or other fabrication methods for forming conductive electrical paths.
  • the conductor can be insulated.
  • the conductor can also comprise any suitable MRI-compatible (and biocompatible) material such as, for example, MP35N drawn filled tubing with a silver core and an ETFE insulation on the drawn tubing.
  • CSM current suppression module
  • MCSM current suppression module
  • backward refers to a lengthwise or longitudinal direction that is substantially opposite a forward lengthwise or longitudinal direction.
  • sections refers to discrete sub-portions of a conductor or lead.
  • MR compatible means that the material is selected so as to be non-ferromagnetic and to not cause MR operational incompatibility, and may also be selected so as not to cause undue artifacts in MR images.
  • RF safe means that the device, lead or probe is configured to operate within accepted heat-related safety limits when exposed to normal RF signals associated with target (RF) frequencies such as those frequencies associated with conventional MRI systems or scanners.
  • high impedance means an impedance that is sufficiently high to reduce, inhibit, block and/or eliminate flow of RF-induced current at a target frequency range(s).
  • the impedance has an associated resistance and reactance as is well known to those of skill in the art.
  • Some embodiments of the lead and/or conductors of the instant invention may provide an impedance of at least about 100 Ohms, typically between about 400 Ohms to about 600 Ohms, such as between about 450 Ohms to about 500 Ohms, while other embodiments provide an impedance of between about 500 Ohms to about 1000 Ohms or higher.
  • Embodiments of the invention configure leads that are safe (heat-resistant) at frequencies associated with a plurality of different conventional and future magnetic field strengths of MRI systems, such as at least two of 0.7T, 1.0T, 1.5T, 2T, 3T, 7T, 9T, and the like, allow for safe use in those environments (future and reverse standard MRI Scanner system compatibility).
  • the term “tuned” with respect to a coil means tuned to define a desired minimal impedance at a certain frequency band(s) such as those associated with one or more high-field MRI Scanner systems.
  • the word “tuned” means that the circuit has a high impedance at one or more target frequencies or frequency bands, typically including one or more MRI operating frequencies.
  • coil segment refers to a conductor ( e . g ., trace, wire or filar) that has a coiled configuration.
  • the coil may have revolutions that have a substantially constant diameter or a varying diameter or combinations thereof.
  • co-wound segments means that the affected conductors can be substantially concentrically coiled at the same or different radii, e.g., at the same layer or one above the other.
  • co-wound is used to describe structure indicating that more than one conductor resides closely spaced in the lead and is not limiting to how the structure is formed ( i . e ., the coiled segments are not required to be wound concurrently or together, but may be so formed).
  • volutions refers to the course of a conductor as it rotates about its longitudinal/lengthwise extending center axis.
  • a conductor where coiled can have revolutions that have a substantially constant or a varying distance from its center axis or combinations of constant and varying distances for revolutions thereof.
  • swipe refers to a curvilinear shape of back and forth turns of a conductor as a subset of a length of the conductor, such as, for example, in an "s" or “z” like shape, including, but not limited to at least one flattened “s” or “z” like shape, including a connected series of "s” or “z” like shapes or with additional sub-portions of same or other curvilinear shapes to define forward and backward sections of a conductor.
  • the upper and lower (and any intermediate) lengthwise extending segments of a serpentine shape may have substantially the same or different physical lengths.
  • SAR Specific Absorption Rate
  • the term "Specific Absorption Rate” is a measure of the rate at which RF energy is absorbed by the body when exposed to radio-frequency electromagnetic fields.
  • the SAR is a function of input power associated with a particular RF input source and the object exposed to it, and is typically measured in units of Watts per kilogram (W/kg) taken over volumes of 1 gram of tissue or averaged over ten grams of tissue or over the entire sample volume, or over the volume of the exposed portion of the sample.
  • W/kg Watts per kilogram
  • SAR can be expressed as a peak input and/or whole body average value. Different MRI Scanners may measure peak SAR in different ways resulting in some variation as is well known to those of skill in the art, while whole body average values are typically more consistent between different MR Scanner manufacturers.
  • Peak input SAR measurement is an estimate of the maximum input RF energy deposited in tissue during an MRI scan.
  • the peak SAR temperature(s) is typically measured near the surface.
  • the phantom can be any shape, size and/or volume and is typically substantially filled with a medium simulating tissue, e.g., the medium has electrical conductivity corresponding to that of tissue - typically between about 0.1-1.0 siemens/meter.
  • the medium can be a gel, slurry, or the like, as is well known, and has conduction and/or convective heat transfer mechanisms.
  • low DC resistance refers to leads having less than about 1 Ohm/cm, typically less than about 0.7 Ohm/cm, so, for example, a 60-70 cm lead can have DC resistance that is less than 50 Ohms. In some embodiments, a lead that is 73 cm long can have a low DC resistance of about 49 Ohms. Low DC resistance can be particularly appropriate for leads that connect power sources to certain components, e.g ., electrodes and IPGs for promoting low-power usage and/or longer battery life.
  • the lead can have good flexibility and high fatigue resistance to allow for chronic implantation.
  • the lead can easily bend over itself as shown in Figure 49 .
  • the lead, when held suspended in a medial location is sufficiently flexible so that the opposing long segments drape or droop down together (do not hold a specific configuration).
  • the lead can be sufficiently fatigue resistant to withstand 1 million cycles of a degree of motion that includes axial rotation and lateral translation that is many times greater than that imparted to the lead in position due to human anatomy/organ movement.
  • the stroke cycle can be carried out at rates of between about 8-9 Hz (which is relatively fast compared to an average, resting human heartbeat rate of about 1Hz).
  • a lead does not exhibit breakage, breakdown of insulation (insulation resistance breakdown or cracking, splitting or rupture of insulation) or short or open circuits when exposed to the test cycles.
  • the leads can be tested submerged in a liquid (Normal saline) using a test fixture that automatically cycles a lead through a translational stroke of about 2. 9 inches.
  • This stroke was selected to greatly exceed normal anatomical motions of the intended implant or use location of the lead (e.g., a cardiac cycle for cardiac leads) or respiratory cycle for leads that reside over the pulmonary region and the like.
  • the lead can also be configured to withstand rotation of about 180 degrees/half-cycle.
  • the test fixture 350 includes a drive system 370 that can include a motor 370 with a gear 372 that drives a belt or chain 371 that rotates wheel 380.
  • a connecting rod 381 connects the wheel 380 to a linear slide block 393 that linearly slides over table 395.
  • the slide block 393 is also connected to a rotational member 375 such as a gear assembly, e.g ., a rotating gear 390 in communication with a stationary rack gear 376 (e.g., a rack and pinion gear assembly).
  • the wheel 380 rotates continuously which pulls the connecting rod and the connected linear slide back and forth causing the gear 390 to rotate thus imparting linear and rotational forces on the underlying lead 20.
  • the lead 20 can be attached to the fixture 350 using a holder such as a lower extending rod 399 (e.g., a PEEK (poly ether-ether ketone) rod) that is held similar to an axle 391 in the center of the gear 390 and extends vertically down into a liquid bath (e.g ., an end portion of the lead can be epoxied to or mechanically attached to the rod) so that the linear translation and rotation motion of the stroke cycle generated by the wheel 380 and rotation of gear 390 are directly imparted to the lead 20.
  • the movement is automatically carried out using the automated drive system 370 that automatically cycles the test specimen 20 repeatedly and continuously through a stroke cycle at a desired rate/frequency.
  • the rod 390 is partially immersed in a temperature controlled, circulated water bath of Normal saline solution, while the lead 20 is completely immersed.
  • the "free end" of the lead can optionally be secured with a weight to confine the motion to a region or portion of the lead.
  • the fixture 350 can provide discrete stroke adjustments in desired increments.
  • the wheel 380 includes several apertures 382 sized and confgured to slidably receive mounting pin 383 ( Figure 54C ).
  • the apertures 382 are radially offset at different distances from the center of the wheel 380. By placing the connecting rod/crank pin 383 in a different aperture 382, the rod 381 and the slide block 393 move a different linear distance through the rotation of the wheel 380.
  • the rack 376 is held at an adjustable location in slots 377 ( Figure 54B ).
  • a different size diameter gear 390 see, Figure 54C , 390a, b, c ) can be placed on the slide block 393 and engage the stationary gear 376 to rotate a lesser amount (a larger circumference) based on the linear movement of the slide table 393.
  • both linear and rotational movement is easily adjusted using this fixture 350.
  • Two embodiments of leads 20 with MCSMs formed of tri-layer stacked coils were tested with this fixture and withstood over 2 million cycles and over 15 million cycles, respectively.
  • the leads may be particularly suitable for medical use, and can be used with interventional or other devices and may be acutely placed externally or in vivo or may be chronically implantable and can include one or more of a stimulating, ablating and/or recording electrode and/or sensor.
  • the leads may be particularly suitable for implantable lead systems for IPGs, cardiac defibrillators, cardiac pacing (CP), neurostimulation or neuromodulation (peripheral, deep brain, or spinal), EP catheters, guidewires, SCS or any cable or conductors, particularly those that operate in an MR Scanner, and the like.
  • the leads may be implantable, MRI compatible multi-purpose lead systems with at least one stimulating/pacing electrode (in some embodiments with electrodes at both end portions) and may optionally be configured to provide an internal MRI receive antenna.
  • the leads may be particularly suitable as implantable or therapeutic devices for animal and/or human subjects.
  • the leads can be sterilized and packaged for medical use.
  • Some lead embodiments can be sized and configured for brain stimulation, typically deep brain stimulation.
  • Some probe embodiments can be configured to stimulate a desired region of the sympathetic nerve chain.
  • Other embodiments may be directed to other anatomical structures, organs or features including the heart.
  • the leads of the present invention may be configured for use in interventional procedures or as implantable leads for treating cardiac, gastrointestinal, urinary, spinal or other organs or body regions.
  • the leads function as conventional pacemaker/ICD leads, i.e., leads that sense and transmit electrophysiological signals to the pacemakers/ICDs and deliver stimulation pulse from the IPG/ICD to the cardiac tissue.
  • the leads can be configured to connect two devices and provide substantial immunity to (common mode signals induced by virtue of proximity to) an electromagnetic radiation source and/or electromagnetic fields having frequencies between about 1 MHz to at least about 1THz, typically between 1MHz and 1 GHz.
  • the electromagnetic radiation source can be from RADAR, communications transmission, e.g ., satellite or extra-territorial and territorial based cellular systems, television transmission, and/or radio transmission.
  • the lead may be used as an external non-medical device.
  • the lead may also be configured for both internal/external use or combinations thereof
  • the lead can be configured as an implantable or interventional (acutely placed) medical lead that connects two internal devices, such as one or more electrodes to an IPG, a medical lead that connects one internal device to an external device (e.g., a therapeutic delivery device such to an external power source, control unit or supply), or an external medical lead that connects two external devices (such as a grounding pad to an RF generator for an EP (electrophysiology) ablation procedure).
  • an implantable or interventional (acutely placed) medical lead that connects two internal devices, such as one or more electrodes to an IPG
  • an external device e.g., a therapeutic delivery device such to an external power source, control unit or supply
  • an external medical lead that connects two external devices (such as a grounding pad to an RF generator for an EP (electrophysiology) ablation procedure).
  • embodiments of the invention are directed at single or multi conductor leads where the conductor(s) of the lead are arranged so as to reduce RF pickup by the lead during exposure to electromagnetic fields, such as, but not limited to, those associated with RF pulse sequences used with MRI Scanners.
  • the conductors can be arranged in multiple CSMs along the length of the lead.
  • the CSMs can be configured to have low impedance of between, for example, 5-30 Ohms, while in other embodiments, the CSMs can have an impedance of greater than about 50 Ohms, e.g., an impedance of at least 100 Ohms, such as at least about 200 ohms, at MRI frequencies and the electrical length can be configured to be about or shorter than a quarter wavelength in a physiological medium in the electrical field.
  • This configuration may significantly reduce coupling of the lead to the RF induced in the body during an MRI scan, and propagation of the current along the length of the lead and into the tissue adjacent to any associated electrodes that the lead may optionally have.
  • this applied RF magnetic field has a frequency of about 64 MHz.
  • This field is perpendicular to the MRI scanner's static magnetic fields, and is linearly or circularly polarized.
  • the RF magnetic field can have associated with it an electric field, whose spatial distribution depends on the geometry of the MRI scanner's excitation coil and on the patient, but generally has the greatest amplitude closest to its conductors.
  • the applied RF pulses can directly induce an electric field with an associated voltage and current in the metallic leads, implants (especially elongated ones) and conductors, consistent with Faraday's Law and Maxwell's equations, as is well known to those skilled in the field of Electricity and Magnetism. Further, the applied RF pulses generate local electric fields in the body that can be effectively focused by the presence of metallic implants and electrical leads. In both cases, any voltages and currents that are induced in the conductors of the lead may cause them to resistively heat.
  • Leads for use with implanted devices, monitors and IPGs are typically designed for the conduction of direct current (DC) or audio frequency (AF) signals, and are typically electrically insulated along their length except for electrode contacts.
  • Devices incorporating designs and arrangements of conducting implantable leads according to embodiments of the invention can significantly ameliorate sensitivity to induced RF currents and RF power deposition and/or other RF or MRI based heating phenomena. These arrangements can reduce the magnitude of the induced RF current and/or voltages, thereby suppressing to a significant extent the RF power deposited on and/or associated with the lead, and consequently deposited in tissue adjacent to the lead (and electrode(s)). By this, the local temperature rise in the tissue adjacent the lead and/or electrode(s) is reduced.
  • the lead is able to heat local tissue less than about 10 degrees Celsius above ambient or body temperature, more typically about 5 degrees Celsius or less, when a patient is exposed to target RF frequencies at a peak SAR of at least about 4W/kg, typically up to at least about 20W/kg, and/or a whole body average SAR of at least about 2W/kg, typically up to at least about 10 W/kg.
  • the lead can induce a limited increase in temperature of less than about 6 degrees Celsius, typically about 5 degrees or less, with the temperature increase at a peak SAR of about 4.3 W/kg being less than about 2 degrees Celsius so that a maximum temperature rise associated with the lead is less than about 2 degrees Celsius.
  • the lead is able to heat local tissue less than about 6 degrees Celsius when exposed to a peak SAR of between about 8W/kg to about 12 W/kg, with the temperature increase at a peak SAR of about 8W/kg and/or a whole body average SAR of about 4W/kg is typically less than about 4 degrees Celsius, and, in some embodiments can be below about 1 degree Celsius.
  • embodiments of the invention can employ one or more functional underlying mechanisms incorporated by arrangements of conductors to thereby suppress and/or minimize RF coupling, induced currents, and/or RF power deposition when implemented as external, implantable or intrabody leads subjected to RF EM fields. These suppression mechanisms shall be discussed further below, in embodiments of the invention detailed herein.
  • the leads can be used in several situations where individuals who have external or implanted conductors and devices may be exposed to EM fields that could induce currents in them and thereby present a safety concern or equipment malfunction, such as, for example, but not limited to, RADAR, radio, wireless (cellular) telephone or communications and TV transmission and reception installations/facilities/equipment (fixed or mobile), RF devices, as well as MRI.
  • RADAR radio, wireless (cellular) telephone or communications and TV transmission and reception installations/facilities/equipment (fixed or mobile), RF devices, as well as MRI.
  • the coupled and induced currents in the conductors are in the same direction, and shall henceforth be termed "common mode currents".
  • This current travels back and forth at the RF, and can cause a local temperature to rise to unsafe levels especially where currents peak at the ends, in tissue adjacent to electrodes, for example as shown in Figures 1 and 2.
  • Figure 2 illustrates temperature rise on two different leads, an SCS (spinal cord stimulation) lead and a DBS (deep brain stimulation) lead.
  • the local temperature rise can be proportional to the total RF power deposited on the conductor, which is a function of: the applied RF field strength, frequency and duty cycle; the electrical length of the conductor in the body, which is a function of the conductor's RF impedance (its conductivity, insulation thickness and the complex impedance of the environment around the conductor); and the size and RF electrical properties of the body.
  • the conductor e.g ., wire
  • the electrical length of reversed sections are modified so as to alter their physical length, while providing a canceling, nulling or offset affect of common mode currents.
  • the lengths of the sections are chosen based on considerations described hereinbelow, which also include factors that relate the impedance and transmission line characteristics of the conductor, and/or its EM wavelength.
  • the reverse sections can have a physical length that is less or the same as at least one adjacent (neighboring) forward section and may have an electrical length that is less, the same or more than that of the at least one adjacent (neighboring) forward section.
  • the top conductor 2 configuration is of a 27 cm long straight conductor.
  • This configuration conductor was placed in a simulated tissue gel phantom and subjected to external RF fields in a 1.5T MRI scanner operating at about 64 MHz, a local temperature change of about 20°C was measured in the tissue adjacent to the electrode ( see, Figure 8C ).
  • modifying the 27 cm conductor 2 configuration as shown by conductor 3 with the conductor 3 turned upon itself (in about 9 cm sections) to define a conductor portion or segment having a BS section 10 and two FS sections 9 causes a substantially lower local temperature change, measured as less than about 1°C during the same MRI scan carried out for conductor 2, which is similar to that seen with a conductor 5 having a 9 cm conductor as shown by the bottom conductor configuration.
  • Conductor 5 has a physical length of about 9 cm and may have an electrical length of about ⁇ /4 or less. The temperature reduction is believed to reflect reduced coupling to the local E-fields because of the reduced length of each section (9 cm vs. 27 cm).
  • a common mode current may be induced in all three sections of the turned 27 cm conductor 3.
  • the current in one forward section 9 1 of the conductor 3 may be thought of as being canceled or reduced by the current in the reverse (backward) section 10, leaving a reduced (or net un-canceled) current in the third (9 cm) section 9 2 consistent with this conductor 3 producing substantially the same heating as the shorter (9 cm) length conductor 5, alone.
  • other or additional operational mechanisms may be responsible for the reduced heating.
  • the length of implanted leads can become comparable to the EM wavelength of current in the leads, which generally results in modulation of the currents as a function of distance along the lead due to the EM wave, which can cause any heating that occurs in the exposed sections ( 9 1 , 9 2 , and the like) to vary with position in response to variations in the current amplitude, and can thereby modulate the common-mode suppression strategy outlined above.
  • each individual CSM 8 or a respective BS 10 and/or FS 9 thereof may have an electrical length that is preferably no more than about ⁇ /4, typically shorter than ⁇ /4, where ⁇ is the EM wavelength of the conductor in the body at the RF of interest (e.g ., the operational frequency of the MRI scanner).
  • each module 8 has at least two sections, a forward section (FS) 9 and a backward section (BS) 10.
  • the FS 9 and BS 10 can have similar or substantially equal electrical lengths, and thus experience a similar extent of coupling to the EM fields and similar magnitudes and direction of induced common mode current when immersed in the same EM fields.
  • these similar magnitudes and directions of the currents induced in the forward and backward sections can be thought of as meeting each other at the ends of each section, resulting in a substantial cancellation of the current, as distinct from conventional straight leads wherein the current(s) can continue unabated and even increase, potentially causing undesired heating.
  • non-equivalent electrical length configurations may be used, for example, a shorter electrical length in a FS 9 relative to a corresponding BS 10, and in the location of the BS 10 on a proximal length, or on a distal length, relative to the overall physical length of the conductor 3 (e.g., wire or filar), and/or symmetrically disposed relative to a first turn or bend in the conductor 3.
