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DE60308548D1 - Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff - Google Patents

Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff

Info

Publication number
DE60308548D1
DE60308548D1 DE60308548T DE60308548T DE60308548D1 DE 60308548 D1 DE60308548 D1 DE 60308548D1 DE 60308548 T DE60308548 T DE 60308548T DE 60308548 T DE60308548 T DE 60308548T DE 60308548 D1 DE60308548 D1 DE 60308548D1
Authority
DE
Germany
Prior art keywords
epoxy resin
resin composition
phosphonate
filler
reducing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60308548T
Other languages
English (en)
Other versions
DE60308548T2 (de
Inventor
Sergei Levchik
Mark Buczek
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Akzo Nobel NV
Original Assignee
Akzo Nobel NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=32312940&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DE60308548(D1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Akzo Nobel NV filed Critical Akzo Nobel NV
Publication of DE60308548D1 publication Critical patent/DE60308548D1/de
Application granted granted Critical
Publication of DE60308548T2 publication Critical patent/DE60308548T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/53—Phosphorus bound to oxygen bound to oxygen and to carbon only
    • C08K5/5317—Phosphonic compounds, e.g. R—P(:O)(OR')2
    • C08K5/5333—Esters of phosphonic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
    • C08G59/4071—Curing agents not provided for by the groups C08G59/42 - C08G59/66 phosphorus containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C08G59/621—Phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4
    • C08K5/523—Esters of phosphoric acids, e.g. of H3PO4 with hydroxyaryl compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
    • C08L61/34—Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C08L61/04, C08L61/18 and C08L61/20
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/012—Flame-retardant; Preventing of inflammation
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
DE60308548T 2002-11-08 2003-11-07 Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff Expired - Lifetime DE60308548T2 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US42519602P 2002-11-08 2002-11-08
US425196P 2002-11-08
PCT/US2003/035519 WO2004044054A1 (en) 2002-11-08 2003-11-07 Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler

Publications (2)

Publication Number Publication Date
DE60308548D1 true DE60308548D1 (de) 2006-11-02
DE60308548T2 DE60308548T2 (de) 2007-09-20

Family

ID=32312940

Family Applications (2)

Application Number Title Priority Date Filing Date
DE60335671T Expired - Lifetime DE60335671D1 (de) 2002-11-08 2003-11-07 Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat
DE60308548T Expired - Lifetime DE60308548T2 (de) 2002-11-08 2003-11-07 Epoxidharzzusammensetzung enthaltend reaktives flammhemmendes phosphonat oligomer und füllstoff

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE60335671T Expired - Lifetime DE60335671D1 (de) 2002-11-08 2003-11-07 Vernetzungsverfahren für eine Epoxidharzzusammensetzung enthaltend reaktives Phosphonat

Country Status (12)

Country Link
US (1) US7427652B2 (de)
EP (2) EP1719802B2 (de)
JP (1) JP2006505679A (de)
KR (1) KR101169658B1 (de)
CN (1) CN100402605C (de)
AT (2) ATE340220T1 (de)
AU (1) AU2003290646A1 (de)
CA (1) CA2505396A1 (de)
DE (2) DE60335671D1 (de)
ES (2) ES2359226T3 (de)
TW (1) TWI335926B (de)
WO (1) WO2004044054A1 (de)

