DK2867743T3 - Serverhukommelse-køleapparat - Google Patents
Serverhukommelse-køleapparat Download PDFInfo
- Publication number
- DK2867743T3 DK2867743T3 DK13802097.9T DK13802097T DK2867743T3 DK 2867743 T3 DK2867743 T3 DK 2867743T3 DK 13802097 T DK13802097 T DK 13802097T DK 2867743 T3 DK2867743 T3 DK 2867743T3
- Authority
- DK
- Denmark
- Prior art keywords
- cooling apparatus
- server memory
- server
- memory
- cooling
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20709—Modifications to facilitate cooling, ventilating, or heating for server racks or cabinets; for data centers, e.g. 19-inch computer racks
- H05K7/20763—Liquid cooling without phase change
- H05K7/20772—Liquid cooling without phase change within server blades for removing heat from heat source
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Human Computer Interaction (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US13/538,162 US9158348B2 (en) | 2012-06-29 | 2012-06-29 | Server memory cooling apparatus |
| PCT/IB2013/002453 WO2014013346A2 (en) | 2012-06-29 | 2013-06-20 | Server memory cooling apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| DK2867743T3 true DK2867743T3 (da) | 2019-05-27 |
Family
ID=49725159
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DK13802097.9T DK2867743T3 (da) | 2012-06-29 | 2013-06-20 | Serverhukommelse-køleapparat |
Country Status (8)
| Country | Link |
|---|---|
| US (3) | US9158348B2 (da) |
| EP (1) | EP2867743B1 (da) |
| CN (1) | CN104541226B (da) |
| DK (1) | DK2867743T3 (da) |
| ES (1) | ES2728173T3 (da) |
| HK (1) | HK1209502A1 (da) |
| PL (1) | PL2867743T3 (da) |
| WO (1) | WO2014013346A2 (da) |
Families Citing this family (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ITVI20130273A1 (it) * | 2013-11-14 | 2015-05-15 | Eurotech S P A | Scheda elettronica per supercalcolo refrigerata e procedimento per produrla |
| US9721870B2 (en) | 2014-12-05 | 2017-08-01 | International Business Machines Corporation | Cooling structure for electronic boards |
| CN107209538B (zh) * | 2015-03-24 | 2021-08-27 | 慧与发展有限责任合伙企业 | 用于液体冷却的系统 |
| FR3041485B1 (fr) | 2015-09-21 | 2017-10-13 | Commissariat Energie Atomique | Batterie metal/oxygene |
| US10383261B2 (en) * | 2015-10-20 | 2019-08-13 | Ge Global Sourcing Llc | Heat transfer chassis and method for forming the same |
| US10021811B2 (en) | 2016-05-24 | 2018-07-10 | Asetek Danmark A/S | Single ended cooling module rows and assemblies for thermal management of in-line memory modules |
| USD800675S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Set of cooling plate rows for in-line memory |
| USD800674S1 (en) | 2016-05-24 | 2017-10-24 | Asetek Danmark A/S | Cooling plate row for in-line memory |
| CN106376219B (zh) * | 2016-09-26 | 2017-09-29 | 郑州航空工业管理学院 | 用于大数据一体机的散热装置 |
| US10520259B2 (en) | 2017-08-17 | 2019-12-31 | Hewlett Packard Enterprise Development Lp | Memory module cooler with rotatable cooling tube |
| US10462932B2 (en) | 2017-11-01 | 2019-10-29 | Hewlett Packard Enterprise Development Lp | Memory module cooler with vapor chamber device connected to heat pipes |
| GB2576030B (en) | 2018-08-02 | 2021-12-29 | Provost Fellows Found Scholars & Other Members Board College Holy & Und | Liquid-based heat exchanger |
| US10582645B1 (en) | 2018-09-28 | 2020-03-03 | Hewlett Packard Enterprise Development Lp | Cooling apparatus for electronic components |
| US10499488B1 (en) * | 2018-10-19 | 2019-12-03 | Hewlett Packard Enterprise Development Lp | Liquid-cooled integrated circuit system |
| US10874032B2 (en) | 2018-10-31 | 2020-12-22 | Hewlett Packard Enterprise Development Lp | Rotatable cold plate assembly for cooling pluggable modules |
| US10539753B1 (en) | 2018-10-31 | 2020-01-21 | Hewlett Packard Enterprise Development Lp | Liquid-cooled assembly |
| US10602640B1 (en) * | 2018-11-14 | 2020-03-24 | Hewlett Packard Enterprise Development Lp | Memory coolers |
| US10750639B2 (en) * | 2018-11-20 | 2020-08-18 | Hewlett Packard Enterprise Development Lp | Cooling memory modules |