  • a shorter electrical length in a FS 9 relative to a corresponding BS 10 and in the location of the BS 10 on a proximal length, or on a distal length, relative to the overall physical length of the conductor 3 (e.g., wire or filar), and/or symmetrically disposed relative to a first turn or bend in the conductor 3.
  • the electrical length and wavelength ( ⁇ ) of a conductor is a function of its physical length, RF impedance, the insulator/dielectric material surrounding it and the electrical properties of the medium it is placed in.
  • the electrical length and wavelength ( ⁇ ) of a conductor is a function of its physical length, RF impedance, the insulator/dielectric material surrounding it and the electrical properties of the medium it is placed in.
  • a copper wire of the type used for winding magnetic coils (“magnet wire") 9 cm long is roughly equal to ⁇ /4.
  • increases, i . e ., the 9 cm long conductor with insulation now has an electrical length that is shorter than ⁇ /4.
  • coiling a length of the conductor can affect the effective physical and electrical lengths.
  • the ⁇ /4 length of the coil depends on the diameter of the conductor and the diameter of the coil.
  • a 9 cm straight conductor (e.g ., magnet wire) 9 is electrically equivalent in length to a wire 10 having a 3.5 cm straight section 10s and a 1.5 cm coil 10c formed of the conductor (e.g ., magnet wire (diameter 0.040" ID)); and to a ⁇ 2.5 cm of the same conductor ( e . g ., magnet wire) coiled 10c to an ID of 0.040" ( Figure 9 ).
  • Figure 5 illustrates that the backward section 10 has a coiled section 10c and an overall physical length "L CB " of about 5 cm to provide substantially the same electrical length as the forward section 9, shown here with a linear (straight) length of about 9 cm.
  • one or both of the FS 9 and/or BS 10 segments of each or some CSMs 8 on a lead may each be coiled or comprise coiled segments.
  • sections 9 and 10 are subjected to the same or a similar EM field such that the common mode currents are induced in the same direction, depicted here by arrows, will provide a certain level of cancellation where the sections meet. It would appear that if sections 9 and 10 are of electrically substantially equivalent lengths, and if the EM field is the same across the lengths of both sections, then cancellation should be complete.
  • the FS and BS portions 9, 10 of proposed current suppression modules 8 have RF electrical impedances comprised of the total resistance of the section, and a reactive component comprised primarily of the inductance of coil portions.
  • coil can include discrete circuit inductors (which are typically micro-wound coils; non-magnetic and MRI-compatible for MRI applications) in addition to those coils formed by the conducting leads.
  • the reactive component may include parallel capacitance depicted as connecting between FSs 9 and BSs 10 and that is distributed mutually between lead sections or included as discrete components, as well as stray capacitance between the surrounding environment in which the lead is placed, as illustrated in Figure 6A .
  • the distributed capacitance may vary from being of negligible value to tens of pF.
  • Discrete circuit elements capacitors and/or inductors
  • the reactance is a determinant of the EM wavelength in the sections, and their electrical lengths as discussed above.
  • the conductor arrangements of FS 9 and BS 10 as shown in Figure 5 may potentially be thought of as adding the benefit of a high-impedance filtering effect when the magnitude of the impedance at the RF frequency of interest is large, for example ⁇ 100 Ohms. In general, this can occur over a range of frequencies, and in addition, higher levels of filtering can be expected at certain specific frequencies where the conductor electrical lengths correspond to integral multiples of ⁇ /4.
  • the RF filtering may be due to the impedance of the modules that is typical of that of inductor-capacitor (LC) circuits: the impedance at a particular frequency is determined by the series inductance formed substantially by the coils incorporated into the sections, and by the parallel capacitance, which can arise between the conducting lead and the adjoining environment, including nearby conductor portions ( e . g ., 9 and 10).
  • LC inductor-capacitor
  • the substantially straight sections 9 in conjunction with the BS coiled section 10c may be thought of as forming an LC circuit that provides an RF filter affect.
  • the coiled section 10c can be an electrical equivalent of a series inductor and a capacitance 7 that may be created by a (insulated) coil between the straight section 9 and the coiled section 10c, insulated by a dielectric ( e . g ., a polymer), thus potentially creating a high impedance which suppresses induced RF currents.
  • FIGS 6B-6E are schematic illustrations of a conductor with a CSM 8 of forward and reverse segments 9, 10 and exemplary capacitance configurations according to embodiments of the present invention.
  • the capacitance/capacitors are used in conjunction with the inductance of the conductor ( Figures 6B, 6C, 6D ) or with one or more coiled sections ( Figure 6E ) to reduce the physical length of the lead for a fixed electrical length in order to suppress common mode currents and/or to provide the a high impedance RF filtering effect.
  • Figures 6C and 6D may not be suitable for applications involving passage of direct currents (DC) or low frequency currents for pacemakers etc..., due to the presence of the series capacitances.
  • a purpose of the series capacitances in Figures 6C and 6D can be to augment the impedance of a FS 9 to further improve the RF filter effect.
  • the embodiment of Figure 6E includes a coil 9c in FS 9 in addition to the one in BS 10. These coils are wound in opposite directions to each other, and may be cowound with the FS conductor 9 next to the BS conductor 10 at substantially the same coil radius, or wound one on top of the other in two or more layers, or consecutively coiled.
  • a purpose of the added coil 9c can be to augment the impedance of a FS 9 to further improve the RF filter effect, and may be of different length, diameter, and possess a different impedance from 10c.
  • coil 9c may be formed in either or both of the upper and lower FS 9 portions. When using only a distributed capacitance, Figure 6E , may be accomplished just by forming conductor 3 into FS coils 9c and BS coils 10c.
  • CSMs 8 with respective FS and BS sections 9, 10.
  • One or more of the CSMs 8 can include BS sections 10 having coiled portions 10c and FS sections 9 having coiled portions and leads 20 can include a plurality of conductors 3, as depicted , and described in the examples presented hereinbelow.
  • Figure 7 depicts a prototype single lead system that has a length L 1 (such as about 36 cm long) with a single electrode 4 showing four of six RF induced current suppression modules 8 each with two FSs 9 with a length L 2 (such as about 9 cm long) corresponding to approximately ⁇ /4 at 64 MHz, and each with one with a BS 10 with a length L 3 (such as about 5 cm) including a longer straight length L 4 (of about a 3.5 cm) and a shorter coiled length segment (of about a 1.5 cm) 10c.
  • the conductor is formed from 0.007" diameter magnet wire and the coiled sections 10c have an inner diameter of 0.040".
  • the coiled BS 10 provides the inductance, and FS 9 couples with the inductor, with the stray capacitance contributed by the electrical coupling between the FSs 9 and BSs 10 themselves and the environment.
  • both the respective sections 9, 10 of the module 8 are in close proximity, they can couple to substantially the same local E-fields and have substantially the same direction of RF current induced in them at a given time, so that, in accordance with the above discussion, the current deposited on the forward section 9 may be thought of as being cancelled to a significant extent by the current induced in the backward section 10 at the point where the sections meet, and overall less induced current flows toward the electrode 4 and into the adjacent tissues compared to that which occurs without CSMs 8.
  • FIG 7 The prototype shown in Figure 7 , underwent in vitro tissue heating tests in a 1.5T MRI scanner operating at 64 MHz by placing it in an gel medium having similar electrical properties as a healthy muscle (conductivity, 0.7 Siemens/m conductivity). Local temperature rise in various sections (namely in gel adjacent to electrode 4) was measured using a fiberoptic temperature measurement system.
  • Figure 8A illustrates the change in temperature (°C) versus time (sec) for this lead in the gel at the electrode end, which is less than 0.5°C.
  • a control lead of a straight conductor of the same length in the same field displayed a 20°C temperature rise in the gel adjacent to the electrode ( Figure 8C ).
  • FIG. 8B illustrates the in vitro tissue heat test data performed under the same conditions. The heating at the electrode is slightly higher for the 27 cm lead, at about 1°C, but remains within an acceptable range and greatly reduced compared to the 20°C seen in some conventional leads ( Figure 8C ).
  • each backward section 10 has a coiled segment 10c that runs substantially the entire length thereof, for example, about 2.5 cm, rather than about 1.5 cm, as noted above. Other lengths and coil diameters and coil sizes may also be used.
  • the four conductors or leads can be co-wound to provide cowound coiled sections 10c of sections 10 to counter the common mode currents.
  • the coils 10c may serve as series inductances, which, together with stray capacitance 7 with other sections 9 and/or surrounding environment, provide a current suppression affect.
  • a multi-electrode, multi-conductor lead system 20 is illustrated in Figure 11 for a four electrode 4 and/or four conductor 3 lead system 20.
  • Figure 11 illustrates a subset of the modules 8, e.g., five CSMs 8 of an exemplary 11 CSM conductors of a 58 cm lead 20, and five CSMs 8 of 12 CSMs of conductors of a 64 cm lead system.
  • each lead 20 was made with four conductors, namely 0.005" magnet wires (4 wires), each having a straight FS 9 about 9 cm long, and a coiled BS 10c (also interchangeably called a "CBS”) about 4.3 cm long.
  • the coils 10c had a 0.046" ID with respective coiled segments 10c of the different conductors being substantially co-wound.
  • Multiple digital photographs of a prototype lead 20 for connecting between electrodes and an IPG or pacemaker are shown in Figures 12A -D: 12A the entire lead; 12B the distal end showing the electrodes; 12C and 12D, close-up photographs of the modules 8 and coils 10c.
  • These leads 20 were tested for in vitro tissue heating performance in a gel phantom in a 1.5T (64 MHz) MRI scanner system.
  • CSMs 8 for multi-conductor lead systems can typically comprise between about 2-100 conductors 3 and/or electrodes 4, but even greater numbers of conductors 3 and/or electrodes 4 can be formed according to the embodiments described herein are included within the scope of the present invention.
  • one or more such CSMs 8 of the type illustrated in Figure 11 for multiple conductors can be arranged so that a CSM 8 of a respective conductor is separated from a neighboring CSM 8 by an electrical length of ⁇ /4 or less, analogous to the single line arrangement depicted in Figure 7 , where ⁇ is the EM wavelength of the straight (uncoiled) lead in the medium in which it is to be implanted.
  • is the EM wavelength of the straight (uncoiled) lead in the medium in which it is to be implanted.
  • all electrodes may be at one end portion and connectors/interfaces to the power source or other device at the other end.
  • multi-electrode and/or multi-conductor (>2 conductor) embodiments of the present invention can include conductors having separate suppression modules as shown in Figure 7 .
  • the multiple conductors 3 can be grouped with the coil locations 10c displaced one from the other so that the coils 10c do not coincide in space, and the maximum lead diameter does not become excessive.
  • Combinations of cowound and non-cowound coiled sections and grouped or ungrouped conductors may also be used.
  • each coiled segment of a respective conductor can be axially (displaced lengthwise) with respect to others, while in other embodiments some or all of the conductors can be stacked one over the other and/or cowound.
  • the configuration details of the conductors 3 and CSMs 8 are for illustration purposes only and not meant to limit the scope of the present invention. While not wishing to be bound to one theory of operation, it is contemplated that the primary purpose of one or more of the cooperating pairs of forward and reverse sections, the coil sections 9c and/or 10c, and/or the reactive elements depicted in Figure 6A-E (coils and/or capacitors) is to alter the electrical length of the associated conductor lengths so that common mode currents induced on longer sections can be suppressed, offset or inhibited and an electrical connection can be provided between physically separated parts, such as electrodes and IPGs or pacemakers, or external EKG leads (or blood pressure transducer, or blood oxygen transducer, or sonography transducer) and a monitoring system, for example.
  • electrical connection can be provided between physically separated parts, such as electrodes and IPGs or pacemakers, or external EKG leads (or blood pressure transducer, or blood oxygen transducer, or sonography transducer) and a monitoring system
  • Figures 12A is a digital photograph of a prototype flexible lead according to embodiments of the present invention.
  • Figure 12B is a partial view of the prototype shown in Figure 12A with the end of the lead shown straight with respect to a ruler.
  • Figures 12C-12D are enlarged images of a portion of the lead shown in Figure 12B .
  • Figures 13A and 13B are graphs of temperature change (C) over time (seconds) for four electrode and four conductor prototype lead systems according to embodiments of the present invention.
  • the graph in Figure 13A illustrates temperature rise over time at a distal end of a CSM module 1 (DM1) and at a proximal end of CSM 1 (PM1) and in the gel near the electrode if a 4 electrode lead system with 4 conductors and 11 CSM modules having a length of about 58 cm.
  • the graph in Figure 13B illustrates the temperature rise of a 64 cm long prototype lead with 4 conductors and 4 electrodes and 12 CSMs.
  • Figures 14A-14I illustrate exemplary CSM 8 configurations with alternative conductor 3 configurations and BS 10 and FS 9 according to some embodiments of the present invention as applied to a single conducting lead 3.
  • conductor 3 has BS 10 with a coiled segment 10c that runs substantially the entire length thereof analogous to the CSM shown in Figure 9 .
  • Figure 14B illustrates that one FS 9 may extend inside the coil of a BS 10 to provide the cancellation effect discussed above. The FS 9 passing through the coil may pass through any interior portion of the coil, thereby generally resulting in a reduction in the outer diameter of the lead as compared to Figure 14A , but also affecting the RF impedance.
  • FIG. 14C and 14D illustrate that a FS 9 can axially loop or turn several times above, below and/or through a BS 10 (defining several "mini” or “sub” FS 9 1 , 9 2 and an intermediate "mini” BS 10 1 ) before extending axially downstream of the primary BS 10.
  • FIG. 14E illustrates that the FS 9 can include a coiled segment 9c and a linear segment 91, analogous to Figure 6E .
  • the coiled segment 9c can reside proximate the BS 10c.
  • the BS coil 10c and the FS coil 9c can be substantially cowound but with each coil in opposing directions or coiled over or about one another or proximate each other to electrically couple, potentially produce current cancellation at the end of the BS and may generate increased impedance, such as, for example at least about 100 Ohms, and typically about 300 Ohms or more.
  • the coil diameter, conductor size and/or type, and length of coil may be the same in the 9c and 10c sections, or one or more of these parameters may be different.
  • the conductor 3 can be a single continuous conductor along substantially its entire length, and is typically the same conductor at least along a length of a respective CSM 8.
  • Figure 14F illustrates that the conductor 3 can include a continuous closely spaced section of conductor that turns on itself several times in a lengthwise direction, analogous to the axial/lengthwise turns or loops introduced in embodiments Figure14C and 14C .
  • This configuration is similar to that in Figure 14A , except that the coil axis is rotated 90 degrees, whereupon multiple BSs 10 are created by the coil windings.
  • Figures 14G-14I illustrate yet other conductor CSM 8 configurations with a plurality of adjacent longitudinally extending back and forth lengths (which may be straight, taper or may be curvilinear) forming a series of stacked reverse and forward segments 10, 9, respectively.
  • one or more coils 3c may extend between the adjacent CSMs 8, such as is shown in Figure 14K (which also illustrates that the CSM 8 can include one double turn (one reverse segment) configuration.
  • Figure 14J illustrates a configuration similar to Figure 14K but without the coiled intermediate segment 3c.
  • the lead can include combinations of different types and configurations of CSMs 8.
  • Figure 14H illustrates that the modules 8 can include both the side (lengthwise) extending segments and a coiled segment with the side extending segments being inside and/or outside the coiled segment and the coiled segment can be a forward or a reverse segment, analogous to Figure 14C .
  • Figure 141 illustrates that the side segments of adjacent modules 8 in Figure 14G , may be interleaved in part.
  • the interleaving of the conductor(s) is extended in whole, so that the axial and/or lengthwise loops are cowound and form a single module. This can be obtained, for example, by forming a flat loop of conductor at the center of module 8, then folding the loop several times and laying it against the two FSs 9.
  • An alternative embodiment is to wrap the flat loop as a coil around a FS 9.
  • Figures 14L and 14M illustrate that the lead 20 can have at least one conductor 3 at least one CSM 8 that extends between an electrode 4 and a power source, such as an IPG.
  • Figure 14M illustrates that the distal end of the conductor 3 can be coiled as it connects to the electrode 4 to further reduce heating proximate the electrode.
  • Figure 14L illustrates that more than one conductor 3 may be used to connect a single electrode 4 for redundancy and/or lower power or energy transmission or the like.
  • FIG 15A illustrates impedance versus frequency for a single CSM when immersed in a physiological saline solution.
  • the CSM comprises 4.3 cm Coiled Back Sections (CBS) and 9 cm (straight) forward sections (FS).
  • CBS Coiled Back Sections
  • FS straight forward sections
  • the CSM has 4 cowound conductors (for prototype proposes, magnet wires, 0.005" diameter) with the CBS having about a 0.046 inch inner diameter.
  • Figure 15B illustrates that the impedance can be measured by connecting the impedance measurement probe to the CSM at the two points shown by the arrows.
  • Figure 16 illustrates impedance versus frequency for an entire lead with eleven axially spaced consecutive CSMs, when immersed in a physiological saline solution.
  • the lead is a 4 electrode system with FS having a length of about 9 cm and the CBS having a length of about 4.3 cm and an inner diameter of about 0.046 inches.
  • the use of multiple CSMs may alter the impedance dispersion in accordance with the cumulative impedance and wavelength effects associated with the longer lead length.
  • the impedance data shows very low resistance ( ⁇ 1 ohm) at DC frequencies and around 60-300 Ohm impedance at RF frequencies, although a peak of around 1600 Ohm is evident at ⁇ 20 MHz.
  • the conductors 3 can have broadband low pass filtering, while affording a higher impedance narrowband filtering effect at specific frequencies.
  • the location and/or maxima impedance characteristics can be adjusted to other desired RF frequencies by re-configuring the CSM, e . g ., changing one or more of the length of the BS 10, the diameter of conductors defining the coil 10c ( e.g ., inductors) and/or or part of the FS 9c, and/or the number of revolutions on the conductors in the coiled BS 10c.
  • the leads 20 can be configured with multiple FSs 9 and BSs 10, to generate maxima at multiple frequencies (or frequency bands) by adjusting the configuration, e . g ., length/diameter/number of revolutions of different ones of the FSs 9 and/or BSs 10.
  • the conductors 3 with CSMs 8 can have an impedance that varies and exhibits local maxima at a frequency band and/or over a target frequency range.
  • the CSMs 8 can exhibit an impedance of at least about 100 Ohms over its respective length at a target radio frequency of interest.
  • the FS and BS sections 9, 10, respectively, can be configured such that at least one local impedance maxima substantially coincides with at least one frequency (or frequency band) of interest (e.g., 64 MHz for 1.5T, 128 MHz for 3T, etc.) within that range. Because the local maxima are relatively broad, the target frequency band can be within +/- about 5 MHz of the typical RF frequency of an MRI scanner. In some particular embodiments, the target impedance local maxima can also be the global maximum.
  • Figure 17 is a graph of local temperature change measured at different locations along the length of the lead with eleven CSMs (corresponding FS and CBS) in a 1.5T MRI scanner operating at 64 MHz. The test method is as described with respect to Figures 8A-8C .
  • the MRI RF. frequency in this case is 128 MHz.
  • the lead corresponds to that analyzed with respect to Figures 16 and 17 , and the same test method as described for Figures 8A-8C was used.
  • the conductors 3 may provide for rejection of induced voltages and currents over a broad band of RF in the range between about 10 MHz to about 200 MHz.
  • the local maximas can correspond to two or more RF frequencies of interest, where one or more is an RF MRI frequency corresponding to 0.1, 0.3, 0.7, 1.0, 1.5, 2.5, 3, 4, 4.7, 7, and 9.4 Tesla.
  • Figures 19 and 20 are graphs of impedance versus frequency (MHz).
  • embodiment “B” refers to the embodiment shown in Figure 14B
  • embodiment “C” refers to the embodiment shown in Figure 14C
  • embodiment “D” refers to the embodiment shown in Figure 14D .
  • Each embodiment is able to generate multiple local maximas over an RF frequency range (MHz) with Embodiment C generating about 1000 Ohms at between about 70-80 MHz and generating over 200 Ohms between about 50-100 MHz.
  • the word “flooded” means that there was no polymer layer on the conductor (magnet wire) CSMs so that the conductors are in complete contact with the surrounding medium (saline or gel).
  • the conductors 3 can be configured to increase the impedance and/or shift the frequency of local maxima of the impedance depending on the length of the CSM (FS 9, BS 10, FS 9 ) and the orientation of the FS 9 with respect to the coiled BS 10c.
  • discrete or distributed impedance elements such as inductors and/or capacitances, may be included in the leads for increasing impedance or tuning the local impedence maxima and providing desirable current suppression capabilities.
  • conductors 3 and/or current suppression modules 8 may incorporate one or more of the above configurations described above and/or other features, such as, for example, but not limited to, one or more of the following:
  • standing wave formation on long (coaxial) conductors may be attenuated by incorporating balun circuits or RF chokes at various locations on the longer FSs 9 or sections of the lead 3 that extend between CSMs 8, or between electrodes or an electronic device and a CSM, or on a shield where this is included in embodiments noted above.
