CN221826776U - Wafer photoluminescence detection device - Google Patents
Wafer photoluminescence detection device Download PDFInfo
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- CN221826776U CN221826776U CN202323520688.XU CN202323520688U CN221826776U CN 221826776 U CN221826776 U CN 221826776U CN 202323520688 U CN202323520688 U CN 202323520688U CN 221826776 U CN221826776 U CN 221826776U
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- 238000000241 photoluminescence detection Methods 0.000 title claims abstract description 40
- 239000013307 optical fiber Substances 0.000 claims abstract description 42
- 238000005259 measurement Methods 0.000 claims abstract description 15
- 238000000103 photoluminescence spectrum Methods 0.000 claims abstract description 13
- 239000000523 sample Substances 0.000 claims description 41
- 230000003287 optical effect Effects 0.000 claims description 26
- 238000001228 spectrum Methods 0.000 claims description 15
- 239000000835 fiber Substances 0.000 claims description 10
- 230000005284 excitation Effects 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 7
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 25
- 238000001514 detection method Methods 0.000 abstract description 15
- 230000008569 process Effects 0.000 abstract description 12
- 230000003595 spectral effect Effects 0.000 abstract description 8
- 239000006185 dispersion Substances 0.000 description 9
- 238000010586 diagram Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 6
- 238000007689 inspection Methods 0.000 description 5
- 238000005424 photoluminescence Methods 0.000 description 5
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000000628 photoluminescence spectroscopy Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000012552 review Methods 0.000 description 1
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Abstract
The utility model discloses a wafer photoluminescence detection device, which comprises: the mobile carrier is used for carrying a sample to be tested; the optical fiber focusing device comprises a light source module, an optical fiber light path, a tube mirror, an objective lens, a spectrometer and an automatic focusing module which are sequentially arranged; the camera module and the light splitting module are also included. According to the wafer photoluminescence detection device provided by the utility model, the spectral confocal method is used for focusing in photoluminescence spectrum detection of the wafer, so that a light path and a spectrometer module can be shared in the focusing process and the photoluminescence spectrum detection process, the system structure is simplified, and accurate automatic focusing can be realized; through the arrangement of the light splitting module and the tube mirror, automatic focusing, photographing 3D measurement and photoluminescence spectrum detection of the wafer can be realized at the same time.
Description
Technical Field
The utility model relates to semiconductor wafer detection, in particular to a wafer photoluminescence detection device.
Background
With the development of technology, semiconductor technology is increasingly widely used in the daily field; semiconductor manufacturing varies from front to back, is complex, and has a large number of process steps/processes. Because of the complex process and multiple procedures, each section needs a strict quality inspection and assessment instrument and method; for example, in the wafer stage, it is necessary to perform appearance defect inspection or photoluminescence measurement on the semiconductor. Thereby intercepting defective products of the process section, and preventing the defective products from continuously flowing into the subsequent process section to influence the yield of products. While finding undesirable effects may also facilitate process improvement and optimization.
In the stage of semiconductor wafer inspection, the resolution of the inspection is high, a microscopic imaging device is needed, and the depth of field of the high-resolution microscopic imaging device is generally small and is generally below 50 μm. However, the wafer generally has larger fluctuation, and the XY stage at the lower end of the inspection stage cannot guarantee strict horizontal movement in operation. Therefore, when different areas are shot, the wafer is more likely to exceed the depth of field, imaging is blurred, and accurate defect measurement cannot be achieved.
Disclosure of utility model
In order to meet at least one defect or improvement requirement of the prior art, the utility model provides a wafer photoluminescence detection device, which integrates a photoluminescence spectrum detection module and an automatic focusing module, and simplifies the structure of a detection system.
