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EP2145505A1 - Convertisseur acoustique - Google Patents

Convertisseur acoustique

Info

Publication number
EP2145505A1
EP2145505A1 EP08748345A EP08748345A EP2145505A1 EP 2145505 A1 EP2145505 A1 EP 2145505A1 EP 08748345 A EP08748345 A EP 08748345A EP 08748345 A EP08748345 A EP 08748345A EP 2145505 A1 EP2145505 A1 EP 2145505A1
Authority
EP
European Patent Office
Prior art keywords
substrate
membrane
layer
acoustic transducer
vibrations
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP08748345A
Other languages
German (de)
English (en)
Inventor
Christoph Nölle
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Baumer Electric AG
Original Assignee
Baumer Electric AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Baumer Electric AG filed Critical Baumer Electric AG
Publication of EP2145505A1 publication Critical patent/EP2145505A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • G—PHYSICS
    • G10—MUSICAL INSTRUMENTS; ACOUSTICS
    • G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
    • G10K9/00—Devices in which sound is produced by vibrating a diaphragm or analogous element, e.g. fog horns, vehicle hooters or buzzers
    • G10K9/18—Details, e.g. bulbs, pumps, pistons, switches or casings
    • G10K9/22—Mountings; Casings

Definitions

  • the invention relates to an acoustic transducer and a method for producing such a transducer according to the features of claims 1 and 3.
  • ultrasonic sensors which operate on the pulse-echo principle, are widely used ultrasonic transducers with a piezoceramic disk and a matching layer.
  • the matching layer has an acoustic characteristic impedance which is between that of the piezoceramic disk and that of the surrounding medium (usually air or water).
  • Such ultrasonic transducers are relatively narrow band. They are excited by electrical impulses or transmit bursts to emit wave packets. These sound waves are reflected on objects. Upon impact of such echo signals on the ultrasonic transducer they are evaluated by a detection electronics. The transit time between the emission of the ultrasonic bursts and the
  • Receiving the echo signals is a measure of the respective object distance.
  • ultrasonic sensors For many applications, miniaturization of ultrasonic sensors is desired. In sensors with ultrasonic transducers, which include a piezoceramic disk and a matching layer connected to it, miniaturization is limited. In medical imaging applications, where ultrasonic waves are transmitted between a sensor head and the human body by means of a gel, it is known to form the sensor head with one or two-dimensional array-like arranged transducer elements. By controlling the transducer elements with defined variable relative phase positions propagation properties such as the propagation direction or the focal range of the ultrasonic waves can be influenced.
  • DE-Al-10 2005 051604 proposes a method for Producing a polymer-based capacitive ultrasonic transducer before. It essentially comprises the following steps:
  • the substrate made of silicon, the conductors of sputtered copper or platinum, the sacrificial layers of Metal and the polymer-based material to be made of a photoresist.
  • the openings introduced from the front side into the polymer-based material are closed in a further method step by spin-coating with a further layer of the polymer-based material.
  • the substrate may comprise a plate covered by a patternable layer, such as a photoresist or a protective layer, such as the blue protective film used with silicon wafers.
  • a patternable layer such as a photoresist or a protective layer, such as the blue protective film used with silicon wafers.
  • structures such as channels or round holes can be formed by known methods which are then filled with a liquid such as an optical oil.
  • the used materials of the structured layer and the liquid lead due to the surface tension to a characteristic curvature of the liquid surface.
  • the liquid is preferably selected so that it is repelled or does not adhere to the structured layer.
  • substrate and liquid are coated with parylene in a low-pressure gas deposition process at about 7 Pa chamber pressure, wherein the substrate and the liquid can be kept at ambient or room temperature.
  • di-para-xylenes is pyrolyzed, then polymerized at 600 ° and at room temperature on the substrate or the
  • EP-Al-1672394 discloses the possibility of producing a channel with piezoelectric or capacitive actuators produced according to the described method equip. These actuators comprise rectangular electrodes or piezoelectric regions arranged along the channel on the membrane-like sheath and / or on the substrate plate. A staggered periodic activation of these actuators can trigger peristaltic contractions of the envelope for transporting liquids in the channel.
  • cylindrical recesses are formed in a layer, which are then filled with liquid and covered with a membrane.
  • the liquid is left in the cavities between the membrane and the structured layer, resulting in microlenses.
  • transparent heating resistors By means of transparent heating resistors, the temperature of the liquid can be changed. Due to the associated relatively slow volume change, the focal lengths of the microlenses can be changed.
  • acoustic transducers with one or more membranes can be produced simply and inexpensively.
  • the membranes are made by depositing and / or depositing a plastic and / or other materials on a surface of a high viscosity liquid or gel and the adjacent surface of a substrate.
  • parylene is used to make the membranes.
  • this may be inert and / or mechanically stable and / or optically transparent and / or biocompatible.
