EP2396172A1

EP2396172A1 - Improved method for producing a laminated layer composite

Info

Publication number: EP2396172A1
Application number: EP10702440A
Authority: EP
Inventors: Matthias Grötsch; Georgios Tziovaras
Original assignee: Bayer MaterialScience AG
Current assignee: Covestro Deutschland AG
Priority date: 2009-02-13
Filing date: 2010-01-30
Publication date: 2011-12-21
Also published as: EP2218579A1; CA2752100A1; TW201041738A; BRPI1007980A2; WO2010091796A1

Abstract

The present invention relates to a method for producing a laminated layer composite, wherein at least one base layer (3) and at least one further layer (4), with a component (1) located in between, are laminated from two thermoplastic materials having different Vicat softening temperatures B/50 in two stages into a layer composite. The invention further relates to a layer design suitable for said method, to a laminated layer composite produced according to said method, and to a security and/or value document comprising such a laminated layer composite.

Description

Improved process for producing a laminated layer composite

The present invention relates to a method for producing a laminated layer composite in which at least one base layer and at least one further layer, between which a component is located, are laminated in two stages from two thermoplastic materials having different Vicat softening temperatures B / 50 to form a laminate. The invention furthermore relates to a layer structure suitable for this process, to a laminated layer composite produced by this process, and to a security and / or value document containing such a laminated layer composite.

ID cards represent security and / or value documents of increasing interest. Such ID cards usually contain a plurality of layers, which may preferably consist of identical or different thermoplastic materials. Such ID cards may also have in their construction a component, preferably an electronic component, such as e.g. a chip and an antenna included. Such electronic components are preferably arranged in the middle part of an ID card. Em such middle part of an ID card has in its simplest case at least one base layer on which the component is applied, and at least one but preferably several further layer (s) which are to embed the component in the thermoplastic or the plastics (intermediate layers ), and optionally at least one cover layer on said further layer (s). These layers are preferably processed by means of Lammieren to an inseparable layer composite.

According to the current state of the art, there are two possibilities for laminating such laminates, for example for the middle part of a security and / or value document with a built-in component:

1. The further layer (s) (interlayer (s)) is (are) punched out, so that the recess eliminates the component to be embedded (see Fig. 1).

2. The further layer (s) (intermediate layer (s)) will not be punched out.

FIG. 1 shows schematically a layer structure with a component to be embedded in the form of a chip (1) and an antenna (2), a base layer (3) to which this component is applied, three intermediate layers (4) which together approximate the height of the Have chips and are punched around the chip, and a cover view (5). By punching out the intermediate layers around the chip, a small gap is created in which the softened material is pressed during the laminating process using the laminating pressure P (see FIG. 2). This leads to a destruction of the connection between antenna and chip. In addition, the additional step of punching out the intermediate layers is disadvantageous, since the size of the punched-out surface must be matched to the component to be integrated in each case and makes standardized large-scale production more difficult. FIG. 3 shows schematically a layer structure with a component to be embedded in the form of a chip (1) and an antenna (2), a base layer (3) to which this component is applied, two intermediate layers (4) which together approximate the height of the Have chips and are not punched around the chip, and a cover view (5). By resting the intermediate layers on the chip also creates a small gap, in which the softened Mateπal the lamination process under

Application of Lamimerdrucks P is pressed. This also leads to a destruction of the connection between the antenna and the chip.

Both options are therefore not suitable for the production of laminated composites with functional integrated components.

There was therefore still a need for a method for producing a laminated

Laminated composite with embedded component in which the functionality of the component is not destroyed or significantly reduced by the lamination process.

Accordingly, the object of the present invention was to find and provide a method for producing a laminated layer composite with an integrated component, wherein the functionality of the component is not destroyed or significantly reduced by the lamination process.

This object has been achieved in that a layer structure comprising at least one base layer of a thermoplastic, polymeric Mateπal having a Vicat softening temperature B / 50 _(Bas i _s) and applied to this base layer component, at least one further layer of a thermoplastic polymer Mateπal , with a Vicat softening temperature B / 50 ₍ s _ctπcht) less than the Vicat softening temperature B / 50 _(B a _s i _s) and optionally at least one cover layer of a thermoplastic polymer Mateπal is laminated in a two-stage lamination process, wherein the first lamination at a temperature above the Vicat softening temperature B / 50 _(Shi _ch t), which is at most 5 ° C above the Vicat softening temperature B / 50 _(Bas i _s) , and the second lamination at a temperature above the Vicat softening temperature B / 50 _(BaS i _{s) is} performed.

The present invention accordingly provides a process for producing a laminated layer composite, characterized in that a layer structure comprising

at least one base layer of a thermoplastic, polymeric material having a Vicat softening temperature B / 50 _(BasiS)

at least one further layer of a thermoplastic polymeric Mateπal having a lower Vicat softening temperature B / 50 _(see _Ch i _ch _t) as the thermoplastic polymeric matenal of the base layer optionally at least one cover layer of a thermoplastic, polymeric Mateπal,

wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening temperature B / 50 ₍ Schi tt ₎ ,

a) in a first step at a temperature above the Vicat softening temperature B / 50 ₍ sc _h light), which is not more than 5 ° C above the Vicat softening temperature B / 50 _(B asis) is laminated, and

b) is laminated in a second step at a temperature above the Vicat softening temperature B / 50 ₍ base).

The lamination temperature of the second step b) of the process according to the invention is preferably higher than the lamination temperature of the first step a).

) Of the process according to the invention at a temperature above the Vicat softening temperature B / 50 _(Sch i _CHT) and below the Vicat softening point B / 50 _(B asi _s) is further preferably laminated in the first step a.

The method according to the invention has the advantage that only a further layer (s) are softened in the first laminating layer by using a termoplastic plastic with a lower Vicat softening temperature B / 50 for the further layer (s), and that they are gapless To put the component to be embedded before the base layer is softened in the second step to form the entire layer composite. As a result, no destruction of the functionality of the component according to the prior art method can take place.

The Vicat softening temperature B / 50 of a thermoplastic in the context of the invention is the Vicat softening temperature B / 50 according to ISO 306 (50 N, 50 ° C./h).

Preferably, the Vicat softening temperature B / 50 _(Sch , _{Cht) is} at least 5 ° C lower, preferably at least 10 ° C lower than the Vicat softening temperature B / 50 _(B _s i _s) -

The component may, for example and preferably, be at least one electronic component or at least one (volume) hologram. The electronic component (s) may, for example, be integrated circuits, thick-film circuits, circuits comprising a plurality of discrete active and passive electronic components, sensors, chip modules, displays, batteries, coils, capacitors, printed conductors and / or contact points. - A -

The thermoplastic polymeric material for both the base layer and the further layer (s) may independently preferably be at least one thermoplastic selected from polymers of ethylenically unsaturated monomers and / or polycondensates of bifunctional reactive compounds and / or Polyaddition products of bi-functional reactive compounds, act. For certain

Applications may be advantageous and therefore preferred to use a transparent thermoplastic. The thermoplastic of the layer (s) containing at least one thermoplastic and the layer (s) containing at least one thermoplastic and at least one laser-sensitive additive may be the same or different.

