EP2598453A1

EP2598453A1 - Device and method for substrate processing

Info

Publication number: EP2598453A1
Application number: EP11709348.4A
Authority: EP
Inventors: Jessica Hartwich; Franz Karg
Original assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Current assignee: Saint Gobain Glass France SAS; Compagnie de Saint Gobain SA
Priority date: 2010-03-01
Filing date: 2011-02-22
Publication date: 2013-06-05
Also published as: US20130059431A1; CN102770385A; KR20130024884A; WO2011107373A1; JP2013521408A; EP2368860A1; ZA201206144B; EA201290845A1

Abstract

The present invention relates to a device for processing substrates in a processing system having at least one process tool disposed in at least one process area, said tool comprising two substrate levels disposed opposite each other and aligned at least approximately perpendicular, wherein the device is adapted for processing at least two substrates at the same time in the process area by means of the process tool, wherein the substrates can be disposed in the substrate levels so that coatings of the substrates face each other and a quasi-closed process space is formed between the substrates at least during processing. The invention further relates to a method for processing coated substrates in a processing system, wherein the substrates comprise coatings and the substrates are each disposed opposite each other, such that the coatings of the substrates face each other and a quasi-closed process space is formed between the substrates at least during processing.

Description

Device and method for substrate processing

The present invention relates to an apparatus and a method for substrate processing in a processing plant with at least one process tool arranged in a process area.

Such processing is carried out in particular in the production of semiconductor components and may, inter alia, consist in a coating, structuring, temperature control or the like. Especially in the processing of glass substrates with passive and active components (for example for architectural glazing, for heat reflection from inside a building, for displays, thin-film solar cells, such as CIS / CIGS thin-film solar cells, or the like), coatings and temperature treatments play a significant role Role. If the coating contains a volatile component (such as organic compounds, selenium, sulfur or the like), the coating process, but especially the temperature treatment, results in a significant loss of the volatile component to the environment (such as the walls of the coating chamber). This results in an uncontrolled shift in the stoichiometry of the coating and / or high additional costs for providing a required excess of the volatile component.

Basically, these conditions also apply to the processing of a variety of other substrate materials, such as metal plates, glass ceramics, ceramics and

Plastics.

In order to control the stoichiometry while at the same time reducing the cost of the required excess volatile component, WO 2009/135685 has proposed a temporary process box. With the aid of this process box, the process space in which the substrate is processed is substantially reduced so that only a significantly smaller amount of the volatile component is needed to generate the necessary partial pressure of volatile component. which costs can be significantly reduced.

The object of the present invention is to further reduce these costs and at the same time to enable a homogeneous processing of the substrates or of the coatings on the substrates.

This object is achieved according to the invention by an apparatus and a method for processing substrates having the features of the claims in juxtaposition. Advantageous developments are specified in the subclaims.

The device according to the invention for processing substrates, in particular coated substrates, in a processing plant, preferably a vacuum treatment plant, having at least one process tool arranged in at least one process area, in particular a thermal evaporator device, a sputtering device, preferably a rotatable cylinder magnetron sputtering device, a structuring device, a heating device or the like, is characterized in that the device in the process region has two oppositely arranged substrate planes, which are aligned substantially vertically so that the device is adapted to at least two substrates simultaneously in the process area with the process tool process, wherein the substrates can be arranged in the substrate planes, wherein the substrate planes are preferably aligned parallel with respect to their vertical component. In this case, the substrates in the substrate planes can be arranged so that coatings of the substrates face each other and at least during the processing between the substrates a quasi-closed process space is formed. In one possible embodiment of the device according to the invention, a frame which limits the process space in a gas-tight manner between the two chambers is provided for forming a closed process space

Substrates arranged. Thus, the device is designed such that the substrates which can be arranged with a certain distance from one another form a substantially closed or quasi-closed process space. In the context of the present invention, the term "quasi-closed" describes a process space that is open at the edge, but at least for the period of processing of the multi-layer body practically no gas exchange between the process space and its environment takes place, so that no appreciable change in Process conditions takes place in the process room, as marginal effects are negligible with respect to a gas exchange with the environment. In addition, a barrier gas-tightly sealing the process space or a frame surrounding the process space in a gastight manner may be provided.