  • means for exciting and / or detecting vibrations or deformations or mechanical stresses of the membrane or parts of such agents can be applied to the membrane.
  • Such means are, for example, planar electrodes of capacitors, metallizations acting as optical mirrors, gratings or the like, multilayer systems such as DFB structures, piezoelectric or piezoresistive structures. If required, these detection and / or stimulation means can be isolated and protected from the environment by a further plastic or parylene layer.
  • the substrate is preferably plate-like and may comprise one or more layers.
  • the uppermost layer of the substrate is prepared by known methods such as anisotropic etching, laser processing, mechanical processing or embossing process structured.
  • cavities or depressions with different dimensions, shapes and surface textures can be formed. These depressions can then be filled with the liquid, on the surface of which the plastic deposit should take place.
  • means for exciting and / or detecting for example, by means of coating and / or structuring techniques
  • Membrane vibrations and / or deformations or parts of such agents are applied to the substrate or formed on this.
  • Such means are, for example, planar electrodes, which together with such electrodes on the associated membranes form capacitors whose capacitances are variable depending on the membrane deflections.
  • the substrate comprises a semiconductor plate or layer
  • any sensor elements and / or actuator elements for detecting vibrations or deflections of the membrane can be arranged, so for example, the aforementioned electrodes or light emitting or laser diodes and Photodiodes which detect light emitted by the light-emitting diodes and reflected at the mirror-finished membrane.
  • Such sensor and / or actuator elements can eg for control and / or control tasks (closed loop Feedback).
  • the use of a substrate with a semiconductor layer also has the advantage that even very low signal levels can be detected and amplified largely without interference immediately after the respective sensor element.
  • the electronics for driving and / or evaluating the actuator elements and / or sensor elements can thus be arranged to save space on the substrate. In particular, in more complex arrangements with multiple arranged to a one- or two-dimensional array
  • Membranes which are to be excited and / or coordinated synchronously or coordinated, a driving and / or evaluation electronics integrated in the substrate is very advantageous.
  • the deposition technique used for membrane fabrication does not require high temperatures and is compatible with the semiconductor structures used.
  • the substrate may comprise one or more layers of any other materials and with the same or different layer thicknesses, such as glass, ceramic, metal, semiconductors or plastics. Such layers may be polycrystalline, amorphous, organic or inorganic, for example.
  • the means on the membrane and / or the substrate for detecting and / or generating deflections or vibrations of the membrane are each connected via insulated tracks to a controller and / or connected via a suitable interface with such a controller.
  • the liquid used for producing the membrane on the substrate can be left in the cavity or can be removed from the cavity via one or more openings in the substrate from the rear side or laterally.
  • a plurality of openings are formed in each cavity, which are sealed during the manufacturing process by a film or pin on the back of the substrate.
  • gas can thus flow into the cavity through at least one of these openings.
  • the liquid can also be drained from the cavity through openings, such as pores in the deposited or applied membrane, sucked off or removed in any other way.
  • a porous membrane can subsequently be further coated or post-treated, so that the pores close.
  • Figure 1 shows an embodiment of a capacitive
  • FIG. 2 shows a cross section of a first embodiment of an ultrasound transducer with a two-layered substrate
  • FIG. 3 shows a semiconductor substrate layer for a capacitive ultrasonic transducer with integrated electronics and with a plurality of electrodes for transducer elements arranged along a line
  • FIG. 4 shows a cross section of an ultrasonic transducer in a further embodiment
  • FIG. 5 shows a cross section of a further transducer with a single-layered substrate
  • FIG. 6 shows a cross-section of a transducer of an annular rib structure for supporting the membrane and / or for increasing the sensitivity or the efficiency.
  • FIG. 1 shows a cross section through a capacitive micromechanically produced ultrasonic transducer 1, as is known from DE-Al-10 2005 051604.
  • a first planar conductor region 5a is applied on a substrate 3 made of silicon.
  • a cavity 9 is excluded which has been formed by etching away a sacrificial layer (not shown) previously applied to the conductor region 5a and laterally overlapping it. For etching away the sacrificial layer, passage openings through the first polymer layer 7 have to be exposed.
  • FIG. 2 shows a cross section of a first embodiment of a capacitive ultrasonic transducer 1 that can be produced according to the invention.
  • a substrate 3 comprises a composite of a planar first substrate layer 3a or plate, which can be made, for example, from an electrically insulating plastic or an electrically conductive metal or a semiconductor and a thickness sl of, for example, about 1 mm, and a planar second substrate layer 3b or plate, which may be made, for example, from an oleophobic plastic such as polyethylene, PVC or Teflon and has a thickness s2 of, for example, about 0.1 mm.
  • the second substrate layer 3b one or more depressions or recesses 4 produced by known structuring methods, such as anisotropic etching, are formed. These may, for example, have a circular cross section with a diameter d 1 of, for example, 2 mm.