Families Citing this family (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1432719A1 (de) * 2001-10-04 2004-06-30 Akzo Nobel N.V. Oligomere, hydroxy-terminierte phosphonate
CA2525856A1 (en) * 2003-05-22 2004-12-29 Supresta Llc Polyphosphonate flame retardant curing agent for epoxy resin
US7910665B2 (en) * 2004-05-19 2011-03-22 Icl-Ip America Inc. Composition of epoxy resin and epoxy-reactive polyphosphonate
TW200916561A (en) * 2007-05-07 2009-04-16 Martinswerk Gmbh Flame retarded thermosets
US9348991B2 (en) * 2008-05-20 2016-05-24 International Business Machines Corporation User management of authentication tokens
TWI423741B (zh) * 2009-02-13 2014-01-11 Iteq Corp An epoxy resin composition and a film and a substrate made of the epoxy resin composition
JP2013521381A (ja) * 2010-03-05 2013-06-10 ハンツマン・アドバンスド・マテリアルズ・アメリカズ・エルエルシー 電子部品に使用するための高周波で低い誘電体損の熱硬化性樹脂系
US20120095132A1 (en) * 2010-10-19 2012-04-19 Chung-Hao Chang Halogen- and phosphorus-free thermosetting resin composition
EP2655384B1 (de) * 2010-12-22 2017-09-06 FRX Polymers, Inc. Oligomerphosphonate und zusammensetzungen damit
CN102408419B (zh) * 2011-08-10 2014-11-05 哈尔滨理工大学 苯并噁嗪树脂的方法
EP2948464A4 (de) * 2013-01-22 2016-12-07 Frx Polymers Inc Phosphorhaltige epoxiverbindungen und zusammensetzungen daraus
JP2015040289A (ja) * 2013-08-23 2015-03-02 三菱化学株式会社 エポキシ樹脂、エポキシ樹脂組成物、硬化物及び電気・電子回路用積層板
CN105802128B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN105801814B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料和印制电路用层压板
CN105802127B (zh) * 2014-12-29 2018-05-04 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料以及印制电路用层压板
CN107151308B (zh) 2016-03-04 2019-06-14 广东生益科技股份有限公司 一种无卤热固性树脂组合物及使用它的预浸料、印制电路用层压板
CN108117632B (zh) * 2016-11-30 2019-08-23 广东生益科技股份有限公司 一种热固性树脂组合物
CN108117634B (zh) * 2016-11-30 2019-08-27 广东生益科技股份有限公司 一种热固性树脂组合物
CN108164684B (zh) * 2016-12-07 2019-08-27 广东生益科技股份有限公司 一种热固性树脂组合物
WO2019055346A1 (en) 2017-09-13 2019-03-21 Hexion Inc. EPOXY RESIN SYSTEMS
KR102346010B1 (ko) * 2019-09-19 2021-12-31 코오롱인더스트리 주식회사 말단이 불포화기로 캡핑된 인 함유 수지, 이의 제조방법 및 상기 말단이 불포화기로 캡핑된 인 함유 수지를 포함하는 수지 조성물
CN114539313B (zh) * 2022-02-23 2024-04-26 长春市兆兴新材料技术有限责任公司 一种双反应型膦酸酯交联阻燃剂及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2716101A (en) * 1952-09-10 1955-08-23 Eastman Kodak Co Polymeric organo-phosphonates containing phosphato groups
US2682522A (en) * 1952-09-10 1954-06-29 Eastman Kodak Co Process for preparing polymeric organo-phosphonates
FR1438381A (fr) * 1964-03-28 1966-05-13 Gelsenberg Benzin Ag Procédé de préparation de phosphonates contenant des groupes hydroxyle
GB1308521A (en) * 1970-03-23 1973-02-21 Exxon Research Engineering Co Phenolic stabilizers and compositions containing them
IT1019221B (it) † 1973-09-11 1977-11-10 Sumitomo Bakelite Co Composizione di resina termoindu rente inifiammabile e procedi mento per produrla
DE2715589A1 (de) * 1976-04-14 1977-10-27 Ciba Geigy Ag Neue phenol-stabilisatoren
US4268633A (en) * 1978-04-20 1981-05-19 Stauffer Chemical Company Polyurethanes containing a poly (oxyorganophosphate/phosphonate) flame retardant
DE2925207A1 (de) * 1979-06-22 1981-01-29 Bayer Ag Thermoplastische, verzweigte, aromatische polyphosphonate, ihre verwendung und ein verfahren zu ihrer herstellung
DE3139958A1 (de) * 1981-10-08 1983-04-28 Basf Ag, 6700 Ludwigshafen Selbstverloeschende thermoplastische formmassen
