EP1057859A3 - Strahlungsempfindliche Harzzusammensetzung und deren Verwendung in einem interlaminaren Isolierfilm - Google Patents

Strahlungsempfindliche Harzzusammensetzung und deren Verwendung in einem interlaminaren Isolierfilm Download PDF

Info

Publication number: EP1057859A3
Authority: EP; European Patent Office
Prior art keywords: resin composition; sensitive resin; radiation sensitive; insulating film; interlaminar insulating
Prior art date: 1999-06-04
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

EP00111681A

Other languages

English (en)

French (fr)

Other versions

EP1057859A2 (de

EP1057859B1 (de

Inventor

Isao c/o JSR Corporation Nishimura

Masayoshi c/o JSR Corporation Suzuki

Fumiko c/o JSR Corporation Yonezawa

Masayuki c/o JSR Corporation Endo

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

JSR Corp

Original Assignee

JSR Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1999-06-04

Filing date

2000-05-31

Publication date

2000-12-20

2000-05-31 Application filed by JSR Corp filed Critical JSR Corp

2000-12-06 Publication of EP1057859A2 publication Critical patent/EP1057859A2/de

2000-12-20 Publication of EP1057859A3 publication Critical patent/EP1057859A3/de

2004-05-19 Application granted granted Critical

2004-05-19 Publication of EP1057859B1 publication Critical patent/EP1057859B1/de

2020-05-31 Anticipated expiration legal-status Critical

Status Expired - Lifetime legal-status Critical Current

Classifications

- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0755—Non-macromolecular compounds containing Si-O, Si-C or Si-N bonds
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
- C08K5/28—Azides
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides

Landscapes

Physics & Mathematics (AREA)
Spectroscopy & Molecular Physics (AREA)
General Physics & Mathematics (AREA)
Chemical & Material Sciences (AREA)
Medicinal Chemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Health & Medical Sciences (AREA)
Polymers & Plastics (AREA)
Organic Chemistry (AREA)
Materials For Photolithography (AREA)
Magnetic Heads (AREA)
Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Compositions Of Macromolecular Compounds (AREA)

EP00111681A 1999-06-04 2000-05-31 Strahlungsempfindliche Harzzusammensetzung und deren Verwendung in einem interlaminaren Isolierfilm Expired - Lifetime EP1057859B1 (de)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
JP15746399		1999-06-04
JP11157463A JP2000347397A (ja)	1999-06-04	1999-06-04	感放射線性樹脂組成物およびその層間絶縁膜への使用

Publications (3)

Publication Number	Publication Date
EP1057859A2 EP1057859A2 (de)	2000-12-06
EP1057859A3 true EP1057859A3 (de)	2000-12-20
EP1057859B1 EP1057859B1 (de)	2004-05-19

Family

ID=15650226

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
EP00111681A Expired - Lifetime EP1057859B1 (de)	1999-06-04	2000-05-31	Strahlungsempfindliche Harzzusammensetzung und deren Verwendung in einem interlaminaren Isolierfilm

Country Status (6)

Country	Link
US (1)	US6399267B1 (de)
EP (1)	EP1057859B1 (de)
JP (1)	JP2000347397A (de)
KR (1)	KR100663818B1 (de)
DE (1)	DE60010797T2 (de)
TW (1)	TW593488B (de)

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US7108954B2 (en) *	2000-12-11	2006-09-19	Jsr Corporation	Radiation-sensitive composition changing in refractive index and method of changing refractive index
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US7125647B2 (en) *	2001-03-13	2006-10-24	Jsr Corporation	Radiation-sensitive composition changing in refractive index and utilization thereof
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JP4524944B2 (ja) *	2001-03-28	2010-08-18	Ｊｓｒ株式会社	感放射線性樹脂組成物、その層間絶縁膜およびマイクロレンズの形成への使用、ならびに層間絶縁膜およびマイクロレンズ
JP4631081B2 (ja) *	2001-07-16	2011-02-16	ナガセケムテックス株式会社	ポジ型感放射線性樹脂組成物
JP2003043682A (ja)	2001-08-01	2003-02-13	Jsr Corp	感放射線性誘電率変化性組成物、誘電率変化法
KR100784672B1 (ko) *	2001-08-20	2007-12-12	주식회사 동진쎄미켐	감광성 수지 조성물
KR100809544B1 (ko) *	2001-10-24	2008-03-04	주식회사 동진쎄미켐	퀴논디아지드 술폰산 에스테르 화합물을 포함하는 감광성수지조성물
CN100468195C (zh) *	2002-04-18	2009-03-11	日产化学工业株式会社	正型感光性树脂组合物及图案形成方法
KR20040092550A (ko) *	2003-04-24	2004-11-04	클라리언트 인터내셔널 리미티드	레지스트 조성물 및 레지스트 제거용 유기용제
JP4099114B2 (ja) *	2003-06-26	2008-06-11	Ａｚエレクトロニックマテリアルズ株式会社	感光性樹脂組成物
CN100535747C (zh) *	2003-07-16	2009-09-02	Az电子材料（日本）株式会社	光敏树脂组合物
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CN1898605B (zh) *	2004-04-08	2010-08-18	Jsr株式会社	辐射敏感性树脂组合物、层间绝缘膜和微透镜以及它们的制备方法
TWI386714B (zh) *	2004-05-06	2013-02-21	Dongjin Semichem Co Ltd	Ｔｆｔ-ｌｃｄ用層間有機絕緣膜、ｔｆｔ-ｌｃｄ用層間有機絕緣膜用丙烯酸系共聚合體樹脂及其製造方法
KR20050113351A (ko) *	2004-05-27	2005-12-02	주식회사 동진쎄미켐	감광성 수지 조성물
KR101206780B1 (ko) *	2005-03-03	2012-11-30	주식회사 동진쎄미켐	감광성 수지 조성물
KR101326595B1 (ko) *	2005-06-04	2013-11-20	주식회사 동진쎄미켐	감광성 수지 조성물, 이를 이용한 박막 트랜지스터 기판의 제조방법 및 공통 전극 기판의 제조방법
US7799509B2 (en) *	2005-06-04	2010-09-21	Samsung Electronics Co., Ltd.	Photosensitive resin composition, method of manufacturing a thin-film transistor substrate, and method of manufacturing a common electrode substrate using the same
JP4934353B2 (ja) *	2005-06-10	2012-05-16	ドンジンセミケムカンパニーリミテッド	ネガティブ感光性樹脂組成物
KR100696195B1 (ko)	2005-09-13	2007-03-20	한국전자통신연구원	저온 경화형 고분자 게이트 절연막 및 이를 적용한 유기박막 트랜지스터
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KR101330345B1 (ko)	2006-04-25	2013-11-15	코오롱인더스트리 주식회사	절연막 형성용 조성물
KR100867948B1 (ko) *	2006-12-13	2008-11-11	제일모직주식회사	유기 절연막 형성용 감광성 수지 조성물 및 이를 포함하는소자
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GB2054617A (en) *	1979-07-16	1981-02-18	Mitsubishi Rayon Co	Radiation sensitive resins comprising 2-alkylglycidyl methacrylate homopolymer or copolymer
JPH08262709A (ja) *	1995-03-24	1996-10-11	Japan Synthetic Rubber Co Ltd	感放射線性樹脂組成物
EP0845708A1 (de) *	1996-06-17	1998-06-03	Toray Industries, Inc.	Trocken flachdruckplatte
JPH1152560A (ja) *	1997-08-06	1999-02-26	Jsr Corp	感放射線性樹脂組成物

