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DE69942902D1 - Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung - Google Patents

Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung

Info

Publication number
DE69942902D1
DE69942902D1 DE69942902T DE69942902T DE69942902D1 DE 69942902 D1 DE69942902 D1 DE 69942902D1 DE 69942902 T DE69942902 T DE 69942902T DE 69942902 T DE69942902 T DE 69942902T DE 69942902 D1 DE69942902 D1 DE 69942902D1
Authority
DE
Germany
Prior art keywords
production
type device
electronic chip
chip
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69942902T
Other languages
English (en)
Inventor
Taisuke Ahiko
Hiroki Sato
Takaya Ishigaki
Takashi Kamiya
Masanori Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TDK Corp
Original Assignee
TDK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP10104075A external-priority patent/JPH11288839A/ja
Priority claimed from JP11104498A external-priority patent/JPH11307390A/ja
Priority claimed from JP10307593A external-priority patent/JP2000133546A/ja
Application filed by TDK Corp filed Critical TDK Corp
Application granted granted Critical
Publication of DE69942902D1 publication Critical patent/DE69942902D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/005—Electrodes
    • H01G4/012—Form of non-self-supporting electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09181—Notches in edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09372—Pads and lands
    • H05K2201/09381—Shape of non-curved single flat metallic pad, land or exposed part thereof; Shape of electrode of leadless component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Coils Or Transformers For Communication (AREA)
DE69942902T 1998-03-31 1999-03-31 Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung Expired - Lifetime DE69942902D1 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP10104075A JPH11288839A (ja) 1998-03-31 1998-03-31 積層チップ型電子部品及びその製造方法
JP11104498A JPH11307390A (ja) 1998-04-21 1998-04-21 電子部品
JP10307593A JP2000133546A (ja) 1998-10-28 1998-10-28 積層セラミックチップ部品及びその製造方法

Publications (1)

Publication Number Publication Date
DE69942902D1 true DE69942902D1 (de) 2010-12-16

Family

ID=27310152

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69942902T Expired - Lifetime DE69942902D1 (de) 1998-03-31 1999-03-31 Elektronisches Bauelement in Chipbauweise und Verfahren zu seiner Herstellung

Country Status (3)

Country Link
US (2) US6380619B2 (de)
EP (1) EP0949642B1 (de)
DE (1) DE69942902D1 (de)