| US10849223B2 (en) | 2019-03-06 | 2020-11-24 | Cisco Technology, Inc. | Multi-socket server assembly |
| US11206749B2 (en) | 2019-08-02 | 2021-12-21 | Micron Technology, Inc. | Tubular heat spreaders for memory modules and memory modules incorporating the same |
| US12063759B2 (en) * | 2020-07-13 | 2024-08-13 | Intel Corporation | Conformable cold plate for fluid cooling applications |
| CN114340297A (zh) | 2020-09-29 | 2022-04-12 | 台达电子工业股份有限公司 | 水冷装置及其集流器 |
| US11924996B2 (en) | 2020-09-30 | 2024-03-05 | Coolit Systems, Inc. | Liquid-cooling devices, and systems, to cool multi-chip modules |
| US20210127529A1 (en) * | 2020-12-02 | 2021-04-29 | Intel Corporation | Cold plate system interface for liquid cooled devices |
| US11497137B2 (en) | 2020-12-18 | 2022-11-08 | Hewlett Packard Enterprise Development Lp | Method and apparatus for extended serial temperature control in a compute device |
| CN112650374B (zh) * | 2020-12-21 | 2024-07-30 | 无锡卡兰尼普热管理技术有限公司 | 一种用于电子系统中存储器模块的冷却方法和模组 |
| US12144110B2 (en) * | 2020-12-24 | 2024-11-12 | Intel Corporation | Reduced vertical profile ejector for liquid cooled modules |
| US11523542B2 (en) * | 2021-04-07 | 2022-12-06 | Dell Products L.P. | Conformal memory heatsink |
| US11785743B2 (en) * | 2021-04-22 | 2023-10-10 | Hewlett Packard Enterprise Development Lp | Temperature control of closely packed electronic assemblies |
| US11877422B2 (en) * | 2021-08-11 | 2024-01-16 | Hewlett Packard Enterprise Development Lp | Memory cooler |
| US12108566B2 (en) * | 2022-03-21 | 2024-10-01 | Baidu Usa Llc | Server memory array cooling hardware |
| CN117525935B (zh) * | 2023-12-09 | 2024-09-20 | 深圳市万兆通光电技术有限公司 | 一种高速连接器液冷机构 |
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| US3524497A (en) * | 1968-04-04 | 1970-08-18 | Ibm | Heat transfer in a liquid cooling system |
| US6853554B2 (en) * | 2001-02-22 | 2005-02-08 | Hewlett-Packard Development Company, L.P. | Thermal connection layer |
| US6421240B1 (en) * | 2001-04-30 | 2002-07-16 | Hewlett-Packard Company | Cooling arrangement for high performance electronic components |
| US6496375B2 (en) * | 2001-04-30 | 2002-12-17 | Hewlett-Packard Company | Cooling arrangement for high density packaging of electronic components |
| US7209355B2 (en) | 2002-05-15 | 2007-04-24 | Matsushita Electric Industrial Co., Ltd. | Cooling device and an electronic apparatus including the same |
| US6667882B2 (en) * | 2002-05-15 | 2003-12-23 | Hewlett-Packard Development Company, L.P. | Cooling assembly for a heat producing assembly |
| US7286355B2 (en) * | 2002-09-11 | 2007-10-23 | Kioan Cheon | Cooling system for electronic devices |
| US6807056B2 (en) * | 2002-09-24 | 2004-10-19 | Hitachi, Ltd. | Electronic equipment |
| US7068507B2 (en) * | 2002-09-27 | 2006-06-27 | Rockwell Automation Technologies, Inc. | Compact liquid converter assembly |
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| US20040182544A1 (en) * | 2002-12-27 | 2004-09-23 | Lee Hsieh Kun | Cooling device utilizing liquid coolant |
| DK200301577A (da) * | 2003-10-27 | 2005-04-28 | Danfoss Silicon Power Gmbh | Flowfordelingsenhed og köleenhed |
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| DE102005025381A1 (de) * | 2005-05-31 | 2006-12-07 | Behr Industry Gmbh & Co. Kg | Vorrichtung zur Kühlung von elekronischen Bauelementen |
| US7312987B1 (en) * | 2005-12-09 | 2007-12-25 | Storage Technology Corporation | Adaptable thin plate modular heat exchanger blade for cooling electronic equipment |
| US20080007915A1 (en) | 2006-07-06 | 2008-01-10 | Chao-Chuan Chen | Heat sink device for a heat generating element |
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| US20090323286A1 (en) * | 2008-06-13 | 2009-12-31 | Evga Corporation | Apparatus for removing heat from pc circuit board devices such as graphics cards and the like |
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| US7965509B2 (en) * | 2009-04-06 | 2011-06-21 | International Business Machines Corporation | High performance dual-in-line memory (DIMM) array liquid cooling assembly and method |
