Nothing Special   »   [go: up one dir, main page]

DE69940916D1 - Photohardenable liquid resin composition - Google Patents

Photohardenable liquid resin composition

Info

Publication number
DE69940916D1
DE69940916D1 DE69940916T DE69940916T DE69940916D1 DE 69940916 D1 DE69940916 D1 DE 69940916D1 DE 69940916 T DE69940916 T DE 69940916T DE 69940916 T DE69940916 T DE 69940916T DE 69940916 D1 DE69940916 D1 DE 69940916D1
Authority
DE
Germany
Prior art keywords
resin composition
liquid resin
photohardenable liquid
photohardenable
composition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE69940916T
Other languages
German (de)
Inventor
Tetsuya Yamamura
Akira Takeuchi
Tsuyoshi Watanabe
Takashi Ukachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Japan Fine Coatings Co Ltd
DSM IP Assets BV
Original Assignee
JSR Corp
Japan Fine Coatings Co Ltd
DSM IP Assets BV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP05272998A external-priority patent/JP3824286B2/en
Priority claimed from JP05886298A external-priority patent/JP4017236B2/en
Priority claimed from JP06209098A external-priority patent/JP4017238B2/en
Application filed by JSR Corp, Japan Fine Coatings Co Ltd, DSM IP Assets BV filed Critical JSR Corp
Application granted granted Critical
Publication of DE69940916D1 publication Critical patent/DE69940916D1/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0037—Production of three-dimensional images
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Epoxy Resins (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
DE69940916T 1998-02-18 1999-02-18 Photohardenable liquid resin composition Expired - Lifetime DE69940916D1 (en)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP05272998A JP3824286B2 (en) 1998-02-18 1998-02-18 Photocurable resin composition
JP5886198 1998-02-24
JP05886298A JP4017236B2 (en) 1998-02-24 1998-02-24 Photo-curable liquid resin composition
JP06209098A JP4017238B2 (en) 1998-02-24 1998-02-26 Photo-curable liquid resin composition

Publications (1)

Publication Number Publication Date
DE69940916D1 true DE69940916D1 (en) 2009-07-09

Family

ID=27462810

Family Applications (1)

Application Number Title Priority Date Filing Date
DE69940916T Expired - Lifetime DE69940916D1 (en) 1998-02-18 1999-02-18 Photohardenable liquid resin composition

Country Status (3)

Country Link
US (2) US6287745B1 (en)
EP (1) EP0938026B1 (en)
DE (1) DE69940916D1 (en)