Families Citing this family (82)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223359A (ja) * 1999-01-29 2000-08-11 Murata Mfg Co Ltd セラミック電子部品
JP2001118731A (ja) * 1999-10-19 2001-04-27 Murata Mfg Co Ltd チップ型複合電子部品およびその製造方法
WO2001080256A1 (fr) * 2000-04-14 2001-10-25 Matsushita Electric Industrial Co., Ltd. Corps stratifie, condensateur, composant electronique, procede et dispositif de fabrication dudit corps stratifie, dudit condensateur et dudit composant electronique
JP4138211B2 (ja) * 2000-07-06 2008-08-27 株式会社村田製作所 電子部品およびその製造方法、集合電子部品、電子部品の実装構造、ならびに電子装置
DE60126823T2 (de) * 2001-01-02 2007-11-15 Nds Ltd., West Drayton Verfahren und system zur steuerung des rundfunksendeinhaltszugriffs
JP3850739B2 (ja) * 2002-02-21 2006-11-29 三菱電機株式会社 半導体装置
JP4187184B2 (ja) * 2002-02-28 2008-11-26 Ｔｄｋ株式会社 電子部品
US7463474B2 (en) * 2002-04-15 2008-12-09 Avx Corporation System and method of plating ball grid array and isolation features for electronic components
US7177137B2 (en) * 2002-04-15 2007-02-13 Avx Corporation Plated terminations
US6982863B2 (en) 2002-04-15 2006-01-03 Avx Corporation Component formation via plating technology
US7576968B2 (en) * 2002-04-15 2009-08-18 Avx Corporation Plated terminations and method of forming using electrolytic plating
US7152291B2 (en) 2002-04-15 2006-12-26 Avx Corporation Method for forming plated terminations
US6960366B2 (en) 2002-04-15 2005-11-01 Avx Corporation Plated terminations
TWI260657B (en) * 2002-04-15 2006-08-21 Avx Corp Plated terminations
US6716692B1 (en) * 2003-05-20 2004-04-06 Via Technologies, Inc. Fabrication process and structure of laminated capacitor
US7612443B1 (en) 2003-09-04 2009-11-03 University Of Notre Dame Du Lac Inter-chip communication
KR100565617B1 (ko) * 2003-09-18 2006-03-29 엘지전자 주식회사 냉장고의 제빙장치
US6885539B1 (en) * 2003-12-02 2005-04-26 Presidio Components, Inc. Single layer capacitor
US6903920B1 (en) * 2004-08-06 2005-06-07 Kemet Electronics Clip-on leadframe for large ceramic SMD
EP1830372B1 (de) * 2004-12-24 2018-01-24 Murata Manufacturing Co., Ltd. Mehrschichtiger kondensator und montagestruktur dafür
KR100691146B1 (ko) * 2004-12-24 2007-03-09 삼성전기주식회사 적층형 캐패시터 및 적층형 캐패시터가 내장된 인쇄회로기판
US7016176B1 (en) * 2005-04-07 2006-03-21 Honeywell International Inc. Low ESL and ESR chip capacitor
DE102005017527A1 (de) * 2005-04-15 2006-11-02 Osram Opto Semiconductors Gmbh Oberflächenmontierbares optoelektronisches Bauelement
JP4844045B2 (ja) * 2005-08-18 2011-12-21 Ｔｄｋ株式会社 電子部品及びその製造方法
US7414857B2 (en) * 2005-10-31 2008-08-19 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7697262B2 (en) * 2005-10-31 2010-04-13 Avx Corporation Multilayer ceramic capacitor with internal current cancellation and bottom terminals
