DE68911420D1 - Festkörper-Bildaufnahmevorrichtung. - Google Patents

Festkörper-Bildaufnahmevorrichtung.

Info

Publication number: DE68911420D1
Authority: DE; Germany
Prior art keywords: imaging device; solid state; state imaging; solid; state
Prior art date: 1988-08-18
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Expired - Fee Related

Application number

DE89114371T

Other languages

English (en)

Other versions

DE68911420T2 (de

Inventor

Shigeo Seiko Epson Corpor Toda

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

Seiko Epson Corp

Original Assignee

Seiko Epson Corp

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

1988-08-18

Filing date

1989-08-03

Publication date

1994-01-27

1988-08-18 Priority claimed from JP63205542A external-priority patent/JPH0254580A/ja

1988-08-29 Priority claimed from JP63214452A external-priority patent/JPH0263167A/ja

1988-08-29 Priority claimed from JP63214443A external-priority patent/JPH0263166A/ja

1989-08-03 Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp

1994-01-27 Publication of DE68911420D1 publication Critical patent/DE68911420D1/de

1994-05-11 Application granted granted Critical

1994-05-11 Publication of DE68911420T2 publication Critical patent/DE68911420T2/de

2009-08-04 Anticipated expiration legal-status Critical

Status Expired - Fee Related legal-status Critical Current

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/041—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F
- H01L25/042—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in subclass H10F the devices being arranged next to each other
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/15—Charge-coupled device [CCD] image sensors
- H10F39/152—One-dimensional array CCD image sensors
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F77/00—Constructional details of devices covered by this subclass
- H10F77/50—Encapsulations or containers
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors

Landscapes

Engineering & Computer Science (AREA)
Power Engineering (AREA)
Microelectronics & Electronic Packaging (AREA)
Life Sciences & Earth Sciences (AREA)
Sustainable Development (AREA)
Physics & Mathematics (AREA)
Condensed Matter Physics & Semiconductors (AREA)
General Physics & Mathematics (AREA)
Computer Hardware Design (AREA)
Solid State Image Pick-Up Elements (AREA)
Transforming Light Signals Into Electric Signals (AREA)

DE89114371T 1988-08-18 1989-08-03 Festkörper-Bildaufnahmevorrichtung. Expired - Fee Related DE68911420T2 (de)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
JP63205542A JPH0254580A (ja)	1988-08-18	1988-08-18	イメージセンサ
JP63214452A JPH0263167A (ja)	1988-08-29	1988-08-29	イメージセンサ
JP63214443A JPH0263166A (ja)	1988-08-29	1988-08-29	イメージセンサ

Publications (2)

Publication Number	Publication Date
DE68911420D1 true DE68911420D1 (de)	1994-01-27
DE68911420T2 DE68911420T2 (de)	1994-05-11

Family

ID=27328514

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
DE89114371T Expired - Fee Related DE68911420T2 (de)	1988-08-18	1989-08-03	Festkörper-Bildaufnahmevorrichtung.

Country Status (4)

Country	Link
US (1)	US5068713A (de)
EP (1)	EP0355522B1 (de)
DE (1)	DE68911420T2 (de)
HK (1)	HK106497A (de)

Families Citing this family (35)