  • balun circuits or RF chokes at various locations on the longer FSs 9 or sections of the lead 3 that extend between CSMs 8, or between electrodes or an electronic device and a CSM, or on a shield where this is included in embodiments noted above.
  • Some physical and electrical parameters or characteristics of the conductor 3 and/or FS 9 and BS 10 with modules 8 incorporated in the leads 20 include:
  • Figures 21A, 21B, 21C and 22A, 22B, 22C are examples of leads 20 comprised of stacked multi-layers 8m forming the CSMs 8 of conductor 3.
  • Figure 23 shows a lead 20 with at least one conductor 3 formed with a plurality of CSMs 8 spaced apart in a lengthwise or longitudinal direction.
  • Figure 21A illustrates a tri-layer configuration with three coiled segments closely stacked over each other, with a first inner layer coil 16 as a FS 9c, an intermediate second layer coiled back section 17 ( 10c ) and a third outer layer coiled forward section 18 ( 9c ).
  • Figure 21B illustrates a single conductor triple stacked or tri-layer configuration 8m while Figure 21C illustrates a two conductor 3 1 , 3 2 , triple stacked configuration 8m.
  • the outer coil 18 and inner coil 16 can form two FS 9 (9 1 , 9 2 ) and the intermediate coil 17 can be a BS 10.
  • two or more of the conductors 3n can be cowound to form the three layers, analogous to Figure 9 , as shown, for example, in Figure 21C which illustrates a two conductor 3 1 , 3 2 stacked CSM configuration 8-2.
  • the first layer 16 (8i) can be wound from left to right (distal to proximal end of the lead), the second layer 17 (8k) can be wound over the first layer and is wound right to left (from proximal to distal end of the lead), the final layer 18 ( 8o ) on the top of the two can be wound left to right (distal to proximal end of the lead) and may have the same or smaller (e.g., closer) pitch than the first two layers.
  • all the layers 16, 17, 18 can be coiled maintaining the same rotation direction (CW or CCW) for the coil winding equipment.
  • a fourth or additional layers can be stacked on the third layer 18 (not shown).
  • Figure 21D illustrates a single conductor 3 in a tri-layer stacked configuration 16,17,18 (with each successive coil on a different but closely abutting over layer) held about an integral flexible inner sleeve 190, which may define an open lumen (not shown).
  • at least one end portion of the conductor 3p e.g., the proximal end
  • a relatively short outer sleeve 199 can be placed over a portion of the CSM 8 as well as the coils 3w to help hold the conductor 3 in position/shape before the outer layer is placed thereon ( e.g ., by molding or other suitable method).
  • the short outer sleeve 199 length can vary, but in some embodiments can be between about 0.5 cm to about 2 cm long.
  • Figures 22B and 22C also illustrate a two-layer multi-stacked CSM 8m, with Figure 22B illustrating a single conductor CSM 8 and Figure 22C illustrating a two conductor 3 1 , 3 2 CSM 8-2.
  • the inner layer 8i includes one FS 9c and one BS 10c, which reside under the other FS 9c formed as the outer CSM layer 8 0 .
  • Figures 22D-22F illustrate a portion of a lead 20 with a two-conductor 8-2, double stacked CSM 8.
  • Figures 22D and 22F show the top layer 8o in section view to illustrate the underlying layer 8i of the pattern of the two conductors 3 1 , 3 2 .
  • the conductors 3 1 , 3 2 change rotational direction once at an end portion 33 of a respective CSM 8.
  • Figure 22E illustrates that a short length of a sleeve (such as a PET heat shrink tube) 199 can be placed over the end portion of the CSM 33 at at least one end of the lead and a few revolutions of the conductors 3 1 , 3 2 proximate thereto to hold the conductors in position against the sleeve 190 and/or mandrel 190m.
  • a small amount of UV adhesive or other suitable adhesive can be placed on the conductors 3 1 , 3 2 and/or sleeve 190 at position 33 to help hold the conductors in position prior to winding the next CSM 8.
  • Other inner diameter sleeves/tubes can be positioned at different locations to help hold the conductor(s) in position, such as for attaching one or more electrodes/sensors or transducers to the lead body (not shown).
  • the leads are multi-conductor leads 20, such as, for example, but not limited to, leads having between about 2-100 conductors 3, typically between about 2-50 conductors 3, and more typically between about 3-16 conductors and some or all of the conductors 3 can be wound side-by-side in a substantially flat or level first layer in a first direction ( e . g ., front to back or right to left direction).
  • leads having between about 2-100 conductors 3, typically between about 2-50 conductors 3, and more typically between about 3-16 conductors and some or all of the conductors 3 can be wound side-by-side in a substantially flat or level first layer in a first direction ( e . g ., front to back or right to left direction).
  • the co-wound conductors can then be wound to form a second layer interleaved with and/or over the first layer, then wound to form at least a third layer (or even more layers), again with the third layer interleaved with and/or above the first and/or second layer.
  • the second and third layers may have a varying diameter, but the layers may be substantially concentric with each other.
  • Each coil within a CSM 8 can have a different pitch or some or even all of the coils in a single CSM 8 can have substantially the same pitch.
  • the first layer coil(s) can have a wider (lower) pitch and one or more of the overlying coil(s) can have a closer/ more narrow (greater) pitch.
  • Each layer of one or more coils of a respective conductor(s) can have a relatively thin thickness corresponding to the size of the conductor (with insulation), such as between about 0.0001 inches to about 0. 2 inches.
  • each layer has a thickness of about 0.001 inches to about 0.006, such as, for example about .0026 inches, for a total thickness of the lead being less than about .20 inches (depending on the thickness of the outer encasement layer), such as, for example, between about 0.015 to .020 inches.
  • the different closely spaced and/or stacked coiled sub-portions of a single conductor 3 can be wound with the same or different pitches to form a CSM 8 and/or a CSM as well as the leading portion of the next, neighboring CSM 8 and/or a bridge to the next neighboring CSM 8.
  • the different CSMs 8 of a respective conductor 3 can optionally be formed using multiple lengths of discrete conductors attached together, rather than a single continuous length of conductor.
  • the windings can be substantially continuous along a length of a respective conductor (or, where used, multiple conductors co-wound during the same winding set-up) and can be formed by substantially continuously or intermittently winding a respective conductor using an automated coil winder, such as, for example, an Accuwinder Model 16B, available from Accuwinder Engineering Co. having a place of business at San Dimas, CA.
  • an automated coil winder such as, for example, an Accuwinder Model 16B, available from Accuwinder Engineering Co. having a place of business at San Dimas, CA.
  • a lead incorporating multiple CSMs 8 (as illustrated in Figure 23 ) was prototyped and tested with two 0.007" diameter 35N LT -DFT conductors (e.g ., wires/filars) with silver core (19 filar cable, 0.005" conductor OD and 0.001" wall ETFE insulation), with the conductors ( e.g ., wires/filars) cowound parallel to each other and coiled in three layers.
  • the first layer (coiled forward section) has an inner diameter of 0.023"
  • the second layer (coiled back section) is coiled over the first
  • the third final layer (coiled forward section) is over the first and the second layers.
  • This CSM had an impedance of over 200 ohms at 64 MHz and length of 4.7 cm.
  • the winding details are listed in Table 1 below.
  • TABLE 1 EXEMPLARY TRI-LAYER CSM Layer # Winding Direction Direction of rotation Pitch Length Layer #1 Left to Right Clockwise 0.050" 4.7 cm Layer #2 Right to left Clockwise 0.050" 4.7 cm Layer #3 Left to Right Clockwise 0.020" 4.7 cm
  • the impedance of the 4.7 cm CSM section is shown in Figure 24A .
  • Figure 24B shows one example of a technique that can be used to measure impedance of a multi-conductor configuration (the measurement may be different for different CSM configurations).
  • the measurement probe can be connected to different conductors of the device, taking care to connect the same conductor on each end of the device to be measured (e.g ., conductor 2 of 4) and connect this conductor to the measurement probe shield and core.
  • the network analyzer can be calibrated to the end of the measurement probe and the impedance can be measured when loaded in a saline solution.
  • the change in temperature ( ⁇ T) in the gel (simulating tissue) adjacent to the electrodes as measured to be less than 2°C with a 4.3 W/kg peak input SAR, as shown in Figures 25A and 25B .
  • Figure 22A is a two-layer coil stack configuration of a conductor 3 where one or more conductors are wound/cowound in forward-back-forward sections.
  • two coils 16, 17 are on the same layer adjacent and interleaved with each other and the other coil 18 resides over the inner layer.
  • the BS 10 is coiled in the pitch of the first FS 9 1 on the first layer and the second FS 9 2 is longer and extends over the BS 10 and FS 9 1 .
  • the first forward and back sections 16 (9c) and 17 (10c) are wound such that these do not overlap, and the back section 17 ( 10c ) fits in the pitch (gap) of the forward section 16.
  • This can be formed by attaching the proximal end of the conductors to a coiling mandrel or sleeve thereon and switching the rotational direction of the winding (left to right CW, right to left CCW, then left to right CCW or vice versa).
  • the final forward section 18 ( 9c ) is coiled in the same direction of the back section and over the first forward and back section.
  • the attaching can be adhesively and/or mechanically carried out.
  • Figure 22B illustrates a single conductor 3 configuration of a double stack 8m with both the inner coil FS 9c and the BS coil 10c being inside the second layer 8o with coil FS 9c.
  • Figure 22C illustrates two conductors 3 1 , 3 2 coiled to form a two-conductor 8-2 double stack CSM 8m with the inner layer 8i having both a FS and BS 9c, 10c, respectively, and the outer layer 8o having a FAS 9c.
  • Figures 22D-F also illustrates the optional flexible sleeve 190 (e.g., a biocompatible flexible sleeve).
  • the sleeve 190 is typically placed over the coiling mandrel during fabrication and can remain as an integral part of the lead 20 while the mandrel is typically removed.
  • Other sized sleeves can be used.
  • the sleeve 190 outer diameter is typically sized to provide the desired diameter of the lead (taking into account the outer diameter of the lead will also correspond to the number of stacked layers as well as the outer over encasement or overlayer that defines a substantially constant outer diameter).
  • the sleeve 190 typically has a continuous closed outer wall, but may be discontinuous and/or have open pores or apertures.
  • the sleeve 190 is biocompatible can comprise any suitable material, typically a polymer such as PTFE or Nylon (such as Vestamid® L2140), and can have any suitable size, such as, but not limited to, an outer diameter of between about 0.01 inches to about 0.1 inches, typically between about .01 to about .05 inches, more typically about 0.024 inches, a wall thickness of between about 0.001 inches to about 0.02 inches, and can include a through lumen inner diameter of between about 0.001 inches to about 0.025 inches, typically between about 0.010 to about 0.02 inches, such as about 0.014 inches.
  • the lead 20 can be configured so that the MCSMs extend substantially the entire length of the conductor as a series of continuous coils of adjacent CSMs.
  • the leads 20 can be connected to electrodes and be bipolar for some cardiac applications.
  • a distal and/or proximal end of the lead may include a short length of straight or single layer coil that connects to an electrode.
  • a small piece or length of heat-shrink tubing e.g ., about 10 mm or less of PET heat shrink tubing
  • the third layer can be formed so that most of the revolutions are at a tight pitch, e.g., 78 revolutions at a pitch of about 0.2 in to end at a few last revolutions, e . g ., 5-15 revolutions at a larger pitch such as about 0.7 in for easier electrode installation/connection.
  • a tight pitch e.g., 78 revolutions at a pitch of about 0.2 in to end at a few last revolutions, e . g ., 5-15 revolutions at a larger pitch such as about 0.7 in for easier electrode installation/connection.
  • a lead 20 incorporating this Figure 22A CSM 8 design was prototyped and tested with two 0.007" diameter DFT conductors (with insulation), e.g ., wires/filars with silver core, 19 filar cable, 0.005" cable OD and 0.001" wall ETFE insulation, with conductors cowound parallel to each other and coiled in two layers.
  • the first layer (coiled forward section) has an inner diameter of 0.023" and a pitch of 0.05"
  • the second layer (coiled back section) is coiled in the space/pitch of the first layer
  • the third final layer (coiled forward section) is on/over the first and the second layers.
  • This CSM had an impedance of over 200 ohms at 64 MHz and length of between about 5 cm and 5.7 cm.
  • the details of the windings are as listed in Table II below. TABLE II: EXEMPLARY TWO-LAYER CSM Layer # Winding Direction Direction of rotation Pitch Length Comments Winding #1 Left to Right Clockwise (CW) 0.050" 5.7 cm Layer # 1 Winding #2 Right to left Counter Clockwise (CCW) 0.050" 5.7cm Layer # 1 Winding #3 Left to Right Counter Clockwise (CCW) 0.020" 5.7 cm Layer # 2 To form the next adjacent CSM, the winding can continue in the CCW direction (left to right) and the backward section can be coiled in the CW direction (right to left), followed by the other forward section also in the CW direction (left to right).
  • the conductor changes the coiling rotation direction once per CSM and each adjacent CSM alternates the rotation direction of the different FS, BS, FS segments (e.g., CSM module one, CW, CCW, CCW, CSM module two, CCW, CW, CW, module 3, CW, CCW, CCW).
  • FS segments e.g., CSM module one, CW, CCW, CCW, CSM module two, CCW, CW, CW, module 3, CW, CCW, CCW.
  • Figures 28A and 28B are schematic cross-sectional views of a conductor 3 in the plane of its long axis with a multi-layer coiled CSM configuration 8m.
  • Figure 28A corresponds to the first layer of a two-layer configuration such as that shown in Figure 22A .
  • Figure 28B corresponds to the three separate layers of a three-layer configuration such as shown in Figure 21A .
  • Figures 29A and 29B are enlarged digital images of a multi-conductor lead 20 having conductors 3 in substantially continuously arranged triple stacked layers of coils forming a CSM 8m according to embodiments of the present invention.
  • Figure 29B illustrates an outer encasement layer that defines a substantially constant outer diameter over the flexible lead with the stacked CSMs 8m.
  • Figures 29C and 29D are digital images of an enlarged multi-conductor lead 20 having conductors 3 in substantially continuously arranged double stacked layers of coils forming a CSM 8m according to embodiments of the present invention.
  • Figure 29D illustrates an outer encasement layer that defines a substantially constant outer diameter over the flexible lead with the stacked CSMs 8m.
  • the exemplary coil diameters, coil lengths, and conductor lengths can have a significant range of values within the scope of the invention, typically with a primary design parameter being that of wavelength noted above. While embodiments of the invention have been illustrated in the context of MRI exposure at 64 MHz (1.5T MRI) and 128 MHz (3T MRI), it is intended that applications of the present invention to MRI shall include MRI over the full range of RF afforded by MRI scanners, including, for example, 0.1, 0.3, 0.7, 1.0, 1.5, 2.5, 3, 4, 4.7, 7 and 9.4 Tesla (T) systems, especially commercially available scanners such as, 1.5T scanners, 3T scanners (128 MHz), 1T scanners (42 MHz), 0.5T scanners (21 MHz), 4T (170 MHz) and 7T (300 MHz) scanners.
  • T Tesla
  • embodiments involving implanted leads include the use of biocompatible materials and/or coatings, and the conductors 3 include aluminum, gold, silver, platinum, rhodium, iridium, rare earth metals, alloys of these and other conducting metals including Nickel Titanium alloys (e.g ., nitinol, MP35N, etc.), and conductors formed from coatings of metals, for example, gold coated nitinol, or nitinol or MP35N, etc. with a silver or Pt core, etc., such as, for example drawn tubing formed of MP35N available from Ft. Wayne Industries located in Ft. Wayne, IN, USA.
  • the conductors 3 include aluminum, gold, silver, platinum, rhodium, iridium, rare earth metals, alloys of these and other conducting metals including Nickel Titanium alloys (e.g ., nitinol, MP35N, etc.), and conductors formed from coatings of metals, for example, gold coated
  • the designs can be configured to have the mechano-chemical properties of flexibility, strength, durability, resistance to fatigue, non-corrodible, non-toxic, non-absorbent, and bio-compatible and/or bio-inert. It is further contemplated that embodiments of the invention can be used in any of a range of applications where implanted conducting leads (or external or combinations of same) are required, including but not limited to: connections to IPGs, DBS electrodes, cardiac pacemakers, cardiac electrodes, nerve stimulators, electrodes, EEG and EKG monitors (devices with either or both internal and external leads), cardiac defibrillators, power sources and/or control lines for artificial limbs, power sources and/or control lines for artificial organs (kidneys, etc); power sources and/or control lines for implanted bio-substrates or enzyme delivery devices (e.g ., insulin delivery) or other drug delivery devices, and the like.
  • IPGs IPGs, DBS electrodes, cardiac pacemakers, cardiac electrodes, nerve stimulators, electrodes
  • Figure 30A is a schematic illustration of a DBS system with at least one lead (typically two leads) with CSMs 8 and an IPG and electrodes 4 according to some embodiments of the present invention.
  • the proximal portion of the lead 20e can be reinforced and/or larger (thicker) than the distal portion.
  • This larger portion 20e can be integral on a single lead or may be provided as a matable/connecting lead extension.
  • the proximal end portion 20e can have a length of between about 2-15 cm, typically between about 5-10 cm.
  • the larger portion/extension 20e can provide increased fatigue or torque resistance or other structural reinforcement proximate a rigid body, such as, for example, an IPG.
  • the proximal portion or lead extension 20e can include one or more CSMs 8 or may not include any CSMs 8. Alternatively, the lead extension 20e may include a differently configured CSM 8 and/or a less dense CSM arrangement (less CSMs per cm) relative to the distal portion of the lead 20.
  • Figures 30B and 30C are schematic illustrations of therapeutic systems (medical devices) with leads connected to a cardiac pulse generator. Figure 30B illustrates the system can include two leads, extending to the right auricle (RA) and right ventricle (RV), respectively, while Figure 30C illustrates that the cardiac system can have three leads (one each in the RV, RA and left ventricle, LV).
  • Figure 30B also illustrates that the distal end portion of the lead 20e may have a larger (thicker) and/or reinforced configuration relative to the more flexible distal end portion as discussed with respect to Figure 30A .
  • the proximal end 20e can have a length between about 2-15 cm, typically between about 5-10 cm.
  • Figure 30D schematically illustrates that the lead system 20 interconnects two electronic devices 50 1 , 50 2 residing either inside or external to a human or animal body.
  • the devices can be non-medical devices, such as communication devices.
  • the devices can be medical devices.
  • at least one end portion of the at least one conductor 3 connects an electrocardiographic electrode 50 1 and at least another end is connected to an electrocardiographic monitoring device 50 2 .
  • at least one end portion of the at least one conductor 3 is connected to an electroencephalographic graphic electrode 50 1 and at least another end is connected to an electroencephalographic monitoring device 50 2 .
  • At least one end portion of the at least one conductor 3 is connected to a blood pressure monitoring transducer 50 1 and at least another end is connected to a blood pressure monitoring device 50 2 . In yet other embodiments, at least one end portion of the at least one conductor 3 is connected to a blood oxygen monitoring transducer 50 1 and at least another end is connected to a blood oxygen monitoring device 50 2 .
  • Figure 30E is a schematic illustration of an MR Scanner 500 with a high-field magnet bore 500b.
  • the lead 20 can be configured to extend inside the bore 500b during some interventional or diagnostic procedures.
  • the lead 20 can be a cable, extension or guide that manipulates a device such as a robotic or remotely operated tool or other device.
  • the lead 20 can connect an external control unit 50 1 to an adjustable or moveable component or tool 50 2 inside the magnet bore 500b.
  • the lead 20 can be torqueable, e.g ., rotate to turn or manipulate input or surgical devices or tools.
  • the lead 20 can include at least one cable or conductor with at least one CSM 8 with a respective at least one FS and BS 9, 10.
  • Figure 30F illustrates that the tool 50 2 can be an adjustable trajectory frameless head mount 510 that can be used to adjust the trajectory of the implantable lead to place and implant DBS leads using MR guidance while the patient remains in the magnet bore 500b.
  • Figure 30G is an example of one surgical tool, a frameless head mount 510, with cables or leads 20 configured with at least one CSM 8 according to embodiments of the present invention.
  • the RF/MRI safe leads 20 can include one or more conductors 3 of the lead arranged in multiple CSMs 8 where each CSM has a length of between about 1.5 cm to about 6 cm, and each CSM 8 is arranged such that it has impedance exceeding about 100 ohms at target MRI frequencies (for example, 128 and 64 MHz).
  • FIGS 31A, 31B, 32A and 32B are schematic illustrations of leads that are described as particularly suitable for bradyarrhythmia and tachyarrhythmia or ICD lead systems, for which it is desirable to render MRI-safe and/or RF safe, according to embodiments of the present invention
  • the leads 20 may include different tissue fixation configurations such as, for example, passive fixation or active fixation.
  • passive fixation the distal end of the lead is anchored in the folds of the cardiac tissue.
  • active fixation the distal end of the lead is a helical screw, which is fixed in the cardiac tissue.
  • Bradyarrhythmia leads or pacemaker leads typically have two electrodes 4, a distal pacing and sensing electrode 31, and the proximal ground electrode 33.
  • the conductors 3 connecting the distal electrodes 31 and 33 to IPG contact electrodes 35 and 36, are typically cowound/coiled along the length of the lead 20.
  • the distal electrode 31 may be a conductive contact; whereas in active fixation leads this contact can be a helical screw 37 which can be torqued and turned by turning the proximal end of the coiled conductor via electrode 36.
