CN113675095A - Semiconductor high-precision lead frame etching processing equipment - Google Patents
Semiconductor high-precision lead frame etching processing equipment Download PDFInfo
- Publication number
- CN113675095A CN113675095A CN202110894991.2A CN202110894991A CN113675095A CN 113675095 A CN113675095 A CN 113675095A CN 202110894991 A CN202110894991 A CN 202110894991A CN 113675095 A CN113675095 A CN 113675095A
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- etching
- fixedly arranged
- top end
- workbench
- semiconductor high
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- 238000005530 etching Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 18
- 230000000694 effects Effects 0.000 claims abstract description 15
- 238000002156 mixing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 5
- 238000000034 method Methods 0.000 abstract description 10
- 239000011877 solvent mixture Substances 0.000 abstract 1
- 239000000243 solution Substances 0.000 description 8
- 239000007788 liquid Substances 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 238000003760 magnetic stirring Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000003003 spiro group Chemical group 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4828—Etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Abstract
The invention discloses a semiconductor high-precision lead frame etching processing device, which comprises: a work table; the support legs are fixedly arranged at four corners of the bottom end of the workbench respectively along the vertical direction; the supporting assembly is arranged at the top end of the workbench; the motor is fixedly arranged in the middle of the top end of the supporting component; the auxiliary assembly is arranged in the middle of the bottom end of the supporting assembly; the etching pool is fixedly arranged in the middle of the bottom end of the workbench; and the bottom plate is fixedly arranged at the bottom end of the etching pool. This semiconductor high accuracy lead frame etching processing equipment can realize the effect of a high efficiency and automatic etching, improves the speed of etching to guarantee through the hot plate that whole is the temperature of etching solution, dilute the effect of the solvent mixture of etchant and in the etching pond automatically, it is simple convenient to dilute the process, further improves the convenience of etching processing.
Description
Technical Field
The invention relates to the technical field of lead frame processing, in particular to semiconductor high-precision lead frame etching processing equipment.
Background
The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, plays a role of a bridge connected with an external lead, needs to use the lead frame in most semiconductor integrated blocks and is an important basic material in the electronic information industry;
the existing lead frame is mostly etched through manpower during processing, the lead frame is required to be continuously and fully contacted and stirred with etching liquid for ensuring full contact with the etching liquid, the labor intensity of workers is increased, in addition, other equipment is required for mixing and preparing the etching liquid, the work load is increased for an etching procedure, and the convenience is poor, so that the semiconductor high-precision lead frame processing equipment is provided, and the problems are at least solved.
Disclosure of Invention
The invention aims to provide semiconductor high-precision lead frame etching processing equipment, which at least solves the problems that the labor intensity of workers is increased and the preparation convenience of an etching solution is poor in the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor high-precision lead frame etching processing device comprises:
a work table;
the support legs are fixedly arranged at four corners of the bottom end of the workbench respectively along the vertical direction;
the supporting assembly is arranged at the top end of the workbench;
the motor is fixedly arranged in the middle of the top end of the supporting component;
the auxiliary assembly is arranged in the middle of the bottom end of the supporting assembly;
the etching pool is fixedly arranged in the middle of the bottom end of the workbench;
the bottom plate is fixedly arranged at the bottom end of the etching pool;
an etching component disposed below the auxiliary component;
a pre-mixing assembly disposed at a top end of the etch tank;
the heating plate is fixedly arranged in the inner cavity of the bottom plate.
Preferably, the support assembly comprises: the plurality of support frames are respectively and fixedly arranged at the top end of the workbench; the inserted bar can move up and down and is clamped at the top end of the inner side of the support frame; the connecting pieces are fixedly arranged at the top ends of the inserting rods along the horizontal direction; the electric push rod is fixedly arranged on the rear side of the top end of the workbench along the vertical direction, and the extending end of the top end of the electric push rod is fixedly connected to the connecting piece; and the protective frame is fixedly arranged at the top end of the connecting piece.
Preferably, the auxiliary assembly comprises: the sleeve is movably sleeved outside the extending end of the bottom end of the motor; the first limiting groove is fixedly formed in the inner wall of the sleeve; the fixture block is fixedly arranged on one side of the output end of the motor; the connecting rod is movably clamped on the inner side of the sleeve; the second limiting groove is fixedly arranged on the inner wall of the top end of the connecting rod along the vertical direction and is movably clamped on the outer side of the clamping block; the clamping column is fixedly arranged on the outer wall of the connecting rod and is clamped on the inner side of the first limiting groove.
Preferably, the first limiting groove is wavy in shape.
Preferably, the etching component comprises: the column body is fixedly arranged at the bottom end of the clamping column; the fixing frame is fixedly arranged on the outer side of the outer wall of the cylinder; the connecting plates are fixedly arranged on the inner side of the fixing frame along the vertical direction; the two moving blocks can move up and down and are clamped at the upper side and the lower side of the middle part of the connecting plate respectively; the driving block is movably clamped at the inner sides of the two moving blocks; the rotating block can be arranged in the middle of the connecting plate in a rotating mode around the axis of the rotating block, and is connected to the driving block in a threaded mode.
Preferably, both ends of the driving block are movably clamped with the two moving blocks through T-shaped grooves.
Preferably, the premixing assembly comprises: the feeding hole is fixedly arranged at the top end of the workbench; the premixing tank is fixedly arranged on one side of the top end of the etching tank and is positioned below the feeding hole; the magnetic stirrer is fixedly arranged at the bottom end of the premixing tank; the magnetic rotor is placed at the bottom end of the inner cavity of the premixing groove; and the filter screen is fixedly arranged at the joint of the premixing groove and the etching pool along the vertical direction.