To achieve the above object, according to a first aspect of the present utility model, there is provided a wafer photoluminescence detection device comprising:
The mobile carrier is used for carrying a sample to be tested;
The light source module, the optical fiber optical path, the tube mirror and the objective lens are sequentially arranged along the first optical path, a spectrometer and an auto-focus module;
The light source module is used for emitting polychromatic light and enters the tube mirror through the optical fiber light path; the objective lens is arranged at one end of the tube lens far away from the light source module, and is used for focusing the multi-color light emitted by the light source module, vertically irradiating the surface of the sample to be detected and collecting the multi-color light reflected by the surface of the sample to be detected; the spectrometer is connected with the tube mirror through the optical fiber light path and is used for collecting the spectrum information of the reflected complex-color light; the automatic focusing module adjusts the distance between the movable carrier and the objective lens according to the spectrum information, so that the surface of the sample to be detected is positioned at the focal plane of the light beam with the target wavelength, and automatic focusing is realized;
The light source module is also used for emitting monochromatic light after focusing is completed, entering the tube mirror through the optical fiber light path and then irradiating the surface of the sample to be detected through the objective lens; the spectrometer is also used for receiving excitation light generated after the sample to be measured receives the monochromatic light and performing photoluminescence spectrum measurement.
Further, the wafer photoluminescence detection device further comprises:
the light source module is a multi-channel light source module and emits the monochromatic light or the polychromatic light according to requirements.
Further, the wafer photoluminescence detection device further comprises:
The light source module comprises a wide-spectrum light source module and a monochromatic light source module, wherein the wide-spectrum light source module is used for emitting the multi-color light, and the monochromatic light source module is used for emitting the monochromatic light after focusing is completed.
Further, the wafer photoluminescence detection device further comprises:
The light source modules comprise a plurality of monochromatic light source modules, wherein the plurality of monochromatic light source modules emit monochromatic light with different wavelengths, when the plurality of light source modules are simultaneously turned on, the light source modules emit the compound color light, and when only one of the monochromatic light source modules is turned on, the light source modules emit the monochromatic light.
Further, the wafer photoluminescence detection device further comprises:
The wavelength of the monochromatic light emitted by the light source module after focusing is finished is selectable.
Further, the wafer photoluminescence detection device further comprises:
the wafer photoluminescence detection device further comprises a camera module and a light splitting module, wherein the camera module is sequentially arranged with the tube mirror and the objective lens on a second optical path, receives imaging light from the surface of the sample to be detected, and is used for photographing the surface of the sample to be detected for 3D measurement after focusing is completed; the light splitting module is used for adjusting the direction of the first light path and/or the second light path and separating the first light path and the second light path.
Further, the wafer photoluminescence detection device further comprises:
The optical fiber path comprises a first optical fiber probe and at least one optical fiber coupler, wherein the first optical fiber probe is used for connecting the optical fiber path with the tube mirror, and the first optical fiber probe is positioned at the image plane of the objective lens under the target wavelength.
Further, the wafer photoluminescence detection device further comprises:
The first fiber optic probe is a fiber optic coupler with a fiber optic probe.
Further, the wafer photoluminescence detection device further comprises:
The camera module may make a measurement at a distance from the wafer surface.
Further, the wafer photoluminescence detection device further comprises:
And the automatic focusing module adjusts the position of the movable carrier and/or the objective lens in space according to the spectrum information, so that the surface of the sample to be detected is positioned at the focal plane of the light beam with the target wavelength, and automatic focusing is realized.
In general, the above technical solutions conceived by the present utility model, compared with the prior art, enable the following beneficial effects to be obtained:
(1) According to the wafer photoluminescence detection device provided by the utility model, the spectral confocal method is used for focusing in photoluminescence spectrum detection of the wafer, so that a light path and a spectrometer module can be shared in the focusing process and the photoluminescence spectrum detection process, the system structure is simplified, and accurate automatic focusing can be realized;
(2) According to the wafer photoluminescence detection device provided by the utility model, through the arrangement of the light splitting module and the tube mirror, automatic focusing, photographing 3D measurement and photoluminescence spectrum detection of the wafer can be realized at the same time.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are required to be used in the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural diagram of a wafer photoluminescence detection device according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of another wafer photoluminescence detection apparatus according to an embodiment of the utility model;
FIG. 3 is a schematic diagram of another exemplary embodiment of a wafer photoluminescence detection apparatus according to the present utility model;
FIG. 4 is a schematic diagram of another exemplary embodiment of a wafer photoluminescence detection apparatus according to the present utility model;
FIG. 5 is a schematic diagram of a partial structure of a wafer photoluminescence detection device according to an embodiment of the present utility model;
Fig. 6 is a schematic partial structure diagram of another wafer photoluminescence detection apparatus according to an embodiment of the utility model.