In this case, the substrates can be arranged so that they are at such a distance from one another that a gas exchange barrier or a pressure compensation resistor is formed between the process chamber open to the environment and the external environment, thereby preventing evaporating layer components, process gases or Process reaction gases in the external environment in an uncontrolled amount. This can be achieved by a suitable choice of the (non-zero) distance between the opposing, to be processed surfaces or layers of the substrates, which of the volume of the process space, the mean free path of the gas particles or the respective partial pressures of the gases in the process space depends. For example, a distance (different from zero) between the opposing layers of the substrates to be processed is less than 50 mm, preferably less than 10 mm, particularly preferably 1 to 8 mm, and can also be used with very thin substrates (eg films). less than 1 mm. These values relate to substrates whose layers to be processed each have, for example, a size in the range from 100 cm ² to 200000 cm ² .

Advantageously, the device is designed so that is achieved by the distance between the opposing, to be processed layers of the substrates, that a mass loss of gases in the process space, such as chalcogen components (S, Se), for example, by a heating process (evaporation and diffusion ) less than 50%, preferably smaller than 20%, more preferably less than 10%, more preferably less than 1%), and even more preferably less than 0.1%.

Without a barrier or frame, through which the process space is enclosed in a gas-tight manner, a (gas-permeation) opening of the process space exists in the device according to the invention between the edges of the opposing surfaces of the two substrates to be processed. Depending on the distance d of the two substrates, this opening has a certain opening area S. For rectangular substrates with edge lengths a and b, which are positioned at a distance d (distance between the two surfaces to be processed, which are opposite one another in the multilayer body arrangement) the opening area S on the substrate edges given by the context

S = (2-a + 2-b) -d. On the other hand, in the process space between the two substrates, a Gesamtprozessierfläche T is processed, consisting of the coated surfaces of the two substrates. The total processing area T is given by the relationship T = 2-a-b (two rectangular, coated substrates of edge length a and b). If the ratio of opening area S to total processing area T (referred to as A = S / T) is considered, it is advantageous in the multilayer body arrangement according to the invention if A has a maximum value of 0.4, preferably a maximum value of 0.2 , particularly preferably has a maximum value of 0.02 and even more preferably a maximum value of 0.002.

According to the invention, it is now provided that at least two substrates are processed simultaneously in a substantially vertical orientation, whereby the processing of the two substrates in a common process area by means of at least one process tool is common. As a result, in the context of a combinatorial effect, on the one hand, a largely stress-free and bending-free mounting of the substrates is made possible. During a horizontal processing, especially in such a process

Processing with a process box, the substrate had to be supported at a plurality of support points against bending, can be dispensed with a vertical processing on support elements, which on the inner Act substrate surface. On the one hand, such support points acting on the inner substrate surface lead to local stresses and, on the other hand, they cause shadowing effects. These shading effects not only occur during coating processes, but above all during tempering, since the support points locally change the temperature profile in the substrate. The fact that now no support points must be provided on the inner substrate surface, such tensions and bends are prevented in the substrate and there are no more shadowing effects. A further advantageous effect of the embodiment according to the invention consists in that two substrates can now be processed simultaneously with respect to a process tool, whereby the throughput of such a vacuum treatment plant doubles, which leads to a significant cost reduction. In a preferred embodiment, a substrate transport device is provided which is adapted to transport the substrates past the process tool through the device. Then the device is structurally very simple. In addition, by simply connecting a plurality of such devices in series, an in-line vacuum treatment installation can be simply constructed in which many substrates can be successively processed in different process stations. Alternatively or additionally, however, can also be advantageous if a process tool transport device is provided, which is adapted to transport the process tool through the device to the substrates over.