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Publication number	Priority date	Publication date	Assignee	Title
JP2710174B2 (ja) *	1991-06-27	1998-02-10	日本電気株式会社	一次元イメージセンサ
US5434524A (en) *	1992-09-16	1995-07-18	International Business Machines Corporation	Method of clocking integrated circuit chips
JP3081122B2 (ja) *	1994-07-18	2000-08-28	シャープ株式会社	基板搬送用治具及びそれを用いた液晶表示素子の製造方法
JP3805031B2 (ja)	1995-10-20	2006-08-02	キヤノン株式会社	光電変換装置
DE19616969A1 (de) *	1996-04-27	1997-10-30	Bosch Gmbh Robert	Optische Baugruppe zur Ankopplung eines Lichtwellenleiters und Verfahren zur Herstellung derselben
US5962810A (en) *	1997-09-09	1999-10-05	Amkor Technology, Inc.	Integrated circuit package employing a transparent encapsulant
JPH1197656A (ja) *	1997-09-22	1999-04-09	Fuji Electric Co Ltd	半導体光センサデバイス
JP3400340B2 (ja) *	1998-02-20	2003-04-28	株式会社新川	フリップチップボンディング方法及び装置
DE19812008A1 (de) *	1998-03-19	1999-09-23	Heidenhain Gmbh Dr Johannes	Optoelektronische Bauelementanordnung
DE19964228B4 (de) *	1998-09-08	2008-11-13	Fujitsu Ltd., Kawasaki	Verfahren zur Herstellung eines Reflexionsfilms und Herstellung optischer Vorrichtungen die einen Reflexionsfilm verwenden
US6588949B1 (en) *	1998-12-30	2003-07-08	Honeywell Inc.	Method and apparatus for hermetically sealing photonic devices
US6483030B1 (en) *	1999-12-08	2002-11-19	Amkor Technology, Inc.	Snap lid image sensor package
US6483101B1 (en) *	1999-12-08	2002-11-19	Amkor Technology, Inc.	Molded image sensor package having lens holder
US6792178B1 (en)	2000-01-12	2004-09-14	Finisar Corporation	Fiber optic header with integrated power monitor
US6518659B1 (en)	2000-05-08	2003-02-11	Amkor Technology, Inc.	Stackable package having a cavity and a lid for an electronic device
US6424031B1 (en)	2000-05-08	2002-07-23	Amkor Technology, Inc.	Stackable package with heat sink
US6667544B1 (en)	2000-06-30	2003-12-23	Amkor Technology, Inc.	Stackable package having clips for fastening package and tool for opening clips
US7059040B1 (en)	2001-01-16	2006-06-13	Amkor Technology, Inc.	Optical module with lens integral holder fabrication method
KR100401020B1 (ko)	2001-03-09	2003-10-08	앰코 테크놀로지 코리아 주식회사	반도체칩의 스택킹 구조 및 이를 이용한 반도체패키지
US6906403B2 (en) *	2002-06-04	2005-06-14	Micron Technology, Inc.	Sealed electronic device packages with transparent coverings
US7146106B2 (en) *	2002-08-23	2006-12-05	Amkor Technology, Inc.	Optic semiconductor module and manufacturing method
ITMI20022467A1 (it) *	2002-11-20	2004-05-21	St Microelectronics Srl	Processo per realizzare un transistore di selezione di byte per
JP4203374B2 (ja) *	2003-08-06	2008-12-24	豊田合成株式会社	発光装置
US6977431B1 (en)	2003-11-05	2005-12-20	Amkor Technology, Inc.	Stackable semiconductor package and manufacturing method thereof
US20060261458A1 (en) *	2003-11-12	2006-11-23	Amkor Technology, Inc.	Semiconductor package and manufacturing method thereof
US7359579B1 (en)	2004-10-08	2008-04-15	Amkor Technology, Inc.	Image sensor package and its manufacturing method
US20070210246A1 (en) *	2005-04-14	2007-09-13	Amkor Technology, Inc.	Stacked image sensor optical module and fabrication method
US7227236B1 (en)	2005-04-26	2007-06-05	Amkor Technology, Inc.	Image sensor package and its manufacturing method
US20070272827A1 (en) *	2005-04-27	2007-11-29	Amkor Technology, Inc.	Image sensor package having mount holder attached to image sensor die
US7576401B1 (en)	2005-07-07	2009-08-18	Amkor Technology, Inc.	Direct glass attached on die optical module
US7675180B1 (en)	2006-02-17	2010-03-09	Amkor Technology, Inc.	Stacked electronic component package having film-on-wire spacer
US20080237824A1 (en) *	2006-02-17	2008-10-02	Amkor Technology, Inc.	Stacked electronic component package having single-sided film spacer
US7633144B1 (en)	2006-05-24	2009-12-15	Amkor Technology, Inc.	Semiconductor package
CN101499446B (zh) *	2009-02-26	2013-10-16	光宝电子(广州)有限公司	导线架料片、封装结构以及发光二极管封装结构
DE102009042479A1 (de) *	2009-09-24	2011-03-31	Msg Lithoglas Ag	Verfahren zum Herstellen einer Anordnung mit einem Bauelement auf einem Trägersubstrat und Anordnung sowie Verfahren zum Herstellen eines Halbzeuges und Halbzeug