FIG. 7 is a schematic diagram of another exemplary embodiment of a wafer photoluminescence detection apparatus according to the present utility model;
FIG. 8 is a schematic diagram of another exemplary embodiment of a wafer photoluminescence detection apparatus according to the present utility model;
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
The terms first, second, third and the like in the description and in the claims and in the above drawings, are used for distinguishing between different objects and not necessarily for describing a particular sequential or chronological order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
As shown in fig. 1, as a first embodiment of the present utility model, there is provided a wafer photoluminescence detection apparatus, which includes two systems, one of which is an auto-focusing system and the other is a photoluminescence spectrum detection system, and the two systems share a first optical path.
The automatic focusing mode adopts a spectral confocal method to focus. The principle of the spectral confocal method is that light beams with different wavelengths are focused on planes with different depths after the light beams pass through a dispersion lens. According to the principle of reversibility of the light path, when the surface to be measured is positioned at a certain focal position, the focal spot with corresponding wavelength is coupled into the spectrometer through a pinhole after passing through the dispersive lens and the beam splitting module (such as a spectroscope). Thus, the defocus of the surface to be measured can be measured. For spectroscopic confocal methods, see the following prior art documents: gaoxin, deng Wenyi, niu Chunhui. Chromatic confocal based displacement measurement systems research optical techniques, 38 (1), 2012. Therefore, in the first optical path, the multi-color light source, the spectrometer and the lens with a certain dispersion effect are key components for realizing a spectral confocal method.
For dispersion of the lens, white light (multi-color light) is focused at different points because of the difference in refractive index in the lens. Chromatic dispersion includes axial chromatic dispersion and off-axis chromatic dispersion. The chromatic dispersion is eliminated or utilized according to different application scenes, and the first light path in the utility model is to perform spectral confocal ranging focusing by utilizing the axial chromatic dispersion characteristic of the lens. The axial dispersion of the lens can be adjusted according to the size, structure, form, etc., and the utility model is not limited thereto.
Photoluminescence (PL) is a process of irradiating the surface of a wafer to be measured with monochromatic light, and a semiconductor material emits excitation light in response to the monochromatic light, and if a flaw occurs on the surface of the wafer, the excitation light spectrum at the flaw is different from the excitation light spectrum at the normal position, so that the performance of the wafer can be detected by detecting the spectrum of the excitation light. For photoluminescence spectrum detection methods, reference may also be made to the following prior art documents: bel' kov, VV et al "Microwave-induced patterns in n-GaAs and their photoluminescence imaging"(Physical Review B,Vol.61,No.20,The American Physical Society,2000, 5-15, pp.13698-13702) and Masarotto et al "Development of a UV scanning photoluminescence apparatus for SiC characterization"(Eur J AP 20,141-144,2002)., a monochromatic light source, a spectrometer in the first light path is therefore a key component for achieving photoluminescence spectroscopy detection.
Based on the above principle, the first optical path is set in this embodiment to include the light source module 1, the optical fiber optical path 3, the tube lens 4, the objective lens 7, the spectrometer 2, and the auto-focusing module. Wherein, the light source module 1 needs to emit monochromatic light or polychromatic light according to the working content, namely, when the first light path focuses by a spectral confocal method, the light source module 1 emits polychromatic light as light used for focusing; when the first light path is used for photoluminescence spectrum detection, the light source module 1 emits monochromatic light as light for exciting the wafer surface. In this embodiment, the tube mirror 4 is selected as a specific structural form of the optical path, and the optical fiber optical path 3 is selected as a connection mode for connecting the light source module 1, the spectrometer 2 and the tube mirror 4. In the utility model, the light emitted by the whole system is vertically irradiated on the surface of the sample 9 to be detected, so that the light irradiated on the surface of the sample 9 to be detected, the reflected light on the surface of the sample 9 to be detected and the excitation light on the surface of the sample 9 to be detected can return to the system along the same light path, the light source module 1 and the spectrometer 2 can share the first light path, and the structure of the whole system is simplified.
The light source module 1 in the present utility model needs to realize the functions of outputting monochromatic light and outputting polychromatic light, and three specific embodiments of the light source module 1 are given herein:
as shown in fig. 2, the light source module 1 is directly configured as a multi-channel light source module 101 that can arbitrarily adjust the wavelength and spectral range of the output light, and emits monochromatic light or polychromatic light as required.