Particularly suitable thermoplastics are polycarbonates or copolycarbonates based on diphenols, poly- or copolyacrylates and poly- or co-polyethacrylates such as, by way of example and preferably, polymethyl methacrylate (PMMA), poly- or copolymers with styrene, by way of example and preferably polystyrene (PS) or polystyrene-acrylonitrile (SAN). , thermoplastic polyurethanes, as well as polyolefins, as exemplified and preferably

Polypropylene types, or polyolefins based on cyclic olefins (for example, TOPAS ^®, Hoechst), polyvinyl chloride, poly- or copolycondensates of terephthalic acid, such as for example and preferably poly- or copolyethylene terephthalate (PET or CoPET), glycol-modifϊziertes PET (PETG), glycolic modified poly- or copolycyclohexanedimethylene terephthalate (PCTG) or poly- or copolybutylene terephthalate (PBT or CoPBT), poly- or copolycondensates of

Naphthalenedicarboxylic acid, such as by way of example and preferably polyethylene glycol naphthalate (PEN), poly- or copolycondensate (s) of at least one cycloalkyldicarboxylic acid, such as by way of example and preferably polycyclohexanedimethanolcyclohexanedicarboxylic acid (PCCD), polysulfones (PSU) or mixtures of the foregoing.

Preferred thermoplastics are polyurethanes, polycarbonates or copolycarbonates or blends comprising at least one polyurethane, polycarbonate or copolycarbonate. Particular preference is given to polycarbonates or copolycarbonates Blends comprising at least one polycarbonate or copolycarbonate. Preferred blends are those comprising at least one polycarbonate or copolycarbonate and at least one poly- or copolycondensate of terephthalic acid, naphthalenedicarboxylic acid or a cycloalkyldicarboxylic acid, preferably

Cyclohexanedicarboxylic acid Very particular preference is given to polycarbonates or copolycarbonates, in particular having average molecular weights M _{w of} from 500 to 100,000, preferably from 10,000 to 80,000, more preferably from 15,000 to 40,000 or blends thereof with at least one poly- or copolycondensate of terephthalic acid average molecular weights M _w from 10,000 to 200,000, preferably from 26,000 to 120,000. As polyisocyanates or copolycondensates of terephthalic acid, polyalkylene terephthalates are suitable in preferred embodiments of the invention. Suitable polyalkylene terephthalates are, for example, reaction products of aromatic dicarboxylic acids or their reactive derivatives (for example dimethyl esters or anhydrides) and aliphatic, cycloaliphatic or araliphatic diols and mixtures of these reaction products.

Preferred polyalkylene terephthalates can be prepared from terephthalic acid (or its reactive derivatives) and aliphatic or cycloaliphatic diols having 2 to 10 carbon atoms by known methods (Kunststoff-Handbuch, Vol. VIII, p. 695 ff, Karl Hanser Verlag, Munich 1973 ).

Preferred polyalkylene terephthalates contain at least 80 mol%, preferably 90 mol%

Terephthalic acid residues, based on the dicarboxylic acid component, and at least 80 mol%, preferably at least 90 mol% of ethylene glycol and / or butanediol-1,4- and / or 1,4-cyclohexanedimethanol radicals, based on the diol component.

In addition to terephthalic acid residues, the preferred polyalkylene terephthalates may contain up to 20 mol% of radicals of other aromatic dicarboxylic acids having 8 to 14 carbon atoms or aliphatic

Dicarboxylic acids having 4 to 12 carbon atoms, such as radicals of phthalic acid, isophthalic acid, naphthalene-2,6-dicarboxylic acid, 4,4'-diphenyldicarboxylic acid, succinic, adipic, sebacic, azelaic, cyclohexanediacetic.

The preferred polyalkylene terephthalates, in addition to ethylene or butanediol-l, 4-glycol radicals up to 80 mol% of other aliphatic diols having 3 to 12 carbon atoms or cycloaliphatic

Diols having 6 to 21 carbon atoms, for. B. residues of 1,3-propanediol, 2-Ethylpropandiol-l, 3,

Neopentylglycol, pentanediol-1,5, hexanediol-1,6, cyclohexane-dimethanol-1,4, 3-

Methylpentanediol-2,4, 2-methylpentanediol-2,4,2,2,4-trimethylpentanediol-l, 3 and 2

Ethylhexanediol-1,6,2,2-diethylpropanediol-1,3-hexanediol-2,5,1,4-di- ([beta] -hydroxyethoxy) -benzene, 2,2-bis (4-hydroxycyclohexyl) - propane, 2,4-dihydroxy-1,1,3,3-tetramethyl-cyclobutane, 2,2-

Bis- (3- [beta] -hydroxyethoxyphenyl) -propane and 2,2-bis- (4-hydroxypropoxyphenyl) -propane (cf.

DE-OS 24 07 674, 24 07 776, 27 15 932).

The polyalkylene can be prepared by incorporation of relatively small amounts of trihydric or trihydric alcohols or 3- or 4-basic carboxylic acids, as z. For example, in DE-OS 19 00 270 and US Patent 3,692,744 are branched. Examples of preferred branching agents are trimesic acid, trimellitic acid, trimethylolethane and -propane and pentaerythritol.

Preferably, not more than 1 mol% of the branching agent, based on the acid component, is used. Particular preference is given to polyalkylene terephthalates which have been prepared solely from terephthalic acid and its reactive derivatives (for example their dialkyl esters) and ethylene glycol and / or 1,4-butanediol and / or 1,4-cyclohexanedimethanol radicals, and mixtures of these polyalkylene terephthalates.

Preferred polyalkylene terephthalates are also copolyesters which consist of at least two of the abovementioned acid components and / or of at least two of the abovementioned

Alcohol components are prepared, particularly preferred copolyesters are poly (ethylene glycol / butanediol-1, 4) terephthalates.

The polyalkylene terephthalates preferably used as a component preferably have an intrinsic viscosity of about 0.4 to 1.5 dl / g, preferably 0.5 to 1.3 dl / g, each measured in

Phenol / o-dichlorobenzene (1: 1 parts by weight) at 25 ° C.