Families Citing this family (71)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69940916D1 (en) * 1998-02-18 2009-07-09 Dsm Ip Assets Bv Photohardenable liquid resin composition
US6762002B2 (en) 1998-07-10 2004-07-13 Dsm Desotech, Inc. Solid imaging compositions for preparing polypropylene-like articles
US6379866B2 (en) * 2000-03-31 2002-04-30 Dsm Desotech Inc Solid imaging compositions for preparing polypropylene-like articles
US6287748B1 (en) 1998-07-10 2001-09-11 Dsm N.V. Solid imaging compositions for preparing polyethylene-like articles
US6579917B1 (en) * 1999-02-24 2003-06-17 Sanyo Electric Co., Ltd. Surface treatment agent for model
JP4350832B2 (en) † 1999-04-19 2009-10-21 Ｊｓｒ株式会社 Photocurable resin composition for three-dimensional modeling and a modeled product obtained by curing the same
DE60031238D1 (en) * 1999-08-12 2006-11-23 Mitsui Chemicals Inc LIGHT-CURABLE RESIN COMPOSITION FOR SEALING MATERIALS AND METHODS OF SEALING
EA004241B1 (en) * 1999-09-10 2004-02-26 Награкард Са Method and system for transmitting messages for database
JP2001081438A (en) * 1999-09-14 2001-03-27 Sony Chem Corp Connecting material
GB9921779D0 (en) * 1999-09-16 1999-11-17 Ciba Sc Holding Ag UV-Curable compositions
WO2001095030A2 (en) * 2000-06-09 2001-12-13 Dsm N.V. Resin composition and three-dimensional object
JP2002040632A (en) * 2000-07-21 2002-02-06 Showa Denko Kk Resist ink composition
EP1319197B1 (en) * 2000-09-19 2007-06-06 Shipley Company LLC Antireflective composition
US6849333B2 (en) 2001-05-18 2005-02-01 Corning Incorporated Optical fiber with an improved primary coating composition
US6811937B2 (en) 2001-06-21 2004-11-02 Dsm Desotech, Inc. Radiation-curable resin composition and rapid prototyping process using the same
US7048985B2 (en) * 2001-07-23 2006-05-23 Vrac, Llc Three-dimensional spacer fabric resin infusion media and reinforcing composite lamina
US7060156B2 (en) * 2001-07-23 2006-06-13 Vrac, Llc Three-dimensional spacer fabric resin interlaminar infusion media process and vacuum-induced reinforcing composite laminate structures
US6810187B2 (en) 2001-07-27 2004-10-26 Corning Incorporated Optical waveguide thermoplastic elastomer coating
CN1267478C (en) * 2001-12-06 2006-08-02 范蒂科股份公司 Heat-curable resin composition
US6689463B2 (en) 2001-12-18 2004-02-10 Corning Incorporated Secondary coating composition for optical fibers
JP2005520007A (en) * 2002-03-08 2005-07-07 レンセラール ポリテクニック インスティチュート Accelerators for cationic photopolymerization
US20030198824A1 (en) * 2002-04-19 2003-10-23 Fong John W. Photocurable compositions containing reactive polysiloxane particles
ES2405107T3 (en) 2002-05-03 2013-05-30 Dsm Ip Assets B.V. Composition of radiation curable resin and procedure for rapid prototyping using the same
AU2003247228A1 (en) * 2002-06-20 2004-01-06 Dsm Ip Assets B.V. Compositions comprising a benzophenone photoinitiator
US6850681B2 (en) * 2002-08-22 2005-02-01 Addison Clear Wave, Llc Radiation-curable flame retardant optical fiber coatings
US20040077745A1 (en) * 2002-10-18 2004-04-22 Jigeng Xu Curable compositions and rapid prototyping process using the same
DE60316591D1 (en) * 2002-11-06 2007-11-08 Nippon Kayaku Kk SEALING MATERIAL FOR LIQUID CRYSTAL AND LIQUID CRYSTAL DISPLAY CELL THEREWITH
US20040137368A1 (en) * 2003-01-13 2004-07-15 3D Systems, Inc. Stereolithographic resins containing selected oxetane compounds
DE602004015758D1 (en) * 2003-04-08 2008-09-25 Nippon Kayaku Kk LIQUID CRYSTAL SEALANT AND LIQUID CRYSTALLINE DISPLAY CELL THEREFOR
JP4161850B2 (en) * 2003-05-13 2008-10-08 コニカミノルタエムジー株式会社 Photosensitive composition, photosensitive lithographic printing plate, and image forming method thereof
JP2005015627A (en) * 2003-06-26 2005-01-20 Jsr Corp Photocurable liquid resin composition
JP2005056998A (en) * 2003-08-01 2005-03-03 Fuji Photo Film Co Ltd Solid-state image pickup device and its manufacturing method
JP4551638B2 (en) * 2003-08-01 2010-09-29 富士フイルム株式会社 Method for manufacturing solid-state imaging device
US7232850B2 (en) * 2003-10-03 2007-06-19 Huntsman Advanced Materials Americas Inc. Photocurable compositions for articles having stable tensile properties
US20050101684A1 (en) * 2003-11-06 2005-05-12 Xiaorong You Curable compositions and rapid prototyping process using the same
KR101138169B1 (en) * 2003-11-06 2012-04-25 훈츠만 어드밴스트 머티리얼스(스위처랜드) 게엠베하 Photocurable composition for producing cured articles having high clarity and improved mechanical properties
CN1946795B (en) * 2003-11-21 2010-06-23 洛德公司 Dual-stage wafer applied underfills
JP2005153273A (en) * 2003-11-25 2005-06-16 Nitto Denko Corp Resin sheet, liquid crystal cell substrate, liquid crystal display device, substrate for electroluminescence display device, electroluminnescence display device and substrate for solar cell
US7560519B2 (en) * 2004-06-02 2009-07-14 Lord Corporation Dual-stage wafer applied underfills
EP1720072B1 (en) 2005-05-01 2019-06-05 Rohm and Haas Electronic Materials, L.L.C. Compositons and processes for immersion lithography
JP4744200B2 (en) 2005-06-20 2011-08-10 シーメット株式会社 Solid modeling object with smoothed modeling end face
US7541391B2 (en) * 2005-09-02 2009-06-02 General Electric Company Self-forming polymer waveguide and waveguide material with reduced shrinkage
CN101277991B (en) * 2005-09-29 2011-11-09 Cmet公司 Resin composition for stereo planography
EP1801142B1 (en) * 2005-12-16 2016-02-24 Canon Kabushiki Kaisha Resin composition,resin cured product, and liquid discharge head
US9676899B2 (en) * 2006-05-01 2017-06-13 Dsm Ip Assets B.V. Radiation curable resin composition and rapid three dimensional imaging process using the same
KR101379126B1 (en) * 2006-07-14 2014-03-28 데쿠세리아루즈 가부시키가이샤 Resin composition and display apparatus
EP2067810B1 (en) * 2006-09-29 2013-10-09 DIC Corporation Cation-polymerizable resin composition containing multi-branched polyether polyol, adhesive agent comprising the composition, and laminate and polarizing plate using the adhesive agent
EP1918778B1 (en) 2006-10-30 2016-08-03 Rohm and Haas Electronic Materials LLC Compositions and processes for immersion lithography
WO2008115057A1 (en) * 2007-03-20 2008-09-25 Dsm Ip Assets B.V. Stereolithography resin compositions and three-dimensional objects made therefrom
KR101498309B1 (en) 2007-04-09 2015-03-03 데쿠세리아루즈 가부시키가이샤 image display device
JP5470735B2 (en) 2007-04-10 2014-04-16 デクセリアルズ株式会社 Manufacturing method of image display device
JP4973876B2 (en) * 2007-08-22 2012-07-11 信越化学工業株式会社 Pattern forming method and pattern surface coating material used therefor
EP2056162B1 (en) 2007-11-05 2016-05-04 Rohm and Haas Electronic Materials LLC Process for immersion lithography
JP2009244421A (en) * 2008-03-28 2009-10-22 Fujifilm Corp Plate-making method of lithographic printing plate
KR20110128808A (en) * 2009-02-16 2011-11-30 소켄 케미칼 앤드 엔지니어링 캄파니, 리미티드 Radiation curable adhesive composition for optical components and adhesive optical component
KR101714798B1 (en) 2009-03-13 2017-03-09 디에스엠 아이피 어셋츠 비.브이. Radiation curable resin composition and rapid three-dimensional imaging process using the same
JP5430345B2 (en) * 2009-10-26 2014-02-26 Ｊｓｒ株式会社 Radiation curable liquid resin composition for optical three-dimensional modeling and three-dimensional modeling obtained by photocuring the same
US20110300367A1 (en) * 2010-06-07 2011-12-08 Ching-Kee Chien Optical Fiber With Photoacid Coating
KR20130106507A (en) * 2012-03-20 2013-09-30 삼성디스플레이 주식회사 Sealing composition and method for manufacturing display panel using the same
US9644062B2 (en) * 2012-10-19 2017-05-09 Dow Global Technologies Llc Polymer particle dispersions with polyols
CN104837920A (en) 2012-11-19 2015-08-12 惠普发展公司，有限责任合伙企业 Compositions for three-dimensional (3D) printing
EP3266815B1 (en) 2013-11-05 2021-11-03 Covestro (Netherlands) B.V. Stabilized matrix-filled liquid radiation curable resin compositions for additive fabrication
JP2015225205A (en) * 2014-05-28 2015-12-14 京セラドキュメントソリューションズ株式会社 Optical deflector and image forming apparatus including the optical deflector
US10683381B2 (en) 2014-12-23 2020-06-16 Bridgestone Americas Tire Operations, Llc Actinic radiation curable polymeric mixtures, cured polymeric mixtures and related processes
JP6706740B2 (en) * 2015-02-16 2020-06-10 パナソニックＩｐマネジメント株式会社 Acrylic resin composition for sealing, cured product thereof, manufacturing method, semiconductor device using the resin composition, and manufacturing method thereof
EP3390006B1 (en) 2015-12-17 2021-01-27 Bridgestone Americas Tire Operations, LLC Additive manufacturing cartridges and processes for producing cured polymeric products by additive manufacturing
EP3429833B1 (en) * 2016-03-14 2022-04-13 Covestro (Netherlands) B.V. Radiation curable compositions for additive fabrication with improved toughness and high temperature resistance
US11453161B2 (en) 2016-10-27 2022-09-27 Bridgestone Americas Tire Operations, Llc Processes for producing cured polymeric products by additive manufacturing
US20180229442A1 (en) * 2017-02-14 2018-08-16 Ut-Battelle, Llc Bonded permanent magnets produced by additive manufacturing
EP3814392A1 (en) 2018-06-26 2021-05-05 Arkema France Curable compositions based on multistage polymers
US20240327665A1 (en) * 2023-03-28 2024-10-03 Canon Kabushiki Kaisha Photocurable composition