  • Tachyarrhythmia leads typically have three electrodes; distal pacing and sensing electrode 31, and two proximal shocking electrodes 38 and 40.
  • the conductor 3 connecting the distal electrode is coiled along the length of the lead, and is in the center of the lead.
  • the shocking coils are cowound coils of non-insulated conductors, and are connected to the proximal electrodes/IPG by conductors 39 and 41.
  • conducting leads of the tachyarrhythmia, bradyarrhythmia, ICD (implantable cardio-defibrillator) and/or pacing lead system may be formed with CSM, 8 or with CSMs and shield elements to suppress induced RF currents and improve the safety of such devices during MRI, as exemplified in Figures 33-44 and Figures 55A-58B .
  • Figure 33 illustrates a lead 20 with a passive fixation bradyarrhythmia lead design with two conductors 3 1 , 3 2 , each conductor is wound in CSMs 8 and arranged along the length of the lead one conductor 3 1 , alternating the other 3 2 .
  • Each conductor has CSMs 8 formed along the length and spaced intermittently.
  • the CSMs of each conductor are interleaved/alternated along the length of the lead.
  • the straight sections of the conductors will typically overlap the CSMs of other conductors.
  • Conductors 3 2 and 3 1 connecting to the distal electrode 4 and distal ground electrode 31, respectively, are wound in CSMs 8 which are spaced apart from each other.
  • the CSMs 8 of the two conductors 3 1 , 3 2 alternate.
  • Figures 34 and 35 show embodiments with two conductors 3 1 , 3 2 , with multiple CSMs 8 along the length of the lead 20; with one conductor 3 1 CSM assembly substantially concentric to the other 3 2 .
  • the CSMs 8 of the conductors 3 1 , 3 2 have inner and outer diameters such that they can be concentrically arranged along the length of the lead.
  • One conductor CSM assembly, for conductor 3 2 can rotate with respect to the other, i . e . in CSM assembly for conductor 3 1 .
  • the CSMs 8 of the conductors 3 2 and 3 1 have inner and outer diameters such that they can be concentrically arranged along the length of the lead.
  • One conductor 8 CSM 3 2 assembly can rotate with respect to the other 3 1 .
  • the center conductor CSM assembly 32 is connected to the fixation helix 37 at the distal end.
  • the fixation helix 37 can be manipulated by torquing the center conductor CSM assembly 3 2 and this in turn rotates and laterally slides the fixation helix 37 in and out of the lead 20 allowing anchoring in the cardiac tissue.
  • Figure 36 shows a passive fixation bradyarrhythmia lead embodiment with distal electrode conductor 3 wound in trilayer CSMs 8m along the length of the lead and is in the center of the lead 20.
  • the proximal connecter is connected to the IPG by means of a RF high impedance shield layer 48 with RF traps 49 and the shield layer can shield the inner conductor 3 and CSM 8m thereof.
  • the conductor 3 1 connecting to the distal electrode may be arranged along the length to have one or more CSMs.
  • the conductor 3 2 connecting the proximal electrode is a high impedance shield 48 incorporating RF traps 49 along the length of the shield.
  • the impedance of the RF trap can typically exceed about 300 ohms and one or more traps can be placed along the length of the lead.
  • Figure 37 shows an embodiment of the invention in an active fixation bradyarrhythmia lead 20 with distal electrode conductor 3 1 wound in trilayer CSMs 8m along the length of the lead and is in the center of the lead, and this conductor 3 1 can rotate freely with respect to (WRT) the lead body.
  • the proximal electrode conductor 3 2 is arranged in CSMs 8 and is substantially concentrically outside the distal electrode conductor 3 1 .
  • Figure 38 shows an active fixation bradyarrhythmia lead 20 with distal electrode conductor 3 1 wound in trilayer CSMs 8m along the length of the lead and is in the center of the lead, and rotates freely WRT the lead body.
  • the proximal electrode conductor 3 2 is arranged as an RF trap 49 along the length of the lead and can provide a shield 49 for the inner conductor 3 1 .
  • the center conductor CSM assembly 3 1 is connected to a helical fixation screw 37 at the distal end.
  • the proximal electrode is connected to the IPG via a high impedance shield 48 with RF traps 49 as discussed with respect to Figure 37 .
  • the inner conductor assembly 3 1 can be rotated WRT the outer shield 49, by rotating the proximal electrode. This also rotates and drives the fixation screw 37 laterally, thus anchoring in the cardiac tissue.
  • Figure 39 illustrates another (passive fixation) tachyarrhythmia lead 20 where three conductors 3 1 , 3 2 , 3 3 are cowound to form CSMs 8.
  • One is connected to the sensing electrode 40, other two to the shocking electrodes 4 (38).
  • the three conductors 3 1 , 3 2 and 3 3 are cowound and multiple CSMs 8 along the length in the proximal section, in the mid section (between two stimulation electrodes 38 and 40 ) two conductors 3 3 and 3 2 are cowound to form some CSMs 8, and in the distal part only the distal electrode conductor 3 2 is arranged to form CSMs 8.
  • Figure 40 illustrates a (passive fixation) tachyarrhythmia lead where the three conductors 3 1 , 3 2 , 3 3 are arranged to have CSMs 8 along the length of the lead 20 and the three conductors 3 1 , 3 2 , 3 3 alternate CSM 8 locations along the length of the lead.
  • CSMs 8 are placed discontinuously or intermittently along the length of each conductor 3.
  • the sensing electrode conductor and the distal shocking electrode conductor 3 2 , 3 3 , respectively are alternated
  • the CSMs 8 on all the three conductors 3 1 , 3 2 , 3 3 are alternated. This design may reduce the coupling of the distal electrode conductor 3 3 with the stimulation or shocking conductors 3 1 , 3 2 during the shock-defibrillation operation of the ICD.
  • Figure 41 shows a (passive fixation) tachyarrhythmia lead 20 where the three conductors 3 1 , 3 2 , 3 3 are arranged to have CSMs 8 along the length of the lead 20 and the distal electrode conductor 3 1 is in the center of the lead and concentric to the shocking electrode conductors 3 2 , 3 3 .
  • This design may reduce the coupling of the distal electrode conductor with the shocking conductors during the shocking operation of the ICD.
  • Figure 42 illustrates a (passive fixation) tachyarrhythmia lead 20 where the distal electrode conductor 3 1 is arranged to have CSMs 8 along the length of the lead 20 and the shocking electrode conductors are straight along the length of the lead.
  • Figure 43 illustrates an active fixation tachyarrhythmia lead 20 where the distal electrode conductor 3 1 is arranged to have CSMs 8 along the length of the lead 20 and the stimulation/shocking electrode conductors 3 2 , 3 3 are substantially straight along the length of the lead 20.
  • Figure 44 shows an active fixation tachyarrhythmia lead 20 where the distal electrode conductor 3 1 is arranged to have CSMs 8 along the length of the lead 20 and the shocking electrode conductors 3 2 , 3 3 are arranged so as to have CSMs 8 along the length of the lead.
  • the cardiac leads can be configured with shocking electrodes used in ICD leads, the conventional shocking electrodes, which are conventionally 4-5 cm long and comprise a wound conductor may need modification for MRI compatibility. This conductor may be longer than ⁇ /4 at MRI frequencies and may add to temperature rise in the tissue adjacent to the coils.
  • the shocking coils can be electrically reduced in length and this may be achieved by using a flexible stent-like design instead of a coil, e.g ., using a sinusoidal helix where one segment is interconnected with other so as to reduce the electrical length of the shocking electrode.
  • every or some alternate CSMs 8 may be wound in opposite directions to suppress currents induced in the lead by alternating magnetic fields and potential nerve stimulation.
  • the conductor configurations can be used for any lead used during an interventional procedure and/or for any medical device, whether implantable or not and whether for chronic or acute use.
  • FIGS 55A and 55B illustrate a distal end portion of a lead 20 suitable for a passive fixation pacemaker lead.
  • the CSM 8 is a triple stacked CSM 8m having two-conductors CSM 8 with coils in three layers 8i, 8k and 8o .
  • the FS 9c are the inner and outer layers 8i, 8o and the BS 10 is in between the two FS 9c in layer 8k.
  • the lead 20 can include one or more electrodes 31 and a fixation barb 34.
  • an outer layer 21 of a suitable biocompatible material can be formed over the CSMs 8 to define a substantially constant outer diameter.
  • Figures 56A and 56B illustrate a distal portion of a lead 20 that may be particularly suitable for a passive fixation ICD lead.
  • the lead 20 includes both a two-conductor 8-2 and a three-conductor 8-3 CSM 8 (both in a triple-stack configuration).
  • the three conductor CSM 8-3 resides upstream of the two-conductor CSM 8-2 which merges into the tip electrode 31t.
  • Figures 57A and 57B illustrate another lead 20 which may be particularly suitable for an active fixation pacemaker lead.
  • the distal tip of the lead 20t can comprise a screw electrode 31s that merges into an expansion spring 135 in communication with a single inner conductor 3i having one or more CSMs 8 (as shown, the inner conductor 3i has a triple-stacked CSM configuration).
  • the lead 20 includes an inner sleeve 80 over the inner conductor 3i and an outer sleeve 85 over the inner sleeve.
  • One or more CSMs can reside over the inner sleeve 85.
  • a single outer conductor 3o can be configured in one or more outer triple stacked CSM configurations 8-1o that merges into electrode 31.
  • the inner conductor 3i is configured with one or more inner CSM configurations 8-1i and can rotate and/or translate with respect to the outer sleeve 85 to extend the screw electrode 31s out of a lumen defined by the lead.
  • the inner sleeve 80 can be a PET shrink sleeve compressed against the inner conductor 3i.
  • the outer sleeve 85 can be a FEP sleeve or other suitable biocompatible material that is bonded or otherwise held to the outer sleeve 85.
  • the lead 20 can include an outer layer 21 over the outer conductor(s)/CSMs 8. A nut 131 can be attached to the distal end of the sleeve 85.
  • both the inner and outer conductor configurations can be a plurality of conductors and the CSMs can be formed in other CSM configurations as described herein with respect to other figures.
  • FIGS 58A and 58B illustrate another lead 20 which may be particularly suitable for an active fixation ICD lead.
  • This embodiment is similar to that described with respect to Figures 57A and 57B , but the lead includes outer two-conductor CSMs 8-2 formed as a triple stack configurations 8m that merge into a single-conductor CSM 8-1o also formed as a triple stack configuration 8m.
  • the two-conductor CSM 8-2o extends to a first electrode 31 and the single CSM 8-1o extends to the next upstream electrode 31.
  • different numbers of conductors and different arrangements or CSM configurations can also be used to form the ICD lead.
  • Figures 45-53 describe methods of fabricating devices and associated fabrication systems or apparatus according to the present invention.
  • Figures 45A-45E illustrate two conductors being cowound on a coiling mandrel to form the stacked trilayer CSM 8m ( see, e.g., Figure 21A ).
  • a copper wire or other suitable material elongate substrate, typically but optionally, covered with a tube or sleeve can form the mandrel.
  • Figures 46A-46F illustrate a two-layer stacked CSM 8m conductor design during fabrication ( see , e.g., Figure 22A ).
  • the coil winder and/or conductors 3 are shown moving back and forth on the mandrel to coil the conductors in the forward and reverse directions ( see, e.g., Tables I and II above).
  • Figures 47A-47C show a coiled conductor lead subassembly before an overmolded flexible layer is formed thereover.
  • Figures 48A-48D illustrate that the subassembly can be placed in a mold and a material directed therein (shown as being injected when the mold is closed in Figure 48B ).
  • Figure 48C and 48D illustrate the molded lead after the mold lid is removed.
  • Figure 49 illustrates a resultant flexible overmolded lead 20.
  • Figures 50-52 illustrate an exemplary mold 100 used to form the flexible lead 20.
  • the mold 100 is sized and configured to receive the lead subassembly 20s with the coiled conductor(s) 30.
  • the mold has a top and bottom 101, 102 which together form a shallow mold cavity 103 that is sized and configured to receive the subassembly 20s.
  • a spacer 120 can optionally be placed over the subassembly 20s to snugly position the subassembly in the cavity 103 to inhibit the lead subassembly from moving during introduction of a desired moldable material, such as a flowable polymer, that will form the polymer skin or encasement of the lead 20.
  • a desired moldable material such as a flowable polymer
  • the spacer 120 can be a spiral wrap can be placed about the subassembly 20s.
  • the spiral wrap 120 can be configured to allow the molded outer layer to form on the subassembly without affecting the thickness of the skin or outer layer.
  • the spiral wrap 120 can be formed using a silicone tape and/or an application of semi-solid flexible silicone, polyurethane, epoxy or other polymer, co-polymer or derivatives thereof and/or combinations of same or other suitable material.
  • spacer 120 configurations may also be used, such as, for example, discrete polymer geometrically shaped members such as pellets or balls and/or holding tabs rods or cones.
  • Over-wrapping the subassembly before placement in the mold cavity 103 can allow the lead subassembly 20s to remain centered even during introduction of the flowable (e.g ., gelatinous or liquid) polymer.
  • Suitable overmold layer materials include, but are not limited to, polymers (homopolymer, copolymer or derivatives thereof), silicone, polyurethane, Nylon, Teflon, ETFE, FEP and the like.
  • the mold 100 can include one or more open exit ports 105 ( Figure 51 ) that may remain open during molding.
  • the mandrel 300 ( Figure 51 and 45a ) used to coil the subassembly can be removed after the subassembly is molded by pulling from the end of the mold via port 105 ( Figure 51 ).
  • the mandrel 300 can be held inside a flexible thin sleeve or tube during the winding.
  • the sleeve can form an integral part of the subsequent lead.
  • the mandrel can remain in position during the molding or pulled from the sleeve prior to inserting the subassembly (held on the sleeve) into the mold cavity 103 ( Figure 52 ).
  • the mandrel can be inserted into a PTFE tube (1/10 inch inner diameter) and/or be formed by a coated copper or SST wire or other suitable support device.
  • the winding operations used to form stacked coils of CSMs can be carried out by winding a conductor on a mandrel to form a first coil in a forward lengthwise (or longitudinal) direction (e.g ., left to right) (block 200 ).
  • the mandrel can be a wire held in tension during the winding operation(s).
  • the conductor can be wound over the mandrel to form a second closely spaced coil in a reverse lengthwise direction from the winding direction of the first coil ( e . g ., right to left) (block 210 ).
  • the second coil can be formed all or partially over the first coil or all or partially next to the first coil on the same layer as the first coil in the gaps formed by the pitch of the first coil.
  • the conductor can be coiled in a third coil in the forward lengthwise direction (e.g., left to right, the same longitudinal direction as the first coil) (block 220 ). This can be repeated for a desired number of CSMs.
  • an overmolded outer layer can be molded onto the conductor with the coils (block 230 ).
  • the mandrel can be removed from the center of the stacked coils before, during or after the molding step (block 240 ).
  • the mandrel is placed in the mold with the lead subassembly and removed (pulled from the lead body) after about 10-30 minutes or longer ( e.g., 1-3 hours) after the polymer overcoat material is placed in the mold and the mold material heated or cured as desired.
  • the outer surface layer can have a substantially constant diameter formed over the stacked coils. Also, although some embodiments describe a two or three layer stacked-configuration, additional numbers of stacked layers may also be used, e.g., four, five, six, seven, eight or even more by continuing the back and forth winding of the conductor.
  • the overmolding process has been described above, in other embodiments, other types of manufacturing processes can be used to form the biocompatible outer coating to form a suitable biocompatible substantially constant outer diameter (for at least a portion of the lead).
  • the outer diameter is not constant, but varies over the length of the lead at least one or more times.
  • alternative outer layer forming processes include extrusion, injection molding and heated draw down.
  • an extrusion tube such as a silicone tube with an inner diameter that is smaller than the conductor winding can be expanded (such as, for example, using hexane). Once expanded, the wound conductor body can be placed inside the tube. As the hexane or other expander evaporates, the tube contracts to original size against the coil winding configuration.
  • the electrodes (where used) can then be attached and an overlayer formed over them as appropriate, typically using liquid injection molding.
  • standard injection molding which may include silicone or a thermoplastic polymer such as thermoplastic polyurethane ( e . g ., Pellethane TM ) in standard injection molding equipment.
  • Pellethane TM is available from Dow Chemicals, Inc.
  • thermoplastic extruded tube such as Pellethane TM
  • the extruded tube can have a slightly larger inner diameter than the outer diameter of the conductor winding body and the conductor winding body is placed inside the tube.
  • the assembly can then be loaded into a Drawdown machine such as one manufactured by Interface Associates of Website of Website, GTE.
  • the inner diameter of the die (the final desired outer diameter of the lead) is smaller than the outer diameter of the tubing.
  • the die is heated to a temperature that causes the thermoplastic material to flow.
  • the die is drawn across the length of the conductor winding body causing the material to produce a smooth and substantially constant outer diameter over the length of the body.
  • one part of the lead may be thicker than others.
  • a proximal portion of the lead may be reinforced to provide increased durability or fatigue resistance while at least the distal portion can be low profile with a smaller diameter or size.
  • a lead extension 20e ( Figure 30B ) can extend between one lead and another lead or implantable or external component (e.g ., IPG).
  • the conductor(s) can be wound over the (thin) mandrel directly or via a sleeve over the mandrel (block 205 ). That is, rather than winding the conductor(s) to have a tight compressive force against the mandrel (or underlying sleeve), the coils can be formed to (directly or indirectly) contact the mandrel with a substantially constant force but with minimal compression.
  • the winding operations can be carried out to from two of the coils substantially on one layer and the other in another layer to form a two-layer stacked coil configuration (block 215 ).
  • the first coil can be wound in a clockwise direction, the second in a counterclockwise direction, and the third in the counterclockwise direction (or the windings can be reversed, with the first coil in the CCW direction and the second and third in the CW direction) (block 216 ).
  • Winding of the third coil on the upper or top layer can continue forward to form the first (lower) forward layer of the next adjacent coils.
  • an end portion of the first coil can be held in position while the reverse rotational turning is initiated for the second coil.
  • the winding can be carried out using a conductor of about 0.007 inches O.D, with a starting winding O.D. (mandrel size) of about 0.023 inches.
  • the conductor(s) can be wound for about 30-60 revolutions right (clockwise), typically about 32-45 revolutions, at a pitch of about 0.05 inches followed by about 30-60 revolutions left (with the winding changed to counterclockwise), typically about 32-45 revolutions, with the conductor falling into the gap in the first coil spacing over the mandrel, followed by winding greater than 60 revolutions to the right (counterclockwise), typically about 78-110 revolutions to the right, at a pitch of about 0.02 inches.
  • for a lead having a length of about 57.5 cm can have about 10 CSMs 8.
  • the conductor feed head direction changes direction and the coil wind direction also changes direction.
  • the pitch of each of the first two layers is typically greater than about two times the conductor thickness and the coil wind direction is reversed, the first two layers sit substantially side-by-side. Other pitches and numbers of revolutions can be used to form the double-stack configurations.
  • the winding operations can be repeated a plurality of times to form multiple CSMs 8 along a length of a lead ( e.g ., MCSMs).
  • the winding operations can be carried out to stack the coils in three or more different stacked layers (e.g., a tri-layer configuration) (block 212 ).
  • the first and second coils can have substantially the same pitch and the third can have a smaller (closer) pitch (block 213 ).
  • the first, second and third coils can all be wound in the same rotational direction (either one of the clockwise or counterclockwise directions) (block 214 ).
  • the feed head serially changes directions three times to form the three coils (from forward to backaward/reverse to forward again) but the rotational winding direction remains the same.
  • the winding or turning can be carried out using a conductor ( e .
  • the winding can be carried out by winding the conductor(s) about 20-60 revolutions in a first direction for the first layer, e.g ., right (clockwise) with a pitch of about 0.05 inches, typically about 32 to about 38 revolutions right, then winding about 20-60 revolutions in the opposite direction for the second layer, e.g., left at a pitch of bout 0.05 inches, typically about 32 to about 38 revolutions left, then winding the third layer in the first direction again, e.g ., right, for between about 30-110 revolutions right, typically about 78-94 revolutions, at a pitch of about 0.02 inches.
  • the third layer typically has an increased number of revolutions relative to the first and second layers.
  • the last CSM of the conductor can be fabricated so that the third layer coil terminates with a larger pitch that is larger than both the first, second and most of the third layer coils (e.g ., about .070 inches relative to the revolutions of the remainder of the layer which, in some embodiments is at about 0.20 inches).
  • Some resulting multi-conductor configurations can have a multi-layer stacked transverse cross-sectional size that is between about 0.025 inches to about 0.1 inches, typically between about 0.056 inches to about 0.080 inches.
  • Other pitches and numbers of revolutions can be used to form a triple or even greater layer of stacked coils.
  • the winding operations can be continuously or substantially continuously repeated a plurality of times to form a plurality of CSMs 8 along a length of a lead.
  • the CSMs 8 can have a length of about 4cm and the lead can have about 17 CSMs 8.
  • the electrodes can be attached to the MCSM in the following order:
  • this example is for a two-conductor lead formed into a tri-layer MCSM configuration so additional coils of conductor may be used where more than two conductors are being formed into the lead.