Suitably, the process tool is arranged between the two substrate planes. Then it acts on both substrate layers and the substrates located there same and very effective. For a heating source as a process tool, however, it is also possible that it is arranged outside the two substrate planes. This results in a particularly effective and gentle tempering, since the heat source does not have to be arranged in the immediate vicinity of the coatings and still a very homogeneous especially for thin substrates Temperature control can be done, since each substrate is indirectly heated by the opposite substrate with.

Particularly advantageously, the substrate planes, preferably the substrate transport device, have rolling elements which are adapted to support the substrate, the rolling elements preferably having a groove-like design so as to form a guide channel for the substrate.

Furthermore, expediently at least one gas inlet can be provided in the process area.

In a preferred embodiment, at least one trough is arranged below the substrate planes, which trough is preferably made extendable out of the device. This tray can catch material that is generated by a possible substrate break, so that this material can be easily removed from the device.

Self-contained protection is claimed for a method for processing substrates, in particular coated substrates, in a processing plant, preferably a vacuum treatment plant, having at least one process tool arranged in at least one process area, in particular a thermal evaporator device, a sputtering device, preferably a rotatable cylindrical magnetron Sputtering device, a heater or the like, in which at least two substrates are arranged in the process area in oppositely arranged substrate planes, the substrate planes being oriented substantially vertically, wherein the substrate planes are preferably aligned parallel with respect to their vertical component. Preferably, this method is performed in a device as described above. In this case, the substrates on coatings and the substrates are each arranged so opposite that the coatings of

Assign substrates to each other. This defines a spatially very small process space. This process space can preferably be further reduced by defining, at least during processing, between the Substrates a closed process space, in particular by arranging a frame between the substrates is formed.

In an expedient refinement, it is provided that a carrier and / or process gas is introduced between the substrate levels, wherein at least one gas inlet and at least one gas outlet are preferably provided in the frame. Except for the gas inlet and outlet, the process room is closed. Advantageously, the substrates are moved past the process tool, wherein alternatively or additionally, the process tool is moved past the substrates.

The invention further extends to the use of a device as described above, as well as a method for producing a thin-film solar cell or module as described above, which preferably comprises a chalcopyrite compound as semiconductor layer, in particular Cu (In, Ga) (S, Se) ₂ , contains. Preferably, the use is for producing a CIS or (CIGSSe) thin-film solar cell or a CIS or (CIGSSe) thin-film solar module, wherein in particular each substrate is formed in the form of a glass pane and with at least the elements Cu, In or Cu, In, Ga or Cu, In, Ga, selenium for the selenization and / or sulfurization of a chalcopyrite thin film semiconductors is coated.

It is understood that the various embodiments of the objects according to the invention can be implemented individually or in any desired combinations. In particular, those mentioned above and below are to be explained

Features not only in the specified combinations, but also in other combinations or in isolation, without departing from the scope of the present invention. The invention will be described with reference to embodiments, which are explained in more detail with reference to FIGS. Showing: Fig. 1, the fiction, contemporary device in a first preferred embodiment and

Fig. 2 shows the device according to the invention in a second preferred

Design.

In Fig. 1, the device 1 according to the invention is shown purely schematically in a first preferred embodiment in section. The device 1 has an evacuable housing (not further shown) in which a specific pressure level can be set by means of suitable pump technology.

In a process area 2 of the device 1, at least one process tool 3 is arranged, which in the present case is designed as a rotatable cylinder magnetron sputtering device 3, which is basically known to a person skilled in the art. This sputtering device 3 is connected to an electrical supply device 4, which is located outside the housing of the device 1.