As shown in fig. 3, the light source module 1 includes a wide-spectrum light source module 111 and a monochromatic light source module 112, wherein the wide-spectrum light source module 111 is configured to emit monochromatic light, and the monochromatic light source module 112 is configured to emit monochromatic light after focusing is completed.
As shown in fig. 4, the light source module 1 includes a plurality of single-color light source modules. In fig. 4, three monochromatic light source modules 121, 122, 123 are exemplified. The plurality of single-color light source modules emit single-color light of different wavelengths, and when the plurality of light source modules 121, 122, 123 are simultaneously turned on, the output light thereof is superimposed as a multi-color light, that is, the light source module 1 emits the multi-color light, and when only one of the single-color light source modules is turned on, the light source module 1 emits the single-color light.
It will also be appreciated by those skilled in the art that the specific arrangement and selection of the light source module 1 is not limited to the above arrangement, and may be satisfied by emitting the polychromatic light and the monochromatic light as required.
In the photoluminescence spectrum detection, the light source module 1 may emit monochromatic light of a specific wavelength as required.
In the utility model, an optical fiber light path 3 is selected as a connecting device for connecting the light source module 1, the spectrometer 2 and the tube mirror 4. Optical fiber couplers and optical fiber probes are commonly used as optical passive devices, the optical fiber couplers are commonly used for realizing optical signal branching/combining, and the optical fiber probes are commonly installed on the end face of an optical fiber and used for being connected with other devices and are optical fiber 'plugs'. Because the wafer photoluminescence detection device provided by the utility model comprises the light source module 1 and the spectrometer 2, at least one optical fiber coupler 32 is needed to couple two paths of optical fibers into one path and input the two paths of optical fibers into the tube mirror 4. Meanwhile, in order to ensure the accuracy of the auto-focusing, the first fiber probe 31 for connecting the fiber optic path 3 needs to be installed at the image plane of the objective lens 7 at the target wavelength.
The particular fiber optic coupler 32 and first fiber optic probe 31 arrangement may be as shown in fig. 5-6. Fig. 5-6 are enlarged schematic views of a portion of the area a of fig. 1. In fig. 5, an optical fiber coupler is adopted, one end of the optical fiber coupler is connected with the light source module 1 and the spectrometer 2, and the other end of the optical fiber outputs a short optical fiber, and the short optical fiber is connected with the tube mirror 4 through the first optical fiber probe 31. Fig. 6 shows a fiber-optic coupler with a fiber-optic probe, which is directly connected to a tube mirror as a first fiber-optic probe 31. It will be understood by those skilled in the art that when the light source modules are arranged in different manners, a plurality of optical fiber couplers may be arranged in the optical fiber path, and only the beam combining/splitting function is required.
As shown in fig. 7-8, further, a second optical path may be provided in the present utility model, as a 3D measurement of the wafer surface. In the second optical path, the objective lens, tube lens and camera module are the core elements for imaging. The first optical path and the second optical path may share the objective lens 7 and are separated by a spectroscopic module. As shown in fig. 7 to 8, two arrangements of the optical paths are provided in this embodiment. Wherein the tube mirror 4 is arranged in a T-shaped structure, the first optical path and the second optical path share the objective lens 7, and the objective lens 7 vertically faces the movable carrier 8 carrying the sample 9 to be measured; the first light path and the second light path are separated by the light splitting module 6, and then corresponding measurement is respectively realized.
The second optical path in the above embodiment can take a 3D measurement within a certain range on the wafer surface, so the camera module 5 can optionally take a measurement at a certain distance on the wafer surface, so that the whole surface of the wafer can be traversed, and the effect of complete detection is achieved.
The automatic focusing mode may be to adjust the position of the moving stage 8, or alternatively to adjust the position of the objective lens 7, so as to achieve automatic focusing only by making the surface of the sample 9 to be measured be at the focal plane of the light beam with the target wavelength. Means for moving the objective lens 7 include, but are not limited to: the module comprised in the whole first optical path, the second optical path, or the length of the tube mirror 4 is moved as in fig. 7-8, thereby adjusting the position of the objective lens 7 in space.
It will be readily appreciated by those skilled in the art that the foregoing description is merely a preferred embodiment of the utility model and is not intended to limit the utility model, but any modifications, equivalents, improvements or alternatives falling within the spirit and principles of the utility model are intended to be included within the scope of the utility model.
