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DE112020000393A5 - Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements - Google Patents

Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements Download PDF

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Publication number
DE112020000393A5
DE112020000393A5 DE112020000393.0T DE112020000393T DE112020000393A5 DE 112020000393 A5 DE112020000393 A5 DE 112020000393A5 DE 112020000393 T DE112020000393 T DE 112020000393T DE 112020000393 A5 DE112020000393 A5 DE 112020000393A5
Authority
DE
Germany
Prior art keywords
optoelectronic component
manufacturing
optoelectronic
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020000393.0T
Other languages
English (en)
Inventor
Thomas Reeswinkel
Jens Eberhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020000393A5 publication Critical patent/DE112020000393A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/54—Encapsulations having a particular shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/005—Processes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
DE112020000393.0T 2019-01-11 2020-01-09 Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements Pending DE112020000393A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019100612.0 2019-01-11
DE102019100612.0A DE102019100612A1 (de) 2019-01-11 2019-01-11 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
PCT/EP2020/050428 WO2020144280A1 (de) 2019-01-11 2020-01-09 Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Publications (1)

Publication Number Publication Date
DE112020000393A5 true DE112020000393A5 (de) 2021-09-23

Family

ID=69174450

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102019100612.0A Withdrawn DE102019100612A1 (de) 2019-01-11 2019-01-11 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE112020000393.0T Pending DE112020000393A5 (de) 2019-01-11 2020-01-09 Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102019100612.0A Withdrawn DE102019100612A1 (de) 2019-01-11 2019-01-11 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements

Country Status (4)

Country Link
US (1) US20220029074A1 (de)
CN (1) CN113272975A (de)
DE (2) DE102019100612A1 (de)
WO (1) WO2020144280A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11444225B2 (en) * 2020-09-08 2022-09-13 Dominant Opto Technologies Sdn Bhd Light emitting diode package having a protective coating

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100731677B1 (ko) * 2006-04-21 2007-06-22 서울반도체 주식회사 표면처리된 수지 봉지재를 갖는 발광 다이오드 패키지제조방법 및 그것에 의해 제조된 패키지
DE102012201447A1 (de) * 2012-02-01 2013-08-01 Osram Gmbh LED-Modul
JP6033557B2 (ja) * 2012-03-06 2016-11-30 日東電工株式会社 封止シート、および、それを用いた発光ダイオード装置の製造方法
KR101757786B1 (ko) * 2012-05-18 2017-07-14 스미토모 오사카 세멘토 가부시키가이샤 표면수식 금속산화물 입자재료, 분산액, 실리콘 수지 조성물, 실리콘 수지 복합체, 광반도체 발광 장치, 조명 기구 및 액정 화상 장치
JP6476567B2 (ja) * 2013-03-29 2019-03-06 日亜化学工業株式会社 発光装置
KR102188500B1 (ko) * 2014-07-28 2020-12-09 삼성전자주식회사 발광다이오드 패키지 및 이를 이용한 조명장치
JP6536560B2 (ja) * 2016-12-27 2019-07-03 日亜化学工業株式会社 発光装置及びその製造方法
DE102017107957A1 (de) * 2017-04-12 2018-10-18 Osram Opto Semiconductors Gmbh Optoelektronisches Bauelement

Also Published As

Publication number Publication date
US20220029074A1 (en) 2022-01-27
WO2020144280A1 (de) 2020-07-16
CN113272975A (zh) 2021-08-17
DE102019100612A1 (de) 2020-07-16

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