| DE112009004714B4 (de) * | 2009-04-29 | 2018-11-08 | Hewlett Packard Enterprise Development Lp | Kühlanordnung für gedruckte schaltungsplatinen |
| US7978472B2 (en) * | 2009-06-10 | 2011-07-12 | International Business Machines Corporation | Liquid-cooled cooling apparatus, electronics rack and methods of fabrication thereof |
| CN101715283A (zh) * | 2009-08-27 | 2010-05-26 | 李建权 | 散热装置 |
| US8027162B2 (en) * | 2009-09-24 | 2011-09-27 | International Business Machines Corporation | Liquid-cooled electronics apparatus and methods of fabrication |
| WO2011053307A1 (en) | 2009-10-30 | 2011-05-05 | Hewlett-Packard Development Company, L.P. | A cold plate having blades that interleave with memory modules |
| WO2011053311A1 (en) | 2009-10-30 | 2011-05-05 | Hewlett-Packard Development Company, L.P. | A frame having frame blades that participate in cooling memory modules |
| US8125780B2 (en) | 2009-12-22 | 2012-02-28 | International Business Machines Corporation | In-line memory module cooling system |
| US7969736B1 (en) * | 2010-02-08 | 2011-06-28 | International Business Machines Corporation | System for cooling memory modules |
| CN102782837B (zh) * | 2010-03-08 | 2015-08-12 | 国际商业机器公司 | 液态双列直插存储模块冷却设备 |
| US8385069B2 (en) * | 2010-05-24 | 2013-02-26 | International Business Machines Corporation | Liquid coolant conduit secured in an unused socket for memory module cooling |
| US8385067B2 (en) * | 2010-11-11 | 2013-02-26 | International Business Machines Corporation | In-line memory and circuit board cooling system |
| CN102469748A (zh) * | 2010-11-12 | 2012-05-23 | 奇鋐科技股份有限公司 | 水冷装置的流道结构改良 |
| US20120152500A1 (en) * | 2010-12-21 | 2012-06-21 | Pai-Ling Kao | Flow passage structure for water-cooling device |
| US20120261095A1 (en) | 2011-04-12 | 2012-10-18 | Asia Vital Components Co., Ltd. | Thermal module structure and manufacturing method thereof |
| US8493738B2 (en) * | 2011-05-06 | 2013-07-23 | International Business Machines Corporation | Cooled electronic system with thermal spreaders coupling electronics cards to cold rails |
| US8638559B2 (en) * | 2011-11-10 | 2014-01-28 | International Business Machines Corporation | User-serviceable liquid DIMM cooling system |
| US8587943B2 (en) * | 2011-11-28 | 2013-11-19 | International Business Machines Corporation | Liquid-cooling memory modules with liquid flow pipes between memory module sockets |
| CN102419623B (zh) * | 2011-11-30 | 2014-03-26 | 华为技术有限公司 | 内存液冷散热方法、装置及系统 |
| US8659897B2 (en) * | 2012-01-27 | 2014-02-25 | International Business Machines Corporation | Liquid-cooled memory system having one cooling pipe per pair of DIMMs |
| US8913384B2 (en) * | 2012-06-20 | 2014-12-16 | International Business Machines Corporation | Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) |
-
2012
- 2012-06-29 US US13/538,162 patent/US9158348B2/en active Active
-
2013
- 2013-06-20 PL PL13802097T patent/PL2867743T3/pl unknown
- 2013-06-20 WO PCT/IB2013/002453 patent/WO2014013346A2/en active Application Filing
- 2013-06-20 CN CN201380033641.0A patent/CN104541226B/zh active Active
- 2013-06-20 EP EP13802097.9A patent/EP2867743B1/en active Active
- 2013-06-20 ES ES13802097T patent/ES2728173T3/es active Active
- 2013-06-20 DK DK13802097.9T patent/DK2867743T3/da active
-
2015
- 2015-09-14 US US14/852,647 patent/US9867315B2/en not_active Expired - Fee Related
- 2015-10-13 HK HK15109960.0A patent/HK1209502A1/xx unknown
-
2017
- 2017-11-29 US US15/825,643 patent/US20180084672A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| ES2728173T3 (es) | 2019-10-22 |
| WO2014013346A3 (en) | 2014-03-20 |
| CN104541226A (zh) | 2015-04-22 |
| CN104541226B (zh) | 2020-08-07 |
| US20140002980A1 (en) | 2014-01-02 |
| HK1209502A1 (en) | 2016-04-01 |
| US9867315B2 (en) | 2018-01-09 |
| EP2867743B1 (en) | 2019-03-06 |
| US20160026223A1 (en) | 2016-01-28 |
| US9158348B2 (en) | 2015-10-13 |
| PL2867743T3 (pl) | 2019-08-30 |
| EP2867743A2 (en) | 2015-05-06 |
| WO2014013346A2 (en) | 2014-01-23 |
| US20180084672A1 (en) | 2018-03-22 |
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