EP2484787A4 - Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME - Google Patents

Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Info

Publication number: EP2484787A4
Authority: EP; European Patent Office
Prior art keywords: copper alloy; electronic material; producing same; producing; electronic
Prior art date: 2009-09-28
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP09849834.8A

Other languages

German (de)

French (fr)

Other versions

EP2484787B1 (en

EP2484787A1 (en

Inventor

Hiroshi Kuwagaki

Naohiko Era

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JX Nippon Mining and Metals Corp

Original Assignee

JX Nippon Mining and Metals Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2009-09-28

Filing date

2009-09-28

Publication date

2013-06-05

2009-09-28 Application filed by JX Nippon Mining and Metals Corp filed Critical JX Nippon Mining and Metals Corp

2012-08-08 Publication of EP2484787A1 publication Critical patent/EP2484787A1/en

2013-06-05 Publication of EP2484787A4 publication Critical patent/EP2484787A4/en

2015-01-07 Application granted granted Critical

2015-01-07 Publication of EP2484787B1 publication Critical patent/EP2484787B1/en

Status Active legal-status Critical Current

2029-09-28 Anticipated expiration legal-status Critical

Classifications

- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
- C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
- C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent

Landscapes

Chemical & Material Sciences (AREA)
Engineering & Computer Science (AREA)
Materials Engineering (AREA)
Mechanical Engineering (AREA)
Metallurgy (AREA)
Organic Chemistry (AREA)
Physics & Mathematics (AREA)
Thermal Sciences (AREA)
Crystallography & Structural Chemistry (AREA)
Conductive Materials (AREA)

EP09849834.8A 2009-09-28 2009-09-28 Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME Active EP2484787B1 (en)

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
PCT/JP2009/066794 WO2011036804A1 (en)	2009-09-28	2009-09-28	Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Publications (3)

Publication Number	Publication Date
EP2484787A1 EP2484787A1 (en)	2012-08-08
EP2484787A4 true EP2484787A4 (en)	2013-06-05
EP2484787B1 EP2484787B1 (en)	2015-01-07

Family

ID=43795574

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP09849834.8A Active EP2484787B1 (en)	2009-09-28	2009-09-28	Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME

Country Status (5)

Country	Link
EP (1)	EP2484787B1 (en)
JP (1)	JP5506806B2 (en)
KR (1)	KR20120054099A (en)
CN (1)	CN102549180A (en)
WO (1)	WO2011036804A1 (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US8821477B2 (en)	2007-08-06	2014-09-02	Boston Scientific Scimed, Inc.	Alternative micromachined structures
US8795254B2 (en)	2008-12-10	2014-08-05	Boston Scientific Scimed, Inc.	Medical devices with a slotted tubular member having improved stress distribution
EP2552530A1 (en)	2010-03-31	2013-02-06	Boston Scientific Scimed, Inc.	Guidewire with a flexural rigidity profile
JP6246454B2 (en) *	2011-11-02	2017-12-13	Ｊｘ金属株式会社	Cu-Ni-Si alloy and method for producing the same
JP5770113B2 (en) *	2012-01-13	2015-08-26	Jx日鉱日石金属株式会社	Metal foil composite, molded body and method for producing the same
US9901706B2 (en)	2014-04-11	2018-02-27	Boston Scientific Scimed, Inc.	Catheters and catheter shafts
JP6310004B2 (en) *	2016-05-27	2018-04-11	Ｊｘ金属株式会社	Cu-Co-Ni-Si alloy for electronic parts
CN106244849A (en) *	2016-10-13	2016-12-21	龙岩学院	A kind of preparation method of intensified by ultrasonic wave high property copper alloy
CN108642419A (en) *	2018-05-31	2018-10-12	太原晋西春雷铜业有限公司	A kind of corson alloy band and preparation method thereof that bending is excellent
JP7451964B2 (en) *	2019-01-16	2024-03-19	株式会社プロテリアル	Cu alloy plate and its manufacturing method
CN110195166A (en) *	2019-04-17	2019-09-03	宁波兴业盛泰集团有限公司	A kind of warping resistance CuNiCoSi used for lead frame system's alloy and its manufacturing method
CN112410646A (en) *	2020-10-16	2021-02-26	扬州千裕电气有限公司	Electronic composite material
CN113234958A (en) *	2021-04-25	2021-08-10	江苏青益金属科技股份有限公司	Alloy wire suitable for constant-temperature sheath of petroleum delivery pipeline and preparation method thereof

Citations (7)

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Publication number	Priority date	Publication date	Assignee	Title
US20040079456A1 (en) *	2002-07-02	2004-04-29	Onlin Corporation	Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (en) *	2005-03-31	2008-01-09	Nippon Mining & Metals Co., Ltd.	Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
JP2008106356A (en) *	2006-09-27	2008-05-08	Dowa Metaltech Kk	Copper alloy sheet and its manufacturing method
US20080190524A1 (en) *	2007-02-13	2008-08-14	Weilin Gao	Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (en) *	2007-03-26	2008-11-06	Furukawa Electric Co Ltd:The	Copper alloy for electrical/electronic device and method for manufacturing the same
JP2009007666A (en) *	2007-05-31	2009-01-15	Furukawa Electric Co Ltd:The	Copper alloy for electrical and electronic equipment
WO2009082695A1 (en) *	2007-12-21	2009-07-02	Gbc Metals Llc	Copper-nickel-silicon alloys

