EP2270242A4 - Copper alloy material for electric and electronic apparatuses, and electric and electronic components - Google Patents

Copper alloy material for electric and electronic apparatuses, and electric and electronic components

Info

Publication number: EP2270242A4
Authority: EP; European Patent Office
Prior art keywords: electric; copper alloy; alloy material; electronic; electronic components
Prior art date: 2008-03-31
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP09728058A

Other languages

German (de)

French (fr)

Other versions

EP2270242B1 (en

EP2270242A1 (en

Inventor

Koji Sato

Kiyoshige Hirose

Hiroshi Kaneko

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Furukawa Electric Co Ltd

Original Assignee

Furukawa Electric Co Ltd

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2008-03-31

Filing date

2009-03-30

Publication date

2012-06-27

2009-03-30 Application filed by Furukawa Electric Co Ltd filed Critical Furukawa Electric Co Ltd

2011-01-05 Publication of EP2270242A1 publication Critical patent/EP2270242A1/en

2012-06-27 Publication of EP2270242A4 publication Critical patent/EP2270242A4/en

2014-06-04 Application granted granted Critical

2014-06-04 Publication of EP2270242B1 publication Critical patent/EP2270242B1/en

Status Not-in-force legal-status Critical Current

2029-03-30 Anticipated expiration legal-status Critical

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
- H01B1/026—Alloys based on copper
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)

EP09728058.0A 2008-03-31 2009-03-30 Copper alloy material for electric or electronic apparatuses, method for producing it and component Not-in-force EP2270242B1 (en)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP2008092315		2008-03-31
PCT/JP2009/056576 WO2009123159A1 (en)	2008-03-31	2009-03-30	Copper alloy material for electric and electronic apparatuses, and electric and electronic components

Publications (3)

Publication Number	Publication Date
EP2270242A1 EP2270242A1 (en)	2011-01-05
EP2270242A4 true EP2270242A4 (en)	2012-06-27
EP2270242B1 EP2270242B1 (en)	2014-06-04

Family

ID=41135533

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP09728058.0A Not-in-force EP2270242B1 (en)	2008-03-31	2009-03-30	Copper alloy material for electric or electronic apparatuses, method for producing it and component

Country Status (6)

Country	Link
US (1)	US20110017357A1 (en)
EP (1)	EP2270242B1 (en)
JP (1)	JP4653240B2 (en)
KR (1)	KR101114116B1 (en)
CN (1)	CN101981213B (en)
WO (1)	WO2009123159A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
WO2011068124A1 (en) *	2009-12-02	2011-06-09	古河電気工業株式会社	Copper alloy sheet
US8821655B1 (en)	2010-12-02	2014-09-02	Fisk Alloy Inc.	High strength, high conductivity copper alloys and electrical conductors made therefrom
JP5773929B2 (en) *	2012-03-28	2015-09-02	株式会社神戸製鋼所	Copper alloy sheet for electrical and electronic parts with excellent bending workability and stress relaxation resistance
CN103631050B (en) *	2012-08-20	2018-08-07	东莞市鸿显实业投资有限公司	LCD MODULE and LCD MODULE manufacturing method
US9560154B2 (en) *	2014-12-11	2017-01-31	Facebook, Inc.	Systems and methods for providing information regarding future content
JP6385383B2 (en) *	2016-03-31	2018-09-05	Ｊｘ金属株式会社	Copper alloy sheet and method for producing copper alloy sheet
CN106011522A (en) *	2016-08-03	2016-10-12	苏州市虎丘区浒墅关弹簧厂	High elasticity copper alloy material for springs
KR102119552B1 (en) *	2016-12-02	2020-06-05	후루카와 덴키 고교 가부시키가이샤	Copper alloy wire and method for manufacturing copper alloy wire
JP7193941B2 (en) *	2018-07-26	2022-12-21	Koa株式会社	SHUNT RESISTOR AND CURRENT DETECTION DEVICE USING THE SAME
JP7525322B2 (en)	2020-07-29	2024-07-30	Ｄｏｗａメタルテック株式会社	Cu-Ni-Co-Si copper alloy sheet material, its manufacturing method and conductive spring member

Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20020119071A1 (en) *	2000-12-15	2002-08-29	Takayuki Usami	High-mechanical strength copper alloy
US20050263218A1 (en) *	2004-05-27	2005-12-01	The Furukawa Electric Co., Ltd.	Copper alloy
EP2143810A1 (en) *	2007-03-26	2010-01-13	The Furukawa Electric Co., Ltd.	Copper alloy for electrical/electronic device and method for producing the same