  • the cross section of the recesses 4 could also have a different shape, for example elliptical or polygonal, in particular square, rectangular or hexagonal.
  • the layer thicknesses sl 'and s2 of the substrate layers 3a, 3b and the dimensions of the recesses 4 can be set within a wide range.
  • the first substrate layer 3a may be formed, for example, as a thin, flexible plastic film or as a solid metal, glass or ceramic body. Accordingly, layer thicknesses sl in the range of preferably about 0.1mm to about 10mm or more may be provided. Capacitive ultrasonic transducer 1 with one or more too
  • Vibrations of excitable membranes 2 preferably have a low thickness s 2 of the second substrate layer 3 b or the depth of the recesses 4 or of the structures in the second substrate layer 3 b.
  • the thickness s2 of the second substrate layer s2 be significantly greater. Accordingly, layer thicknesses s2 can be provided in the range from about 0.05 mm to about 5 mm or more.
  • layer thicknesses s2 can be provided in the range from about 0.05 mm to about 5 mm or more.
  • the membrane areas of the individual transducer elements can be very small;
  • acoustic transducers which are intended to generate sound signals with relatively high sound levels in the audible range preferably comprise a single transducer element with one relatively large membrane area.
  • the membrane surfaces covering the recesses 4 may be of the order of about 0.001 mm 2 to about 1000 mm 2 or more.
  • the material of the second substrate layer 3b is preferably completely removed in the region of the recesses 4, so that the upper side of the first substrate layer 3b or a metallization applied to the first substrate layer 3a at least in the region of the recesses 4 (henceforth called the first conductor region 5a) is exposed there ,
  • the first conductor region 5a could also be formed on the surface of the second substrate layer 3b facing the first substrate layer 3a or within the second substrate layer 3b.
  • the first conductor region 5 a can be produced, for example, in the case of insulators or semiconductors by vapor deposition of the first substrate layer 3 a with a thin metal layer of, for example, 0.05 mm, wherein the regions which are not to be metallized are masked in a conventional manner by means of a photoresist layer.
  • electrically conductive first substrate layers 3a these can be used directly as first conductor regions 5a.
  • electrically conductive first substrate layers 3a can be covered with a thin insulator layer on which the first conductor region 5a is then applied.
  • the first conductor region 5a in addition to the planar electrodes in the region of the recesses 4, also comprises electrical connection lines 6a to a connection interface (eg connection plug or cable) and / or to an electronic control 8 (FIG. 3) for exciting and / or evaluating membrane oscillations or deformations.
  • the controller 8 or parts thereof can be arranged directly on the substrate 3 or alternatively outside the converter.
  • FIG. 3 schematically shows a first substrate layer 3 a made of silicon for an ultrasonic transducer 1 comprising five transducer elements, the electrodes or first conductor regions 5 a being connected via connecting lines 6 a to the controller 8 integrated in the substrate layer 3 a.
  • the second substrate layer 3b and the recess 4 are covered by a homogeneous polymer layer 11, preferably a parylene layer, such that each of the recesses 4 is covered or covered by a membrane 2 delimiting a cavity 9.
  • a second conductor region 5b with planar electrodes in the region of the membranes 2 and with connecting lines 6b is formed on the second substrate layer 3b. If required, these can be connected, for example via plated-through holes 6c, with parts of the first conductor region 5a and / or with a possible controller 8 or a connection interface.
  • the second substrate layer 3b and the second conductor region 5b may be covered by a further polymer layer 11-preferably a further parylene layer-which acts as an electrical insulator and protect against mechanical and / or chemical environmental influences.
  • a further polymer layer 11-preferably a further parylene layer-which acts as an electrical insulator and protect against mechanical and / or chemical environmental influences Such an arrangement is shown in FIG.
  • one or more channels 10 are formed, which open into the cavity 9 and allow a connection of the cavity 9 with the environment.
  • the Channels In the embodiment of the transducer according to FIG. 2, the channels 10 penetrate the first substrate layer 3a and the electrodes on this first substrate layer 3a.
  • the channels 10 may be formed in the first substrate layer 3a before or after the application of the first conductor region 5a, for example by mechanical, micromechanical or chemical processing.
  • the production of the channels 10 can take place before or after the connection of the two substrate layers 3a, 3b.
  • the channels 10 can be sealed, for example by applying a self-adhesive plastic film (not shown) on the underside of the first substrate layer 3a sealing.
  • the channels 10 are preferably arranged in the peripheral region of the cavities 9 or of the electrodes located there. There are the vibration amplitudes of the respective recess 4 covering membrane 2 and thus interference in capacitive excitation / evaluation of membrane vibrations minimal.
  • the recesses 4 are filled with a liquid.
  • the outwardly limited channels 10 are filled with the liquid.
  • the volume of liquid that can be received by the channels 10 is generally small compared to the volume of liquid that can be received by the recesses 4. At least the channel widths are small in comparison to the corresponding dimensions of the recesses 4.