On both sides of the sputtering device 3, two substrate transporting devices 5, 6 are provided in the device, each transporting device 5, 6 being formed in each case by a lower row 7, 7 'and an upper row 8, 8' by rolling bodies 9 arranged horizontally in one plane , In this case, the lower row 7, 7 'and the upper row 8, 8' substantially vertically arranged one above the other, so that by the two transport means 5, 6 substantially vertically extending substrate planes A, B are defined. The rolling elements 9 are mounted rotatably about the axis D and have a concave curvature with respect to their longitudinal extent along the axis D, whereby a guide channel 10 is formed, in which substrates 1 1, 1 1 'can be arranged.

The substrates 1 1, 1 Γ are transported over the rolling elements 9 in a plane perpendicular to the plane of representation along the substrate planes A, B on the sputtering device 3 over, as part of an in-line treatment process before and / or after the coating process by means of the sputtering device 3 further processing steps can follow, for example, Temperierungsschritte and the like. Between these substrates 1 1, 1 1 ', a quasi-closed process chamber 12 is formed, which is laterally bounded by the substrates 1 1, 1 1'. For this purpose, the two parallel substrates 1 1, 1 1 'have a spacing of, for example, 5 mm. The substrate area of the rectangular substrates is for example 500 cm ² .

In addition, if appropriate, upper and lower boundaries, for instance at the level of the rolling bodies 9, can also be provided for delimiting the process space 12. By means of suitable gas inlet and gas outlet elements (not shown), a process gas is introduced into the process space 12 during the coating, whereby a sputtering process, for example a reactive sputtering process, is carried out in the process space 12 by means of the sputtering device 3 around the substrates 11, 1 Γ to be provided with a coating 13, 13 '.

The fact that the two substrates 1 1, 1 1 'are arranged facing each other with their sides to be coated and limit a common process space 12, the coating of the substrates 1 1, 1 1' with the coating 13, 13 'with a common sputtering. 3 take place, whereby on the one hand the throughput is doubled compared to individual processing lines and, on the other hand, compared to the use of two sputtering devices, substantially less process gas is necessary. Furthermore, it is also possible to dispense with the use of process boxes or the like for reducing the process space 12 because the substrates 11, 11 'now themselves delimit the process space 12. The arrangement of the substrates 1 1, 1 1 'in vertical substrate planes A, B is also achieved that the substrates 1 1, 1 1' are not subject to support-related tensions and shading effects. As a result, the application of the coating 13, 13 'is very homogeneous. Possible temperature-induced changes in size of the substrates 11, 11 'are dissipated via the rotatable rolling elements 9, so that distortions of the substrates do not occur during the processing. In Fig. 2, a second preferred embodiment of the device 20 according to the invention is shown purely schematically in section, wherein here again the wall of the device 20 and other non-essential elements are not shown. The substrate transport device is not shown here. The same and identical elements are provided with the same or the same reference numerals.

It can be seen that substrates 1 1, 11 'provided here with coatings 13, 13' are also arranged in two oppositely arranged substrate planes A ', B'. The substrates are in turn aligned facing each other with their sides to be coated and define between them the process space 12 ', in the present case, however, no coating tool or the like. Is arranged. Instead, the process area 2 'is set up for tempering, for which purpose a heating source 21 consisting of numerous heating elements 22 is provided. Although the heat source is arranged outside the two substrate planes A ', B' in two rows of heating elements 22, but it is a uniform process tool 21, since on the one hand, the heating elements 22 are operated together and on the other, for example, the substrate 1 1 in the substrate plane A 'arranged heating elements 22 indirectly also the other substrate 1 1' in the substrate plane B 'with heat and vice versa.

Since in this advantageous device 20 for tempering the substrates 1 1, 1 1 'are also arranged facing each other again and limit a common process space 12', the tempering process is very effective and cost effective executable because at least these two substrates 1 1 , 1 1 'can be tempered simultaneously and on the other hand to prevent outgassing of volatile components only in this limited process space 12' an excess of the volatile component must be introduced and this excess for both substrates 1 1, 1 1 'is used at the same time.

