Nothing Special   »   [go: up one dir, main page]

DE602006016750D1 - Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente - Google Patents

Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente

Info

Publication number
DE602006016750D1
DE602006016750D1 DE200660016750 DE602006016750T DE602006016750D1 DE 602006016750 D1 DE602006016750 D1 DE 602006016750D1 DE 200660016750 DE200660016750 DE 200660016750 DE 602006016750 T DE602006016750 T DE 602006016750T DE 602006016750 D1 DE602006016750 D1 DE 602006016750D1
Authority
DE
Germany
Prior art keywords
production
electronic component
dielectric sheet
multilayer electronic
compound dielectric
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
DE200660016750
Other languages
English (en)
Inventor
Tomoaki Onoue
Norihiro Yoshikawa
Yasunori Hioki
Ichiro Nakamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of DE602006016750D1 publication Critical patent/DE602006016750D1/de
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L29/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical; Compositions of hydrolysed polymers of esters of unsaturated alcohols with saturated carboxylic acids; Compositions of derivatives of such polymers
    • C08L29/14—Homopolymers or copolymers of acetals or ketals obtained by polymerisation of unsaturated acetals or ketals or by after-treatment of polymers of unsaturated alcohols
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/446—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from vinylacetals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/20—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06
    • H01G4/206—Dielectrics using combinations of dielectrics from more than one of groups H01G4/02 - H01G4/06 inorganic and synthetic material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0239—Coupling agent for particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/25—Web or sheet containing structurally defined element or component and including a second component containing structurally defined particles
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/29—Coated or structually defined flake, particle, cell, strand, strand portion, rod, filament, macroscopic fiber or mass thereof
    • Y10T428/2982—Particulate matter [e.g., sphere, flake, etc.]
    • Y10T428/2984—Microcapsule with fluid core [includes liposome]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31515—As intermediate layer
    • Y10T428/31522—Next to metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Inorganic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Inorganic Insulating Materials (AREA)
  • Organic Insulating Materials (AREA)
DE200660016750 2005-03-23 2006-02-01 Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente Active DE602006016750D1 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005083747 2005-03-23
PCT/JP2006/301621 WO2006100833A1 (ja) 2005-03-23 2006-02-01 複合誘電体シートおよびその製造方法ならびに積層型電子部品

Publications (1)

Publication Number Publication Date
DE602006016750D1 true DE602006016750D1 (de) 2010-10-21

Family

ID=37023521

Family Applications (1)

Application Number Title Priority Date Filing Date
DE200660016750 Active DE602006016750D1 (de) 2005-03-23 2006-02-01 Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente

Country Status (5)

Country Link
US (1) US7635519B2 (de)
EP (1) EP1863038B1 (de)
JP (1) JP4697226B2 (de)
DE (1) DE602006016750D1 (de)
WO (1) WO2006100833A1 (de)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4893396B2 (ja) * 2007-03-16 2012-03-07 株式会社村田製作所 誘電体フィルムおよびそれを用いた電子部品
GB0706638D0 (en) 2007-04-04 2007-05-16 Mbda Uk Ltd A high-dielectric material
WO2010101170A1 (ja) 2009-03-05 2010-09-10 株式会社村田製作所 フィルムコンデンサ用誘電体樹脂組成物およびその製造方法、ならびにフィルムコンデンサ
EP2415834B1 (de) 2009-04-03 2018-09-05 Murata Manufacturing Co., Ltd. Dielektrische harzzusammensetzung zur verwendung in filmkondensatoren und filmkondensator
KR20110065623A (ko) * 2009-12-10 2011-06-16 삼성전기주식회사 적층 세라믹 커패시터
CN103250243B (zh) 2010-12-16 2016-04-27 三菱电机株式会社 半导体装置
JP5588383B2 (ja) * 2011-03-17 2014-09-10 積水化学工業株式会社 セラミックスラリー組成物及びセラミックグリーンシート
JP2012248622A (ja) * 2011-05-26 2012-12-13 Taiyo Yuden Co Ltd チップ状電子部品
JP5794380B2 (ja) * 2012-02-29 2015-10-14 株式会社村田製作所 フィルムコンデンサ用誘電体樹脂組成物
US9465317B2 (en) 2013-02-25 2016-10-11 Ricoh Company, Ltd. Nozzle insertion member, powder container, and image forming apparatus
KR101514512B1 (ko) * 2013-04-08 2015-04-22 삼성전기주식회사 적층 세라믹 커패시터 및 그 제조방법
MY182641A (en) * 2014-01-17 2021-01-27 Shoei Chemical Ind Co Method for producing binder resin, method for producing resin composition, binder resin, and resin composition
US8971017B1 (en) * 2014-10-30 2015-03-03 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
CN105163490B (zh) * 2015-08-17 2017-11-07 广东欧珀移动通信有限公司 一种多功能元器件
KR102653211B1 (ko) * 2016-07-13 2024-04-01 삼성전기주식회사 필름 커패시터
WO2020189560A1 (ja) * 2019-03-15 2020-09-24 株式会社村田製作所 モジュール
JP6870778B1 (ja) * 2020-12-11 2021-05-12 昭和電工マテリアルズ株式会社 成形用樹脂組成物及び電子部品装置
CN114255908B (zh) * 2022-03-01 2022-05-17 西安宏星电子浆料科技股份有限公司 一种耐酸碱盐雾性介质浆料及其制备方法