In particularly preferred embodiments of the invention, the blend of at least one polycarbonate or copolycarbonate with at least one poly- or copolycondensate of terephthalic acid is a blend of at least one polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or

Copolycyclohexandimethylenterephthalat. Such a blend of polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexanedimethylene terephthalate may preferably be one having from 1 to 90% by weight of polycarbonate or copolycarbonate and from 99 to 10% by weight of polyisocyanate or polycarbonate Copolybutylene terephthalate or glycol-modified poly- or Copolycyclohexandimethylenterephthalat, preferably with 1 to 90 wt .-% polycarbonate and 99 to 10 wt .-% polybutylene terephthalate or glycol-modified polycyclohexanedimethylene terephthalate, wherein the proportions add up to 100 wt .-%. Such a blend of polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexanedimethylene terephthalate may be particularly preferably of such a blend with 20 to 85

% By weight of polycarbonate or copolycarbonate and 80 to 15% by weight of poly- or copolybutylene terephthalate or glycol-modified poly- or copolycyclohexanedimethylene terephthalate, preferably with 20 to 85% by weight of polycarbonate and 80 to 15% by weight of polybutylene terephthalate or glycol modified polycyclohexanedimethylene terephthalate, wherein the proportions add up to 100 wt .-%. With very particular preference, such a blend can be obtained

Polycarbonate or copolycarbonate with poly- or copolybutylene terephthalate or glycol-modified poly- or Copolycyclohexandimethylenterephthalat to such with 35 to 80 wt .-% polycarbonate or copolycarbonate and 65 to 20 wt .-% poly- or Copolybutylenterephthalat or glycol-modified poly- or Copolycyclohexandimethylenterephthalat , preferably with 35 to 80 wt .-% polycarbonate and 65 to 20 wt .-% polybutylene terephthalate or glycol-modified polycyclohexanedimethylene terephthalate, wherein the proportions add to 100 wt .-%. In very particularly preferred embodiments, these may be blends of polycarbonate and glycol-modified polycyclohexanedimethylene terephthalate in the abovementioned compositions.

Particularly suitable polycarbonates or copolycarbonates in preferred embodiments are aromatic polycarbonates or copolycarbonates.

The polycarbonates or copolycarbonates may be linear or branched in a known manner.

The preparation of these polycarbonates or copolycarbonates can be carried out, inter alia, in a known manner from diphenols, carbonic acid derivatives, optionally chain terminators and optionally branching agents. Details of the production of polycarbonates have been laid down in many patents for about 40 years. As an example, let's just say quick,

"Polymer and Physics of Polycarbonates", Polymer Reviews, Volume 9, Interscience Publishers, New York, London, Sydney 1964, to D. Freitag, U. Grigo, PR Müller, H. Nouvertne ¹ , BAYER AG, "Polycarbonates" in Encyclopedia of Polymer Science and Engineering, Volume 11, Second Edition, 1988, pages 648-718 and finally to Dres. U. Grigo, K. Kirchner and PR Müller "Polycarbonates" in Becker / Braun, Kunststoff-Handbuch, Volume 3/1, Polycarbonates, polyacetals,

Polyester, cellulose ester, Carl Hanser Verlag Munich, Vienna 1992, pages 117-299 referenced.

For example, production of the polycarbonates or copolycarbonates can be carried out in a known manner by the phase boundary process.

According to this process, the phosgenation of a disodium salt of a diphenol (or a mixture of various.) Prepared in an aqueous alkaline solution (or suspension) is carried out

Diphenols) in the presence of an inert organic solvent or solvent mixture which forms a second phase. The resulting, mainly present in the organic phase, oligocarbonates are condensed with the aid of suitable catalysts to high molecular weight, dissolved in the organic phase, polycarbonates. The organic phase is finally separated and the polycarbonate isolated from it by various work-up steps.

However, the preparation of the polycarbonates or copolycarbonates can also be carried out in a known manner by the melt transesterification process.

Suitable diphenols may be, for example, dihydroxyaryl compounds of the general formula (I)

HO-Z-OH (I) wherein Z is an aromatic radical having 6 to 34 carbon atoms, which may contain one or more optionally substituted aromatic nuclei and aliphatic or cycloaliphatic radicals or alkylaryl or heteroatoms as bridge members.

Examples of suitable dihydroxyaryl compounds are: dihydroxybenzenes, dihydroxydiphenyls, bis (hydroxyphenyl) alkanes, bis (hydroxyphenyl) -cycloalkanes, bis (hydroxyphenyl) -aryls, bis-

(hydroxyphenyl) ethers, bis (hydroxyphenyl) ketones, bis (hydroxyphenyl) sulfides, bis (hydroxyphenyl) sulfones, bis (hydroxyphenyl) sulfoxides, 1, 1 'bis (hydroxyphenyl) diisopropylbenzenes , and their alkylated, nuclear alkylated and nuclear halogenated compounds.

These and other suitable other dihydroxyaryl compounds are e.g. in DE-A 3 832 396, FR-A 1 561 518, in H. Schnell, Chemistry and Physics of Polycarbonates, Interscience Publishers,

New York 1964, p. 28 ff .; Pp. 102 ff. And in D.G. Legrand, J.T. Bendler, Handbook of Polycarbonates Science and Technology, Marcel Dekker New York 2000, pp. 72 et seq.

Preferred dihydroxyaryl compounds are, for example, resorcinol, 4,4'-dihydroxydiphenyl, bis (4-hydroxyphenyl) methane, bis (3, 5-dimethyl-4-hydroxyphenyl) methane, bis (4-hydroxyphenyl) diphenylmethane , 1,1-bis (4-hydroxyphenyl) -1-phenyl-ethane, 1,1-bis (4-hydroxyphenyl) -l- (1-naphthyl) -ethane, 1,1-bis- (4-hydroxyphenyl) -1- hydroxyphenyl) -1- (2-naphthyl) ethane, 2,2-bis (4-hydroxyphenyl) -propane, 2,2-bis (3-methyl-4-hydroxyphenyl) -propane, 2,2-bis - (3,5-dimethyl-4-hydroxyphenyl) -propane, 2,2-bis (4-hydroxyphenyl) -1-phenyl-propane, 2,2-bis (4-hydroxyphenyl) -hexafluoro-propane, 2 , 4-bis (4-hydroxyphenyl) -2-methylbutane, 2,4-bis (3,5-dimethyl-4-hydroxyphenyl) -2-methylbutane, 1,1-bis- (4-hydroxyphenyl) cyclohexane, 1,1-bis- (3,5-dimethyl-4-hydroxyphenyl) -cylohexane, 1,1-bis- (4-hydroxyphenyl) -4-methylcyclohexane, 1,3-bis- [2- (4-hydroxyphenyl) -2-propyl] -benzene, 1, 1'-bis (4-hydroxyphenyl) -3-diisopropylbenzene, 1,1'-bis (4-hydroxyphenyl) -4-diisopropylbenzene , 1,3-bis [2- (3,5-dimethyl-4-hydroxyphenyl) -2-p ropyl] - benzene, bis (4-hydroxyphenyl) ether, bis (4-hydroxyphenyl) sulfide, bis (4-hydroxyphenyl) sulfone, bis (3,5-dimethyl-4-hydroxyphenyl) sulfone and 2,2 ', 3,3'-tetrahydro-3,3,3', 3'-tetramethyl-1, spirospi- [1H-indene] -5, 5'-diol or