  • the polymer deposition is carried out analogously to the process described in EP-Al-1672394.
  • the membranes 2 are formed, which cover the recesses 4 or cavities 9.
  • the pins or the film which seals off the channels 10 are removed and the liquid is discharged from the cavity 9. This process can e.g. by movements of the substrate 3 (in particular by spinning), by suction,
  • channels 10 may also be provided, for example, as grooves or trenches in the surface of the first surface facing cavity 9 Substrate layer 3a and / or be formed in one of the surfaces of the second substrate layer 3b, as shown in Figure 4. Such channels 10 formed on the surface of one of the substrate layers 3a, 3b protrude laterally beyond the cavity 9 or the one for the
  • the channels 10 may be e.g. by means of
  • Transducer elements or membranes 2 are then to separate these transducers by separation processes, and then to separate these transducers by separation processes, allows a cost-effective production of such transducers.
  • acoustic transducers can also be produced with a plurality of substrate layers 3a, 3b or with only one substrate layer 3a.
  • a possible embodiment is shown in FIG.
  • the surface of the substrate layer 3a is first structured with recesses 4 or depressions.
  • the substrate layer 3a is metallized with a first conductor region 5a, wherein a planar electrode is formed at the bottom of the recess 4 and connected by means of over the edges of the recess 4 protruding connecting lines 6a with an interface and / or optionally with an electronics 8.
  • the side surfaces of the recess 4 may be angled in a cone or pyramid (not shown), so that a proper electrical connection between the electrode in the recess and the connecting lines 6a is ensured.
  • the wells are analogous to the method described for two-layer substrates 3 with filled with a liquid, coated with a polymer layer 7 and provided with a second conductor portion 5b.
  • the materials for the substrate 3 and the liquid are preferably chosen so that the adjacent to the side edges of the substrate
  • the liquid surface and thus the membrane formed thereon 2 has no or only a slight curvature.
  • the liquid can be removed from the cavity 9 via channels 10 or left in the cavity 9, for example in ultrasonic transducer arrays for medical diagnostics or applications in liquids.
  • the recesses 4 or depressions can comprise pillars, webs or other structures for supporting the membrane 2 and / or for locally reducing the distance between the membrane 2 and the substrate 3, ie island-like or contiguous regions which are from below are in contact with the membrane 2 or have only a small distance from the membrane 2 and are not firmly connected to the membrane 2.
  • Such structures may include metallizations which are connected to or belong to the first conductor region 5a.
  • Figure 6 shows an example of such a transducer having structures in the form of concentric rings. These are during the deposition of the polymer layer 7 covered with liquid, so that no adhesive bond is formed between the polymer layer 7 and the protruding on the substrate 3 rings.
  • the capacitance of the dielectric comprising the polymer layer 7 through the two conductor regions 5a and 5b and the interposed therebetween is relatively large due to the short distance between the membrane 2 and the structures.
  • the conductor regions 5a, 5b can be charged by applying electrical voltages. Depending on the relative polarity of the charges on the two opposing electrodes, the membrane 2 bulges outwards or inwards and is thereby mechanically tensioned.
  • the acoustic transducer By driving with an AC signal, the acoustic transducer can be used as a sound generator for generating sound waves or ultrasonic waves. If the capacitance of the transducer is connected to a reinforcing evaluation electronics (this is usually part of the electronic control 8), it can be used as a microphone, wherein incident on the transducer sound waves lead to corresponding vibrations of the membrane 2, which then detects as a capacitance change can be. Alternatively, other physical principles may be used to excite and / or detect vibrations or static pressures.
  • a piezoelectric layer for example PVDF
  • piezoresistive structures are preferably formed in the transition region between the recess 4 and the substrate 2 carrying the membrane 2 on the membrane 2, with which membrane vibrations or deflections can be detected as resistance or change in resistance.
  • a light-emitting diode or a laser diode and a photodiode or a CCD line or corresponding other optical elements are formed on the substrate 3 below the metallized and thus reflective membrane 2. The light emitted by the light source is reflected differently at the reflecting membrane 2 as a function of its deflection or oscillation behavior. This can be detected and evaluated with the optical detectors.
  • acoustic transducers for example, microphone / loudspeaker combinations, mobile telephones, earphones with integrated microphone, hearing aids.
  • acoustic transducers can be produced with the method according to the invention, but also a multiplicity of other sensors which operate on different physical principles and make use of the advantages of a mechanically stable, chemically resistant membrane 2.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Acoustics & Sound (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Biomedical Technology (AREA)
  • Biophysics (AREA)
  • Medical Informatics (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Mechanical Engineering (AREA)
  • Gynecology & Obstetrics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • Transducers For Ultrasonic Waves (AREA)