The process space 12 'can additionally be limited and sealed in a gas-tight manner by providing a gas-tight frame 23 between the substrates 11, 11' which extends along the circumference of the substrates 11, 11 '. This frame 23 may, for example, be arranged stationarily in the device 20, wherein the substrates 11, 11 'are guided past this frame at a very small distance by means of the substrate transport device (not shown). Alternatively, the frame 23 with the two substrates 1 1, 1 1 'mit- be moved and in particular also be attached to this. In this frame 23 then the gas inlet and gas outlet can be arranged. As shown in Fig. 2, it is not provided when using such a frame 23, that between the two substrates 1 1, 1 1 'is a process tool.

While it has always been assumed in the preferred embodiments of a passing of the substrates 1 1, 1 1 'to the process tools 3, 21, can of course also be provided that the substrates are arranged stationary and instead the process tools are guided past the substrates.

A further optimization could also be carried out by the fact that, as part of an in-line vacuum treatment system, the substrates 1 1, 1 Γ are successively passed through different process areas 2, 2 ', wherein during the processing of two substrates 1 1, 1 1' in For example, a coating area, the coating tool 3 is also moved in a certain manner within the process area 2 to adjust certain coating parameters to be achieved.

The device 1, 20 can be used in any processing plant, but is preferably used in vacuum treatment plants to allow treatment under special process atmospheres. Of course, it may also be a treatment and normal pressure or even under pressure, for example, to perform a heating process under particularly adapted conditions.

From the above description it has become clear that with the inventive device 1, 20 and the inventive method a Substrate processing is possible, which is much more efficient and cheaper and also allows a very homogeneous processing.

Further aspects of the invention will become apparent from the following description:

The invention relates to a device for processing substrates, in particular coated substrates, in a processing plant, preferably a vacuum treatment plant, having at least one process tool arranged in at least one process area, in particular a thermal evaporator device, a sputtering device, preferably a rotatable cylinder magnetron sputtering device , a structuring device, a heating device or the like, which is characterized in that it has two oppositely arranged substrate planes in the process area, which are substantially vertically aligned, so that the device is adapted, at least two substrates simultaneously in the process area process the process tool, wherein the substrates can be arranged in the substrate planes, and wherein the substrate planes are preferably aligned parallel with respect to their vertical component. According to one embodiment, a substrate transport device is provided, which is adapted to transport the substrates past the process tool through the device and / or provides a process tool transport device which is adapted to transport the process tool past the substrates through the device , According to one embodiment, the process tool is arranged between the two substrate levels and / or the process tool is a heat source which is arranged outside the two substrate levels. In accordance with one embodiment, the substrate planes, preferably the substrate transport device, have rolling elements which are adapted to support the substrate, wherein the rolling elements are preferably groove-like, so as to form a guide channel for the substrate. According to one embodiment, at least one gas inlet is in the

Process provided and / or arranged below the substrate planes at least one trough, which preferably formed extendable from the device is. According to one embodiment, a frame is arranged flat between the substrate.

A process according to the invention for processing substrates, in particular coated substrates, in a processing plant, preferably a vacuum treatment plant, having at least one process tool arranged in at least one process area, in particular a thermal evaporator device, a sputtering device, preferably a rotatable cylinder magnetron sputtering device Heating device or the like is characterized in that at least two substrates are arranged in the process region in oppositely arranged substrate planes, wherein the substrate planes are oriented substantially vertically, wherein the substrate planes are preferably aligned parallel with respect to their vertical component, wherein the Method is carried out in particular in a device as described above. According to one embodiment, the substrates have coatings and the substrates are each arranged opposite each other such that the coatings of the substrates face each other, wherein preferably at least during the processing between the substrates a substantially closed process space, in particular by arranging a frame between the substrates, is trained. According to one embodiment, a carrier and / or process gas is introduced between the substrate planes, wherein at least one gas inlet and at least one gas outlet are preferably provided in the frame. According to one embodiment, the substrates are moved past the process tool and / or the process tool is moved past the substrates.

