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DE69114612D1 - Festkörper-Bildaufnahmeanordnung und Steuerverfahren dafür. - Google Patents

Festkörper-Bildaufnahmeanordnung und Steuerverfahren dafür.

Info

Publication number
DE69114612D1
DE69114612D1 DE69114612T DE69114612T DE69114612D1 DE 69114612 D1 DE69114612 D1 DE 69114612D1 DE 69114612 T DE69114612 T DE 69114612T DE 69114612 T DE69114612 T DE 69114612T DE 69114612 D1 DE69114612 D1 DE 69114612D1
Authority
DE
Germany
Prior art keywords
control method
imaging device
solid state
state imaging
method therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE69114612T
Other languages
English (en)
Other versions
DE69114612T2 (de
Inventor
Tetsuo Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Application granted granted Critical
Publication of DE69114612D1 publication Critical patent/DE69114612D1/de
Publication of DE69114612T2 publication Critical patent/DE69114612T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14806—Structural or functional details thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
    • H01G9/20—Light-sensitive devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/148—Charge coupled imagers
    • H01L27/14831—Area CCD imagers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/713—Transfer or readout registers; Split readout registers or multiple readout registers
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/70—SSIS architectures; Circuits associated therewith
    • H04N25/71—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors
    • H04N25/715—Charge-coupled device [CCD] sensors; Charge-transfer registers specially adapted for CCD sensors using frame interline transfer [FIT]

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
  • Solid State Image Pick-Up Elements (AREA)
DE69114612T 1990-07-04 1991-07-04 Festkörper-Bildaufnahmeanordnung und Steuerverfahren dafür. Expired - Fee Related DE69114612T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2176612A JP2760639B2 (ja) 1990-07-04 1990-07-04 固体撮像装置およびその駆動方法

Publications (2)

Publication Number Publication Date
DE69114612D1 true DE69114612D1 (de) 1995-12-21
DE69114612T2 DE69114612T2 (de) 1996-05-02

Family

ID=16016614

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69114612T Expired - Fee Related DE69114612T2 (de) 1990-07-04 1991-07-04 Festkörper-Bildaufnahmeanordnung und Steuerverfahren dafür.

Country Status (5)

Country Link
US (1) US5148013A (de)
EP (1) EP0472859B1 (de)
JP (1) JP2760639B2 (de)
KR (1) KR950011888B1 (de)
DE (1) DE69114612T2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2504845B2 (ja) * 1989-10-06 1996-06-05 シャープ株式会社 固体撮像装置
JPH0491556A (ja) * 1990-08-06 1992-03-25 Fuji Xerox Co Ltd 読み取り装置
JP2760656B2 (ja) * 1990-11-30 1998-06-04 株式会社東芝 固体撮像装置
DE4134666C2 (de) * 1991-10-19 2002-03-28 Zeiss Carl Verfahren und Schaltung zur Verarbeitung optischer Signale
US5355165A (en) * 1992-08-06 1994-10-11 Princeton Scientific Instruments, Inc. Very high frame rate CCD imager
JP2807386B2 (ja) * 1993-02-15 1998-10-08 株式会社東芝 固体撮像装置及び固体撮像装置の駆動方法
JP2888719B2 (ja) * 1993-02-15 1999-05-10 株式会社東芝 固体撮像装置の駆動方法
JPH0767041A (ja) * 1993-08-30 1995-03-10 Toshiba Corp 固体撮像装置の駆動方法
JP3364926B2 (ja) * 1993-09-02 2003-01-08 ソニー株式会社 固体撮像装置
JP3156503B2 (ja) 1994-05-27 2001-04-16 松下電器産業株式会社 固体撮像装置の駆動方法及び固体撮像装置の信号処理回路
US5703639A (en) * 1994-10-25 1997-12-30 Dalsa, Inc. Charge coupled device pulse discriminator
WO1996026546A2 (en) * 1995-02-21 1996-08-29 Philips Electronics N.V. Charge-coupled imaging device having anti-blooming protection and two sets of readout registers
KR100226787B1 (en) * 1996-12-16 1999-10-15 Hyundai Micro Electronics Co Ccd device
JP3548410B2 (ja) * 1997-12-25 2004-07-28 キヤノン株式会社 固体撮像装置および固体撮像装置の信号読み出し方法
EP1110372B1 (de) * 1999-07-09 2006-09-20 BTS Holding International B.V. Optische abtastvorrichtung mit umschaltbarer auflösung
JP3846572B2 (ja) * 2001-09-20 2006-11-15 ソニー株式会社 固体撮像装置
US7554590B2 (en) * 2003-02-26 2009-06-30 Digital Imaging Systems Gmbh Simultaneous readout of CMOS APS imagers
US7480000B2 (en) * 2003-06-25 2009-01-20 Fujifilm Corporation Image-taking apparatus including a vertical transfer control device
DE602005010696D1 (de) * 2005-08-12 2008-12-11 Mesa Imaging Ag Hochempfindliches, schnelles Pixel für Anwendung in einem Bildsensor
KR20210076238A (ko) 2019-12-13 2021-06-24 삼성전자주식회사 이미지 센서, 그것을 포함하는 이미지 장치 및 그것의 동작 방법
US11838659B2 (en) * 2021-11-16 2023-12-05 Pixart Imaging Inc. Image sensing system and image sensing data processing method

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57104377A (en) * 1980-12-19 1982-06-29 Matsushita Electric Ind Co Ltd Solid-state image pickup device
JPS5984466A (ja) * 1982-11-06 1984-05-16 Canon Inc 電荷転送デバイス
JPS60163464A (ja) * 1984-02-02 1985-08-26 Fujitsu Ltd 電荷結合装置
JPH0799869B2 (ja) * 1984-10-20 1995-10-25 オリンパス光学工業株式会社 電子的撮像装置
JPS6386974A (ja) * 1986-09-30 1988-04-18 Nec Corp 電荷転送撮像素子とその駆動方法
US4831453A (en) * 1987-04-10 1989-05-16 Kabushiki Kaisha Toshiba Solid-state imaging device having high-speed shutter function and method of realizing high-speed function in solid-state imaging device
US4897728A (en) * 1987-10-09 1990-01-30 Kabushiki Kaisha Toshiba Charge transfer device for solid state image pickup apparatus and method of driving the same
US4980771A (en) * 1988-02-18 1990-12-25 Victor Company Of Japan, Ltd. Imaging device and imaging apparatus including the imaging device
US5043819A (en) * 1989-12-05 1991-08-27 Samsung Electronics Co., Ltd. CCD solid state image sensor with two horizontal transfer CCDs corresponding to both odd and even columns of elements

Also Published As

Publication number Publication date
JPH0468678A (ja) 1992-03-04
DE69114612T2 (de) 1996-05-02
KR950011888B1 (ko) 1995-10-11
US5148013A (en) 1992-09-15
EP0472859B1 (de) 1995-11-15
EP0472859A1 (de) 1992-03-04
JP2760639B2 (ja) 1998-06-04
KR920003564A (ko) 1992-02-29

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8320 Willingness to grant licences declared (paragraph 23)
8339 Ceased/non-payment of the annual fee