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JPH01122264A (en)	1987-11-05	1989-05-15	Nec Corp	Image output device
JP3408021B2 (en)	1995-06-30	2003-05-19	古河電気工業株式会社	Copper alloy for electronic and electric parts and method for producing the same
EP1873267B1 (en)	2005-03-24	2014-07-02	JX Nippon Mining & Metals Corporation	Copper alloy for electronic material
JP4596490B2 (en) *	2008-03-31	2010-12-08	Ｊｘ日鉱日石金属株式会社	Cu-Ni-Si-Co-based copper alloy for electronic materials and method for producing the same

2009
- 2009-09-28 WO PCT/JP2009/066794 patent/WO2011036804A1/en active Application Filing
- 2009-09-28 JP JP2011532878A patent/JP5506806B2/en active Active
- 2009-09-28 KR KR1020127009709A patent/KR20120054099A/en not_active Application Discontinuation
- 2009-09-28 CN CN2009801616889A patent/CN102549180A/en active Pending
- 2009-09-28 EP EP09849834.8A patent/EP2484787B1/en active Active

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US20040079456A1 (en) *	2002-07-02	2004-04-29	Onlin Corporation	Copper alloy containing cobalt, nickel and silicon
EP1876250A1 (en) *	2005-03-31	2008-01-09	Nippon Mining & Metals Co., Ltd.	Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
JP2008106356A (en) *	2006-09-27	2008-05-08	Dowa Metaltech Kk	Copper alloy sheet and its manufacturing method
US20080190524A1 (en) *	2007-02-13	2008-08-14	Weilin Gao	Cu-Ni-Si-based copper alloy sheet material and method of manufacturing same
JP2008266783A (en) *	2007-03-26	2008-11-06	Furukawa Electric Co Ltd:The	Copper alloy for electrical/electronic device and method for manufacturing the same
JP2009007666A (en) *	2007-05-31	2009-01-15	Furukawa Electric Co Ltd:The	Copper alloy for electrical and electronic equipment
WO2009082695A1 (en) *	2007-12-21	2009-07-02	Gbc Metals Llc	Copper-nickel-silicon alloys

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
H.-A. KUHN ET AL: "A new high performance copper based alloy for electro-mechanical connectors", MATERIALWISSENSCHAFT UND WERKSTOFFTECHNIK, vol. 38, no. 8, 1 August 2007 (2007-08-01), pages 624 - 634, XP055060686, ISSN: 0933-5137, DOI: 10.1002/mawe.200700152 *
See also references of WO2011036804A1 *

Also Published As

Publication number	Publication date
WO2011036804A1 (en)	2011-03-31
CN102549180A (en)	2012-07-04
KR20120054099A (en)	2012-05-29
EP2484787B1 (en)	2015-01-07
EP2484787A1 (en)	2012-08-08
JPWO2011036804A1 (en)	2013-02-14
JP5506806B2 (en)	2014-05-28

Publication	Publication Date	Title
EP2554693A4 (en)	2014-03-12	Cu-ni-si-co copper alloy for electronic material and process for producing same
EP2484787A4 (en)	2013-06-05	Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRONIC MATERIAL AND PROCESS FOR PRODUCING SAME
EP2508635A4 (en)	2015-11-25	Copper alloy sheet and process for producing same
EP2194151A4 (en)	2011-01-26	Cu-ni-si-co-base copper alloy for electronic material and process for producing the copper alloy
EP2578709A4 (en)	2014-04-09	Cu-co-si-based copper alloy for electronic material, and process for production thereof
EP2570505A4 (en)	2014-08-06	Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
ZA201105861B (en)	2012-04-25	Curved metallic material and process for producing same
EP2319947A4 (en)	2011-11-23	Copper alloy material for electrical and electronic components, and manufacturing method therefor
EP2298945A4 (en)	2012-07-04	Copper alloy sheet material and manufacturing method thereof
EP2157199A4 (en)	2012-06-27	Copper alloy material, and method for production thereof
EP2570506A4 (en)	2014-07-09	Copper alloy for electronic device, method for producing copper alloy for electronic device, and copper alloy rolled material for electronic device
EP2248921A4 (en)	2011-03-16	Copper alloy material for electric/electronic component and method for manufacturing the copper alloy material
EP2641983A4 (en)	2016-04-13	Cu-Ni-Si-Co COPPER ALLOY FOR ELECTRON MATERIAL AND METHOD FOR PRODUCING SAME
EP2351862A4 (en)	2012-07-04	Copper alloy material, electric and electronic parts, and copper alloy material manufacturing method
SG11201400688YA (en)	2014-09-26	Metal material for electronic components and method for producing same
EP2653574A4 (en)	2014-09-10	Copper alloy and method for producing copper alloy
EP2371976A4 (en)	2013-06-12	Cu-ni-si-co based copper ally for electronic materials and manufacturing method therefor
EP2330224A4 (en)	2012-01-25	High-purity copper and process for electrolytically producing high-purity copper
EP2333128A4 (en)	2012-07-04	Copper alloy material for electrical/electronic component
EP2508633A4 (en)	2014-07-23	Copper alloy sheet and process for producing same
HK1141563A1 (en)	2010-11-12	Cu-ti-based copper alloy sheet material and method of manufacturing same cu-ti
EP2223754A4 (en)	2014-10-29	Process for manufacturing copper alloy products and equipment therefor
EP2256219A4 (en)	2012-06-27	Copper alloy material
EP2623619A4 (en)	2014-04-09	Cu-Co-Si-BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCING SAME
EP2422904A4 (en)	2016-12-21	Fine solid solution alloy particles and method for producing same

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