Family Cites Families (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2917416A (en) * 1955-10-25 1959-12-15 Shawinigan Resins Corp Polyvinyl acetal-phenol aldehyde resin wire enamel and method of using same
US3412354A (en) * 1963-02-18 1968-11-19 Westinghouse Electric Corp Adhesive coated electrical conductors
IT1113513B (it) * 1977-03-16 1986-01-20 Pirelli Perfezionamento relativo ai cavi per energia
JPH0619577B2 (ja) * 1983-08-03 1994-03-16 東レ株式会社 導電性シ−トおよびそれを用いた静電記録体
US4719255A (en) * 1984-08-23 1988-01-12 Kabushiki Kaisha Toshiba Epoxy resin composition for encapsulation of semi-conductor device
JPH02216708A (ja) * 1988-04-11 1990-08-29 Fuji Photo Film Co Ltd 導電性皮膜
JPH03208324A (ja) 1990-01-11 1991-09-11 Tokin Corp セラミック複合体コンデンサの製造方法
EP0440227B1 (de) * 1990-02-02 1997-07-23 Mitsubishi Chemical Corporation Bildempfangsschicht für thermische Übertragungsaufzeichnung
US5275878A (en) * 1990-02-06 1994-01-04 Matsushita Electric Works, Ltd. Composite dielectric and printed-circuit use substrate utilizing the same
JPH04325453A (ja) * 1991-04-26 1992-11-13 Murata Mfg Co Ltd セラミックグリーンシートの製造方法
JPH0652716A (ja) 1992-07-28 1994-02-25 Matsushita Electric Works Ltd 複合誘電体および回路用基板
US5462911A (en) * 1993-09-24 1995-10-31 Dai Nippon Printing Co., Ltd. Thermal transfer image-receiving sheet
US5707729A (en) * 1994-09-13 1998-01-13 Mitsui Mining & Smelting Co., Ltd. Adhesive for copper foils and adhesive-backed copper foil
ID19337A (id) * 1996-12-26 1998-07-02 Ajinomoto Kk Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini
TW359642B (en) * 1997-04-21 1999-06-01 Toray Industries Resin composition for fiber-reinforced complex material, prepreg and fiber-reinforced complex material
EP0989172A1 (de) * 1998-09-24 2000-03-29 Hitachi Chemical Co., Ltd. Kleber für metallische Folien, mit diesem Kleber überzogene metallische Folie, mit der metallischen Folie überzogene Schichtplatte und daraus hergestellte Erzeugnisse
JP2000186133A (ja) * 1998-12-22 2000-07-04 Mitsui Chemicals Inc エポキシ樹脂組成物およびその用途
JP2000265013A (ja) * 1999-03-15 2000-09-26 Sumitomo Bakelite Co Ltd 難燃架橋樹脂組成物及びその電線・ケーブル
JP2000294447A (ja) 1999-04-09 2000-10-20 Unitika Ltd フィルムコンデンサ用高誘電率フィルムおよびその製造方法
JP4423779B2 (ja) * 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP3412585B2 (ja) * 1999-11-25 2003-06-03 松下電工株式会社 プリント配線板及び多層プリント配線板の製造に用いられるプリプレグ用エポキシ樹脂組成物、プリプレグ、多層プリント配線板
CN1164527C (zh) * 2000-07-28 2004-09-01 株式会社村田制作所 陶瓷糊浆组合物、陶瓷成形体和陶瓷电子元件
TW559835B (en) * 2000-12-08 2003-11-01 Sekisui Chemical Co Ltd Material for insulating substrate
JP2002179772A (ja) * 2000-12-08 2002-06-26 Mitsui Mining & Smelting Co Ltd プリント配線板の層間絶縁層構成用の樹脂化合物、その樹脂化合物を用いた絶縁層形成用樹脂シート及び樹脂付銅箔、並びにそれらを用いた銅張積層板
JP2002212390A (ja) * 2001-01-19 2002-07-31 Hitachi Chem Co Ltd 絶縁樹脂組成物、銅箔付き絶縁材および銅張積層板
JP4207517B2 (ja) * 2002-09-24 2009-01-14 凸版印刷株式会社 素子内蔵基板
US6936644B2 (en) * 2002-10-16 2005-08-30 Cookson Electronics, Inc. Releasable microcapsule and adhesive curing system using the same
KR20050093808A (ko) * 2002-12-27 2005-09-23 티디케이가부시기가이샤 수지조성물, 수지경화물, 시트형상 수지경화물, 적층체,프리프레그, 전자부품 및 다층기판
JP4238124B2 (ja) * 2003-01-07 2009-03-11 積水化学工業株式会社 硬化性樹脂組成物、接着性エポキシ樹脂ペースト、接着性エポキシ樹脂シート、導電接続ペースト、導電接続シート及び電子部品接合体
JP4345324B2 (ja) * 2003-03-04 2009-10-14 株式会社村田製作所 積層セラミックコンデンサの製造方法
TWI335347B (en) * 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
JP2005248048A (ja) * 2004-03-05 2005-09-15 Shin Etsu Chem Co Ltd 難燃性接着剤組成物、ならびにそれを用いた接着シート、カバーレイフィルムおよびフレキシブル銅張積層板
US7211359B2 (en) * 2004-04-30 2007-05-01 Eastman Kodak Company Coating solution containing cocrystals and or crystals of a charge-generation pigment or a mixture of charge-generation pigments
TW200621831A (en) * 2004-11-16 2006-07-01 Hitachi Chemical Co Ltd Prepreg and laminate and printed wiring board using the same