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1999
- 1999-06-04 JP JP11157463A patent/JP2000347397A/ja not_active Withdrawn
2000
- 2000-05-31 DE DE60010797T patent/DE60010797T2/de not_active Expired - Lifetime
- 2000-05-31 EP EP00111681A patent/EP1057859B1/de not_active Expired - Lifetime
- 2000-06-01 US US09/584,776 patent/US6399267B1/en not_active Expired - Lifetime
- 2000-06-03 KR KR1020000030565A patent/KR100663818B1/ko not_active IP Right Cessation
- 2000-06-03 TW TW089110893A patent/TW593488B/zh not_active IP Right Cessation

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PATENT ABSTRACTS OF JAPAN vol. 1999, no. 05 31 May 1999 (1999-05-31) *

Also Published As

Publication number	Publication date
EP1057859A2 (de)	2000-12-06
JP2000347397A (ja)	2000-12-15
DE60010797D1 (de)	2004-06-24
KR100663818B1 (ko)	2007-01-03
DE60010797T2 (de)	2005-06-02
EP1057859B1 (de)	2004-05-19
TW593488B (en)	2004-06-21
US6399267B1 (en)	2002-06-04
KR20010007222A (ko)	2001-01-26

Publication	Publication Date	Title
EP1057859A3 (de)	2000-12-20	Strahlungsempfindliche Harzzusammensetzung und deren Verwendung in einem interlaminaren Isolierfilm
KR100268697B1 (en)	2000-10-16	Epoxy group-containing resin composition
EP1624027A4 (de)	2006-09-06	Härtende zusammensetzung
CA2117382A1 (en)	1993-08-05	Aqueous Adhesive Compositions Containing Stabilized Phenolic Resins
JP2002540245A5 (de)	2006-05-18
EP1122604A3 (de)	2003-07-16	Chemisch verstärkte Positivresistzusammensetzung
DK0435200T3 (da)	1995-11-20	Estrogenholdigt gelpræparat
WO2008117619A1 (ja)	2008-10-02	感光性絶縁樹脂組成物
TW200801800A (en)	2008-01-01	Photosensitive resin composition
DE60030113D1 (de)	2006-09-28	Vinyläther in ungesättigten polyesterharzen, vinylester und vinylesterurethane für konstruktionsteile
JPS646943A (en)	1989-01-11	Heat resistant photosensitive resin composition
ATE65256T1 (de)	1991-08-15	Haftkleber.
CA2354826A1 (en)	2002-02-21	Low temperature curing powder coating for producing reduced gloss, weatherable coatings
JPS5798521A (en)	1982-06-18	Photo-curable composition
JP2003192750A5 (de)	2005-04-07
TW200510932A (en)	2005-03-16	Radiation-sensitive resin composition, interlayer insulating film, microlens and their manufacturing method
ATE242280T1 (de)	2003-06-15	Füllstoffzusammensetzung
JPS5414440A (en)	1979-02-02	Adhesive composition
JPS5476636A (en)	1979-06-19	Hydrophilic pressure-sensitive adhesive composition
JPS55121435A (en)	1980-09-18	Heat resistant photoresist composition and manufacture thereof
JPS5462238A (en)	1979-05-19	Detackifier for adhesive film
JPS5670077A (en)	1981-06-11	Water-soluble pressure-sensitive adhesive
EP0953587A3 (de)	2000-01-26	Beschichtungszusammensetzung mit halogenfreiem Oniumsalz
TW200728333A (en)	2007-08-01	Side-chain unsaturated polymers, radiation-sensitive resin composition and spacer for liquid crystal display device
JPS5647032A (en)	1981-04-28	Resin composition for resist and its using method

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