US7292429B2 (en) * 2006-01-18 2007-11-06 Kemet Electronics Corporation Low inductance capacitor
US7888185B2 (en) * 2006-08-17 2011-02-15 Micron Technology, Inc. Semiconductor device assemblies and systems including at least one conductive pathway extending around a side of at least one semiconductor device
DE102006054085A1 (de) * 2006-11-16 2008-05-29 Epcos Ag Bauelement-Anordnung
US8238116B2 (en) 2007-04-13 2012-08-07 Avx Corporation Land grid feedthrough low ESL technology
US8045319B2 (en) * 2007-06-13 2011-10-25 Avx Corporation Controlled ESR decoupling capacitor
TWI384739B (zh) * 2008-01-03 2013-02-01 Delta Electronics Inc 組合式電路及電子元件
JP2009194096A (ja) * 2008-02-13 2009-08-27 Murata Mfg Co Ltd 部品内蔵基板、及びそれを用いた部品パッケージ
JP5347350B2 (ja) * 2008-07-02 2013-11-20 株式会社村田製作所 積層型電子部品の製造方法
US8446705B2 (en) * 2008-08-18 2013-05-21 Avx Corporation Ultra broadband capacitor
JP2011071457A (ja) * 2008-12-22 2011-04-07 Tdk Corp 電子部品及び電子部品の製造方法
JP5120426B2 (ja) * 2010-08-11 2013-01-16 Ｔｄｋ株式会社 積層型貫通コンデンサ及び積層型貫通コンデンサの実装構造
KR101197787B1 (ko) * 2010-10-29 2012-11-05 삼성전기주식회사 적층형 세라믹 캐패시터 및 이의 제조방법
US9165716B2 (en) 2011-06-24 2015-10-20 Knowles Capital Formation, Inc. High capacitance single layer capacitor
US10128161B2 (en) 2011-10-27 2018-11-13 Global Circuit Innovations, Inc. 3D printed hermetic package assembly and method
US9935028B2 (en) * 2013-03-05 2018-04-03 Global Circuit Innovations Incorporated Method and apparatus for printing integrated circuit bond connections
US10147660B2 (en) 2011-10-27 2018-12-04 Global Circuits Innovations, Inc. Remapped packaged extracted die with 3D printed bond connections
US10002846B2 (en) 2011-10-27 2018-06-19 Global Circuit Innovations Incorporated Method for remapping a packaged extracted die with 3D printed bond connections
US9870968B2 (en) 2011-10-27 2018-01-16 Global Circuit Innovations Incorporated Repackaged integrated circuit and assembly method
US10109606B2 (en) 2011-10-27 2018-10-23 Global Circuit Innovations, Inc. Remapped packaged extracted die
US10177054B2 (en) 2011-10-27 2019-01-08 Global Circuit Innovations, Inc. Method for remapping a packaged extracted die
US9966319B1 (en) 2011-10-27 2018-05-08 Global Circuit Innovations Incorporated Environmental hardening integrated circuit method and apparatus
JP5598492B2 (ja) * 2012-03-30 2014-10-01 Ｔｄｋ株式会社 積層コイル部品
JP5678919B2 (ja) * 2012-05-02 2015-03-04 株式会社村田製作所 電子部品
US9620473B1 (en) 2013-01-18 2017-04-11 University Of Notre Dame Du Lac Quilt packaging system with interdigitated interconnecting nodules for inter-chip alignment