Abstract

La présente invention concerne un convertisseur acoustique comprenant une ou plusieurs membranes (2) recouvrant des cavités (9) présentes sur un substrat (3), et présentant une couche polymère (7) d'épaisseur homogène produite par dépôt en phase vapeur. Dans la zone des cavités (9) a lieu sur la surface un dépôt en phase vapeur d'un liquide qui peut ensuite être retiré des cavités (9) par des canaux (10).
EP08748345A 2007-05-07 2008-05-02 Convertisseur acoustique Withdrawn EP2145505A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH7392007 2007-05-07
PCT/CH2008/000203 WO2008134909A1 (fr) 2007-05-07 2008-05-02 Convertisseur acoustique

Publications (1)

Publication Number Publication Date
EP2145505A1 true EP2145505A1 (fr) 2010-01-20

Family

ID=39671901

Family Applications (1)

Application Number Title Priority Date Filing Date
EP08748345A Withdrawn EP2145505A1 (fr) 2007-05-07 2008-05-02 Convertisseur acoustique

Country Status (3)

Country Link
US (1) US20110026367A1 (fr)
EP (1) EP2145505A1 (fr)
WO (1) WO2008134909A1 (fr)

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JP5578810B2 (ja) * 2009-06-19 2014-08-27 キヤノン株式会社 静電容量型の電気機械変換装置
JP5875243B2 (ja) * 2011-04-06 2016-03-02 キヤノン株式会社 電気機械変換装置及びその作製方法
US9181086B1 (en) 2012-10-01 2015-11-10 The Research Foundation For The State University Of New York Hinged MEMS diaphragm and method of manufacture therof
US20150377837A1 (en) * 2013-02-22 2015-12-31 The Board Of Trustees Of The Leland Stanford Junior University Ultrasonic sensor for object and movement detection
AU2014293274B2 (en) * 2013-07-23 2018-11-01 Butterfly Network, Inc. Interconnectable ultrasound transducer probes and related methods and apparatus
WO2015171224A1 (fr) * 2014-05-09 2015-11-12 Chirp Microsystems, Inc. Transducteur à ultrasons micro-usiné utilisant de multiples matériaux piézoélectriques
DE102015101425B4 (de) * 2014-10-31 2018-02-01 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Verfahren zur Herstellung eines Bauelements auf Basis eines strukturierbaren Substrats mit dreidimensionaler, Poren im nm-Bereich aufweisender Membranstruktur
US10616690B2 (en) * 2016-08-22 2020-04-07 Goertek Inc. Capacitive MEMS microphone and electronic apparatus
PL3502105T3 (pl) * 2016-09-29 2022-07-11 Equinox Sciences, Llc. Postać polimorficzna związku stanowiącego inhibitor kinazy, zawierająca ją kompozycja farmaceutyczna oraz sposób jej wytwarzania i jej zastosowanie
SG11201903872SA (en) 2016-10-31 2019-05-30 Thales Australia Ltd Acoustic transducer
CN108871389B (zh) * 2018-05-10 2020-03-31 京东方科技集团股份有限公司 超声波传感单元及制作方法、超声波传感器及显示装置
FR3090421B1 (fr) * 2018-12-23 2020-12-25 Commissariat Energie Atomique Transducteur ultrasonore à membrane vibrante à effet capacitif à large bande passante

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US7589456B2 (en) * 2005-06-14 2009-09-15 Siemens Medical Solutions Usa, Inc. Digital capacitive membrane transducer

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Also Published As

Publication number Publication date
WO2008134909A1 (fr) 2008-11-13
US20110026367A1 (en) 2011-02-03

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