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4428807A (en) * 1978-06-30 1984-01-31 The Dow Chemical Company Composition containing polymerizable entities having oxirane groups and terminal olefinic unsaturation in combination with free-radical and cationic photopolymerizations means
US5002854A (en) 1989-04-21 1991-03-26 E. I. Du Pont De Nemours And Company Solid imaging method using compositions containing core-shell polymers
US5545367A (en) 1992-04-15 1996-08-13 Soane Technologies, Inc. Rapid prototype three dimensional stereolithography
TW269017B (en) * 1992-12-21 1996-01-21 Ciba Geigy Ag
US5453450A (en) * 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
CA2183187C (en) 1995-08-25 2001-01-02 Akira Kasari Aqueous colored base coating composition and method for forming topcoat
JP3626275B2 (en) * 1996-04-09 2005-03-02 Ｊｓｒ株式会社 Photocurable resin composition
ATE191090T1 (en) 1996-07-29 2000-04-15 Ciba Sc Holding Ag LIQUID, RADIATION-CURED COMPOSITION, PARTICULARLY FOR STEREOLITHOGRAPHY
JP3786480B2 (en) * 1996-10-14 2006-06-14 Ｊｓｒ株式会社 Photocurable resin composition
JP3844824B2 (en) 1996-11-26 2006-11-15 株式会社Ａｄｅｋａ Energy ray-curable epoxy resin composition, resin composition for optical three-dimensional modeling, and optical three-dimensional modeling method
JP3650238B2 (en) * 1996-12-10 2005-05-18 Ｊｓｒ株式会社 Photocurable resin composition
JP3626302B2 (en) * 1996-12-10 2005-03-09 Ｊｓｒ株式会社 Photocurable resin composition
JP3765896B2 (en) 1996-12-13 2006-04-12 Ｊｓｒ株式会社 Photocurable resin composition for optical three-dimensional modeling
US6054250A (en) * 1997-02-18 2000-04-25 Alliedsignal Inc. High temperature performance polymers for stereolithography
JP4614030B2 (en) * 1997-07-21 2011-01-19 ハンツマン アドバンスト マテリアルズ （スイッツァランド） ゲーエムベーハー Radiation-Viscosity stabilization of curable compositions
DE69940916D1 (en) * 1998-02-18 2009-07-09 Dsm Ip Assets Bv Photohardenable liquid resin composition
US6136497A (en) * 1998-03-30 2000-10-24 Vantico, Inc. Liquid, radiation-curable composition, especially for producing flexible cured articles by stereolithography
US6100007A (en) * 1998-04-06 2000-08-08 Ciba Specialty Chemicals Corp. Liquid radiation-curable composition especially for producing cured articles by stereolithography having high heat deflection temperatures