Also Published As

Publication number Publication date
JPWO2006100833A1 (ja) 2008-08-28
JP4697226B2 (ja) 2011-06-08
WO2006100833A1 (ja) 2006-09-28
US7635519B2 (en) 2009-12-22
EP1863038A1 (de) 2007-12-05
EP1863038B1 (de) 2010-09-08
US20080014430A1 (en) 2008-01-17
EP1863038A4 (de) 2009-08-12

Similar Documents

Publication Publication Date Title
DE602006016750D1 (de) Zusammengesetztes dielektrisches blatt, verfahren zu seiner herstellung und mehrschichtige elektronische komponente
DE602005021303D1 (de) Elektronische Schaltungsanordnung und Verfahren zu deren Herstellung.
TWI371997B (en) Printed wiring board and method for manufacturing the same
DE602006012283D1 (de) Integrierte schaltung und verfahren zu ihrer herstellung
DE602008005947D1 (de) Leiterplatte und Verfahren zu deren Herstellung
EP1945013A4 (de) Mehrschichtige leiterplatte und herstellungsverfahren dafür
EP2068605A4 (de) Leiterplatte
EP1830615A4 (de) Mehrschichtige leiterplatte und verfahren zu ihrer herstellung
HK1135556A1 (en) Printed wiring board and method for manufacturing the same
DE602005020467D1 (de) Dielektrische luneberglinse und verfahren zu ihrer herstellung
EP2071907A4 (de) Flex-rigid-leiterplatte und verfahren zur herstellung der flex-rigid-leiterplatte
ATE556077T1 (de) Tetrahydrochinolinderivate und verfahren zu deren herstellung
FI20050645A0 (fi) Menetelmä piirilevyrakenteen valmistamiseksi ja piirilevyrakenne
DE602006012666D1 (de) Ren eignen und verfahren zu deren herstellung
FI20050646A0 (fi) Piirilevyrakenne ja menetelmä piirilevyrakenteen valmistamiseksi
EP2280594A4 (de) Leiterplatte und verfahren zu ihrer herstellung
ATE423166T1 (de) Pflanzliches-öl-stärkepfropfcopolymere und ihre biofaserverbundwerkstoffe und verfahren zu ihrer herstellung
EP1951016A4 (de) Flex-starre leiterplatte und herstellungsverfahren dafür
EP2157842A4 (de) Laminierte leiterplatte und verfahren zu ihrer herstellung
EP1884967A4 (de) Mehrschichtige keramik-elektronikkomponente und verfahren zu deren herstellung
EP1954112A4 (de) Verfahren zur herstellung einer mehrschichtigen leiterplatte, schaltungsplatte und verfahren zur herstellung der schaltungsplatte
EP1876610A4 (de) Dünnfilmkondensator und verfahren zu seiner herstellung
GB0724097D0 (en) Method for manufacturing a circuit board structure, and a circuit board structure
DE602005007419D1 (de) Rohmix-pulverzusammensetzungen und verfahren zu deren herstellung
EP2141971A4 (de) Mehrschichtige leiterplatte und verfahren zu ihrer herstellung