Dihydroxydiphenylcycloalkanes of the formula (Ia)

(Ia)

wherein

R ¹ and R ² independently of one another are hydrogen, halogen, preferably chlorine or bromine,

C ₈ alkyl, C ₅ -C ₆ cycloalkyl, C ₆ -C | _0- aryl, preferably phenyl, and C ₇ -C ₂ -alkyl, preferably phenyl-C 1 -C ₄ -alkyl, in particular benzyl,

m is an integer from 4 to 7, preferably 4 or 5,

R ³ and R ^{4 are} individually selectable for each X, independently hydrogen or QC ₆ -

Alkyl and

X means carbon,

with the proviso that on at least one atom X, R ³ and R ^{4 are} simultaneously alkyl. Are preferred in the formula (Ia) at one or two atom (s) X, in particular only on one atom X, R ³ and R ⁴ are simultaneously alkyl.

Preferred alkyl radical for the radicals R ³ and R ⁴ in formula (Ia) is methyl. The X atoms in the alpha position to the diphenyl-substituted C atom (CI) are preferably not dialkyl-substituted, whereas alkyl disubstitution in the beta position to CI is preferred.

Particularly preferred dihydroxydiphenylcycloalkanes of the formula (Ia) are those having 5 and 6 ring C atoms X in the cycloaliphatic radical (m = 4 or 5 in formula (Ia)), for example the diphenols of the formulas (Ib) to (Id),

(Ia-I)

(Ia-2)

(Ia-3)

A most preferred dihydroxydiphenylcycloalkane of Formula I (Ia) is 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane (Formula (Ia-I) where R ¹ and R ² are H).

Such polycarbonates can be prepared according to EP-A 359 953 from dihydroxydiphenylcycloalkanes of the formula (Ia).

Particularly preferred dihydroxyaryl compounds are resorcinol, 4,4'-dihydroxydiphenyl, bis (4-hydroxyphenyl) -diphenyl-methane, 1,1-bis- (4-hydroxyphenyl) -l-phenyl-ethane, bis- (4-hydroxyphenyl) - 1 - (1-naphthyl) -ethane, bis- (4-hydroxyphenyl) -1- (2-naphthyl) -ethane, 2,2-bis (4-hydroxyphenyl) -propane, 2,2-bis (3 , 5-dimethyl-4-hydroxyphenyl) -propane, 1,1-bis (4-hydroxyphenyl) -cyclohexane, 1,1-bis (3,5-dimethyl-4-hydroxyphenyl) -cyclohexane, 1, l Bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane, 1,1'-bis (4-hydroxyphenyl) -3-diisopropylbenzene and 1, V-bis (4-hydroxyphenyl) -4 diisopropyl benzene. Very particularly preferred dihydroxyaryl compounds are 4,4'-dihydroxydiphenyl and 2,2-bis (4-hydroxyphenyl) propane.

Both a dihydroxyaryl compound to form homopolycarbonates and various dihydroxyaryl compounds to form copolycarbonates can be used. It is possible to use either a dihydroxyaryl compound of the formula (I) or (Ia) with the formation of

Homopolycarbonates and a plurality of dihydroxyaryl compounds of formula (I) and / or (Ia) are used to form copolycarbonates. The various dihydroxyaryl compounds can be linked to one another both statistically and in blocks. In the case of copolycarbonates of dihydroxyaryl compounds of the formula (I) and (Ia), the molar ratio of dihydroxyaryl compounds of the formula (Ia) to the other dihydroxyaryl compounds of the formula (I) which may be used is preferably between 99 mol% (Ia) and 1 mol -% (I) and 2 mol% (Ia) to 98 mol% (I), preferably between 99 mol ^o / o (Ia) to 1 mol% (I) and 10 mol% (Ia) to 90 Mol% (I) and in particular between 99 mol% (Ia) to 1 mol% (I) and 30 mol% (Ia) to 70 mol% (I).

A most preferred copolycarbonate can be prepared using 1,1-bis (4-hydroxyphenyl) -3,3,5-trimethylcyclohexane and 2,2-bis (4-hydroxyphenyl) -propane

Dihydroxyarylverbindungen of formula (Ia) and (I) are prepared.

Suitable carbonic acid derivatives for the preparation according to the melt transesterification process may be, for example, diaryl carbonates of the general formula (II)

wherein

R, R 'and R "are independently the same or different and represent hydrogen, linear or branched Ci-C ₃₄ alkyl, C ₇ -C ₃₄ - alkylaryl or C ₆ -C ₃₄ -ATyI further, R and -COO-R'"whereR" is hydrogen, linear or branched C _r C ₃₄ alkyl, C ₇ -C ₃₄ alkylaryl or C ₆ -C ₃₄ aryl.

Preferred diaryl carbonates are, for example, diphenyl carbonate, methylphenyl phenyl carbonates and di (methylphenyl) carbonates, 4-ethylphenyl phenyl carbonate, di (4-ethylphenyl) carbonate, 4-n-propylphenyl phenyl carbonate, di- (4-n-propylphenyl) carbonate, 4-iso-propylphenyl-phenyl-carbonate, di- (4-iso-propylphenyl) -carbonate, 4-n-butylphenyl-phenyl-carbonate, di- (4-n-propylphenyl) carbonate butylphenyl) carbonate, 4-iso-butylphenyl phenyl carbonate, di (4-iso-butylphenyl) carbonate, 4-tert-butylphenyl phenyl carbonate, di (4-tert-butylphenyl) carbonate, 4 -n-pentylphenyl phenyl carbonate, di- (4-n-pentylphenyl) carbonate, 4-n-hexylphenyl phenyl carbonate, di- (4-n-hexylphenyl) carbonate, 4-iso-octylphenyl-phenyl carbonate, di (4-iso-octylphenyl) carbonate, 4-n-nonylphenyl phenyl carbonate, di (4-n-nonylphenyl) carbonate, 4-cyclohexylphenyl phenyl carbonate, di (4- cyclohexylphenyl) carbonate, 4- (1-methyl-1-phenylethyl) -phenyl-phenyl carbonate, di- [4- (1-methyl-1-phenylethyl) -phenyl] -carbonate, biphenyl-4-yl-phenyl carbonate, di- (biphenyl-4-yl) carbonate, 4- (1-naphthyl) -phenyl-phenyl carbonate, 4- (2-naphthyl) -phenyl-phenyl-carbonate, di- [4- (1 -naphthyl) -phenyl] carbonate, di- [4- (2-naphthyl) phenyl] carbonate, 4-phenoxyphenyl phenyl carbonate, di (4-phenoxyphenyl) carbonate, 3-pentadecylphenyl phenyl carbonate, Di (3-pentadecylphenyl) carbonate, 4-trityl phenyl phenyl carbonate, di (4-trity 1-phenyl) carbonate, methyl salicylate phenyl carbonate, di (methyl salicylate) carbonate, ethyl salicylate phenyl carbonate, di (ethyl salicylate) carbonate, n-propyl salicylate phenyl carbonate, di (n-propyl salicylate) carbonate , iso-propyl salicylate phenyl carbonate, di (iso-propyl salicylate) carbonate, n-butyl salicylate phenyl carbonate, di- (n-butylsalicylate) carbonate, isobutyl salicylate-phenyl carbonate, di- (iso-) butyl salicylate) carbonate, tert-butyl salicylate phenyl carbonate, di (tert-butylsalicylate) carbonate, di (phenyl salicylate) carbonate and di (benzyl salicylate) carbonate.