Also Published As

Publication number Publication date
EP0938026A1 (en) 1999-08-25
EP0938026B1 (en) 2009-05-27
US6287745B1 (en) 2001-09-11
US6727035B2 (en) 2004-04-27
US20020048717A1 (en) 2002-04-25

Similar Documents

Publication Publication Date Title
DE69940916D1 (en) Photohardenable liquid resin composition
DE69922626D1 (en) Resin composition
DE69923862D1 (en) RESIN COMPOSITION
DE69916514D1 (en) resin composition
DE69941227D1 (en) Photosensitive resin composition
DE69738578D1 (en) Photohardenable resin composition
DE69801448D1 (en) LIQUID, HARDENABLE RESIN COMPOSITION
DK0975693T4 (en) Liquid curable resin composition
DK1047740T3 (en) Healable resin compositions
DE60016295D1 (en) resin composition
DE69833249D1 (en) Resin composition
FI20002731A (en) Photosensitive resin composition
DE69817924D1 (en) Superabsorbent resin composition
DE69937418D1 (en) Resin composition and resin film
DE69935623D1 (en) Curable resin composition
DE69903370D1 (en) Polyoxymethylene resin composition
DE19782046T1 (en) Resin composition
DE69926192D1 (en) RESIN COMPOSITION CONTAINING MULTILAYER POLYMERS
DE69920572D1 (en) Polyamide resin composition
DE69932995D1 (en) Photosensitive resin composition
DE19981597T1 (en) Polyoxymethylene resin composition
DE69819336D1 (en) LIQUID, HARDENABLE RESIN COMPOSITION
DE69821192D1 (en) Photosensitive resin composition
DE69926319D1 (en) Resin composition
DE69918751D1 (en) FLUOR RESIN COMPOSITION

Legal Events

Date Code Title Description
8364 No opposition during term of opposition