DE60030369D1 - Rechner integrierte Fertigungstechniken - Google Patents
Rechner integrierte FertigungstechnikenInfo
- Publication number
- DE60030369D1 DE60030369D1 DE60030369T DE60030369T DE60030369D1 DE 60030369 D1 DE60030369 D1 DE 60030369D1 DE 60030369 T DE60030369 T DE 60030369T DE 60030369 T DE60030369 T DE 60030369T DE 60030369 D1 DE60030369 D1 DE 60030369D1
- Authority
- DE
- Germany
- Prior art keywords
- manufacturing techniques
- computer integrated
- integrated manufacturing
- computer
- techniques
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41845—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by system universality, reconfigurability, modularity
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31018—Virtual factory, modules in network, can be selected and combined at will
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/31—From computer integrated manufacturing till monitoring
- G05B2219/31202—Semiconductor equipment communication standard SECS
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45026—Circuit board, pcb
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/80—Management or planning
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Quality & Reliability (AREA)
- General Engineering & Computer Science (AREA)
- Automation & Control Theory (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US363966 | 1999-07-29 | ||
| US09/363,966 US7069101B1 (en) | 1999-07-29 | 1999-07-29 | Computer integrated manufacturing techniques |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| DE60030369D1 true DE60030369D1 (de) | 2006-10-12 |
| DE60030369T2 DE60030369T2 (de) | 2007-08-30 |
Family
ID=23432479
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| DE60030369T Expired - Lifetime DE60030369T2 (de) | 1999-07-29 | 2000-07-19 | Rechner integrierte Fertigungstechniken |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US7069101B1 (de) |
| EP (1) | EP1072967B1 (de) |
| JP (1) | JP2001143981A (de) |
| KR (1) | KR100779436B1 (de) |
| DE (1) | DE60030369T2 (de) |
| SG (1) | SG85207A1 (de) |
| TW (1) | TW514771B (de) |
Families Citing this family (135)
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| US6708075B2 (en) * | 2001-11-16 | 2004-03-16 | Advanced Micro Devices | Method and apparatus for utilizing integrated metrology data as feed-forward data |
| US6515368B1 (en) * | 2001-12-07 | 2003-02-04 | Advanced Micro Devices, Inc. | Semiconductor device with copper-filled via includes a copper-zinc/alloy film for reduced electromigration of copper |
| US6528409B1 (en) * | 2002-04-29 | 2003-03-04 | Advanced Micro Devices, Inc. | Interconnect structure formed in porous dielectric material with minimized degradation and electromigration |
| US6735492B2 (en) * | 2002-07-19 | 2004-05-11 | International Business Machines Corporation | Feedback method utilizing lithographic exposure field dimensions to predict process tool overlay settings |
-
1999
- 1999-07-29 US US09/363,966 patent/US7069101B1/en not_active Expired - Fee Related
-
2000
- 2000-07-19 EP EP00115577A patent/EP1072967B1/de not_active Expired - Lifetime
- 2000-07-19 DE DE60030369T patent/DE60030369T2/de not_active Expired - Lifetime
- 2000-07-21 TW TW089114674A patent/TW514771B/zh not_active IP Right Cessation
- 2000-07-27 SG SG200004286A patent/SG85207A1/en unknown
- 2000-07-29 KR KR1020000043981A patent/KR100779436B1/ko not_active IP Right Cessation
- 2000-07-31 JP JP2000231003A patent/JP2001143981A/ja active Pending
-
2002
- 2002-02-28 US US10/084,092 patent/US7174230B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001143981A (ja) | 2001-05-25 |
| EP1072967A2 (de) | 2001-01-31 |
| US7174230B2 (en) | 2007-02-06 |
| EP1072967B1 (de) | 2006-08-30 |
| US20020156548A1 (en) | 2002-10-24 |
| KR20010030038A (ko) | 2001-04-16 |
| DE60030369T2 (de) | 2007-08-30 |
| KR100779436B1 (ko) | 2007-11-26 |
| EP1072967A3 (de) | 2001-11-21 |
| US7069101B1 (en) | 2006-06-27 |
| TW514771B (en) | 2002-12-21 |
| SG85207A1 (en) | 2003-11-27 |
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