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ID19337A - Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini - Google Patents

Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini

Info

Publication number
ID19337A
ID19337A IDP973913A ID973913A ID19337A ID 19337 A ID19337 A ID 19337A ID P973913 A IDP973913 A ID P973913A ID 973913 A ID973913 A ID 973913A ID 19337 A ID19337 A ID 19337A
Authority
ID
Indonesia
Prior art keywords
cables
film
mold
platin
inter
Prior art date
Application number
IDP973913A
Other languages
English (en)
Inventor
Shigeo Nakamura
Tadahiko Yokota
Original Assignee
Ajinomoto Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ajinomoto Kk filed Critical Ajinomoto Kk
Publication of ID19337A publication Critical patent/ID19337A/id

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H05K3/4655—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern by using a laminate characterized by the insulating layer
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4661—Adding a circuit layer by direct wet plating, e.g. electroless plating; insulating materials adapted therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0212—Resin particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0335—Layered conductors or foils
    • H05K2201/0355—Metal foils
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/066—Transfer laminating of insulating material, e.g. resist as a whole layer, not as a pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
    • H05K2203/0773—Dissolving the filler without dissolving the matrix material; Dissolving the matrix material without dissolving the filler
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4673—Application methods or materials of intermediate insulating layers not specially adapted to any one of the previous methods of adding a circuit layer
    • H05K3/4676—Single layer compositions
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/287—Adhesive compositions including epoxy group or epoxy polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
IDP973913A 1996-12-26 1997-12-18 Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini ID19337A (id)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP34844896 1996-12-26
JP16863297 1997-06-25
JP18823597 1997-07-14

Publications (1)

Publication Number Publication Date
ID19337A true ID19337A (id) 1998-07-02

Family

ID=27323035

Family Applications (1)

Application Number Title Priority Date Filing Date
IDP973913A ID19337A (id) 1996-12-26 1997-12-18 Film perekat antar-pelapis untuk papan pembuat kabel cetakan berlapis-banyak dan papan kabel cetakan berlapis-banyak memakai film ini

Country Status (7)

Country Link
US (3) US6376053B1 (id)
EP (1) EP0851726B1 (id)
KR (1) KR100435607B1 (id)
DE (1) DE69735799T2 (id)
ID (1) ID19337A (id)
MY (1) MY117878A (id)
TW (1) TW432907B (id)

