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DE69222501D1 - Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp - Google Patents

Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp

Info

Publication number
DE69222501D1
DE69222501D1 DE69222501T DE69222501T DE69222501D1 DE 69222501 D1 DE69222501 D1 DE 69222501D1 DE 69222501 T DE69222501 T DE 69222501T DE 69222501 T DE69222501 T DE 69222501T DE 69222501 D1 DE69222501 D1 DE 69222501D1
Authority
DE
Germany
Prior art keywords
microcapsule
producing
conductive filler
type conductive
type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69222501T
Other languages
English (en)
Other versions
DE69222501T2 (de
Inventor
Hiroaki Date
Makoto Usui
Isao Watanabe
Yuko Hozumi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP4263219A external-priority patent/JPH082995B2/ja
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Application granted granted Critical
Publication of DE69222501D1 publication Critical patent/DE69222501D1/de
Publication of DE69222501T2 publication Critical patent/DE69222501T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
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    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
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    • H01L23/49883—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers characterised by the materials the conductive materials containing organic materials or pastes, e.g. for thick films
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Pigments, Carbon Blacks, Or Wood Stains (AREA)
  • Paints Or Removers (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
DE1992622501 1991-10-24 1992-10-23 Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp Expired - Lifetime DE69222501T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30381891 1991-10-24
JP4263219A JPH082995B2 (ja) 1991-10-24 1992-09-04 マイクロカプセル型導電性フィラーの作製方法

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DE1992622501 Expired - Lifetime DE69222501T2 (de) 1991-10-24 1992-10-23 Verfahren zum Herstellen eines leitenden Füllstoffs vom Mikrokapseltyp

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JP3455871B2 (ja) 1997-06-23 2003-10-14 株式会社スリーボンド マイクロカプセル型導電性フィラーの製造方法
US6506448B1 (en) * 1999-06-01 2003-01-14 Fry's Metals, Inc. Method of protective coating BGA solder alloy spheres
US6451875B1 (en) * 1999-10-12 2002-09-17 Sony Chemicals Corporation Connecting material for anisotropically electroconductive connection
KR100832282B1 (ko) * 2000-10-23 2008-05-26 세키스이가가쿠 고교가부시키가이샤 피복 입자
US6734466B2 (en) * 2002-03-05 2004-05-11 Agilent Technologies, Inc. Coated phosphor filler and a method of forming the coated phosphor filler
CN105295760A (zh) * 2015-10-23 2016-02-03 浙江欧仁新材料有限公司 一种各向异性导电双面胶

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JPH02103875A (ja) * 1988-10-11 1990-04-16 Stanley Electric Co Ltd 異方性導電材
JPH02103874A (ja) * 1988-10-11 1990-04-16 Stanley Electric Co Ltd 異方性導電膜
JP2906612B2 (ja) * 1990-08-10 1999-06-21 富士通株式会社 マイクロカプセル型導電性接着剤と接着方法
JP3092971B2 (ja) * 1991-06-07 2000-09-25 富士通株式会社 金属微粒子のポリマ被覆方法

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EP0539211B1 (de) 1997-10-01
DE69232886D1 (de) 2003-02-06
DE69222501T2 (de) 1998-02-05
EP0539211A3 (de) 1994-03-16
EP0539211A2 (de) 1993-04-28
DE69232886T2 (de) 2005-03-10
CA2081222A1 (en) 1993-04-25
CA2081222C (en) 1998-10-27

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