Particularly preferred diaryl compounds are diphenyl carbonate, 4-tert-butylphenyl phenyl carbonate, di (4-tert-butylphenyl) carbonate, biphenyl-4-yl phenyl carbonate, di (biphenyl-4-yl) carbonate, 4- (1-methyl-1-phenylethyl) -phenyl-phenyl carbonate, di- [4- (1-methyl-1-phenylethyl) -phenyl] carbonate and di (methyl salicylate) carbonate.

Very particular preference is given to diphenyl carbonate.

Both a diaryl carbonate and various diaryl carbonates can be used.

For controlling or changing the end groups, it is additionally possible, for example, to use one or more monohydroxyaryl compounds as chain terminators which are not suitable for use as chain terminators

Preparation of the diaryl carbonate (s) used was (s) used. These may be those of the general formula (III),

in which R ^A is linear or branched Ci-C ₃₄ -alkyl, C ₃₄ -alkoxy, C ₇ -C ₃₄ alkylaryl, C ₆ -C ₃₄ -aryl or -COO-R ^0, wherein R ^D is hydrogen linear or branched Ci-C ₃₄ alkyl, C ₇ -C ₃₄ alkylaryl or C ₆ -C ₃₄ aryl, and

R ^B , R ^c independently of one another are identical or different hydrogen, linear or branched C, -C ₃₄ alkyl, C ₇ -C ₃₄ alkylaryl or C ₆ -C ₃₄ aryl.

Such Monohydroxyarylverbindungen are, for example, 1-, 2- or 3-methylphenol, 2,4-dimethylphenol 4-ethylphenol, 4-n-propylphenol, 4-iso-propylphenol, 4-n-butylphenol, 4- lSoButylphenol, 4-tert-butylphenol , 4-n-pentylphenol, 4-n-hexylphenol, 4-iso-octylphenol, 4-n-nonylphenol, 3-pentadecylphenol, 4-cyclohexylphenol, 4- (l-methyl-1-phenylethyl) -phenol, 4-phenylphenol , 4-phenoxyphenol, 4- (1-naphthyl) -phenol, 4- (2-naphthyl) -phenol, 4-t-tylphenol,

Methylsahcylate, ethylsahcylate, n-propylsalicylate, iso-propylsalicylate, n-butylsaccharylate, isobutylsalicylate, tert-butylsaccharylate, phenylsahcylate, and benzylsalicylate.

Preference is given to 4-tert-butylphenol, 4-iso-octylphenol and 3-pentadecylphenol.

For the polycarbonates or copolycarbonates for the further layer (s) with a lower Vicat softening temperature B / 50 ₍ s _Ch i _cht) are particularly preferred

Monohydroxyarylverbmdung (s) of the general formula (III), wherein R ^{A is a} linear or branched Ci _O -C ₂₅ alkyl, Ci ₀ -C ₂₅ alkoxy or Ci _O -C ₂₅ alkyl-substituted aryl and R ^B and R ^c independently of one another identical or different for hydrogen, linear or branched for linear or branched Ci _O -C ₂₅ alkyl, Cio-C ₂₅ alkoxy or Aryl stand. In this case, "Cio-C ₂₅ -alkyl-substituted aryl" is preferably a phenyl or

Naphtyl radical which is substituted by Ci _O -C ₂₅ alkyl.

Such monohydroxyaryl compounds are, for example, n-decyl, n-undecyl, n-dodecyl, n-t-decyl, n-pentadecyl, n-hexadecyl, n-heptadecyl or n-octadecylphenol. The phenols can carry these substituents m o-, m-, or p-position.

Very particular preference is given to n-dodecylphenol and 3-pentadecylphenol.

Particularly preferably suitable polycarbonates or copolycarbonates can be used for the further layer (s) (s) having a Vicat softening temperature niedπgeren B / 50 _(Sch ic _h _t) of more than 80 mol%, in particular more than 90 mol%, based to the total amount of chain terminators used, end groups of general formula (III), wherein R ^{A is} linear or branched C ₁₀ -C ₂₅ alkyl, C ₁₀ -C ₂ 5-alkoxy or C ₁₀ -C ₂₅ alkyl-substituted aryl and R ^B and R ^c are independently the same or different and represent hydrogen, linear or branched C ₁₀ -C ₂₅ -alkyl, C ₀ - containing C ₂₅ alkoxy or C _O -C ₂₅ alkyl-substituted aryl. In suitable polycarbonates or copolycarbonates for the further layer (s) with a lower Vicat Softening temperature B / 50 _(Sch i _ct) can also be up to 40 mol%, based on the total amount of chain terminators used, the end groups of other chain terminators of the general formula (III) are formed.

The measurement of the respective proportion of end groups can be determined e.g. determine by NMR spectroscopy about integration of aliphatic protons. A more detailed analysis is the alkaline total saponification of the polycarbonate or copolycarbonate followed by HPLC analysis, with prior appropriate calibration with the pure substance, e.g. 4-n-pentadecylphenol is made.

The chain terminators of the general formula (III) are used in the preparation of the polycarbonates or copolycarbonates preferably in a total amount of 0.1 to 10 mol%, based on moles

Diphenols used.

Suitable branching agents may be compounds having three or more functional groups, preferably those having three or more hydroxyl groups. Usually trisphenols, quarterphenols or acid chlorides of tri- or tetracarboxylic acids are used, or mixtures of polyphenols or acid chlorides.