Claims

claims

A device (1, 20) for processing substrates (1 1, 1 Γ) in a processing plant with at least one process tool (3, 21) arranged in at least one process area (2, 2 '), which in the process area (2, 2 ') has two oppositely arranged substrate planes (A, B; Α', B ') which are oriented at least approximately vertically, wherein the device (1; 20) is adapted to simultaneously at least two substrates (1 1, 1 1') Processes (2, 2 ') with the process tool (3, 21) to process, wherein the substrates (1 1, 1) in the substrate planes (A, B, Α', B ') can be arranged so that coatings ( 13, 13 ') of the substrates (1 1, 1 1') face each other and at least during the processing between the substrates (1 1, 1 1 ') a quasi-closed process space (12, 12') is formed.

A device (1; 20) according to claim 1, wherein the substrate planes (A, B; Α ', B') are aligned in parallel with respect to their vertical component.

3. Device (1; 20) according to one of claims 1 or 2, wherein for forming a closed process space (12; 12 ') a frame is arranged between the substrates.

4. Device (1; 20) according to one of claims 1 to 3, in which a substrate transport device (5, 6) is provided, which is adapted to the substrates (1 1, 1 1 ') by the device (1 20) is to be transported past the process train (3; 21) and / or a process tool transport device is provided which is designed to transport the process tool past the substrates through the device.

5. Device (1) according to one of claims 1 to 4, wherein the process tool (3) between the two substrate levels (A, B) is arranged and / or the process tool is a heating source (21), which is outside the two Substrate levels (Α ', Β') is arranged.

6. Device (1; 20) according to one of claims 1 to 5, in which the substrate planes (A, B; Α ', B') have rolling elements (9) which are designed to support the substrate (1 1, 1 1 ') support.

7. Device (1; 20) according to claim 6, in which the substrate transport device (5, 6) has the rolling elements (9).

8. Device (1; 20) according to any one of claims 6 or 7, wherein the rolling elements (9) are formed like a groove so as to form a guide channel (10) for the substrate (1 1, 1 1 ').

9. Device according to one of claims 1 to 8, wherein at least one gas inlet is provided in the process area and / or below the substrate levels at least one trough is arranged.

10. Device according to one of claims 1 to 9, wherein a frame is arranged between the substrate planes.

1 1. A method for processing coated substrates (1 1, 1 Γ) in a processing plant with at least one in at least one process area (2, 2 ') arranged process tool (3; 21), wherein at least two substrates (1 1 , 1 1 ') in the process area (2; 2') are arranged in oppositely arranged substrate planes (A, B; Α ', B'), the substrate planes (A, B; Α ', B') being oriented at least approximately vertically , wherein the substrates (1 1, 1 1 ') coatings (13, 13') and the substrates (1 1, 1 1 ') are each arranged opposite each other so that the coatings (13, 13') of the substrates (1 1, 1 1 ') to each other, and wherein at least during the processing between the substrates (1 1, 1 1') a quasi-closed process space (12, 12 ') is formed between the substrates.

12. The method of claim 1 1, wherein for forming a closed process space (12, 12 ') between the substrates, a frame (23) is arranged.

13. The method according to any one of claims 1 1 or 12, wherein between the substrate planes (A, B, Α ', B'), a carrier and / or process gas is introduced.

14. The method according to claim 1, wherein the substrates are moved past the process tool and / or the process tool is moved past the substrates.

15. Use of a device according to any one of claims 1 to 10, and a method according to any one of claims 1 1 to 14 for the production of a thin-film solar cell or module, in particular a CIS (CIGSSe) -Sünn- layer solar cell or a CIS (CIGSSe) Thin-film solar module, wherein in particular each substrate is formed in the form of a glass and coated with at least the elements Cu, In or Cu, In, Ga or Cu, In, Ga, selenium for selenization and / or sulfurization of a chalcopyrite thin film semiconductor.