Landscapes

  • Health & Medical Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • General Health & Medical Sciences (AREA)
  • Biomedical Technology (AREA)
  • Public Health (AREA)
  • Radiology & Medical Imaging (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Veterinary Medicine (AREA)
  • Engineering & Computer Science (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Cardiology (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Neurology (AREA)
  • Magnetic Resonance Imaging Apparatus (AREA)
  • Electrotherapy Devices (AREA)
  • Communication Cables (AREA)

Claims (15)

  1. MRI-sicheres Leitungssystem mit:
    einer länglichen flexiblen Leitung mit mehreren Leitern, die eine Länge mit einem proximalen und einem gegenüberliegenden distalen Endabschnitt haben, wobei die Leiter jeweils mehrere sich entlang der Länge des Leiters erstreckende Stromunterdrückungsmodule aufweisen,
    wobei jedes Stromunterdrückungsmodul konfiguriert und eingerichtet ist, Strom im Wesentlichen zu unterdrücken, der durch RF induziert wird, die während einer MRI-Behandlung verwendet wird; und
    mehreren Elektroden, wobei einer oder mehrere der Leiter in Verbindung mit einer jeweiligen Elektrode stehen;
    dadurch gekennzeichnet, dass jedes Stromunterdrückungsmodul ein erstes, vorwärts gerichtetes Teilstück aufweist, das sich in eine axial vorwärts gerichtete Richtung erstreckt, dann umkehrt, um ein zweites, rückwärts gerichtetes Teilstück zu definieren, das sich in eine im Wesentlichen entgegengesetzte axiale Richtung erstreckt, dann sich erneut wendet, um ein drittes, vorwärts gerichtetes Teilstück zu definieren, das sich in die axial vorwärts gerichtete Richtung erstreckt, wobei das erste, vorwärts gerichtete, das zweite, rückwärts gerichtete und/oder das dritte, vorwärts gerichtete Teilstück ein gewendeltes Segment mit mehreren Wendeln aufweist, wobei zumindest ein Abschnitt des ersten, vorwärts gerichteten, zweiten rückwärts gerichteten und/oder dritten, vorwärtsgerichteten Teilstücks innerhalb der Wendel des gewendelten Segments angeordnet ist.
  2. Leitungssystem nach Anspruch 1, wobei das Leitungssystem konfiguriert ist, einen unerwünschten Temperaturanstieg in lokalem Gewebe auf weniger als 10°C einzudämmen, während es mit dem MRI-Scanner in Zusammenhang stehenden RF-Frequenzen bei einem SAR-Spitzenwert von zwischen etwa 4 W/kg bis mindestens etwa 10 W/kg und/oder einem SAR-Durchschnittswert des gesamten Körpers von zwischen etwa 2 W/kg bis mindestens etwa 5 W/kg ausgesetzt ist.
  3. Leitungssystem nach Anspruch 1, wobei das erste, vorwärts gerichtete, das zweite, rückwärts gerichtete und das dritte, vorwärts gerichtete Teilstück eines jeweiligen Stromunterdrückungsmoduls eine elektrische Länge aufweisen, die etwa λ/4 oder weniger in einem MRI-Scanner beträgt, und das erste, vorwärts gerichtete, das zweite, rückwärts gerichtete und das dritte, vorwärts gerichtete Teilstück in Längsrichtung jeweils eine physikalische Länge von zwischen etwa 1 bis 25 cm haben.
  4. Leitungssystem nach Anspruch 1, wobei die zweiten, rückwärts gerichteten Teilstücke der Stromunterdrückungsmodule eine physikalische Länge aufweisen, die zwischen etwa 30 bis 70% der physikalische Länge eines angrenzenden ersten oder dritten, vorwärts gerichteten Teilstücks liegt.
  5. Leitungssystem nach Anspruch 1, wobei die mehreren Stromunterdrückungsmodule zwischen etwa 4 bis 40 Stromunterdrückungsmodule sind.
  6. Leitungssystem nach Anspruch 1, wobei die mehreren Stromunterdrückungsmodule zwischen etwa 6 bis 20 Stromunterdrückungsmodule sind.
  7. Leitungssystem nach Anspruch 1, wobei die mehreren Leiter zwischen etwa 2 bis 100 Leiter sind und wobei die Leiter so konfiguriert sind, dass die gewendelten Segmente zumindest einiger Stromunterdrückungsmodule mit mindestens einem anderen Leiter zusammen gewickelt sind.
  8. Leitungssystem nach Anspruch 1, wobei die Größe der Leitung zwischen etwa 1 French bis etwa 10 French beträgt.
  9. Leitungssystem nach Anspruch 1, wobei die Leiter einen distalen Endabschnitt mit mindestens einem der Stromunterdrückungsmodule aufweisen, das in ein vorwärts gewendeltes Segment ausläuft, das an eine der Elektroden anschließt.
  10. Leitungssystem nach Anspruch 1, wobei das zweite, rückwärts gerichtete Teilstück das gewendelte Segment aufweist.
  11. Leitungssystem nach Anspruch 10, wobei ein Abschnitt des ersten, vorwärts gerichteten Teilstücks innerhalb des gewendelten Segments des zweiten, rückwärts gerichteten Teilstücks angeordnet ist.
  12. Leitungssystem nach Anspruch 10, wobei ein Abschnitt des dritten, vorwärts gerichteten Teilstücks innerhalb des gewendelten Segments des zweiten, rückwärts gerichteten Teilstücks angeordnet ist.
  13. Leitungssystem nach Anspruch 1, wobei das dritte, vorwärts gerichtete Teilstück das gewendelte Segment aufweist.
  14. Leitungssystem nach Anspruch 13, wobei ein Abschnitt des zweiten, rückwärts gerichteten Teilstücks innerhalb des gewendelten Segments des dritten, vorwärts gerichteten Teilstücks angeordnet ist.
  15. Leitungssystem nach Anspruch 13, wobei ein Abschnitt des ersten, vorwärts gerichteten Teilstücks innerhalb des gewendelten Segments des dritten, vorwärts gerichteten Teilstücks angeordnet ist.
EP13151461.4A 2007-03-19 2008-03-13 MRI- und HF-kompatible Leitungen Active EP2705874B1 (de)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US89561907P 2007-03-19 2007-03-19
US91283507P 2007-04-19 2007-04-19
US95572407P 2007-08-14 2007-08-14
EP08726851.2A EP2131918B1 (de) 2007-03-19 2008-03-13 Mrt- und hf-kompatible leitungen und relevante verfahren zur bedienung und herstellung von leitungen

Related Parent Applications (2)

Application Number Title Priority Date Filing Date
EP08726851.2A Division EP2131918B1 (de) 2007-03-19 2008-03-13 Mrt- und hf-kompatible leitungen und relevante verfahren zur bedienung und herstellung von leitungen
EP08726851.2A Division-Into EP2131918B1 (de) 2007-03-19 2008-03-13 Mrt- und hf-kompatible leitungen und relevante verfahren zur bedienung und herstellung von leitungen

Publications (2)

Publication Number Publication Date
EP2705874A1 EP2705874A1 (de) 2014-03-12
EP2705874B1 true EP2705874B1 (de) 2016-09-28

Family

ID=39540648

Family Applications (2)

Application Number Title Priority Date Filing Date
EP13151461.4A Active EP2705874B1 (de) 2007-03-19 2008-03-13 MRI- und HF-kompatible Leitungen
EP08726851.2A Active EP2131918B1 (de) 2007-03-19 2008-03-13 Mrt- und hf-kompatible leitungen und relevante verfahren zur bedienung und herstellung von leitungen

Family Applications After (1)

Application Number Title Priority Date Filing Date
EP08726851.2A Active EP2131918B1 (de) 2007-03-19 2008-03-13 Mrt- und hf-kompatible leitungen und relevante verfahren zur bedienung und herstellung von leitungen

Country Status (8)

Country Link
US (2) US9492651B2 (de)
EP (2) EP2705874B1 (de)
JP (1) JP5568316B2 (de)
KR (1) KR101413679B1 (de)
AU (1) AU2008229465B2 (de)
CA (1) CA2681367C (de)
ES (2) ES2607450T3 (de)
WO (1) WO2008115426A1 (de)