Suitable compounds having three or more phenolic hydroxyl groups are, for example, phloroglucinol, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) -hepten-2, 4,6-dimethyl-2,4,6-tri- (4-hydroxyphenyl) heptane, 1, 3,5-tri- (4-hydroxyphenyl) -benzene, 1,1,1-tris (4-hydroxyphenyl) -ethane, tri- (4-hydroxyphenyl) -phenylmethane, 2,2-bis (4,4-bis (4-hydroxyphenyl) cyclohexyl] propane, 2,4-bis (4-hydroxyphenyl-isopropyl) -phenol and tetra (4-hydroxyphenyl) -methane.

Other suitable compounds having three and more functional groups are, for example, 2,4-dihydroxybenzoic acid, trimesic acid (trichloride), cyanuric trichloride and 3,3-bis (3-methyl-4-hydroxyphenyl) -2-oxo-2,3-dihydroindole.

Preferred branching agents are 3,3-bis (3-methyl-4-hydroxyphenyl) -2-oxo-2,3-dihydroindole and

1,1,1-tris (4-hydroxyphenyl) ethane.

The thermoplastic polymeric materials may be mixed with various additives.

The addition of additives serves to extend service life or color (stabilizers), to simplify processing (e.g., demulsifiers, flow aids, antistatic agents), or to tailor polymer properties to particular loads

(Impact modifiers, such as rubbers, colorants, glass fibers).

These additives can be added individually or in any desired mixtures or several different mixtures of the polymer melt, namely directly in the isolation of the polymer or after melting of granules in a so-called Compounding. The additives or their mixtures may be added as a solid, ie as a powder, or as a melt of the polymer melt. Another type of dosing is the use of masterbatches or mixtures of masterbatches of the additives or additive mixtures.

For example, laser-sensitive write-on additives can be added by laser engraving. As such laser-sensitive additives are for example so-called laser marking additives in question, i. those from an absorber in the wavelength range of the laser to be used, preferably in the wavelength range of ND: YAG lasers (neodymium-doped yttrium-aluminum-garnet lasers). Such laser marking additives and their use in molding compositions are described, for example, in WO-A 2004/50766 and WO-A 2004/50767 and are described by the

DSM under the brand name Micabs ^® commercially offered. Furthermore, as laser-sensitive additives suitable absorbers, carbon black, coated layer silicates such as, for example, in DE-A-described 195 22 397 and commercially available under the brand names Lazerflair ^®, antimony-doped tin oxide such as described in US 6,693,657 and commercially available under the brand names of Mark-it ™, and phosphorus-containing tin-copper mixed oxides such as in WO-A

2006/042714 described.

Laser-sensitive additives are preferred for laser engraving inscription from dark to light background. Particularly preferred laser-sensitive additives in the context of the invention are black pigments. A most preferred laser-sensitive additive is carbon black.

Alternatively or additionally, for example, fillers may be added to the thermoplastic polymeric materials. The filler may be, for example and preferably, at least one color pigment and / or at least one other filler for producing a translucency of the filled layers, such as e.g. e.g. Conventional inorganic pigments, especially metals or metal oxides such as aluminum oxides, silicic acid, titanites, and alkaline metal salts such as carbonates or sulfates of calcium or barium, particularly preferably a white pigment, most preferably titanium dioxide, zirconium dioxide or barium sulfate, in a preferred embodiment to titanium dioxide ,

The fillers mentioned are preferably used in amounts of from 2 to 45% by weight, more preferably from 5 to 30% by weight, based on the total weight of filler and thermoplastic, of the thermoplastics prior to shaping into the plastic film, which, for example by extrusion or coextrusion added.

Other known additives, such as antistatic agents, IR absorbers, metal identification platelets, fluorescent fibers labeled with glass fibers, etc., can be added to the thermoplastic polymeric materials. Preferably, the layer structure for the process according to the invention comprises at least one cover layer and the thermoplastic, polymeric material of the cover layer has a Vicat softening temperature B / 50 ( _DeCkschi _cht) , which is higher than the Vicat softening temperature

B / 50 (layer) - Also for the cover layer (s) are the above-mentioned thermoplastic, polymeric materials in question.

Preferably, the Vicat softening temperature B / 50 _(DeCks c _h ic _h t) is at least 5 ° C higher, preferably at least 10 ⁰ C higher than the Vicat softening temperature B / 50 (s _Ch ic _h t) -

For the process according to the invention, the layer structure to be laminated is produced in such a way that films made of the respective thermoplastic, polymeric materials with the respective

Vicat softening temperatures B / 50 formed a corresponding Fohenstapel and this is then laminated according to the invention in two stages. In this case, the component to be embedded is applied to the film for producing the base layer prior to formation of the film stack.

The component may, prior to formation of the film stack on the film for the production of the base layer by means of known measures, such. Lamimeren, welding, clamping, press-fitting, gluing and / or printing to avoid changing the position during the lamination process. The component can also be placed without fixing on the base layer.

In preferred embodiments of the inventive method, the layer structure in the first Laminierschπtt with a temperature 5 to 30 ⁰ C, preferably 5 to 15 ° C above the Vicat

Softening temperature B / 50 _(Sch , c _ht) is and a maximum of 5 ⁰ C above, but preferably below the Vicat softening temperature B / 50 _(Bas is ₎ hudes, applied, by which the further (s) layer (s) containing at least one polycarbonate or Copolacarbonat with a lower Vicat softening point B / 50 _(sc _h ic _ht) softens (soften). Since base and top layer (s) do not soften at this temperature or not yet completely, it comes to a gentle

Circulation of the core without gap formation (see schematic illustration in Figure 4). Subsequently, the layer structure at a temperature above, preferably 5 to 50 ⁰ C, more preferably 10 to 40 ⁰ C, most preferably 20 to 35 ⁰ C above the Vicat softening temperature B / 50 _(Bas i _s) halls laminated (cf., schematic representation m Fig. 5). The Lamimerdruck is in the first lamination for gentle flow preferably 2 to 100 N / cm ² , in the second

Laminierschπtt during heating and cooling preferably 100 to 400 N / cm ² . A pressure of 10 to 30 N / cm ² is particularly preferred in the first lamination for gentle flow, and a pressure of 150 to 350 N / cm ² in the second lamination cycle during heating and cooling. Depending on the number of films to be laminated in the film stack, the lamination time can preferably be between a few minutes and more than one hour. Preferably, depending on the number to be laminated

Foils in the foil stack a lamination time of 1 to 30 minutes. 4 shows schematically a foil stack with a base layer (3), a component to be embedded in the form of a chip (1) and an antenna (2), two intermediate layers (4) which together have approximately the height of the chip (1) and a cover layer (5), which in the first step of the inventive method with pressurization with a first laminating pressure P at a temperature T above the Vicat softening temperature B / 50 _(Sch ic _h t) and at most 5 ⁰ C above, but preferably below the Vicat Softening temperature B / 50 ( _B asis) is laminated.

