Nothing Special   »   [go: up one dir, main page]

DE112020003641A5 - Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement - Google Patents

Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement Download PDF

Info

Publication number
DE112020003641A5
DE112020003641A5 DE112020003641.3T DE112020003641T DE112020003641A5 DE 112020003641 A5 DE112020003641 A5 DE 112020003641A5 DE 112020003641 T DE112020003641 T DE 112020003641T DE 112020003641 A5 DE112020003641 A5 DE 112020003641A5
Authority
DE
Germany
Prior art keywords
electronic device
manufacturing
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
DE112020003641.3T
Other languages
English (en)
Inventor
Gunnar Petersen
Daniel Richter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ams Osram International GmbH
Original Assignee
Osram Opto Semiconductors GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Osram Opto Semiconductors GmbH filed Critical Osram Opto Semiconductors GmbH
Publication of DE112020003641A5 publication Critical patent/DE112020003641A5/de
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers
    • H01L33/486—Containers adapted for surface mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
    • H01L2933/0008—Processes
    • H01L2933/0033—Processes relating to semiconductor body packages
    • H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Led Device Packages (AREA)
  • Wire Bonding (AREA)
DE112020003641.3T 2019-07-31 2020-07-23 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement Pending DE112020003641A5 (de)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102019120717.7 2019-07-31
DE102019120717.7A DE102019120717A1 (de) 2019-07-31 2019-07-31 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement
PCT/EP2020/070812 WO2021018727A1 (de) 2019-07-31 2020-07-23 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement

Publications (1)

Publication Number Publication Date
DE112020003641A5 true DE112020003641A5 (de) 2022-04-14

Family

ID=72039560

Family Applications (2)

Application Number Title Priority Date Filing Date
DE102019120717.7A Withdrawn DE102019120717A1 (de) 2019-07-31 2019-07-31 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement
DE112020003641.3T Pending DE112020003641A5 (de) 2019-07-31 2020-07-23 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement

Family Applications Before (1)

Application Number Title Priority Date Filing Date
DE102019120717.7A Withdrawn DE102019120717A1 (de) 2019-07-31 2019-07-31 Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement

Country Status (4)

Country Link
US (1) US20220367422A1 (de)
CN (1) CN114175284A (de)
DE (2) DE102019120717A1 (de)
WO (1) WO2021018727A1 (de)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022102494A1 (de) * 2022-02-02 2023-08-03 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Optoelektronisches bauelementepackage und verfahren

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10487987B2 (en) * 2015-08-17 2019-11-26 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament
EP2535954B1 (de) * 2010-02-09 2019-06-12 Nichia Corporation Lichtemittierende vorrichtung
WO2013118002A1 (en) * 2012-02-10 2013-08-15 Koninklijke Philips N.V. Molded lens forming a chip scale led package and method of manufacturing the same
JP2013258209A (ja) * 2012-06-11 2013-12-26 Nitto Denko Corp 封止シート、発光ダイオード装置およびその製造方法
EP2902432B1 (de) * 2012-09-28 2017-05-31 Sharp Kabushiki Kaisha Herstellungsverfahren für ein dichtungsmaterial mit einem fluoreszierenden körper, dichtungsmaterial mit dem fluoreszierenden körper, und für eine lichtemittierende vorrichtung
US8933478B2 (en) * 2013-02-19 2015-01-13 Cooledge Lighting Inc. Engineered-phosphor LED packages and related methods
DE102013210668A1 (de) * 2013-06-07 2014-12-11 Würth Elektronik GmbH & Co. KG Verfahren zur Herstellung eines optischen Moduls
US20160172554A1 (en) * 2013-07-19 2016-06-16 Koninklijke Philips N.V. Pc led with optical element and without ssubstrate carrier
DE102016105211A1 (de) * 2016-03-21 2017-09-21 Osram Opto Semiconductors Gmbh Filament und dessen Herstellung sowie Leuchtmittel mit Filamenten
DE102017113745A1 (de) * 2017-06-21 2018-12-27 Osram Opto Semiconductors Gmbh Halbleiterdisplay, optoelektronisches Halbleiterbauteil und Verfahren zur Herstellung solcher
EP4004434B1 (de) * 2019-07-30 2024-03-27 Signify Holding B.V. Farbsteuerbares led-filament und lampe mit solch einem filament
US11841115B2 (en) * 2019-10-03 2023-12-12 Signify Holding B.V. LED filament lighting device
US12111021B2 (en) * 2019-11-15 2024-10-08 Signify Holding, B.V. LED filament and LED filament lamp

Also Published As

Publication number Publication date
CN114175284A (zh) 2022-03-11
WO2021018727A1 (de) 2021-02-04
US20220367422A1 (en) 2022-11-17
DE102019120717A1 (de) 2021-02-04

Similar Documents

Publication Publication Date Title
DE112019001502A5 (de) Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
DE112016002417A5 (de) Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE112015005964A5 (de) Bauelement und Verfahren zur Herstellung eines Bauelements
DE112018000431A5 (de) Halbleiterlaser und Verfahren zur Herstellung eines solchen Halbleiterlasers
DE112016000691A5 (de) Optoelektronisches Halbleiterbauelement und Verfahren zur Herstellung eines optoelektronischen Halbleiterbauelements
DE112018003036A5 (de) Verfahren und Vorrichtung zur Herstellung von Reifen
DE112018000912A5 (de) Verfahren und Vorrichtung zur Beatmung
DE112018001984A5 (de) Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE112017002058A5 (de) Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE112017000332A5 (de) Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements
DE112015004781A5 (de) Elektronische Vorrichtung und Verfahren zur Herstellung einer elektronischen Vorrichtung
DE112020004606A5 (de) Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
DE112016001670A5 (de) Bauelement und Verfahren zur Herstellung eines Bauelements
DE112019004212A5 (de) Optoelektronisches halbleiterbauelement und verfahren zur herstellung eines optoelektronischen halbleiterbauelements
DE112018002299A5 (de) Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112018000064A5 (de) Transporteinrichtung sowie Verfahren und Vorrichtung zur Herstellung der Transporteinrichtung
DE112019005944A5 (de) Optoelektronisches halbleiterlaserbauelement und verfahren zur herstellung eines optoelektronischen halbleiterlaserbauelements
DE112018001563A5 (de) Verfahren zur herstellung eines optoelektronischen bauelements und optoelektronisches bauelement
DE112020003641A5 (de) Verfahren zur herstellung eines elektronischen bauelements und elektronisches bauelement
DE112019002625A5 (de) Bauteil und verfahren zur herstellung eines bauteils
DE112019003634T8 (de) Optoelektronisches bauelement und das verfahren zur herstellung eines optoelektronischen bauelements
DE112018003925A5 (de) Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements
DE112019004099A5 (de) Optoelektronischer Halbleiterchip und Verfahren zur Herstellung eines optoelektronischen Halbleiterchips
DE112018001205A5 (de) Verfahren zur Herstellung eines optoelektronischen Bauelements und optoelektronisches Bauelement
DE112020000393A5 (de) Optoelektronisches bauelement und verfahren zur herstellung eines optoelektronischen bauelements

Legal Events

Date Code Title Description
R012 Request for examination validly filed