CN212577812U

CN212577812U - Semiconductor high-precision lead frame etching processing equipment

Info

Publication number: CN212577812U
Application number: CN202020977683.7U
Authority: CN
Inventors: 邵文庆
Original assignee: Changzhou Hongshengda Electronic Equipment Co ltd
Current assignee: Changzhou Hongshengda Electronic Equipment Co ltd
Priority date: 2020-06-02
Filing date: 2020-06-02
Publication date: 2021-02-23
Anticipated expiration: 2030-06-02

Abstract

The utility model discloses a semiconductor high accuracy lead frame etching processing equipment, including mount, workstation and main trachea, the internal surface of mount is provided with the air pump, and the upper surface of air pump is connected with the lower extreme of bronchus to the upper end of bronchus is connected with the end of master cylinder and auxiliary cylinder respectively, main ejector pad is installed to the front end of master cylinder, and the lower extreme of main ejector pad is fixed with the slider to the surface of slider is connected with the inboard of spout, the surface of gyro wheel is connected with orbital internal surface, and the track is located the inside of crossbeam, and the second motor is installed to the left end of crossbeam. This semiconductor high accuracy lead frame etching processing equipment, the device are provided with main ejector pad and vice ejector pad perpendicularly, through the extension of bronchus simultaneous control main cylinder and vice cylinder with withdraw, the main ejector pad of being convenient for and vice ejector pad step up the lead frame for fixing on the workstation that the lead frame can be stable.

Description

Semiconductor high-precision lead frame etching processing equipment

Technical Field

The utility model relates to a semiconductor processing technology field specifically is a semiconductor high accuracy lead frame etching processing equipment.

Background

The lead frame is a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a circuit leading-out end in a core and an outer lead by means of a bonding material to form an electrical circuit, and when the lead frame is used, the unnecessary part on the surface of the lead frame needs to be etched and removed, and finally a protective film needs to be removed, but the existing etching method has some problems:

firstly, the traditional chemical etching method mainly adopts strong acid or strong base to directly carry out chemical corrosion on the unprotected part of a workpiece, but the corrosive liquid is harmful to the health of an operator in the production process, and the production time is slow;

secondly, electrochemical etching is to use the workpiece as an anode and use electrolyte to electrify, and the anode is dissolved, but the etching depth is small, the current distribution is not uniform, and the depth is not easy to control.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor high accuracy lead frame etching processing equipment to propose among the above-mentioned background art that the etching in-process is harmful to the operating personnel health, the production speed is slower and the not easily controlled problem of depth.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor high-precision lead frame etching processing device comprises a fixing frame, a workbench and a main air pipe, wherein an air pump is arranged on the inner surface of the fixing frame, the upper surface of the air pump is connected with the lower end of a branch air pipe, the upper end of the branch air pipe is respectively connected with the tail ends of a main air cylinder and an auxiliary air cylinder, a main push block is arranged at the front end of the main air cylinder, a slide block is fixed at the lower end of the main push block, the outer surface of the slide block is connected with the inner side of a slide groove, the left end and the right end of the workbench are connected with the inner wall of the fixing frame, 2 slide grooves are formed in the upper surface of the workbench in parallel, auxiliary push blocks are symmetrically arranged in the front and at the back of the workbench, the outer sides of the auxiliary push blocks are connected with the auxiliary air cylinder, the lower end of the main air pipe is connected with the upper surface of, the upper surface of telescoping cylinder is connected with the lower surface of movable block, and the inside of movable block is provided with first motor to the gyro wheel is installed to the output of first motor, the surface of gyro wheel is connected with orbital internal surface, and the track is located the inside of crossbeam, and the second motor is installed to the left end of crossbeam, the inside transmission shaft that is provided with of second motor, and the both ends of transmission shaft install the pulley to the lower surface of pulley is provided with the slide, the slide symmetry sets up on the inner wall of mount, and the upper end of mount is provided with laser generator.

Preferably, the branch pipe is provided with 4 branches, and the branch pipe is communicated with the main cylinder and the auxiliary cylinder.

Preferably, the number of the main cylinders and the number of the auxiliary cylinders are 2, the main cylinders are symmetrically arranged on the left side and the right side of the workbench, and the auxiliary cylinders are symmetrically arranged on the front side and the rear side of the workbench.

Preferably, the central line of the main push block is perpendicular to the sliding groove, and the sliding groove and the sliding block form a sliding structure.

Preferably, the movable block and the track form a rolling structure through a roller.

Preferably, the number of the pulleys is 2, and the pulleys are in rolling connection with the slide ways.