FIG. 5 schematically shows the film stack laminated according to FIG. 4, which is laminated in the second step of the method according to the invention with pressurization with a second laminating pressure P at a temperature T above the Vicat softening temperature B / 50 _(BaS i _s) . Further subject of the present invention is a layer structure containing

at least one base layer of a thermoplastic, polymeric material having a Vicat softening temperature B / 50 ( _BaS is)

at least one further layer of a thermoplastic polymeric material having a lower Vicat softening temperature B / 50 ₍ Schig _h ) than the thermoplastic polymeric material of the base layer

optionally at least one cover layer of a thermoplastic, polymeric Mateπal,

wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric Mateπal with medi gerer Vicat softening temperature B / 50 _(Sch ic _h t ₎ .

The layer structure is preferably a film stack of corresponding films and the electronic component between the film for producing the base layer and the - optionally first - further layer, wherein the component may be attached to the base layer or not. The respective films can be made of the aforementioned thermoplastic, polymeric

Mateπahen be prepared by extrusion or coextrusion. These methods are known to the person skilled in the art and adequately described in the literature.

The thickness of the suitable films is preferably 5 to 1000, μm, more preferably 5 to 850.

The foils can be smooth on one side or both sides or matt or structured on one or both sides.

It is also possible to introduce a plurality of layers of the layer structure according to the invention in the form of a coextrusion film into the film stack. With the method according to the invention, laminated layer composites comprising functional components can be produced from the layer structure according to the invention.

A further subject of the present invention is therefore a laminated layer composite obtainable by the process according to the invention. The layers in the layer composite or layer structure according to the invention may consist of the same or different materials. Even though layers consist predominantly of the same thermoplastic, polymeric material, they are nevertheless different layers for the purposes of the present invention, when incorporated in e.g. be applied in separate steps, contain different additives or have different properties.

The expression "at least one layer" means that the layer composite or layer structure according to the invention can have one or more such layers.

The laminated layer composite according to the invention can be part of security and / or value documents.

Further subject of the present invention is therefore a safety and / or

Value document containing at least one laminated layer composite according to the invention.

The security and / or value document may be, for example, data carriers in the form of cards and identity cards, e.g. Smart ID cards, smart cards in general, EC cards, credit cards, insurance cards, passports, RFID tags, driving licenses etc act.

The security and / or value document according to the invention can also be further additional

Having layers which provide UV protection, protection against mechanical damage - e.g. Scratch-resistant coatings - etc. have. If appropriate, such layers can also be subsequently applied to the laminated layer composite according to the invention. This can be done for example by gluing or another laminating step.

The invention is illustrated below by way of examples. These examples serve to exemplify the invention and are in no way to be construed as limiting. Examples

Example 1: Preparation of a polycarbonate granulate for the preparation of the further layer (s) with low Vicat softening temperature B / 50fSrhi _< -hn

To a nitrogen inert solution of 4566 g (20 mol) of bisphenol A and 3520 g (88 mol)

Sodium hydroxide in 40 L of water was added to 40 L of methylene chloride. At a pH of 12.5 - 13.5 and 20 ⁰ C 3556 g (40 mol) of phosgene were introduced. In order to prevent the pH from dropping below 12.5, 30% sodium hydroxide solution was added during the phosgenation (about 7000 g). After completion of phosgenation and purging with nitrogen, 258 g (0.85 mol) of m-pentadecylphenol dissolved in 1 1 of dichloromethane was added. The mixture was stirred for a further 10 minutes, 22.6 g (0.2 mol) of N-ethylpiperidine was added and left to stir for 1 hour. The organic phase was acidified after separating the aqueous phase with phosphoric acid and washed neutral with distilled water and salt-free. After solvent exchange against chlorobenzene, the product was extruded at 290 ⁰ C and 80 revolutions / min at 0.1 mbar via a Ausdampffextruder and granulated through a granulator.

Example 2 Compounding of a Masterbatch for the Production of the Base Layer Containing a Thermoplastic Plastic and a White Pigment as Filler

The preparation of masterbatches for the production of the layer comprising a thermoplastic and a white pigment as filler was carried out with a conventional twin-screw

Compounding extruder (ZSK 32) at processing temperatures customary for polycarbonate from 250 to 330 ^° C.

A masterbatch was compounded with the following composition and then granulated:

• Makrolon ^® 3108 polycarbonate from the company. Bayer MaterialScience AG with a share of 85

Wt .-%

• Titanium dioxide (Kronos® 2230 from Kronos Titan) as white pigment filler in a proportion of 15% by weight. Example 3: Preparation of the corresponding films

Each film from the granules according to Example 1, the masterbatch of Example 2 and pure polycarbonate Makrolon ^® 3108 Fa. Bayer Material Science AG were extruded. The respective polycarbonate films had a width of 350 mm.

For this purpose, an investment was made

- An extruder from Stork with a screw of 37 mm diameter (D) and a length of 24xD. The screw has a degassing zone;

- a slot die with 350 mm width;

- a lip gap of 0.8 mm

- a trigger device;

- Used a winding station.

From the nozzle, the melt reached the casting roll and then the cooling roll, the rolls having the temperature mentioned in Tab. 1. Subsequently, the film was transported through a trigger and then wound up.

Tab. 1

From the granules according to Example 1 films of thickness of 100 microns were prepared. From the masterbatch according to Example 2 foils of thickness of 105 microns and 150 microns were prepared.

In Makrolon ^® 3108 films the thickness were prepared of 100 microns.

Example 4: Production of a laminated layer composite according to the invention

method

It was a Fohenstapel consisting of

a 150 micron thick film of the masterbatch according to Example 2 for a first base layer (Vicat softening temperature B / 50 ( _B asis) ⁼ 148.1 ⁰ C), - a 105 micron thick film of the masterbatch according to Example 2 for a second

Base layer (Vicat softening temperature B / 50 ( _B asis) = 148.1 ⁰ C), a component in the form of antenna and chip on this film for the second base layer, two 100 micron thick films from the granules of Example 1 for two more Layers (Vicat softening temperature B / 50 ₍ layer) ⁼ 133.1 ⁰ C), - a 105 micron thick film of the masterbatch according to Example 2 for a cover layer

(Vicat softening temperature B / 50 (DeCkSChICM) ⁼ 148.1 ⁰ C)

produced.

The further layers were realized with transparent material, the base and cover layers with white material in order to be able to recognize the Matenal flow in microscopic images.