Families Citing this family (183)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8244370B2 (en) 2001-04-13 2012-08-14 Greatbatch Ltd. Band stop filter employing a capacitor and an inductor tank circuit to enhance MRI compatibility of active medical devices
US8256430B2 (en) 2001-06-15 2012-09-04 Monteris Medical, Inc. Hyperthermia treatment and probe therefor
US9295828B2 (en) 2001-04-13 2016-03-29 Greatbatch Ltd. Self-resonant inductor wound portion of an implantable lead for enhanced MRI compatibility of active implantable medical devices
CA2482202C (en) 2001-04-13 2012-07-03 Surgi-Vision, Inc. Systems and methods for magnetic-resonance-guided interventional procedures
US7844344B2 (en) 2004-03-30 2010-11-30 Medtronic, Inc. MRI-safe implantable lead
EP1948296B2 (de) 2005-10-14 2017-10-11 Pacesetter, Inc. Kabelloser herzschrittmacher und system
US9168383B2 (en) 2005-10-14 2015-10-27 Pacesetter, Inc. Leadless cardiac pacemaker with conducted communication
US9610459B2 (en) 2009-07-24 2017-04-04 Emkinetics, Inc. Cooling systems and methods for conductive coils
US9339641B2 (en) 2006-01-17 2016-05-17 Emkinetics, Inc. Method and apparatus for transdermal stimulation over the palmar and plantar surfaces
US7734354B1 (en) 2006-08-04 2010-06-08 Advanced Neuromodulation Systems, Inc. Stimulation lead, stimulation system, and method for limiting MRI induced current in a stimulation lead
US10786669B2 (en) 2006-10-02 2020-09-29 Emkinetics, Inc. Method and apparatus for transdermal stimulation over the palmar and plantar surfaces
US11224742B2 (en) 2006-10-02 2022-01-18 Emkinetics, Inc. Methods and devices for performing electrical stimulation to treat various conditions
US9005102B2 (en) 2006-10-02 2015-04-14 Emkinetics, Inc. Method and apparatus for electrical stimulation therapy
US9827415B2 (en) 2006-11-09 2017-11-28 Greatbatch Ltd. Implantable lead having multi-planar spiral inductor filter
US9468750B2 (en) 2006-11-09 2016-10-18 Greatbatch Ltd. Multilayer planar spiral inductor filter for medical therapeutic or diagnostic applications
US8239041B2 (en) 2010-08-02 2012-08-07 Greatbatch Ltd. Multilayer helical wave filter for medical therapeutic or diagnostic applications
US7610101B2 (en) 2006-11-30 2009-10-27 Cardiac Pacemakers, Inc. RF rejecting lead
US7962224B1 (en) * 2007-02-05 2011-06-14 Advanced Neuromodulation Systems, Inc. Stimulation lead, stimulation system, and method for limiting MRI-induced current in a stimulation lead
US9044593B2 (en) 2007-02-14 2015-06-02 Medtronic, Inc. Discontinuous conductive filler polymer-matrix composites for electromagnetic shielding
EP2705874B1 (de) 2007-03-19 2016-09-28 Boston Scientific Neuromodulation Corporation MRI- und HF-kompatible Leitungen
KR101413677B1 (ko) 2007-03-19 2014-07-01 엠알아이 인터벤션즈, 인크. 전도체를 갖는 리드 제조 방법 및 장치와 관련 가요성 리드 구성
US8103347B2 (en) 2007-04-25 2012-01-24 Advanced Neuromodulation Systems, Inc. Implantable pulse generator comprising MRI current limiting windings in header structure
US8483842B2 (en) 2007-04-25 2013-07-09 Medtronic, Inc. Lead or lead extension having a conductive body and conductive body contact
JP2010532446A (ja) * 2007-07-02 2010-10-07 ボーグワーナー・インコーポレーテッド ポンプアセンブリ用の流入部の設計
US8032230B1 (en) 2007-10-09 2011-10-04 Advanced Neuromodulation Systems, Inc. Stimulation lead, stimulation system, and method for limiting MRI induced current in a stimulation lead
EP2227289B1 (de) * 2007-12-06 2015-07-22 Cardiac Pacemakers, Inc. Implantierbare elektrode mit variabler spulenleitersteigung
EP2249920B1 (de) 2008-02-06 2015-07-01 Cardiac Pacemakers, Inc. Leitung mit mrt-kompatiblen designmerkmalen
US9037263B2 (en) 2008-03-12 2015-05-19 Medtronic, Inc. System and method for implantable medical device lead shielding
US9108066B2 (en) 2008-03-20 2015-08-18 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US10080889B2 (en) 2009-03-19 2018-09-25 Greatbatch Ltd. Low inductance and low resistance hermetically sealed filtered feedthrough for an AIMD
US20090270956A1 (en) * 2008-04-25 2009-10-29 Pacesetter, Inc. Implantable medical lead configured for improved mri safety
US8103360B2 (en) * 2008-05-09 2012-01-24 Foster Arthur J Medical lead coil conductor with spacer element
US8244375B2 (en) * 2008-08-25 2012-08-14 Pacesetter, Inc. MRI compatible lead
WO2010030373A2 (en) * 2008-09-12 2010-03-18 Surgivision, Inc. Intrabody mri stacked flat loop antennas and related systems
US8364279B2 (en) 2008-09-25 2013-01-29 Boston Scientific Neuromodulation Corporation Electrical stimulation leads having RF compatibility and methods of use and manufacture
US20100076535A1 (en) * 2008-09-25 2010-03-25 Boston Scientific Neuromodulation Corporation Leads with non-circular-shaped distal ends for brain stimulation systems and methods of making and using
US8335570B2 (en) 2008-10-09 2012-12-18 Boston Scientific Neuromodulation Corporation Electrical stimulation leads having RF compatibility and methods of use and manufacture
US8301249B2 (en) * 2008-10-23 2012-10-30 Pacesetter, Inc. Systems and methods for exploiting the tip or ring conductor of an implantable medical device lead during an MRI to reduce lead heating and the risks of MRI-induced stimulation
US20100106227A1 (en) * 2008-10-23 2010-04-29 Pacesetter, Inc. Systems and Methods for Disconnecting Electrodes of Leads of Implantable Medical Devices During an MRI to Reduce Lead Heating
US20110015713A1 (en) * 2008-10-23 2011-01-20 Pacesetter, Inc. Systems and methods for reducing lead heating and the risks of mri-induced stimulation
US8634931B2 (en) * 2008-10-30 2014-01-21 Pacesetter, Inc. MRI compatible implantable medical lead and method of making same
US9399129B2 (en) * 2008-10-30 2016-07-26 Pacesetter, Inc. MRI compatible implantable medical lead and method of making same
US20100114275A1 (en) * 2008-10-30 2010-05-06 Pacesetter, Inc. Implantable medical lead including winding for improved mri safety
US8364281B2 (en) * 2008-11-07 2013-01-29 W. L. Gore & Associates, Inc. Implantable lead
CN102215906B (zh) 2008-11-13 2014-03-12 沙皮恩斯脑部刺激控制有限公司 深度脑部刺激器探针中的螺旋形导线
US20100137704A1 (en) * 2008-12-02 2010-06-03 Surgivision, Inc. Medical mats with electrical paths and methods for using the same
WO2010078552A1 (en) * 2009-01-05 2010-07-08 Kenergy, Inc. Mri compatible electrical lead for an implantable electronic medical device
US8527068B2 (en) 2009-02-02 2013-09-03 Nanostim, Inc. Leadless cardiac pacemaker with secondary fixation capability
US8909320B2 (en) * 2009-02-20 2014-12-09 MRI Interventions, Inc. Cable management systems for MRI systems and related methods
CN103549952B (zh) 2009-03-04 2016-08-17 艾姆瑞科医疗系统有限公司 构造mri兼容电极电路的方法
EP2403403A4 (de) 2009-03-04 2017-06-28 Imricor Medical Systems, Inc. Kombination aus feldortung und mri-verfolgung
US8805540B2 (en) 2009-03-04 2014-08-12 Imricor Medical Systems, Inc. MRI compatible cable
US8855788B2 (en) 2009-03-04 2014-10-07 Imricor Medical Systems, Inc. MRI compatible electrode circuit
US8843213B2 (en) 2009-03-04 2014-09-23 Imricor Medical Systems, Inc. MRI compatible co-radially wound lead assembly
US8761899B2 (en) 2009-03-04 2014-06-24 Imricor Medical Systems, Inc. MRI compatible conductive wires
CA2839071C (en) 2009-03-04 2017-10-17 Imricor Medical Systems, Inc. Mri compatible medical device temperature monitoring system and method
US8831743B2 (en) 2009-03-04 2014-09-09 Imricor Medical Systems, Inc. MRI compatible electrode circuit
US9084883B2 (en) 2009-03-12 2015-07-21 Cardiac Pacemakers, Inc. Thin profile conductor assembly for medical device leads
WO2010111245A1 (en) * 2009-03-26 2010-09-30 Kenergy, Inc. Mri compatible implanted lead-electrode interface
DE102009001984A1 (de) 2009-03-30 2010-10-14 Bruker Biospin Ag Vorrichtung zur Überwachung eines Lebewesens während eines Magnetresonanz-Experimentes
KR101719831B1 (ko) 2009-04-15 2017-03-24 마이크로벤션, 인코포레이티드 임플란트 전달 시스템
KR101828088B1 (ko) * 2009-04-15 2018-02-09 마이크로벤션, 인코포레이티드 임플란트 전달 시스템
EP2537554B1 (de) 2009-04-30 2015-10-07 Medtronic, Inc. Abschluss einer Abschirmung in einer implantierbaren medizinischen Elektrode
US20100312094A1 (en) 2009-06-08 2010-12-09 Michael Guttman Mri-guided surgical systems with preset scan planes
JP2012529977A (ja) 2009-06-16 2012-11-29 エムアールアイ・インターヴェンションズ,インコーポレイテッド Mri誘導装置、及び準リアルタイムに該装置を追跡し、該装置の動的可視化を生成することができるmri誘導介入システム
AU2010263218B2 (en) 2009-06-26 2014-03-06 Cardiac Pacemakers, Inc. Medical device lead including a unifilar coil with improved torque transmission capacity and reduced MRI heating
US20100331942A1 (en) * 2009-06-29 2010-12-30 Pacesetter, Inc. Mri compatible implantable medical lead and method of making same
US8406896B2 (en) * 2009-06-29 2013-03-26 Boston Scientific Neuromodulation Corporation Multi-element contact assemblies for electrical stimulation systems and systems and methods of making and using
WO2011010257A1 (en) 2009-07-24 2011-01-27 Koninklijke Philips Electronics N.V. Medical device for electrical stimulation
US8601672B2 (en) * 2009-07-31 2013-12-10 Advanced Neuromodulation Systems, Inc. Method for fabricating a stimulation lead to reduce MRI heating
US20110034983A1 (en) * 2009-08-07 2011-02-10 Pacesetter, Inc. Implantable medical device lead incorporating a conductive sheath surrounding insulated coils to reduce lead heating during mri
US8170687B2 (en) * 2009-08-07 2012-05-01 Pacesetter, Inc. Implantable medical device lead incorporating insulated coils formed as inductive bandstop filters to reduce lead heating during MRI
US8979871B2 (en) 2009-08-13 2015-03-17 Monteris Medical Corporation Image-guided therapy of a tissue
US8406897B2 (en) 2009-08-19 2013-03-26 Boston Scientific Neuromodulation Corporation Systems and methods for disposing one or more layers of material between lead conductor segments of electrical stimulation systems
US20110077708A1 (en) * 2009-09-28 2011-03-31 Alan Ostroff MRI Compatible Leadless Cardiac Pacemaker
US8335572B2 (en) 2009-10-08 2012-12-18 Cardiac Pacemakers, Inc. Medical device lead including a flared conductive coil
WO2011049684A1 (en) 2009-10-19 2011-04-28 Cardiac Pacemakers, Inc. Mri compatible tachycardia lead
EP2493551A4 (de) 2009-10-26 2013-04-17 Emkinetics Inc Verfahren und vorrichtung zur elektromagnetischen stimulation von nerven, muskeln und körpergewebe
US20120232632A1 (en) * 2009-10-30 2012-09-13 St. Jude Medical Ab medical implantable lead
US8554338B2 (en) * 2009-11-05 2013-10-08 Pacesetter, Inc. MRI-compatible implantable lead having a heat spreader and method of using same
US8295944B2 (en) 2009-11-30 2012-10-23 Boston Scientific Neuromodulation Corporation Electrode array with electrodes having cutout portions and methods of making the same
US8391985B2 (en) 2009-11-30 2013-03-05 Boston Scientific Neuromodulation Corporation Electrode array having concentric windowed cylinder electrodes and methods of making the same
US20110144722A1 (en) * 2009-12-10 2011-06-16 Pacesetter, Inc. Mri-compatible implantable lead with improved lc resonant component
US20110152990A1 (en) * 2009-12-22 2011-06-23 Pacesetter, Inc. Mri compatible lead employing multiple miniature inductors
JP5551794B2 (ja) 2009-12-30 2014-07-16 カーディアック ペースメイカーズ, インコーポレイテッド Mri条件下において安全な医療装置リード線
US8391994B2 (en) 2009-12-31 2013-03-05 Cardiac Pacemakers, Inc. MRI conditionally safe lead with low-profile multi-layer conductor for longitudinal expansion
EP2519305B1 (de) * 2009-12-31 2017-07-05 Cardiac Pacemakers, Inc. Bedingt mri-sichere elektrode mit mehrschichtigem leiter
EP2536464A1 (de) 2010-02-19 2012-12-26 Cardiac Pacemakers, Inc. Elektrode mit leitern mit konfiguration für reduzierte mri-induzierte ströme
WO2011109733A1 (en) * 2010-03-04 2011-09-09 Imricor Medical Systems, Inc. Mri compatible transmission line circuit
US20120016451A1 (en) * 2010-07-13 2012-01-19 Roger Struve Torque enhancement for mri-conditionally safe medical device lead
DE112011102764T5 (de) * 2010-08-20 2013-07-04 Kenergy, Inc. Verfahren zur Herstellung eines MRT-kompatiblen leitenden Elektrodenkörpers
US8825181B2 (en) * 2010-08-30 2014-09-02 Cardiac Pacemakers, Inc. Lead conductor with pitch and torque control for MRI conditionally safe use
WO2012051237A1 (en) 2010-10-12 2012-04-19 Nanostim, Inc. Temperature sensor for a leadless cardiac pacemaker
US9060692B2 (en) 2010-10-12 2015-06-23 Pacesetter, Inc. Temperature sensor for a leadless cardiac pacemaker
JP2013540022A (ja) 2010-10-13 2013-10-31 ナノスティム・インコーポレイテッド スクリュー戻り回転防止要素を備えたリードレス心臓ペースメーカ
EP2446922B1 (de) 2010-10-28 2014-03-05 BIOTRONIK SE & Co. KG Implantierbare Leiter mit zusätzlichen Leitern zur Feldentkopplung
US20120130462A1 (en) 2010-11-24 2012-05-24 Biotronik Se & Co. Kg Implantable Lead Comprising an Elongate Lead Body
WO2012082755A1 (en) 2010-12-13 2012-06-21 Nanostim, Inc. Pacemaker retrieval systems and methods
JP2014501136A (ja) 2010-12-13 2014-01-20 ナノスティム・インコーポレイテッド デリバリーカテーテルシステム及び方法
WO2012082900A2 (en) 2010-12-15 2012-06-21 Boston Scientific Neuromodulation Corporation Systems and methods for making and using leads for electrical stimulation systems with improved rf compatibility
US8942825B2 (en) * 2010-12-17 2015-01-27 Biotronik Se & Co. Kg Implantable device with elongated electrical conductor
US8509915B2 (en) * 2010-12-17 2013-08-13 Biotronik Se & Co. Kg Implantable electrode line device for reducing undesirable effects of electromagnetic fields
JP2014501584A (ja) 2010-12-20 2014-01-23 ナノスティム・インコーポレイテッド 放射状固定機構を有するリードレスペースメーカー
CA2824906A1 (en) * 2011-01-26 2012-08-02 Boston Scientific Neuromodulation Corporation Systems and methods for making and using electrical stimulation systems with improved rf compatibility
US8612021B2 (en) 2011-02-10 2013-12-17 Medtronic, Inc. Magnetic resonance imaging compatible medical electrical lead and method of making the same
EP2678067A4 (de) * 2011-02-24 2015-02-25 Mri Interventions Inc Mrti-gesteuerte katheter
US11198014B2 (en) 2011-03-01 2021-12-14 Greatbatch Ltd. Hermetically sealed filtered feedthrough assembly having a capacitor with an oxide resistant electrical connection to an active implantable medical device housing
US10272252B2 (en) 2016-11-08 2019-04-30 Greatbatch Ltd. Hermetic terminal for an AIMD having a composite brazed conductive lead
US10596369B2 (en) 2011-03-01 2020-03-24 Greatbatch Ltd. Low equivalent series resistance RF filter for an active implantable medical device
US10350421B2 (en) 2013-06-30 2019-07-16 Greatbatch Ltd. Metallurgically bonded gold pocket pad for grounding an EMI filter to a hermetic terminal for an active implantable medical device
US9427596B2 (en) 2013-01-16 2016-08-30 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US9931514B2 (en) 2013-06-30 2018-04-03 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
EP2522387B1 (de) 2011-05-10 2017-05-31 BIOTRONIK SE & Co. KG Implantierbare medizinische Leitung
EP2572752A1 (de) * 2011-09-21 2013-03-27 BIOTRONIK SE & Co. KG Elektrodenkathetereinrichtung
WO2013067496A2 (en) 2011-11-04 2013-05-10 Nanostim, Inc. Leadless cardiac pacemaker with integral battery and redundant welds
AU2012333113B2 (en) 2011-11-04 2014-11-20 Cardiac Pacemakers, Inc. Implantable medical device lead including inner coil reverse-wound relative to shocking coil
BR112014012659B1 (pt) 2011-11-29 2020-11-03 Koninklijke Philips N.V. tubo para ser introduzido em um objeto; sistema de intervenção para realização de um procedimento de intervenção; e aparelho e método de fabricação para fabricação de um tubo
AU2013211937B2 (en) 2012-01-25 2016-07-28 Nevro Corporation Lead anchors and associated systems and methods
WO2013138491A1 (en) * 2012-03-15 2013-09-19 Boston Scientific Neuromodulation Corporation Systems and methods for obtaining and using incident field transfer functions of electrical stimulation systems
WO2013158189A1 (en) 2012-04-19 2013-10-24 Medtronic, Inc. Paired medical lead bodies with braided conductive shields having different physical parameter values
US9581665B2 (en) * 2012-04-20 2017-02-28 General Electric Company Systems and methods for damping common-mode energy
JP5905611B2 (ja) 2012-04-20 2016-04-20 カーディアック ペースメイカーズ, インコーポレイテッド ユニファイラーコイル状ケーブルを備える埋込型医療装置リード
US8954168B2 (en) 2012-06-01 2015-02-10 Cardiac Pacemakers, Inc. Implantable device lead including a distal electrode assembly with a coiled component
WO2014049448A2 (en) 2012-07-26 2014-04-03 Adi Mashiach Implant encapsulation
WO2014022661A1 (en) 2012-08-01 2014-02-06 Nanostim, Inc. Biostimulator circuit with flying cell
US8958889B2 (en) 2012-08-31 2015-02-17 Cardiac Pacemakers, Inc. MRI compatible lead coil
EP2908903B1 (de) 2012-10-18 2016-08-31 Cardiac Pacemakers, Inc. Induktives element für mri-kompatibilität in einer leitung eines implantierbaren medizinproduktes
USRE46699E1 (en) 2013-01-16 2018-02-06 Greatbatch Ltd. Low impedance oxide resistant grounded capacitor for an AIMD
US9078588B2 (en) 2013-03-08 2015-07-14 MRI Interventions, Inc. MRI compatible intrabody stylets and related methods and systems
US11229789B2 (en) 2013-05-30 2022-01-25 Neurostim Oab, Inc. Neuro activator with controller
CA2913074C (en) 2013-05-30 2023-09-12 Graham H. Creasey Topical neurological stimulation
US9265935B2 (en) 2013-06-28 2016-02-23 Nevro Corporation Neurological stimulation lead anchors and associated systems and methods
EP3021934A2 (de) * 2013-07-15 2016-05-25 Boston Scientific Neuromodulation Corporation Leiteranordnungen für elektrostimulationsleitungen sowie systeme und verfahren mit den leitungen
EP3269419A1 (de) 2013-08-04 2018-01-17 Greatbatch Ltd. Mehrschichtiger planarer spiralinduktorfilter für medizinische, therapeutische oder diagnostische anwendungen
US9119970B2 (en) 2013-08-19 2015-09-01 Boston Scientific Neuromodulation Corporation Feedthrough assembly with glass layer and electrical stimulation systems containing the assembly
EP2848282B1 (de) * 2013-09-13 2016-08-10 BIOTRONIK SE & Co. KG Implantierbares Gerät
US9993638B2 (en) 2013-12-14 2018-06-12 Medtronic, Inc. Devices, systems and methods to reduce coupling of a shield and a conductor within an implantable medical lead
US10234518B2 (en) 2014-02-21 2019-03-19 Children's Hospital Medical Center Loop coil with integrated balun for MR applications
WO2015130753A1 (en) 2014-02-26 2015-09-03 Cardiac Pacemakers, Inc Construction of an mri-safe tachycardia lead
US9486170B2 (en) 2014-03-18 2016-11-08 Monteris Medical Corporation Image-guided therapy of a tissue
US10675113B2 (en) 2014-03-18 2020-06-09 Monteris Medical Corporation Automated therapy of a three-dimensional tissue region
US9700342B2 (en) 2014-03-18 2017-07-11 Monteris Medical Corporation Image-guided therapy of a tissue
US9782581B2 (en) 2014-06-27 2017-10-10 Boston Scientific Neuromodulation Corporation Methods and systems for electrical stimulation including a shielded sheath
EP3171931B1 (de) 2014-07-23 2021-11-10 Medtronic, Inc. Verfahren zur abschirmung implantierbarer medizinischer elektroden und implantierbare medizinische elektrodenerweiterungen
EP3191175B1 (de) 2014-07-24 2022-03-02 Medtronic, Inc. Vorrichtung zur abschirmung von implantierbaren medizinischen leitungen und leitungsverlängerungen
US10816621B2 (en) 2014-07-30 2020-10-27 Children's Hospital Medical Center Magnetic resonance signal detector grid assemblies for magnetic resonance imaging
US10031195B2 (en) 2014-07-30 2018-07-24 Children's Hospital Medical Center Detector grid arrays for MR imaging
US11077301B2 (en) 2015-02-21 2021-08-03 NeurostimOAB, Inc. Topical nerve stimulator and sensor for bladder control
US9782582B2 (en) 2015-03-27 2017-10-10 Boston Scientific Neuromodulation Corporation Systems and methods for making and using electrical stimulation systems to reduce RF-induced tissue heating
US10327830B2 (en) 2015-04-01 2019-06-25 Monteris Medical Corporation Cryotherapy, thermal therapy, temperature modulation therapy, and probe apparatus therefor
US10173055B2 (en) 2015-04-30 2019-01-08 Boston Scientific Neuromodulation Corporaation Electrical stimulation leads and systems having a RF shield along at least the lead and methods of making and using
EP3377170A4 (de) 2015-11-16 2019-07-31 Waikatolink Limited Implantatleiteranordnung mit verbesserten hochfrequenzeigenschaften
EP3411116B1 (de) 2016-02-05 2020-01-22 Boston Scientific Neuromodulation Corporation Implantierbare leitung zur optischen stimulation
EP3454935B1 (de) * 2016-05-11 2024-07-24 Inspire Medical Systems, Inc. Abschwächungsanordnung für implantierbare medizinische vorrichtung
US10209328B2 (en) 2016-05-27 2019-02-19 General Electric Company Systems and methods for common mode traps in MRI systems
US10379181B2 (en) * 2016-05-27 2019-08-13 General Electric Company Systems and methods for common mode traps in MRI systems
KR101903074B1 (ko) * 2016-08-24 2018-10-01 울산과학기술원 회전형 동축 광-전자기 도파관 집합체를 포함하는 광음향-초음파 내시경 시스템과 그 구현 방법
US11185707B2 (en) * 2016-12-09 2021-11-30 The Johns Hopkins University MRI-compatible cardiac defibrillator
US10249415B2 (en) 2017-01-06 2019-04-02 Greatbatch Ltd. Process for manufacturing a leadless feedthrough for an active implantable medical device
TWI668789B (zh) * 2017-02-03 2019-08-11 日商新川股份有限公司 接合裝置
US10603488B2 (en) 2017-02-10 2020-03-31 Oscor Inc. Implantable medical devices having diamagnetic conductors and contacts
WO2019040395A1 (en) * 2017-08-21 2019-02-28 The Johns Hopkins University THERMAL IMPROVEMENT IN MRI RADIO FREQUENCIES FOR METALLIC BRAID CATHETERS
JP2021510608A (ja) 2017-11-07 2021-04-30 ニューロスティム オーエービー インコーポレイテッド 適応回路を有する非侵襲性神経アクティベーター
DE102019106675A1 (de) 2018-03-20 2019-09-26 Biotronik Se & Co. Kg Leitung für ein medizinisches Implantat, mit integrierten periodischen Induktionsspulen (iPIC) für verringerte Wechselwirkungen mit elektromagnetischen Feldern
US10905888B2 (en) 2018-03-22 2021-02-02 Greatbatch Ltd. Electrical connection for an AIMD EMI filter utilizing an anisotropic conductive layer
US10912945B2 (en) 2018-03-22 2021-02-09 Greatbatch Ltd. Hermetic terminal for an active implantable medical device having a feedthrough capacitor partially overhanging a ferrule for high effective capacitance area
WO2019183054A1 (en) 2018-03-23 2019-09-26 Boston Scientific Neuromodulation Corporation Optical stimulation systems with calibration and methods of making and using
US11224743B2 (en) * 2018-09-21 2022-01-18 Boston Scientific Neuromodulation Corporation Systems and methods for making and using modular leads for electrical stimulation systems
CN113271846A (zh) * 2018-10-19 2021-08-17 透壁系统有限责任公司 Mri兼容设备
WO2020102039A1 (en) 2018-11-16 2020-05-22 Boston Scientific Neuromodulation Corporation An optical stimulation system with on-demand monitoring and methods of making
US12114863B2 (en) 2018-12-05 2024-10-15 Microvention, Inc. Implant delivery system
US11219770B2 (en) 2019-01-17 2022-01-11 Pacesetter, Inc. Method and system for validating safety of a medical device when exposed to magnetic resonance imaging fields
DE102020100121A1 (de) * 2019-02-13 2020-08-13 Biotronik Se & Co. Kg Implantierbare Elektrode mit einer Stichleitung
EP3990100A4 (de) 2019-06-26 2023-07-19 Neurostim Technologies LLC Nicht-invasiver nervenaktivator mit adaptiver schaltung
EP3756725A1 (de) * 2019-06-28 2020-12-30 BIOTRONIK SE & Co. KG Implantierbare elktrodenleitung mit zu einem geflechtverbundenen leitern
JP2023506713A (ja) 2019-12-16 2023-02-20 ニューロスティム テクノロジーズ エルエルシー 昇圧電荷送達を用いた非侵襲性神経アクティベータ
EP4084864A1 (de) * 2020-01-05 2022-11-09 Impulse Dynamics NV Prüfung von elektrodenzuständen in einem implantierten herzschrittmacher
DE102020119478B4 (de) * 2020-07-23 2022-02-03 Md Elektronik Gmbh Verfahren zum Herstellen eines elektrischen Steckverbinders für ein mehradriges, elektrisches Kabel
EP4168110A1 (de) 2020-09-04 2023-04-26 Boston Scientific Neuromodulation Corporation Stimulationssysteme mit einer linsenanordnung zur lichtkopplung und verfahren zur herstellung und verwendung
US11806161B2 (en) 2021-06-04 2023-11-07 Endosure Inc. Method and system for monitoring internal bodily disorders by detecting and analyzing tissue frequencies
US11779757B2 (en) 2021-07-21 2023-10-10 Advanced Neuromodulation Systems, Inc. MRI-compatible implantable medical devices
DE202022100244U1 (de) * 2022-01-18 2022-01-25 Biotronik Se & Co. Kg Integrierte seriell resonante Antenne als Wellenemitter für implantierbare Elektroden
WO2024110204A1 (en) * 2022-11-24 2024-05-30 Biotronik Se & Co. Kg Medical electrode device for implantation into a patient and method for fabricating a medical electrode device

