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DE112022004440A5 - Laserbauelement und verfahren zur herstellung eines laserbauelements - Google Patents

Laserbauelement und verfahren zur herstellung eines laserbauelements Download PDF

Info

Publication number
DE112022004440A5
DE112022004440A5 DE112022004440.3T DE112022004440T DE112022004440A5 DE 112022004440 A5 DE112022004440 A5 DE 112022004440A5 DE 112022004440 T DE112022004440 T DE 112022004440T DE 112022004440 A5 DE112022004440 A5 DE 112022004440A5
Authority
DE
Germany
Prior art keywords
laser component
producing
laser
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112022004440.3T
Other languages
English (en)
Inventor
Tobias Haupeltshofer
Markus Reinhard Horn
Christoph Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Ams Osram International GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ams Osram International GmbH filed Critical Ams Osram International GmbH
Publication of DE112022004440A5 publication Critical patent/DE112022004440A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4087—Array arrangements, e.g. constituted by discrete laser diodes or laser bar emitting more than one wavelength
    • H01S5/4093—Red, green and blue [RGB] generated directly by laser action or by a combination of laser action with nonlinear frequency conversion
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/023—Mount members, e.g. sub-mount members
    • H01S5/02325—Mechanically integrated components on mount members or optical micro-benches
    • H01S5/02326—Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02469—Passive cooling, e.g. where heat is removed by the housing as a whole or by a heat pipe without any active cooling element like a TEC
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/0234—Up-side down mountings, e.g. Flip-chip, epi-side down mountings or junction down mountings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0233—Mounting configuration of laser chips
    • H01S5/02345—Wire-bonding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/022—Mountings; Housings
    • H01S5/0235—Method for mounting laser chips
    • H01S5/02355—Fixing laser chips on mounts
    • H01S5/0237—Fixing laser chips on mounts by soldering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/02—Structural details or components not essential to laser action
    • H01S5/024—Arrangements for thermal management
    • H01S5/02476—Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S5/00—Semiconductor lasers
    • H01S5/40—Arrangement of two or more semiconductor lasers, not provided for in groups H01S5/02 - H01S5/30
    • H01S5/4025—Array arrangements, e.g. constituted by discrete laser diodes or laser bar
    • H01S5/4031—Edge-emitting structures
    • H01S5/4043—Edge-emitting structures with vertically stacked active layers
    • H01S5/405—Two-dimensional arrays

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Semiconductor Lasers (AREA)
DE112022004440.3T 2021-12-02 2022-11-28 Laserbauelement und verfahren zur herstellung eines laserbauelements Pending DE112022004440A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102021131795.9 2021-12-02
DE102021131795.9A DE102021131795A1 (de) 2021-12-02 2021-12-02 Laserbauelement und verfahren zur herstellung eines laserbauelements
PCT/EP2022/083449 WO2023099391A1 (de) 2021-12-02 2022-11-28 Laserbauelement und verfahren zur herstellung eines laserbauelements

Publications (1)

Publication Number Publication Date
DE112022004440A5 true DE112022004440A5 (de) 2024-07-25

Family

ID=84487836

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102021131795.9A Withdrawn DE102021131795A1 (de) 2021-12-02 2021-12-02 Laserbauelement und verfahren zur herstellung eines laserbauelements
DE112022004440.3T Pending DE112022004440A5 (de) 2021-12-02 2022-11-28 Laserbauelement und verfahren zur herstellung eines laserbauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102021131795.9A Withdrawn DE102021131795A1 (de) 2021-12-02 2021-12-02 Laserbauelement und verfahren zur herstellung eines laserbauelements

Country Status (3)

Country Link
CN (1) CN118435477A (de)
DE (2) DE102021131795A1 (de)
WO (1) WO2023099391A1 (de)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3486900B2 (ja) * 2000-02-15 2004-01-13 ソニー株式会社 発光装置およびそれを用いた光装置
JP2006278576A (ja) * 2005-03-28 2006-10-12 Sanyo Electric Co Ltd 半導体レーザ装置、半導体レーザ装置の製造方法および光ピックアップ装置
US8064492B2 (en) * 2009-01-26 2011-11-22 Sanyo Electric Co., Ltd. Method of manufacturing semiconductor laser device, semiconductor laser device and light apparatus
JP2011014624A (ja) * 2009-06-30 2011-01-20 Sanyo Electric Co Ltd 半導体レーザ素子の製造方法および半導体レーザ素子
DE102009047791B4 (de) 2009-09-30 2019-01-03 Osram Opto Semiconductors Gmbh RGB-Laserlichtquelle
WO2011105136A1 (ja) * 2010-02-25 2011-09-01 三洋電機株式会社 半導体レーザ装置及び光装置
DE102013223110A1 (de) 2013-11-13 2015-05-28 Osram Opto Semiconductors Gmbh Laserbauelement und Verfahren zu seiner Herstellung
DE102015116092B4 (de) 2015-09-23 2018-06-14 Osram Opto Semiconductors Gmbh Verfahren zum Herstellen eines optoelektronischen Bauelements
DE102016113470A1 (de) * 2016-07-21 2018-01-25 Osram Opto Semiconductors Gmbh Laserbauelement
JP2022549941A (ja) * 2019-09-30 2022-11-29 エイエムエス－オスラム インターナショナル ゲーエムベーハー レーザーパッケージおよびレーザーパッケージを備えたシステム

Also Published As

Publication number Publication date
CN118435477A (zh) 2024-08-02
WO2023099391A1 (de) 2023-06-08
DE102021131795A1 (de) 2023-06-07

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