Claims (10)
1. A wafer photoluminescence detection device, comprising:
The movable carrier (8) is used for carrying a sample (9) to be tested; the optical system comprises a light source module (1), an optical fiber optical path (3), a tube mirror (4) and an objective lens (7), a spectrometer (2) and an automatic focusing module, which are sequentially arranged along a first optical path;
The light source module (1) is used for emitting polychromatic light and enters the tube mirror (4) through the optical fiber light path (3); the objective lens (7) is arranged at one end, far away from the light source module (1), of the tube lens (4), and the objective lens (7) is used for focusing the multi-color light emitted by the light source module (1), vertically irradiating the surface of the sample (9) to be detected and collecting the multi-color light reflected by the surface of the sample (9) to be detected; the spectrometer (2) is connected with the tube mirror (4) through the optical fiber light path (3) and is used for collecting the spectrum information of the reflected complex-color light; the automatic focusing module adjusts the distance between the movable carrier (8) and the objective lens (7) according to the spectrum information, so that the surface of the sample (9) to be measured is positioned at the focal plane of the light beam with the target wavelength, and automatic focusing is realized;
The light source module (1) is also used for emitting monochromatic light after focusing is completed, entering the tube mirror (4) through the optical fiber light path (3) and then irradiating the surface of the sample (9) to be measured through the objective lens (7); the spectrometer (2) is also used for receiving excitation light generated after the sample (9) to be detected receives the monochromatic light and performing photoluminescence spectrum measurement.
2. A wafer photoluminescence detection device according to claim 1, wherein:
the light source module (1) is a multi-channel light source module (101) and emits the monochromatic light or the polychromatic light according to requirements.
3. A wafer photoluminescence detection device according to claim 1, wherein:
The light source module (1) comprises a wide-spectrum light source module (111) and a monochromatic light source module (112), wherein the wide-spectrum light source module (111) is used for emitting the multi-color light, and the monochromatic light source module (112) is used for emitting the monochromatic light after focusing is completed.
4. A wafer photoluminescence detection device according to claim 1, wherein:
The light source module (1) comprises a plurality of monochromatic light source modules, wherein the plurality of monochromatic light source modules emit monochromatic light with different wavelengths, when the plurality of light source modules are simultaneously turned on, the light source module (1) emits the polychromatic light, and when only one of the monochromatic light source modules is turned on, the light source module (1) emits the monochromatic light.
5. A wafer photoluminescence detection device according to claim 1, wherein:
The wavelength of the monochromatic light emitted by the light source module (1) after focusing is finished is selectable.
6. A wafer photoluminescence detection device according to claim 1, wherein:
The wafer photoluminescence detection device further comprises a camera module (5) and a beam splitting module (6), wherein the camera module (5) is sequentially arranged with the tube mirror (4) and the objective lens (7) on a second optical path, receives imaging light from the surface of the sample (9) to be detected, and is used for photographing the surface of the sample (9) to be detected for 3D measurement after focusing is completed; the light splitting module (6) is used for adjusting the direction of the first light path and/or the second light path and separating the first light path and the second light path.
7. A wafer photoluminescence detection device according to claim 1, wherein:
the optical fiber path (3) comprises a first optical fiber probe (31) and at least one optical fiber coupler (32), the first optical fiber probe (31) is used for connecting the optical fiber path (3) and the tube mirror (4), and the first optical fiber probe (31) is positioned at an image plane of the objective lens (7) under the target wavelength.
8. A wafer photoluminescence detection device according to claim 7, wherein:
the first fiber optic probe (31) is a fiber optic coupler with a fiber optic probe.
9. A wafer photoluminescence detection device according to claim 6, wherein:
The camera module (5) can perform a measurement at a distance from the wafer surface.
10. A wafer photoluminescence detection device according to any one of claims 1-9, wherein:
And the automatic focusing module adjusts the position of the movable carrier (8) and/or the objective lens (7) in space according to the spectrum information, so that the surface of the sample (9) to be measured is positioned at the focal plane of the light beam with the target wavelength, and automatic focusing is realized.
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| CN202323520688.XU CN221826776U (en) | 2023-12-22 | 2023-12-22 | Wafer photoluminescence detection device |
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| CN202323520688.XU CN221826776U (en) | 2023-12-22 | 2023-12-22 | Wafer photoluminescence detection device |
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