Family Cites Families (146)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US522506A (en) * 1894-07-03 Electric converter
US1436323A (en) * 1919-06-28 1922-11-21 Western Electric Co Method of and apparatus for testing fibrous materials
US3969930A (en) * 1975-04-10 1976-07-20 Allied Chemical Corporation Testing viscoelastic solids
US4006748A (en) 1976-01-29 1977-02-08 Pacestter Systems, Inc. Implantable unipolar pacemaker with improved outer electrode plate
US4149104A (en) * 1976-12-15 1979-04-10 Hitachi, Ltd. Method of manufacturing a coil heater of an indirectly-heated type cathode electrode of electronic tubes
JPS5734671Y2 (de) * 1976-12-15 1982-07-30
US4165634A (en) * 1978-02-06 1979-08-28 Allied Chemical Corporation Viscoelastometer and process for measuring viscoelastic properties
DE4113120A1 (de) 1991-04-22 1992-11-05 Siemens Ag Kernspintomograph
US5222506A (en) * 1991-07-29 1993-06-29 Medtronic, Inc. Implantable medical lead with electrical cross-over adaptor
US5350419A (en) 1992-09-18 1994-09-27 Ethicon, Inc. Cardiac pacing lead
US5405374A (en) 1993-08-25 1995-04-11 Medtronic, Inc. Transvenous defibrillation lead and method of use
US5582609A (en) * 1993-10-14 1996-12-10 Ep Technologies, Inc. Systems and methods for forming large lesions in body tissue using curvilinear electrode elements
GB9414240D0 (en) 1994-07-14 1994-08-31 Fry Robin Method of coiling and a coiled conductor
WO1996006655A1 (en) 1994-08-29 1996-03-07 Angeion Corporation Low profile defibrillation catheter
US6285910B1 (en) 1997-04-21 2001-09-04 Medtronic, Inc. Medical electrical lead
US6785576B2 (en) 1997-04-21 2004-08-31 Medtronic, Inc. Medical electrical lead
AU4959799A (en) 1998-06-26 2000-01-17 Advanced Bionics Corporation Programmable current output stimulus stage for implantable device
US20020003936A1 (en) * 1998-10-19 2002-01-10 Andrew W. Kaliszek Fine spaced winding pattern for fiber optic coil
US6701176B1 (en) * 1998-11-04 2004-03-02 Johns Hopkins University School Of Medicine Magnetic-resonance-guided imaging, electrophysiology, and ablation
US8244370B2 (en) 2001-04-13 2012-08-14 Greatbatch Ltd. Band stop filter employing a capacitor and an inductor tank circuit to enhance MRI compatibility of active medical devices
US7945322B2 (en) * 2005-11-11 2011-05-17 Greatbatch Ltd. Tank filters placed in series with the lead wires or circuits of active medical devices to enhance MRI compatibility
US7844319B2 (en) * 1998-11-04 2010-11-30 Susil Robert C Systems and methods for magnetic-resonance-guided interventional procedures
US9061139B2 (en) * 1998-11-04 2015-06-23 Greatbatch Ltd. Implantable lead with a band stop filter having a capacitor in parallel with an inductor embedded in a dielectric body
US6284971B1 (en) * 1998-11-25 2001-09-04 Johns Hopkins University School Of Medicine Enhanced safety coaxial cables
US6393325B1 (en) 1999-01-07 2002-05-21 Advanced Bionics Corporation Directional programming for implantable electrode arrays
US7285235B2 (en) * 1999-05-19 2007-10-23 Medtronic, Inc. Manufacturing conduits for use in placing a target vessel in fluid communication with a source of blood
EP1105966B1 (de) 1999-06-14 2005-11-09 Koninklijke Philips Electronics N.V. Gerät für die magnetische-resonanz-bildgebung, ausgestattet mit entstörenden verbindungsleitungen für elektrische einrichtungen
US6516227B1 (en) 1999-07-27 2003-02-04 Advanced Bionics Corporation Rechargeable spinal cord stimulator system
US6278355B1 (en) * 1999-08-23 2001-08-21 Square D Company Transformer winding
US7949395B2 (en) 1999-10-01 2011-05-24 Boston Scientific Neuromodulation Corporation Implantable microdevice with extended lead and remote electrode
US6609029B1 (en) 2000-02-04 2003-08-19 Advanced Bionics Corporation Clip lock mechanism for retaining lead
US6741892B1 (en) 2000-03-10 2004-05-25 Advanced Bionics Corporation Movable contact locking mechanism for spinal cord stimulator lead connector
US20030236562A1 (en) * 2000-10-10 2003-12-25 Kuzma Janusz A. Band type multicontact electrode and method of making the same
JP2002157927A (ja) 2000-11-21 2002-05-31 Sumitomo Wiring Syst Ltd 電線の屈曲試験装置
JP2004514485A (ja) * 2000-11-24 2004-05-20 コーニンクレッカ フィリップス エレクトロニクス エヌ ヴィ 分離された電気的接続導体を有する挿入装置
US7033326B1 (en) 2000-12-29 2006-04-25 Advanced Bionics Corporation Systems and methods of implanting a lead for brain stimulation
US6829509B1 (en) 2001-02-20 2004-12-07 Biophan Technologies, Inc. Electromagnetic interference immune tissue invasive system
US6949929B2 (en) 2003-06-24 2005-09-27 Biophan Technologies, Inc. Magnetic resonance imaging interference immune device
US7899551B2 (en) * 2001-04-13 2011-03-01 Greatbatch Ltd. Medical lead system utilizing electromagnetic bandstop filters
US7916013B2 (en) * 2005-03-21 2011-03-29 Greatbatch Ltd. RFID detection and identification system for implantable medical devices
US8219208B2 (en) * 2001-04-13 2012-07-10 Greatbatch Ltd. Frequency selective passive component networks for active implantable medical devices utilizing an energy dissipating surface
US8437865B2 (en) * 2001-04-13 2013-05-07 Greatbatch Ltd. Shielded network for an active medical device implantable lead
US7787958B2 (en) * 2001-04-13 2010-08-31 Greatbatch Ltd. RFID detection and identification system for implantable medical lead systems
US8989870B2 (en) * 2001-04-13 2015-03-24 Greatbatch Ltd. Tuned energy balanced system for minimizing heating and/or to provide EMI protection of implanted leads in a high power electromagnetic field environment
US8977355B2 (en) * 2001-04-13 2015-03-10 Greatbatch Ltd. EMI filter employing a capacitor and an inductor tank circuit having optimum component values
US20070088416A1 (en) * 2001-04-13 2007-04-19 Surgi-Vision, Inc. Mri compatible medical leads
US8224440B2 (en) 2006-11-09 2012-07-17 Greatbatch Ltd. Electrically isolating electrical components in a medical electrical lead with an active fixation electrode
US20090163980A1 (en) * 2007-12-21 2009-06-25 Greatbatch Ltd. Switch for turning off therapy delivery of an active implantable medical device during mri scans
US8849403B2 (en) * 2001-04-13 2014-09-30 Greatbatch Ltd. Active implantable medical system having EMI shielded lead
CA2482202C (en) * 2001-04-13 2012-07-03 Surgi-Vision, Inc. Systems and methods for magnetic-resonance-guided interventional procedures
US7751903B2 (en) * 2002-04-15 2010-07-06 Greatbatch Ltd. Frequency selective passive component networks for implantable leads of active implantable medical devices utilizing an energy dissipating surface
US20090163981A1 (en) * 2007-12-21 2009-06-25 Greatbatch Ltd. Multiplexer for selection of an mri compatible band stop filter or switch placed in series with a particular therapy electrode of an active implantable medical device
US8457760B2 (en) * 2001-04-13 2013-06-04 Greatbatch Ltd. Switched diverter circuits for minimizing heating of an implanted lead and/or providing EMI protection in a high power electromagnetic field environment
US8000801B2 (en) * 2001-04-13 2011-08-16 Greatbatch Ltd. System for terminating abandoned implanted leads to minimize heating in high power electromagnetic field environments
US8600519B2 (en) * 2001-04-13 2013-12-03 Greatbatch Ltd. Transient voltage/current protection system for electronic circuits associated with implanted leads
US7853325B2 (en) * 2001-04-13 2010-12-14 Greatbatch Ltd. Cylindrical bandstop filters for medical lead systems
US8509913B2 (en) * 2001-04-13 2013-08-13 Greatbatch Ltd. Switched diverter circuits for minimizing heating of an implanted lead and/or providing EMI protection in a high power electromagnetic field environment
US20030079900A1 (en) 2001-10-25 2003-05-01 Hahn Scott D. Adjustable line length
US6944489B2 (en) * 2001-10-31 2005-09-13 Medtronic, Inc. Method and apparatus for shunting induced currents in an electrical lead
US8364278B2 (en) 2002-01-29 2013-01-29 Boston Scientific Neuromodulation Corporation Lead assembly for implantable microstimulator
US20030144720A1 (en) * 2002-01-29 2003-07-31 Villaseca Eduardo H. Electromagnetic trap for a lead
US7917219B2 (en) * 2002-02-28 2011-03-29 Greatbatch Ltd. Passive electronic network components designed for direct body fluid exposure
US8660645B2 (en) * 2002-02-28 2014-02-25 Greatbatch Ltd. Electronic network components utilizing biocompatible conductive adhesives for direct body fluid exposure
WO2003073450A1 (en) * 2002-02-28 2003-09-04 Greatbatch-Sierra, Inc. Emi feedthrough filter terminal assembly utilizing hermetic seal for electrical attachment between lead wires and capacitor
US6985347B2 (en) * 2002-02-28 2006-01-10 Greatbatch-Sierra, Inc. EMI filter capacitors designed for direct body fluid exposure
JP2002355849A (ja) 2002-03-25 2002-12-10 Excel Kk 多層プラスチック成形体の製造方法
JP2004016739A (ja) 2002-06-20 2004-01-22 Kuma Lift Gijutsu Kenkyusho:Kk いす式階段昇降機の肘掛け構造
ES2554762T3 (es) 2002-06-28 2015-12-23 Boston Scientific Neuromodulation Corporation Microestimulador que tiene fuente de alimentación autónoma y sistema de telemetría direccional
US6810751B2 (en) * 2002-07-29 2004-11-02 Michael R. Moreno Method and apparatus for vascular durability and fatigue testing
US6937897B2 (en) 2002-09-30 2005-08-30 Medtronic, Inc. Electrode for His bundle stimulation
DE10249239A1 (de) * 2002-10-23 2004-05-06 Philips Intellectual Property & Standards Gmbh Magnetresonanz-Bildgerät mit elektrischer Zusatzeinrichtung
US6920361B2 (en) 2003-02-14 2005-07-19 Medtronic, Inc. Reverse wound electrodes
US6999818B2 (en) * 2003-05-23 2006-02-14 Greatbatch-Sierra, Inc. Inductor capacitor EMI filter for human implant applications
US7038900B2 (en) 2003-02-27 2006-05-02 Greatbatch-Sierra, Inc. EMI filter terminal assembly with wire bond pads for human implant applications
US7623335B2 (en) * 2003-02-27 2009-11-24 Greatbatch-Sierra, Inc Hermetic feedthrough terminal assembly with wire bond pads for human implant applications
US6987660B2 (en) * 2003-02-27 2006-01-17 Greatbatch-Sierra, Inc. Spring contact system for EMI filtered hermetic seals for active implantable medical devices
US7039950B2 (en) 2003-04-21 2006-05-02 Ipolicy Networks, Inc. System and method for network quality of service protection on security breach detection
US7388378B2 (en) 2003-06-24 2008-06-17 Medtronic, Inc. Magnetic resonance imaging interference immune device
US7765005B2 (en) * 2004-02-12 2010-07-27 Greatbatch Ltd. Apparatus and process for reducing the susceptability of active implantable medical devices to medical procedures such as magnetic resonance imaging
US7035076B1 (en) * 2005-08-15 2006-04-25 Greatbatch-Sierra, Inc. Feedthrough filter capacitor assembly with internally grounded hermetic insulator
US7489495B2 (en) * 2004-04-15 2009-02-10 Greatbatch-Sierra, Inc. Apparatus and process for reducing the susceptibility of active implantable medical devices to medical procedures such as magnetic resonance imaging
CN1947028B (zh) * 2004-04-23 2011-01-26 皇家飞利浦电子股份有限公司 配备有电气附件装置的磁共振成像系统
US7035077B2 (en) * 2004-05-10 2006-04-25 Greatbatch-Sierra, Inc. Device to protect an active implantable medical device feedthrough capacitor from stray laser weld strikes, and related manufacturing process
US7783359B2 (en) 2005-01-05 2010-08-24 Boston Scientific Neuromodulation Corporation Devices and methods using an implantable pulse generator for brain stimulation
US7809446B2 (en) 2005-01-05 2010-10-05 Boston Scientific Neuromodulation Corporation Devices and methods for brain stimulation
US7136273B2 (en) * 2005-03-30 2006-11-14 Greatbatch-Sierra, Inc. Hybrid spring contact system for EMI filtered hermetic seals for active implantable medical devices
US8825180B2 (en) 2005-03-31 2014-09-02 Medtronic, Inc. Medical electrical lead with co-radial multi-conductor coil
WO2006119492A2 (en) * 2005-05-04 2006-11-09 Surgi-Vision, Inc. Improved electrical lead for an electronic device such as an implantable device
US7761165B1 (en) 2005-09-29 2010-07-20 Boston Scientific Neuromodulation Corporation Implantable stimulator with integrated plastic housing/metal contacts and manufacture and use
US8271094B1 (en) 2005-09-30 2012-09-18 Boston Scientific Neuromodulation Corporation Devices with cannula and electrode lead for brain stimulation and methods of use and manufacture
US8255054B2 (en) 2005-11-04 2012-08-28 Kenergy, Inc. MRI compatible implanted electronic medical device
US7917213B2 (en) 2005-11-04 2011-03-29 Kenergy, Inc. MRI compatible implanted electronic medical lead
US7853324B2 (en) * 2005-11-11 2010-12-14 Greatbatch Ltd. Tank filters utilizing very low K materials, in series with lead wires or circuits of active medical devices to enhance MRI compatibility
WO2007117302A2 (en) 2005-11-11 2007-10-18 Greatbatch Ltd. Low loss band pass filter for rf distance telemetry pin antennas of active implantable medical devices
US7672734B2 (en) 2005-12-27 2010-03-02 Boston Scientific Neuromodulation Corporation Non-linear electrode array
US8700178B2 (en) 2005-12-27 2014-04-15 Boston Scientific Neuromodulation Corporation Stimulator leads and methods for lead fabrication
US7244150B1 (en) 2006-01-09 2007-07-17 Advanced Bionics Corporation Connector and methods of fabrication
US8253555B2 (en) * 2006-01-25 2012-08-28 Greatbatch Ltd. Miniature hermetically sealed RFID microelectronic chip connected to a biocompatible RFID antenna for use in conjunction with an AIMD
US8248232B2 (en) * 2006-01-25 2012-08-21 Greatbatch Ltd. Hermetically sealed RFID microelectronic chip connected to a biocompatible RFID antenna
US20100191306A1 (en) * 2006-01-25 2010-07-29 Greatbatch Ltd. Transient voltage suppression circuit for an implanted rfid chip
US8175710B2 (en) 2006-03-14 2012-05-08 Boston Scientific Neuromodulation Corporation Stimulator system with electrode array and the method of making the same
US7881808B2 (en) 2006-03-29 2011-02-01 Cardiac Pacemakers, Inc. Conductive polymeric coating with optional biobeneficial topcoat for a medical lead
US7974706B2 (en) 2006-03-30 2011-07-05 Boston Scientific Neuromodulation Corporation Electrode contact configurations for cuff leads
WO2007118194A2 (en) 2006-04-07 2007-10-18 Biophan Technologies, Inc. Resonance circuit for implantable devices and leads
US7623336B2 (en) * 2006-06-01 2009-11-24 Greatbatch Ltd. Feedthrough capacitor having reduced self resonance insertion loss dip
US7702387B2 (en) * 2006-06-08 2010-04-20 Greatbatch Ltd. Tank filters adaptable for placement with a guide wire, in series with the lead wires or circuits of active medical devices to enhance MRI compatibility
US9042999B2 (en) * 2006-06-08 2015-05-26 Greatbatch Ltd. Low loss band pass filter for RF distance telemetry pin antennas of active implantable medical devices
US8224450B2 (en) 2006-09-18 2012-07-17 Boston Scientific Neuromodulation Corporation Feed through interconnect assembly for an implantable stimulation system and methods of making and using
US8321032B2 (en) * 2006-11-09 2012-11-27 Greatbatch Ltd. RFID-enabled AIMD programmer system for identifying MRI compatibility of implanted leads
US20110288403A1 (en) 2006-11-09 2011-11-24 Greatbatch Ltd. Multilayer helical wave filter for mri applications
DE102007034990A1 (de) * 2006-11-17 2008-06-12 Biotronik Crm Patent Ag Elektrodenkatheter zu Interventionszwecken
KR101413677B1 (ko) * 2007-03-19 2014-07-01 엠알아이 인터벤션즈, 인크. 전도체를 갖는 리드 제조 방법 및 장치와 관련 가요성 리드 구성
EP2705874B1 (de) 2007-03-19 2016-09-28 Boston Scientific Neuromodulation Corporation MRI- und HF-kompatible Leitungen
US9192409B2 (en) 2008-01-23 2015-11-24 Boston Scientific Neuromodulation Corporation Steerable stylet handle assembly
US20090192577A1 (en) 2008-01-28 2009-07-30 Shrojalkumar Desai Medical electrical lead with coated conductor
US8600518B2 (en) 2008-04-30 2013-12-03 Boston Scientific Neuromodulation Corporation Electrodes for stimulation leads and methods of manufacture and use
US20100076535A1 (en) 2008-09-25 2010-03-25 Boston Scientific Neuromodulation Corporation Leads with non-circular-shaped distal ends for brain stimulation systems and methods of making and using
US8364279B2 (en) 2008-09-25 2013-01-29 Boston Scientific Neuromodulation Corporation Electrical stimulation leads having RF compatibility and methods of use and manufacture
US8335570B2 (en) 2008-10-09 2012-12-18 Boston Scientific Neuromodulation Corporation Electrical stimulation leads having RF compatibility and methods of use and manufacture
EP2349453A4 (de) * 2008-10-30 2015-07-01 Greatbatch Ltd Physikalisch seriell angeordnete kondensator- sowie induktorelemente mit parallel geschalteten konzentrierten parametern zur formung eines kerbfilters
US8478423B2 (en) 2009-04-07 2013-07-02 Boston Scientific Neuromodulation Corporation Insulator layers for leads of implantable electric stimulation systems and methods of making and using
CA2758519A1 (en) 2009-04-16 2010-10-21 Boston Scientific Neuromodulation Corporation Deep brain stimulation current steering with split electrodes
US8322026B2 (en) 2009-06-29 2012-12-04 Boston Scientific Neuromodulation Corporation Method for forming a lead
US8875391B2 (en) 2009-07-07 2014-11-04 Boston Scientific Neuromodulation Corporation Methods for making leads with radially-aligned segmented electrodes for electrical stimulation systems
US8887387B2 (en) 2009-07-07 2014-11-18 Boston Scientific Neuromodulation Corporation Methods of manufacture of leads with a radially segmented electrode array
US8340782B2 (en) 2009-07-08 2012-12-25 Boston Scientific Neuromodulation Corporation Systems and methods of making and using support elements for elongated members of implantable electric stimulation systems
US8380324B2 (en) 2009-08-20 2013-02-19 Boston Scientific Neuromodulation Corporation Systems and methods for altering one or more RF-response properties of electrical stimulation systems
US8874232B2 (en) 2009-11-30 2014-10-28 Boston Scientific Neuromodulation Corporation Electrode array having concentric split ring electrodes and methods of making the same
US8788063B2 (en) 2009-11-30 2014-07-22 Boston Scientific Neuromodulation Corporation Electrode array having a rail system and methods of manufacturing the same
US8391985B2 (en) 2009-11-30 2013-03-05 Boston Scientific Neuromodulation Corporation Electrode array having concentric windowed cylinder electrodes and methods of making the same
US8295944B2 (en) 2009-11-30 2012-10-23 Boston Scientific Neuromodulation Corporation Electrode array with electrodes having cutout portions and methods of making the same
US20110230893A1 (en) 2010-03-19 2011-09-22 Boston Scientific Neuromodulation Corporation Systems and methods for making and using electrical stimulation systems having multi-lead-element lead bodies
US8571665B2 (en) 2010-03-23 2013-10-29 Boston Scientific Neuromodulation Corporation Helical radial spacing of contacts on a cylindrical lead
JP5793190B2 (ja) 2010-06-18 2015-10-14 ボストン サイエンティフィック ニューロモデュレイション コーポレイション 脳刺激装置を製造する方法
EP2593177B1 (de) 2010-07-16 2021-10-20 Boston Scientific Neuromodulation Corporation Systeme und verfahren zur radialen lenkung von elektrodenanordnungen
US20120046710A1 (en) 2010-08-18 2012-02-23 Boston Scientific Neuromodulation Corporation Methods, systems, and devices for deep brain stimulation using helical movement of the centroid of stimulation
AU2011305914B2 (en) 2010-09-21 2016-05-12 Boston Scientific Neuromodulation Corporation Systems and methods for making and using radially-aligned segmented electrodes for leads of electrical stimulation systems
ES2530959T3 (es) 2010-12-23 2015-03-09 Boston Scient Neuromodulation Método y conjunto para fabricar un conductor eléctrico que incluye el retirar los conectores elevados mediante amolado
US8700179B2 (en) 2011-02-02 2014-04-15 Boston Scientific Neuromodulation Corporation Leads with spiral of helical segmented electrode arrays and methods of making and using the leads
US20120203316A1 (en) 2011-02-08 2012-08-09 Boston Scientific Neuromodulation Corporation Leads with segmented electrodes for electrical stimulation of planar regions and methods of making and using
JP6005667B2 (ja) 2011-02-08 2016-10-12 ボストン サイエンティフィック ニューロモデュレイション コーポレイション 螺旋状に配列されたセグメント電極を有するリード並びにリードを製造及び使用する方法
JP2014511227A (ja) 2011-02-08 2014-05-15 ボストン サイエンティフィック ニューロモデュレイション コーポレイション 電気刺激システムのためのセグメント電極を有するリードを製造する方法
EP2717961B1 (de) 2011-06-07 2017-10-04 Boston Scientific Neuromodulation Corporation Systeme und verfahren zur herstellung und verwendung von verbesserten elektroden für elektrische stimulationssysteme
US9878148B2 (en) 2012-04-17 2018-01-30 Boston Scientific Neuromodulation Corporation Lead with contact end conductor guide and methods of making and using
WO2014035754A1 (en) 2012-08-27 2014-03-06 Boston Scientific Neuromodulation Corporation Electrical stimulation lead with junction and methods of making and using
EP3021934A2 (de) 2013-07-15 2016-05-25 Boston Scientific Neuromodulation Corporation Leiteranordnungen für elektrostimulationsleitungen sowie systeme und verfahren mit den leitungen