DE3520296A1 (de) * 1985-06-07 1986-12-11 Bayer Ag, 5090 Leverkusen Verfahren zur herstellung von copolyphosphonaten mit hoher zaehigkeit
DE3800672A1 (de) * 1988-01-13 1989-07-27 Bayer Ag Flammgeschuetzte polyethylenterephthalatformmassen
DE3833694A1 (de) * 1988-10-04 1990-04-05 Bayer Ag Flammgeschuetzte, gut kristallisierende polyethylenterephthalatformmassen
US4952646A (en) † 1989-07-20 1990-08-28 Akzo America Inc. Epoxy resin compositions containing a polyphosphoric/polyphosphonic anhydride curing agent
FR2660302B1 (fr) * 1990-03-30 1992-08-07 Selas Sa Installation pour le chauffage, le formage et la trempe de feuilles de verre.
GB9007515D0 (en) * 1990-04-03 1990-05-30 Ciba Geigy Ag Products
US6005064A (en) * 1993-12-27 1999-12-21 Hitachi Chemical Company, Ltd. Thermosetting compounds, cured product thereof and method of preparing the thermosetting compound
JPH08183835A (ja) 1994-12-28 1996-07-16 Hitachi Chem Co Ltd 熱硬化性樹脂組成物、接着剤シート及び接着剤付き 金属はく
US6214455B1 (en) * 1995-09-29 2001-04-10 Toshiba Chemical Corporation Bisphenol A and novolak epoxy resins with nitrogen-containing phenolic resin
JP3487083B2 (ja) * 1996-02-09 2004-01-13 日立化成工業株式会社 熱硬化性樹脂組成物及びその硬化物
US6353080B1 (en) † 1997-06-26 2002-03-05 The Dow Chemical Company Flame retardant epoxy resin composition
GB9713526D0 (en) 1997-06-26 1997-09-03 Dow Deutschland Inc Flame retardant laminating formulations
JPH1180178A (ja) * 1997-09-12 1999-03-26 Hitachi Chem Co Ltd リン含有フェノール末端オリゴマー及びその製造法
JP2000226499A (ja) 1998-12-03 2000-08-15 Hitachi Chem Co Ltd 封止用エポキシ樹脂成形材料及び電子部品装置
JP2000256633A (ja) 1999-03-09 2000-09-19 Hitachi Chem Co Ltd 接着剤組成物
JP4353589B2 (ja) * 1999-07-09 2009-10-28 株式会社Ａｄｅｋａ 難燃性エポキシ樹脂組成物
JP2001098273A (ja) * 1999-09-30 2001-04-10 Nippon Chem Ind Co Ltd 難燃剤組成物および難燃性樹脂組成物
JP2001122948A (ja) * 1999-10-28 2001-05-08 Hitachi Chem Co Ltd 難燃性樹脂組成物、プリプレグ及びプリント配線板用積層板
TW587094B (en) 2000-01-17 2004-05-11 Sumitomo Bakelite Co Flame-retardant resin composition comprising no halogen-containing flame retardant, and prepregs and laminates using such composition
US6440567B1 (en) 2000-03-31 2002-08-27 Isola Laminate Systems Corp. Halogen free flame retardant adhesive resin coated composite
JP2001302879A (ja) * 2000-04-25 2001-10-31 Shin Kobe Electric Mach Co Ltd エポキシ樹脂組成物、ならびにそれを用いたプリプレグおよびプリント配線板
JP2002088138A (ja) * 2000-09-14 2002-03-27 Asahi Denka Kogyo Kk エポキシ樹脂組成物
MY142518A (en) 2001-01-10 2010-12-15 Hitachi Chemical Co Ltd Dihydrobenzoxazine ring-containing resin, phenolic-triazine-aldehyde condensate and epoxy resin
MY138485A (en) 2001-03-12 2009-06-30 Hitachi Chemical Co Ltd Process for producing benzoxazine resin
EP1432719A1 (de) * 2001-10-04 2004-06-30 Akzo Nobel N.V. Oligomere, hydroxy-terminierte phosphonate

Also Published As

Publication number Publication date
ATE340220T1 (de) 2006-10-15
KR101169658B1 (ko) 2012-08-03
TW200417575A (en) 2004-09-16
ES2273060T3 (es) 2007-05-01
EP1570000B1 (de) 2006-09-20
ES2359226T3 (es) 2011-05-19
CN1723243A (zh) 2006-01-18
CA2505396A1 (en) 2004-05-27
EP1719802A1 (de) 2006-11-08
AU2003290646A1 (en) 2004-06-03
TWI335926B (en) 2011-01-11
DE60335671D1 (de) 2011-02-17
KR20050087793A (ko) 2005-08-31
EP1570000A1 (de) 2005-09-07
JP2006505679A (ja) 2006-02-16
US7427652B2 (en) 2008-09-23
WO2004044054A1 (en) 2004-05-27
US20060142427A1 (en) 2006-06-29
DE60308548T2 (de) 2007-09-20
CN100402605C (zh) 2008-07-16
EP1719802B1 (de) 2011-01-05
EP1719802B2 (de) 2015-11-25
ATE494329T1 (de) 2011-01-15

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