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JPS57164585A (en) *	1981-04-02	1982-10-09	Toshiba Corp	Photosemiconductor device
JPS57190455A (en) *	1981-05-19	1982-11-24	Nippon Telegr & Teleph Corp <Ntt>	Adhesion type image sensor
JPS5986363A (ja) *	1982-11-09	1984-05-18	Toshiba Corp	密着センサ用レンズ調整装置
JPS59167037A (ja) *	1983-03-14	1984-09-20	Oki Electric Ind Co Ltd	半導体装置
JPS6062278A (ja) *	1983-09-14	1985-04-10	Toshiba Corp	イメ−ジセンサ
JPS60123059A (ja) *	1983-12-08	1985-07-01	Toshiba Corp	密着型カラ−イメ−ジセンサ
JPS6132469A (ja) *	1984-07-24	1986-02-15	Toppan Printing Co Ltd	カラー固体撮像素子の製造方法
JPS61126861A (ja) *	1984-11-22	1986-06-14	Toshiba Corp	密着型イメ−ジセンサ
JPS61135280A (ja) *	1984-12-06	1986-06-23	Toshiba Corp	三次元撮像素子
JPS61234161A (ja) *	1985-04-10	1986-10-18	Matsushita Electric Ind Co Ltd	密着型イメ−ジセンサ
JPS62104044A (ja) *	1985-10-30	1987-05-14	Nec Corp	パツシベ−シヨン方法
JPS62241358A (ja) *	1986-04-14	1987-10-22	Hitachi Ltd	ワンタイムプログラム型半導体装置
US4877306A (en) *	1987-09-30	1989-10-31	Corning Glass Works	Coated optical waveguide fibers

1989
- 1989-08-03 EP EP89114371A patent/EP0355522B1/de not_active Expired - Lifetime
- 1989-08-03 DE DE89114371T patent/DE68911420T2/de not_active Expired - Fee Related
- 1989-08-15 US US07/393,729 patent/US5068713A/en not_active Expired - Lifetime
1997
- 1997-06-26 HK HK106497A patent/HK106497A/xx not_active IP Right Cessation

Also Published As

Publication number	Publication date
EP0355522B1 (de)	1993-12-15
EP0355522A2 (de)	1990-02-28
EP0355522A3 (en)	1990-08-22
US5068713A (en)	1991-11-26
DE68911420T2 (de)	1994-05-11
HK106497A (en)	1997-08-22

Publication	Publication Date	Title
DE68923909D1 (de)	1995-09-28	Festkörperbildaufnahmegerät.
DE68911420D1 (de)	1994-01-27	Festkörper-Bildaufnahmevorrichtung.
DE68921038D1 (de)	1995-03-23	Bilderzeugungsgerät.
DE68921531D1 (de)	1995-04-13	Bilderzeugungsgerät.
DE68911731D1 (de)	1994-02-10	Bilderzeugungsgerät.
DE68923349D1 (de)	1995-08-10	Bildreduzierungsvorrichtung.
DE68916745D1 (de)	1994-08-18	Bilderzeugungsvorrichtung.
DE69005207D1 (de)	1994-01-27	Bilderzeugungsgerät.
DE69006923D1 (de)	1994-04-07	Bilderzeugunsgerät.
DE69008772D1 (de)	1994-06-16	Bilderzeugungsgerät.
DE68912908D1 (de)	1994-03-17	Bildererzeugungsgerät.
DE69004896D1 (de)	1994-01-13	Bilderzeugungsgerät.
DE68913454D1 (de)	1994-04-07	Bilderzeugungsgerät.
DE68921596D1 (de)	1995-04-13	Bilderzeugungsgerät.
DE69006283D1 (de)	1994-03-10	Bilderzeugungsgerät.
DE68917224D1 (de)	1994-09-08	Bilderzeugungsgerät.
DE69009245D1 (de)	1994-07-07	Bilderzeugungsgerät.
DE69114643D1 (de)	1995-12-21	Festkörper-Bildaufnahmevorrichtung.
DE68920093D1 (de)	1995-02-02	Bilderzeugungsgerät.
DE68921659D1 (de)	1995-04-20	Bilderzeugungsgerät.
DE3884343D1 (de)	1993-10-28	Festkörperbildaufnahmevorrichtung.
DE69010710D1 (de)	1994-08-25	Bilderzeugungsgerät.
DE68913432D1 (de)	1994-04-07	Bilderzeugungsgerät.
DE68915828D1 (de)	1994-07-14	Bilderzeugungsgerät.
DE68915825D1 (de)	1994-07-14	Bilderzeugungsgerät.

Legal Events

Date	Code	Title	Description
1995-01-19	8364	No opposition during term of opposition
1995-07-13	8328	Change in the person/name/address of the agent	Free format text: HOFFMANN, E., DIPL.-ING., PAT.-ANW., 82166 GRAEFELFING
1999-10-07	8339	Ceased/non-payment of the annual fee