Also Published As

Publication number Publication date
ES2607450T3 (es) 2017-03-31
US10391307B2 (en) 2019-08-27
KR101413679B1 (ko) 2014-07-01
EP2705874A1 (de) 2014-03-12
AU2008229465B2 (en) 2013-08-22
US20170113036A1 (en) 2017-04-27
CA2681367C (en) 2016-08-16
US9492651B2 (en) 2016-11-15
AU2008229465A1 (en) 2008-09-25
CA2681367A1 (en) 2008-09-25
WO2008115426A1 (en) 2008-09-25
KR20100015702A (ko) 2010-02-12
US20080243218A1 (en) 2008-10-02
ES2462741T3 (es) 2014-05-26
EP2131918A1 (de) 2009-12-16
JP2010522021A (ja) 2010-07-01
EP2131918B1 (de) 2014-04-23
JP5568316B2 (ja) 2014-08-06

Similar Documents

Publication Publication Date Title
US10391307B2 (en) MRI and RF compatible leads and related methods of operating and fabricating leads
EP2134413B1 (de) Verfahren und gerät zur herstellung von kabeln mit leitern und relevante flexible kabelkonfigurationen
US8688226B2 (en) MRI-safe high impedance lead systems
AU2014253481B2 (en) MRI compatible electrode circuit

Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

AC Divisional application: reference to earlier application

Ref document number: 2131918

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: A1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

RAP1 Party data changed (applicant data changed or rights of an application transferred)

Owner name: BOSTON SCIENTIFIC NEUROMODULATION CORPORATION

Owner name: MRI INTERVENTIONS, INC.

17P Request for examination filed

Effective date: 20140912

RBV Designated contracting states (corrected)

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

GRAP Despatch of communication of intention to grant a patent

Free format text: ORIGINAL CODE: EPIDOSNIGR1

RIC1 Information provided on ipc code assigned before grant

Ipc: A61N 1/16 20060101ALI20160307BHEP

Ipc: B29C 33/12 20060101ALI20160307BHEP

Ipc: A61N 1/37 20060101ALN20160307BHEP

Ipc: A61N 1/08 20060101ALI20160307BHEP

Ipc: B29C 39/18 20060101ALI20160307BHEP

Ipc: A61N 1/05 20060101AFI20160307BHEP

Ipc: H01B 7/04 20060101ALI20160307BHEP

Ipc: G01N 3/32 20060101ALI20160307BHEP

INTG Intention to grant announced

Effective date: 20160414

GRAS Grant fee paid

Free format text: ORIGINAL CODE: EPIDOSNIGR3

GRAA (expected) grant

Free format text: ORIGINAL CODE: 0009210

AC Divisional application: reference to earlier application

Ref document number: 2131918

Country of ref document: EP

Kind code of ref document: P

AK Designated contracting states

Kind code of ref document: B1

Designated state(s): AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MT NL NO PL PT RO SE SI SK TR

REG Reference to a national code

Ref country code: GB

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: CH

Ref legal event code: EP

REG Reference to a national code

Ref country code: AT

Ref legal event code: REF

Ref document number: 832218

Country of ref document: AT

Kind code of ref document: T

Effective date: 20161015

REG Reference to a national code

Ref country code: IE

Ref legal event code: FG4D

REG Reference to a national code

Ref country code: DE

Ref legal event code: R096

Ref document number: 602008046595

Country of ref document: DE

REG Reference to a national code

Ref country code: NL

Ref legal event code: FP

REG Reference to a national code

Ref country code: LT

Ref legal event code: MG4D

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: NO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161228

Ref country code: HR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: FI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: LT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 10

REG Reference to a national code

Ref country code: AT

Ref legal event code: MK05

Ref document number: 832218

Country of ref document: AT

Kind code of ref document: T

Effective date: 20160928

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LV

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: SE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: GR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161229

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: RO

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: EE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: AT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: SK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: BG

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20161228

Ref country code: CZ

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: IS

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170128

Ref country code: BE

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: PL

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: PT

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20170130

REG Reference to a national code

Ref country code: DE

Ref legal event code: R097

Ref document number: 602008046595

Country of ref document: DE

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: DK

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

PLBE No opposition filed within time limit

Free format text: ORIGINAL CODE: 0009261

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: NO OPPOSITION FILED WITHIN TIME LIMIT

26N No opposition filed

Effective date: 20170629

REG Reference to a national code

Ref country code: CH

Ref legal event code: PL

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: SI

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

Ref country code: MC

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: LU

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170313

REG Reference to a national code

Ref country code: FR

Ref legal event code: PLFP

Year of fee payment: 11

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CH

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170331

Ref country code: LI

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170331

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: MT

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20170313

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: HU

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT; INVALID AB INITIO

Effective date: 20080313

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: CY

Free format text: LAPSE BECAUSE OF NON-PAYMENT OF DUE FEES

Effective date: 20160928

PG25 Lapsed in a contracting state [announced via postgrant information from national office to epo]

Ref country code: TR

Free format text: LAPSE BECAUSE OF FAILURE TO SUBMIT A TRANSLATION OF THE DESCRIPTION OR TO PAY THE FEE WITHIN THE PRESCRIBED TIME-LIMIT

Effective date: 20160928

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: NL

Payment date: 20240220

Year of fee payment: 17

Ref country code: IE

Payment date: 20240222

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: DE

Payment date: 20240220

Year of fee payment: 17

Ref country code: GB

Payment date: 20240220

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: IT

Payment date: 20240220

Year of fee payment: 17

Ref country code: FR

Payment date: 20240220

Year of fee payment: 17

PGFP Annual fee paid to national office [announced via postgrant information from national office to epo]

Ref country code: ES

Payment date: 20240402

Year of fee payment: 17