JP5811114B2 (ja) * 2013-02-28 2015-11-11 株式会社村田製作所 電子部品
KR101477405B1 (ko) * 2013-07-05 2014-12-29 삼성전기주식회사 적층 세라믹 커패시터 및 그 실장 기판
US20160276103A1 (en) * 2013-11-22 2016-09-22 Knowles Cazenovia, Inc. High capacitance single layer capacitor and manufacturing method thereof
KR20150072846A (ko) * 2013-12-20 2015-06-30 삼성전기주식회사 반도체 패키지 모듈
KR20150114747A (ko) * 2014-04-02 2015-10-13 삼성전기주식회사 칩형 코일 부품 및 그 실장 기판
US10141112B2 (en) * 2014-07-30 2018-11-27 Kyocera Corporation Laminated electronic component and mounting structure thereof
KR20160019265A (ko) * 2014-08-11 2016-02-19 삼성전기주식회사 칩형 코일 부품 및 그 제조방법
JP6235980B2 (ja) * 2014-10-28 2017-11-22 太陽誘電株式会社 積層型電子部品
JP2016181597A (ja) 2015-03-24 2016-10-13 太陽誘電株式会社 積層セラミックコンデンサ
KR101884392B1 (ko) * 2015-03-30 2018-08-02 다이요 유덴 가부시키가이샤 적층 세라믹 콘덴서
JP6632808B2 (ja) 2015-03-30 2020-01-22 太陽誘電株式会社 積層セラミックコンデンサ
JP2017216328A (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 セラミックコンデンサ
JP2017216332A (ja) * 2016-05-31 2017-12-07 株式会社村田製作所 セラミックコンデンサ
KR20180007865A (ko) * 2016-07-14 2018-01-24 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
KR102494323B1 (ko) * 2016-07-21 2023-02-01 삼성전기주식회사 적층형 커패시터 및 그 실장 기판
JP6766515B2 (ja) * 2016-08-09 2020-10-14 株式会社村田製作所 セラミック電子部品および誘電体磁器組成物
US11315843B2 (en) * 2016-12-28 2022-04-26 Intel Corporation Embedded component and methods of making the same
JP6455561B2 (ja) * 2017-06-30 2019-01-23 Tdk株式会社 電子部品
US10840018B2 (en) 2017-10-23 2020-11-17 Avx Corporation Multilayer electronic device having improved connectivity and method for making the same
US10115645B1 (en) 2018-01-09 2018-10-30 Global Circuit Innovations, Inc. Repackaged reconditioned die method and assembly
JP6753423B2 (ja) * 2018-01-11 2020-09-09 株式会社村田製作所 積層コイル部品
JP7193918B2 (ja) * 2018-02-08 2022-12-21 太陽誘電株式会社 積層セラミックコンデンサおよびその製造方法
JP7510741B2 (ja) 2018-08-23 2024-07-04 太陽誘電株式会社 積層セラミック電子部品の製造方法
JP7388088B2 (ja) * 2018-10-30 2023-11-29 Tdk株式会社 積層セラミック電子部品とその製造方法
US11412616B2 (en) * 2019-03-26 2022-08-09 Canon Kabushiki Kaisha Printed circuit board and electronic device
KR102257992B1 (ko) * 2019-07-08 2021-05-28 삼성전기주식회사 커패시터 부품
KR102333094B1 (ko) * 2019-07-08 2021-12-01 삼성전기주식회사 커패시터 부품
JP7196810B2 (ja) * 2019-10-04 2022-12-27 株式会社村田製作所 積層セラミックコンデンサ
JP7268611B2 (ja) * 2020-01-15 2023-05-08 株式会社村田製作所 インダクタ部品
US11462360B2 (en) * 2020-01-23 2022-10-04 Samsung Electro-Mechanics Co., Ltd. Multilayer electronic component
US11508680B2 (en) 2020-11-13 2022-11-22 Global Circuit Innovations Inc. Solder ball application for singular die
KR20220093451A (ko) * 2020-12-28 2022-07-05 삼성전기주식회사 적층형 커패시터 및 그 실장 기판