Compared with the prior art, the beneficial effects of the utility model are that: the semiconductor high-precision lead frame etching processing equipment,

1. the device is vertically provided with a main push block and an auxiliary push block, and the extension and retraction of a main cylinder and an auxiliary cylinder are controlled simultaneously through a branch air pipe, so that the main push block and the auxiliary push block can conveniently clamp a lead frame, and the lead frame can be stably fixed on a workbench;

2. the device adopts laser etching, high-energy laser generated by a laser emitter is used for removing unnecessary parts on the surface of the lead frame, meanwhile, the laser has good stability, the etching depth can be adjusted by controlling the energy intensity of the laser, the laser processing speed is higher, harmful gas generated by chemical etching is not generated in the laser etching, and the laser etching is harmless to the health of operators;

3. the crossbeam moves about through second motor control pulley along the slide, and the movable block moves along the track through first motor control gyro wheel, through two mutually perpendicular's track and slide control laser head at the inside removal of workstation.

Drawings

FIG. 1 is a schematic overall front sectional view of the present invention;

FIG. 2 is a schematic left sectional view of the whole structure of the present invention;

FIG. 3 is a schematic view of the overall sectional view of the present invention;

fig. 4 is a schematic view of the combined structure of the main push block and the auxiliary push block of the present invention.

In the figure: 1. a fixed mount; 2. an air pump; 3. a bronchus; 4. a master cylinder; 5. a main push block; 6. a slider; 7. a chute; 8. a work table; 9. an auxiliary push block; 10. a secondary cylinder; 11. a main air pipe; 12. a telescopic cylinder; 13. a laser head; 14. a movable block; 15. a first motor; 16. a roller; 17. a track; 18. a cross beam; 19. a second motor; 20. a drive shaft; 21. a pulley; 22. a slideway; 23. a laser generator.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a semiconductor high-precision lead frame etching processing device comprises a fixed frame 1, an air pump 2, a branch air pipe 3, a main air cylinder 4, a main push block 5, a slide block 6, a sliding groove 7, a workbench 8, an auxiliary push block 9, an auxiliary air cylinder 10, a main air pipe 11, a telescopic cylinder 12, a laser head 13, a movable block 14, a first motor 15, a roller 16, a track 17, a cross beam 18, a second motor 19, a transmission shaft 20, a pulley 21, a slide way 22 and a laser generator 23, wherein the inner surface of the fixed frame 1 is provided with the air pump 2, the upper surface of the air pump 2 is connected with the lower end of the branch air pipe 3, the upper end of the branch air pipe 3 is respectively connected with the tail ends of the main air cylinder 4 and the auxiliary air cylinder 10, the main push block 5 is installed at the front end of the main air cylinder 4, the slide block 6 is fixed at the lower end of the main push block 5, the outer surface of the

slide block

6, 2 sliding grooves 7 are arranged on the upper surface of a workbench 8 in parallel, auxiliary push blocks 9 are symmetrically arranged on the front and back of the workbench 8, the outer side of each auxiliary push block 9 is connected with an auxiliary air cylinder 10, the lower end of a main air pipe 11 is connected with the upper surface of an air pump 2, the other end of the main air pipe 11 penetrates through the inner wall of a fixed frame 1 to be connected with a telescopic cylinder 12, a laser head 13 is arranged at the lower end of the telescopic cylinder 12, the upper surface of the telescopic cylinder 12 is connected with the lower surface of a movable block 14, a first motor 15 is arranged inside the movable block 14, a roller 16 is arranged at the output end of the first motor 15, the outer surface of the roller 16 is connected with the inner surface of a rail 17, the rail 17 is positioned inside a cross beam 18, a second motor 19 is arranged at the left end of the cross beam 18, a transmission shaft 20 is arranged inside the second motor 19, pulleys 21 are arranged at two, the slideways 22 are symmetrically arranged on the inner wall of the fixing frame 1, and the upper end of the fixing frame 1 is provided with a laser generator 23.

The branch air pipe 3 is provided with 4 branches, the branch air pipe 3 is communicated with the main air cylinder 4 and the auxiliary air cylinder 10, the branch air pipe 3 is connected with the main air cylinder 4 and the auxiliary air cylinder 10 at the same time, and the main push block 5 and the auxiliary push block 9 are guaranteed to clamp the lead frame at the same time.

The number of the main cylinders 4 and the number of the auxiliary cylinders 10 are 2, the main cylinders 4 are symmetrically arranged on the left side and the right side of the workbench 8, the auxiliary cylinders 10 are symmetrically arranged on the front side and the rear side of the workbench 8, and the lead frame is clamped, so that the center of the lead frame coincides with the center of the workbench 8.

The central line of the main pushing block 5 is perpendicular to the sliding groove 7, the sliding groove 7 and the sliding block 6 form a sliding structure, and the main pushing block 5 moves in parallel along the sliding groove 7 to ensure that the center of the clamp is unchanged.