Families Citing this family (40)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3785749B2 (ja) * 1997-04-17 2006-06-14 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた多層プリント配線板の製造法
EP1009206A3 (en) 1998-12-02 2003-01-15 Ajinomoto Co., Inc. Method of vacuum-laminating adhesive film
DE60022874T2 (de) 1999-04-22 2006-07-13 Ajinomoto Co., Inc. Härtbare harzzusammensetzung und flexibles beschichtungsmaterial für stromkreis das diese zusammensetzung beinhaltet
US7059049B2 (en) * 1999-07-02 2006-06-13 International Business Machines Corporation Electronic package with optimized lamination process
JP4423779B2 (ja) 1999-10-13 2010-03-03 味の素株式会社 エポキシ樹脂組成物並びに該組成物を用いた接着フィルム及びプリプレグ、及びこれらを用いた多層プリント配線板及びその製造法
JP4300687B2 (ja) * 1999-10-28 2009-07-22 味の素株式会社 接着フィルムを用いた多層プリント配線板の製造法
JP2001121667A (ja) * 1999-10-28 2001-05-08 Ajinomoto Co Inc 接着フィルムの真空積層装置及び真空積層法
US6944945B1 (en) * 2000-05-12 2005-09-20 Shipley Company, L.L.C. Sequential build circuit board
KR20030014374A (ko) * 2000-06-15 2003-02-17 아지노모토 가부시키가이샤 접착 필름 및 이를 사용하는 다층 프린트 배선판의 제조방법
JP4038363B2 (ja) * 2000-12-25 2008-01-23 日本特殊陶業株式会社 配線基板
US6770965B2 (en) * 2000-12-28 2004-08-03 Ngk Spark Plug Co., Ltd. Wiring substrate using embedding resin
US6740411B2 (en) * 2001-02-21 2004-05-25 Ngk Spark Plug Co. Ltd. Embedding resin, wiring substrate using same and process for producing wiring substrate using same
US20020130103A1 (en) * 2001-03-15 2002-09-19 Zimmerman Scott M. Polyimide adhesion enhancement to polyimide film
KR100380722B1 (ko) * 2001-06-12 2003-04-18 삼성전기주식회사 접착강도가 개선된 절연필름 및 이를 포함하는 기판
KR100970105B1 (ko) * 2001-11-30 2010-07-20 아지노모토 가부시키가이샤 회로 기판의 적층방법 및 절연층의 형성방법, 다층 프린트배선판 및 이의 제조방법 및 다층 프린트 배선판용 접착필름
KR101001429B1 (ko) 2002-03-05 2010-12-14 히다치 가세고교 가부시끼가이샤 수지 부착 금속박, 그를 이용한 프린트 배선판 및 그의 제조 방법
TWI335347B (en) * 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
TWI321975B (en) * 2003-06-27 2010-03-11 Ajinomoto Kk Resin composition and adhesive film for multi-layered printed wiring board
US20050199094A1 (en) * 2003-09-09 2005-09-15 Noble Fiber Technologies, Inc. Method of producing metal-containing particles
WO2006031229A1 (en) * 2004-09-10 2006-03-23 Noble Fiber Technologies, Inc. Method of producing metal-containing particles
TW200533692A (en) * 2003-11-06 2005-10-16 Showa Denko Kk Curable polyester having an oxetanyl group at end and process for preparing the same, resist composition, jet printing ink composition, curing methods and uses thereof
US20050186434A1 (en) * 2004-01-28 2005-08-25 Ajinomoto Co., Inc. Thermosetting resin composition, adhesive film and multilayer printed wiring board using same
JP4846572B2 (ja) * 2004-05-27 2011-12-28 イビデン株式会社 多層プリント配線板
US20060141211A1 (en) * 2004-12-23 2006-06-29 Insight Electronic Group Inc. Highly heat-transferring substrate and process of manufacturing the same
JP4697226B2 (ja) * 2005-03-23 2011-06-08 株式会社村田製作所 複合誘電体シートおよびその製造方法ならびに積層型電子部品
JP4634856B2 (ja) * 2005-05-12 2011-02-16 利昌工業株式会社 白色プリプレグ、白色積層板、及び金属箔張り白色積層板
US7829188B2 (en) * 2006-04-03 2010-11-09 E.I. Du Pont De Nemours And Company Filled epoxy compositions
KR101386373B1 (ko) * 2006-10-06 2014-04-16 스미토모 베이클리트 컴퍼니 리미티드 수지 조성물, 기재부착 절연 시트, 프리프레그, 다층 프린트 배선판 및 반도체 장치
JP5311772B2 (ja) * 2007-06-27 2013-10-09 デクセリアルズ株式会社 接着フィルム
KR101530874B1 (ko) * 2007-09-11 2015-06-23 아지노모토 가부시키가이샤 다층 프린트 배선판의 제조 방법
JP2011501473A (ja) * 2007-10-26 2011-01-06 イー・アイ・デュポン・ドウ・ヌムール・アンド・カンパニー 多層チップキャリアおよび製造方法
US20090110909A1 (en) * 2007-10-26 2009-04-30 E. I. Dupont De Nemours And Company Asymmetric dielectric film
TW201204548A (en) * 2010-02-05 2012-02-01 Sumitomo Bakelite Co Prepreg, laminate, printed wiring board, and semiconductor device
JP5915301B2 (ja) * 2011-03-30 2016-05-11 住友ベークライト株式会社 積層シートの製造方法および積層シート製造装置
KR101894387B1 (ko) * 2012-05-22 2018-09-04 해성디에스 주식회사 인쇄회로기판 및 그의 제조 방법
JP6322885B2 (ja) * 2012-11-01 2018-05-16 味の素株式会社 プリント配線板の製造方法
US9890306B2 (en) * 2014-05-28 2018-02-13 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in in high density printheads
US10150898B2 (en) 2014-05-28 2018-12-11 Xerox Corporation Use of epoxy film adhesive with high ink compatibility and thermal oxidative stability for printhead interstitial bonding in high density printheads
TWI574595B (zh) * 2015-10-28 2017-03-11 財團法人工業技術研究院 多層線路的製作方法與多層線路結構
TWI563886B (en) * 2015-10-28 2016-12-21 Ind Tech Res Inst Insulating colloidal material and multilayer circuit structure