The film stack was then laminated in a first Lammierschritt at a temperature of 140 ⁰ C and a pressure of 15 N / cm ² for 10 minutes in the press. Then the press was heated to a temperature of 180 ⁰ C and exposed to the vorlammierte layer structure in a second step for 2 minutes at a pressure of 300 N / cm ^2. Subsequently, the laminated layer composite was cooled at a pressure of 300 N / cm ² to a temperature of 40 ⁰ C and finally removed from the press.

The connection between antenna and chip was still functional after the Lamimer process.

Comparative Example 5 Production of a Laminated Layer Composite

It was a Fohenstapel consisting of a 150 micron thick film of the master batch according to example 2 for a first base layer (Vicat softening point B / 50 _(B asis) ⁼ 148.1 ⁰ C), a 105 micron thick film of the master batch according to Example 2 (a second base layer Vicat softening point B / 50 _(B asis) ⁼ 148.1 ⁰ C), - a component in the form of chip antenna and on this film for the second base layer, two 100 micron thick sheets of Makrolon ^® 3108 for two more layers (Vicat - softening temperature B / 50 _(see _ch i _CHT) = 149.0 ⁰ C), these films were each punched out recesses in the approximate size of the embedded chips, a 105 micron thick film of the master batch according to example 2 (a covering layer Vicat softening temperature (eckschicht _D) B / 50 = 148.1 ⁰ C)

produced.

The further layers were realized with transparent material, the base and cover layers with white material in order to be able to recognize the material flow in microscopic images.

The film stack was then laminated in a first Lammierschπtt at a temperature of 140 ⁰ C and a pressure of 15 N / cm ² for 10 minutes in the press. Then the press was heated to a temperature of 180 ⁰ C and exposed to the vorlammierte layer structure in a second step for 2 minutes at a pressure of 300 N / cm ^2. Subsequently, the laminated layer composite was cooled at a pressure of 300 N / cm ² to a temperature of 40 ⁰ C and finally removed from the press.

The base and top coats were pressed into the die gap during the lamimer process. The

Antenna was stretched greatly and the connection between antenna and chip was torn and no longer functional.

The examples show that with the inventive method, the component in the form of chip and antenna was not destroyed during the lamination process and then was still functional.

Claims

claims

1. A process for producing a laminated layer composite, characterized in that a layer structure containing

at least one base layer of a thermoplastic, polymeric material having a Vicat softening temperature B / 50 _(Ba sis)

at least one further layer of a thermoplastic polymeric material which has a lower Vicat softening temperature has B / 50 _(Sch i _ch t) as the thermoplastic polymeric Mateπal the base layer

optionally at least one cover layer of a thermoplastic, polymeric Mateπal,

wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric material having a lower Vicat softening temperature B / 50 ( _Sch ic _h t),

a) in a first step at a temperature above the Vicat softening temperature 6/50 _(SCh1ChI) , which is at most 5 ° C above the Vicat softening temperature B / 50 ( _B asis) is laminated, and

b) is laminated in a second step at a temperature above the Vicat softening temperature B / 50 ( _B asis).

2. The method according to claim 1, characterized in that laminated in the first Schπtt a) at a temperature above the Vicat softening temperature B / 50 _(S c _h ic _h t ₎ and below the Vicat softening temperature B / 50 _(Bas i _s) becomes.

3. The method according to claim 1 or 2, characterized in that the Vicat softening temperature B / 50 _(Sch i _cht) at least 5 ° C lower, preferably at least 10 ⁰ C lower than the Vicat softening temperature B / 50 _(Ba si _s) ¹ pc.

4. The method according to at least one of claims 1 to 3, characterized in that it is at the thermoplastic polymeric Mateπal the base layer to at least one thermoplastic selected from polymers of ethylenically unsaturated monomers and / or polycondensates of bifunctional reactive compounds or mixtures thereof , preferably one or more polycarbonate (s) or copolycarbonate (s) based on diphenols, poly or copolyacrylate (s) and poly or

Copolymethacrylate (s), poly (or copolymer) (s) with styrene, polyurethane (s), and poly- olefin (s), polyvinyl chloride, poly- or copolycondensate (s) of terephthalic acid, poly- or copolycondensate (s) of naphtha dicarboxylic acid, poly- or copolycondensate (s) of at least one cycloalkyl dicarboxylic acid, polysulfones or mixtures thereof, more preferably polycarbonate, polyurethane or mixtures containing at least one of these thermoplastics, very particularly preferably polycarbonate or

Mixtures containing polycarbonate is.

5. The method according to at least one of claims 1 to 4, characterized in that it is in the thermoplastic, polymeric material of the further layer to at least one thermoplastic selected from polymers of ethylenically unsaturated monomers and / or polycondensates of bifunctional reactive

Compounds or mixtures of these, preferably one or more polycarbonate (s) or copolycarbonate (s) based on diphenols, poly- or copolyacrylate (s) and poly- or co-polymethacrylate (s), poly- or copolymer (s) with styrene , Polyurethane (s), as well as poly olefin (s), polyvinyl chloride, poly- or copolycondensate (s) of terephthalic acid, poly- or copolycondensate (s) of naphtha dicarboxylic acid, poly- or copolycondensate (s) of at least one cycloalkyldicarboxylic acid, polysulfones or mixtures of these, more preferably polycarbonate, polyurethane or mixtures containing at least one of these thermoplastics, most preferably polycarbonate or mixtures containing polycarbonate.

6. The method according to at least one of claims 1 to 5, characterized in that it is the component to at least an electronic component or a (volume) hologram.

A method according to claim 6, characterized in that the electronic component (s) are integrated circuits, thick-film circuits, circuits comprising a plurality of discrete active and passive electronic components,

Sensors, chip modules, displays, batteries, coils, capacitors, conductors and / or

Contact points acts.

8 A method according to any one of claims 1 to 7, characterized in that the layer structure comprises at least a cover layer and the thermoplastic Mateπal the cover layer has a Vicat softening point B / 50 _(Decksch ic _h t) which is higher than the Vicat softening temperature B / 50 ( _Sc hi _C ht) -

9. containing layer structure

at least one base layer of a thermoplastic, polymeric material having a Vicat softening temperature B / 50 _(Bas i _s) at least one further layer of a thermoplastic polymeric material which has a lower Vicat softening temperature B / 50 _(Sc hight) than the thermoplastic, polymeric material of the base layer

optionally at least one cover layer of a thermoplastic, polymeric Mateπal,

wherein at least one component is contained between the base layer and the further layer of a thermoplastic, polymeric Mateπal with lower Vicat softening temperature B / 50 _(Sch i _ct) .

10. Laminated layer composite obtainable by a process according to at least one of claims 1 to 8.

11. Security and / or valuable document containing at least one laminated laminate according to claim 10.