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP4154100B2 (en)	1999-12-17	2008-09-24	日鉱金属株式会社	Copper alloy for electronic materials having excellent surface characteristics and method for producing the same
JP2004180161A (en)	2002-11-28	2004-06-24	Nippon Telegraph & Telephone East Corp	Communication mode adjustment device, communication mode adjusting method, communication mode adjustment program, and recording medium with the program stored
JP4100629B2 (en) *	2004-04-16	2008-06-11	日鉱金属株式会社	High strength and high conductivity copper alloy
JP4959141B2 (en)	2005-02-28	2012-06-20	Ｄｏｗａホールディングス株式会社	High strength copper alloy
JP4566048B2 (en)	2005-03-31	2010-10-20	株式会社神戸製鋼所	High-strength copper alloy sheet excellent in bending workability and manufacturing method thereof
JP5247021B2 (en) *	2005-11-28	2013-07-24	Ｊｘ日鉱日石金属株式会社	Cu-Ni-Si-based alloy plate / strip with reduced wrinkles in the bent portion and method for producing the same
JP4986499B2 (en) *	2006-04-26	2012-07-25	Ｊｘ日鉱日石金属株式会社	Method for producing Cu-Ni-Si alloy tin plating strip
JP2008092315A (en)	2006-10-03	2008-04-17	Ricoh Co Ltd	Remote management system of image forming apparatus
JP4357536B2 (en) *	2007-02-16	2009-11-04	株式会社神戸製鋼所	Copper alloy sheet for electrical and electronic parts with excellent strength and formability
CN101646792B (en) *	2007-03-30	2012-02-22	Jx日矿日石金属株式会社	Cu-Ni-Si-based alloy for electronic material

2009
- 2009-03-30 EP EP09728058.0A patent/EP2270242B1/en not_active Not-in-force
- 2009-03-30 CN CN2009801117819A patent/CN101981213B/en not_active Expired - Fee Related
- 2009-03-30 WO PCT/JP2009/056576 patent/WO2009123159A1/en active Application Filing
- 2009-03-30 KR KR1020107023904A patent/KR101114116B1/en not_active IP Right Cessation
- 2009-03-30 JP JP2009536501A patent/JP4653240B2/en not_active Expired - Fee Related
2010
- 2010-09-29 US US12/893,893 patent/US20110017357A1/en not_active Abandoned

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20020119071A1 (en) *	2000-12-15	2002-08-29	Takayuki Usami	High-mechanical strength copper alloy
US20050263218A1 (en) *	2004-05-27	2005-12-01	The Furukawa Electric Co., Ltd.	Copper alloy
EP2143810A1 (en) *	2007-03-26	2010-01-13	The Furukawa Electric Co., Ltd.	Copper alloy for electrical/electronic device and method for producing the same

Also Published As

Publication number	Publication date
JP4653240B2 (en)	2011-03-16
CN101981213B (en)	2012-11-14
WO2009123159A1 (en)	2009-10-08
KR101114116B1 (en)	2012-03-13
JPWO2009123159A1 (en)	2011-07-28
EP2270242B1 (en)	2014-06-04
US20110017357A1 (en)	2011-01-27
CN101981213A (en)	2011-02-23
KR20100132044A (en)	2010-12-16
EP2270242A1 (en)	2011-01-05

Publication	Publication Date	Title
EP2319947A4 (en)	2011-11-23	Copper alloy material for electrical and electronic components, and manufacturing method therefor
EP2333128A4 (en)	2012-07-04	Copper alloy material for electrical/electronic component
EP2248921A4 (en)	2011-03-16	Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material
EP2351862A4 (en)	2012-07-04	Copper alloy material, electric and electronic parts, and copper alloy material manufacturing method
EP2202326A4 (en)	2012-06-27	Copper alloy plate material for electric and electronic components
EP2270242A4 (en)	2012-06-27	Copper alloy material for electric and electronic apparatuses, and electric and electronic components
EP2333127A4 (en)	2012-07-04	Copper alloy material for electrical/electronic component
EP2143810A4 (en)	2012-06-27	Copper alloy for electrical/electronic device and method for producing the same
EP2169093A4 (en)	2012-01-25	Metal material for electrical electronic component
EP2256219A4 (en)	2012-06-27	Copper alloy material
EP2045344A4 (en)	2009-09-30	Copper alloy sheets for electrical/electronic part
EP2154257A4 (en)	2012-01-11	Cu-ni-si-based alloy for electronic material
EP1873267A4 (en)	2008-07-23	Copper alloy for electronic material
EP2554693A4 (en)	2014-03-12	Cu-ni-si-co copper alloy for electronic material and process for producing same
EP2194151A4 (en)	2011-01-26	Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
EP2371976A4 (en)	2013-06-12	Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
EP2216426A4 (en)	2015-11-25	Tin-plated material for electronic part
EP2422918A4 (en)	2012-12-05	Soldering material and electronic component assembly
EP2298945A4 (en)	2012-07-04	Copper alloy sheet material and manufacturing method thereof
EP2184371A4 (en)	2013-05-01	Copper alloy sheet
IL210241A0 (en)	2011-03-31	Metal-containing composition, process for producing electric contact structures on electronic components and also electronic component
EP2182093A4 (en)	2011-10-19	Metal material, method for producing the same, and electrical electronic component using the same
EP2484787A4 (en)	2013-06-05	Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME
EP2415887A4 (en)	2013-06-05	Cu-co-si copper alloy for use in electronics, and manufacturing method therefor
EP2223754A4 (en)	2014-10-29	Process for manufacturing copper alloy products and equipment therefor

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2012-06-27	A4	Supplementary search report drawn up and despatched	Effective date: 20120530
2012-06-27	RIC1	Information provided on ipc code assigned before grant	Ipc: H01B 1/02 20060101ALI20120523BHEP Ipc: C22F 1/08 20060101ALI20120523BHEP Ipc: H01L 23/48 20060101ALI20120523BHEP Ipc: C22F 1/00 20060101ALI20120523BHEP Ipc: H01B 13/00 20060101ALI20120523BHEP Ipc: C22C 9/06 20060101AFI20120523BHEP
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