Family Cites Families (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3637385A (en) * 1969-02-05 1972-01-25 Staley Mfg Co A E Solid deformation imaging
US4054483A (en) * 1976-12-22 1977-10-18 E. I. Du Pont De Nemours And Company Additives process for producing plated holes in printed circuit elements
US4283243A (en) * 1978-10-24 1981-08-11 E. I. Du Pont De Nemours And Company Use of photosensitive stratum to create through-hole connections in circuit boards
US4511757A (en) * 1983-07-13 1985-04-16 At&T Technologies, Inc. Circuit board fabrication leading to increased capacity
US4775611A (en) * 1983-11-10 1988-10-04 Sullivan Donald F Additive printed circuit boards with flat surface and indented primary wiring conductors
US4689110A (en) * 1983-12-22 1987-08-25 Trw Inc. Method of fabricating multilayer printed circuit board structure
DE3674034D1 (de) * 1985-03-27 1990-10-18 Ibiden Co Ltd Substrate fuer elektronische schaltungen.
GB8707929D0 (en) * 1987-04-02 1987-05-07 Int Computers Ltd Printed circuit boards
US4994347A (en) * 1988-01-15 1991-02-19 E. I. Du Pont De Nemours And Company Storage stable photopolymerizable composition and element for refractive index imaging
US4866108A (en) * 1988-01-19 1989-09-12 Hughes Aircraft Company Flexible epoxy adhesive blend
US5309632A (en) * 1988-03-28 1994-05-10 Hitachi Chemical Co., Ltd. Process for producing printed wiring board
US4985294A (en) 1988-08-25 1991-01-15 The Yokohama Rubber Co., Ltd. Printed wiring board
US4987044A (en) * 1989-05-31 1991-01-22 E. I. Du Pont De Nemours And Company Method and apparatus for maintaining desired exposure levels
JPH04112596A (ja) * 1990-08-31 1992-04-14 Matsushita Electric Ind Co Ltd 多層プリント配線板の製造方法
JP2739726B2 (ja) * 1990-09-27 1998-04-15 インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン 多層プリント回路板
JPH04168794A (ja) * 1990-10-31 1992-06-16 Sharp Corp 多層プリント配線板の製造方法
JP3029487B2 (ja) * 1991-05-13 2000-04-04 住友ベークライト株式会社 銅張積層板の製造方法
JPH057094A (ja) 1991-06-14 1993-01-14 Yokohama Rubber Co Ltd:The 多層プリント配線板用シールド板の製造方法
JPH0517604A (ja) * 1991-07-12 1993-01-26 Nissan Chem Ind Ltd ポリイミド樹脂のエツチング溶液
US5153050A (en) * 1991-08-27 1992-10-06 Johnston James A Component of printed circuit boards
JP2560948B2 (ja) * 1992-03-13 1996-12-04 東亞合成株式会社 ブラインドホールを有する多層プリント配線板の製造方法
GB2259812B (en) * 1991-09-06 1996-04-24 Toa Gosei Chem Ind Method for making multilayer printed circuit board having blind holes and resin-coated copper foil used for the method
JPH05136575A (ja) 1991-11-14 1993-06-01 Hitachi Ltd 多層プリント板用光硬化型層間絶縁フイルム及び多層プリント板の製造方法
DE69318369T2 (de) * 1992-10-22 1999-01-28 Ajinomoto Co., Inc., Tokio/Tokyo Polythiol-Epoxidharz-Mischung mit längerer Verarbeitungszeit
US5350621A (en) * 1992-11-30 1994-09-27 Allied-Signal Inc. System of electronic laminates with improved registration properties
US5453450A (en) * 1993-06-16 1995-09-26 Minnesota Mining And Manufacturing Company Stabilized curable adhesives
JPH07111386A (ja) * 1993-10-12 1995-04-25 Hitachi Ltd 多層配線基板およびその製造方法
JPH07193373A (ja) 1993-12-27 1995-07-28 Ibiden Co Ltd 多層プリント配線板及び接着用シート
JPH07202428A (ja) 1993-12-28 1995-08-04 Matsushita Electric Ind Co Ltd 多層回路基板の製造方法
JP3329922B2 (ja) 1993-12-28 2002-09-30 住友ベークライト株式会社 多層プリント配線板用層間接着剤、該接着剤付き銅箔及びこれを用いた多層プリント配線板の製造方法
JPH0841140A (ja) * 1994-07-28 1996-02-13 Toyobo Co Ltd 着色ポリエステル系樹脂微粒子
JP3685507B2 (ja) 1994-08-17 2005-08-17 住友ベークライト株式会社 多層プリント配線板の製造方法
JP3373058B2 (ja) 1994-08-22 2003-02-04 住友ベークライト株式会社 多層プリント配線板の製造方法
JPH08236945A (ja) 1994-12-02 1996-09-13 Nippon Paint Co Ltd 多層基板の製造方法
JPH08157866A (ja) * 1994-12-06 1996-06-18 Lion Corp 液体洗浄剤組成物
JP2908258B2 (ja) * 1994-12-07 1999-06-21 住友ベークライト株式会社 光・熱硬化型アンダーコート材及び多層プリント配線板の製造方法
JPH08204296A (ja) 1995-01-20 1996-08-09 Hitachi Chem Co Ltd マルチワイヤ配線板およびその製造方法
JPH08316642A (ja) 1995-05-19 1996-11-29 Toagosei Co Ltd インタースティシャルバイアホールを有する多層プリント配線板およびその製造方法
JP3624967B2 (ja) * 1995-06-01 2005-03-02 日立化成工業株式会社 多層プリント配線板の製造方法
JP2830820B2 (ja) 1996-02-28 1998-12-02 日立エーアイシー株式会社 多層プリント配線板および多層プリント配線板の製造方法
JPH10314670A (ja) * 1997-05-15 1998-12-02 Kansai Paint Co Ltd 複層塗膜形成方法

Also Published As

Publication number Publication date
EP0851726B1 (en) 2006-05-03
MY117878A (en) 2004-08-30
DE69735799D1 (de) 2006-06-08
US20020076539A1 (en) 2002-06-20
KR100435607B1 (ko) 2005-01-24
DE69735799T2 (de) 2007-05-10
US20050178501A1 (en) 2005-08-18
EP0851726A2 (en) 1998-07-01
US6376053B1 (en) 2002-04-23
TW432907B (en) 2001-05-01
EP0851726A3 (en) 1999-07-07
KR19980064561A (ko) 1998-10-07
US6881293B2 (en) 2005-04-19

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