The movable block 14 forms a rolling structure with a rail 17 through a roller 16, and a first motor 15 controls the movable block 14 to move along a cross beam 18 by driving the roller 16.

The number of the pulleys 21 is 2, the pulleys 21 are in rolling connection with the slide ways 22, and the pulleys 21 move along the slide ways 22 and increase the moving stability of the cross beam 18.

The working principle is as follows: when the semiconductor high-precision lead frame etching processing equipment is used, firstly, a fixing frame 1 of the device is horizontally arranged on the ground, and then, a power supply is connected;

then a lead frame workpiece to be processed is placed on a workbench 8, an air pump 2 is started at the same time, high-pressure air generated by the air pump 2 is transmitted to a main air cylinder 4 through a branch air pipe 3, the main air cylinder 4 pushes a main push block 5, the main push block 5 moves along a sliding groove 7 through a sliding block 6, the sliding block 6 and the sliding groove 7 ensure that the main push block 5 is always parallel, when the main push block 5 clamps a lead frame, the air moves to an auxiliary air cylinder 10 through the branch air pipe 3, the auxiliary air cylinder 10 pushes an auxiliary push block 9 to the lead frame, finally, the periphery of the lead frame is clamped between the workbench 8 by the main push block 5 and the auxiliary push block 9, the main push block 5 and the auxiliary push block 9 are arranged to clamp lead frames with different sizes, the center of the lead frame is overlapped with the center of the workbench 8, a zero-finding point convenient for laser etching is provided, the speed for processing uniform workpieces is provided, adjusting the laser head 13 to a proper position, and providing light energy for the laser head 13 by the laser generator 23;

finally, when etching is carried out, the first motor 15 drives the roller 16 to move along the rail 17, the movable block 14 is controlled to move back and forth, meanwhile, the second motor 19 rotates the pulley 21 through the transmission shaft 20, the pulley 21 drives the cross beam 18 to move left and right along the slide rail 22, the laser head 13 is controlled to move through the telescopic cylinder 12, the first motor 15 and the second motor 19, the surface of the lead frame is convenient to process, and the overall practicability is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor high accuracy lead frame etching processing equipment, includes mount (1), workstation (8) and main trachea (11), its characterized in that: the inner surface of the fixing frame (1) is provided with an air pump (2), the upper surface of the air pump (2) is connected with the lower end of a bronchus (3), the upper end of the bronchus (3) is respectively connected with the tail ends of a main air cylinder (4) and an auxiliary air cylinder (10), the front end of the main air cylinder (4) is provided with a main push block (5), the lower end of the main push block (5) is fixed with a slide block (6), the outer surface of the slide block (6) is connected with the inner side of a chute (7), the left end and the right end of a workbench (8) are connected with the inner wall of the fixing frame (1), 2 chutes (7) are arranged on the upper surface of the workbench (8) in parallel, the auxiliary push blocks (9) are symmetrically arranged in the front and at the back of the workbench (8), the outer side of the auxiliary push block (9) is connected with the auxiliary air cylinder (10), the lower end of the main air pipe, the other end of the main air pipe (11) penetrates through the inner wall of the fixed frame (1) to be connected with the telescopic cylinder (12), the lower end of the telescopic cylinder (12) is provided with a laser head (13), the upper surface of the telescopic cylinder (12) is connected with the lower surface of the movable block (14), the movable block (14) is internally provided with a first motor (15), the output end of the first motor (15) is provided with a roller (16), the outer surface of the roller (16) is connected with the inner surface of the rail (17), the rail (17) is positioned in the cross beam (18), the left end of the cross beam (18) is provided with a second motor (19), the second motor (19) is internally provided with a transmission shaft (20), the two ends of the transmission shaft (20) are provided with pulleys (21), the lower surface of the pulleys (21) is provided with slide ways (22), and the slide ways (22) are symmetrically arranged on the inner wall of the fixed frame (1, and the upper end of the fixed frame (1) is provided with a laser generator (23).

2. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the branch air pipe (3) is provided with 4 branches, and the branch air pipe (3) is communicated with the main air cylinder (4) and the auxiliary air cylinder (10).

3. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the number of the main cylinders (4) and the number of the auxiliary cylinders (10) are 2, the main cylinders (4) are symmetrically arranged on the left side and the right side of the workbench (8), and the auxiliary cylinders (10) are symmetrically arranged on the front side and the rear side of the workbench (8).

4. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the central line of the main push block (5) is vertical to the sliding groove (7), and the sliding groove (7) and the sliding block (6) form a sliding structure.

5. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the movable block (14) and the track (17) form a rolling structure through a roller (16).

6. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the number of the pulleys (21) is 2, and the pulleys (21) are in rolling connection with the slide ways (22).