Family Cites Families (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3444436A (en) 1967-04-26 1969-05-13 Erie Technological Prod Inc Mounted capacitor with spaced terminal feet
US3612963A (en) * 1970-03-11 1971-10-12 Union Carbide Corp Multilayer ceramic capacitor and process
US4017820A (en) * 1975-07-25 1977-04-12 Illinois Tool Works Inc. Humidity sensor with multiple electrode layers separated by a porous monolithic ceramic dielectric structure
JPS5921047A (ja) * 1982-07-27 1984-02-02 Fuji Xerox Co Ltd リ−ドレスチツプキヤリア
US4584074A (en) * 1982-12-07 1986-04-22 International Standard Electric Corporation Capacitors
JPS6314456A (ja) 1986-07-04 1988-01-21 Nitto Electric Ind Co Ltd 光半導体装置
JPS63209115A (ja) * 1987-02-26 1988-08-30 多摩電気工業株式会社 電子部品用電極
US4740863A (en) * 1987-05-15 1988-04-26 Sfe Technologies Current-limiting thin film termination for capacitors
JPH02156514A (ja) 1988-12-08 1990-06-15 Nec Corp 表面実装用チップ部品
DE3921651A1 (de) * 1989-06-30 1991-01-10 Siemens Ag Mindestens sechsflaechiges elektronikbauteil fuer gedruckte schaltungen
JPH0555084A (ja) 1991-08-22 1993-03-05 Murata Mfg Co Ltd 積層チツプコンデンサ
JPH05283284A (ja) * 1992-03-31 1993-10-29 Matsushita Electric Ind Co Ltd チップ型ノイズ対策用フィルタおよびその製造方法
US5302880A (en) * 1992-05-20 1994-04-12 Murata Manufacturing Co., Ltd. Piezoelectric tuning fork resonator and method of manufacturing the same
SG48955A1 (en) * 1992-07-27 1998-05-18 Murata Manufacturing Co Multilayer electronic component method of manufacturing the same and method of measuring characteristics thereof
JP2993301B2 (ja) 1992-11-26 1999-12-20 松下電器産業株式会社 積層セラミックコンデンサ
JP2967666B2 (ja) * 1992-12-08 1999-10-25 株式会社村田製作所 チップ型電子部品
US5821627A (en) * 1993-03-11 1998-10-13 Kabushiki Kaisha Toshiba Electronic circuit device
US5737192A (en) * 1993-04-30 1998-04-07 The United States Of America As Represented By The Secretary Of The Air Force Density improvement in integration modules
JP3152834B2 (ja) * 1993-06-24 2001-04-03 株式会社東芝 電子回路装置
US5388024A (en) * 1993-08-02 1995-02-07 Avx Corporation Trapezoid chip capacitor
US5414588A (en) * 1993-09-20 1995-05-09 The Regents Of The University Of California High performance capacitors using nano-structure multilayer materials fabrication
WO1995011135A1 (en) * 1993-10-18 1995-04-27 Oki Electric Industry Co., Ltd. Ic module and data carrier using same
JPH07169649A (ja) 1993-12-16 1995-07-04 Tdk Corp 積層貫通型コンデンサアレイ
JPH07201634A (ja) * 1993-12-28 1995-08-04 Tdk Corp セラミックチップ部品
JPH081875A (ja) 1994-06-16 1996-01-09 Chisso Corp シート状物
JPH088672A (ja) * 1994-06-16 1996-01-12 Murata Mfg Co Ltd 共振器
JPH0855752A (ja) * 1994-08-10 1996-02-27 Taiyo Yuden Co Ltd 積層コンデンサの実装方法及び積層コンデンサ
US5716481A (en) 1994-10-31 1998-02-10 Tdk Corporation Manufacturing method and manufacturing apparatus for ceramic electronic components
US5600183A (en) * 1994-11-15 1997-02-04 Hughes Electronics Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit substrate
JPH08181033A (ja) 1994-12-22 1996-07-12 Tokin Corp 積層セラミックコンデンサ
US5726861A (en) * 1995-01-03 1998-03-10 Ostrem; Fred E. Surface mount component height control
JPH097877A (ja) * 1995-04-18 1997-01-10 Rohm Co Ltd 多層セラミックチップ型コンデンサ及びその製造方法
JP3289561B2 (ja) 1995-08-11 2002-06-10 株式会社村田製作所 電子部品およびその製造方法
KR100277382B1 (ko) 1995-08-18 2001-01-15 사토 히로시 다층전자부품
JPH09260187A (ja) 1996-03-19 1997-10-03 Murata Mfg Co Ltd セラミック電子部品の製造方法
JP2810647B2 (ja) * 1996-04-30 1998-10-15 山一電機株式会社 Ｉｃパッケージ
JP4030028B2 (ja) * 1996-12-26 2008-01-09 シチズン電子株式会社 Ｓｍｄ型回路装置及びその製造方法
JP3882954B2 (ja) * 1997-03-19 2007-02-21 Ｔｄｋ株式会社 チップ型積層セラミックコンデンサ
US6191933B1 (en) 1998-01-07 2001-02-20 Tdk Corporation Ceramic capacitor
US5880925A (en) * 1997-06-27 1999-03-09 Avx Corporation Surface mount multilayer capacitor
US5959348A (en) * 1997-08-18 1999-09-28 International Business Machines Corporation Construction of PBGA substrate for flip chip packing
JPH1167583A (ja) * 1997-08-26 1999-03-09 Taiyo Yuden Co Ltd 積層型電子部品
US5963416A (en) * 1997-10-07 1999-10-05 Taiyo Yuden Co., Ltd. Electronic device with outer electrodes and a circuit module having the electronic device
JP4216917B2 (ja) * 1997-11-21 2009-01-28 Ｔｄｋ株式会社 チップビーズ素子およびその製造方法
US6011683A (en) * 1997-12-29 2000-01-04 Texas Instruments Incorporated Thin multilayer ceramic capacitors
US5923077A (en) * 1998-02-11 1999-07-13 Bourns, Inc. Passive component integrated circuit chip
US6011691A (en) * 1998-04-23 2000-01-04 Lockheed Martin Corporation Electronic component assembly and method for low cost EMI and capacitive coupling elimination
US6008529A (en) * 1998-06-25 1999-12-28 Bily Wang Laser diode package

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Publication number Publication date
EP0949642A2 (de) 1999-10-13
US20010019176A1 (en) 2001-09-06
US6576497B2 (en) 2003-06-10
US6380619B2 (en) 2002-04-30
EP0949642A3 (de) 2004-01-02
EP0949642B1 (de) 2010-11-03
US20020070442A1 (en) 2002-06-13

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