The invention provides semiconductor high-precision lead frame etching processing equipment, which has the beneficial effects that:
1. according to the invention, an efficient and automatic etching effect can be realized through the mutual cooperation among the supporting component, the auxiliary component and the etching component, the etching speed is improved, the temperature of the whole etching solution is ensured through the heating plate, the etching efficiency is further ensured, more lead frames can be synchronously etched at the same time, and the labor is saved;
2. according to the invention, the pre-mixing component can realize the effect of automatically diluting the etching agent and mixing the solvent in the etching pool, the diluting process is simple and convenient, the etching agent can be fully dissolved, and the convenience of etching processing is further improved.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the structure of the screen of the present invention;
FIG. 3 is a front sectional structural view of the present invention;
FIG. 4 is a front cross-sectional structural view of the auxiliary assembly of the present invention;
FIG. 5 is a schematic diagram of the structure at the etching station of the present invention;
fig. 6 is an enlarged view of a portion a in fig. 5.
In the figure: 1. the device comprises a workbench, 2, support legs, 3, a supporting component, 4, a motor, 5, an auxiliary component, 6, an etching pool, 7, a bottom plate, 8, an etching component, 9, a premixing component, 31, a supporting frame, 32, an inserted link, 33, a connecting piece, 34, an electric push rod, 35, a protective frame, 51, a sleeve, 52, a first limiting groove, 53, a clamping block, 54, a connecting rod, 55, a second limiting groove, 56, a clamping column, 81, a column body, 82, a fixing frame, 83, a connecting plate, 84, a moving block, 85, a driving block, 86, a rotating block, 91, a feeding hole, 92, a premixing groove, 93, a magnetic stirrer, 94, a magnetic rotor, 95 and a filter screen.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, the present invention provides a technical solution: a semiconductor high-precision lead frame etching processing device comprises: workstation 1, stabilizer blade 2, supporting component 3, motor 4, auxiliary assembly 5, etching pond 6, bottom plate 7, etching subassembly 8, pre-mixed subassembly 9 and hot plate 10, a plurality of stabilizer blade 2 is fixed along upper and lower direction respectively and is settled in 1 bottom four corners of workstation, supporting component 3 sets up the top at workstation 1, the fixed top middle part of settling at supporting component 3 of motor 4, auxiliary assembly 5 sets up the bottom middle part at supporting component 3, etching pond 6 is fixed to be settled in the bottom middle part of workstation 1, bottom plate 7 is fixed to be settled in the bottom of etching pond 6, etching subassembly 8 is settled in auxiliary assembly 5's below, pre-mixed subassembly 9 sets up the top at etching pond 6, hot plate 10 is fixed to be settled in the inner chamber of bottom plate 7, can heat the etching solvent, further guarantee reaction rate.
Preferably, the supporting member 3 further includes: support frame 31, the inserted bar 32, connecting piece 33, electric putter 34 and protection frame 35, a plurality of support frame 31 is fixed respectively and is set up on the top of workstation 1, the joint that the inserted bar 32 can be followed the upper and lower direction and remove is on the inboard top of support frame 31, connecting piece 33 is along the fixed top of settling at a plurality of inserted bar 32 of horizontal direction, electric putter 34 is along the fixed top rear side of settling at workstation 1 of upper and lower direction, its top stretches out end fixed connection to connecting piece 33, the fixed top of settling at connecting piece 33 of protection frame 35, can guarantee the stability of this device through supporting component 3.
Preferably, the auxiliary assembly 5 further comprises: sleeve 51, first spacing groove 52, fixture block 53, connecting rod 54 and second spacing groove 55, the sleeve 51 activity is cup jointed in the end outside that stretches out of motor 4 bottom, first spacing groove 52 is fixed to be seted up on sleeve 51's inner wall, the shape of first spacing groove 52 is wavy, fixture block 53 is fixed to be settled in one side of motor 4 output, connecting rod 54 activity joint is in sleeve 51's inboard, second spacing groove 55 is along the fixed inner wall of seting up on connecting rod 54 top of upper and lower direction, and the activity joint is in fixture block 53's outside, card post 56 is fixed to be settled in the outer wall outside of connecting rod 54, the joint is in the inboard of first spacing groove 52 simultaneously, can guarantee through auxiliary assembly 5 that the lead frame stirs about in the etching solution is continuous, and guarantee etching efficiency.
Preferably, the etching module 8 further comprises: cylinder 81, mount 82, connecting plate 83, the movable block 84, drive block 85 and rotatory piece 86, the fixed bottom of settling at calorie post 56 of cylinder 81, the fixed outer wall outside of settling at cylinder 81 of mount 82, a plurality of connecting plate 83 is along the fixed inboard of settling at mount 82 of upper and lower direction, joint that two movable blocks 84 can follow the up-down direction respectively moves is both sides about the middle part of connecting plate 83, drive block 85 activity joint in the inboard of two movable blocks 84, the both ends of drive block 85 are all through T-slot and two movable block 84 activity joint, rotatory piece 86 can be around the rotatory middle part that sets up at connecting plate 83 of self axis, simultaneously spiro union in drive block 85, can provide a kind of quick-connect mounting effect to the lead frame through the minimum 8 of etching.
Preferably, the premixing assembly 9 further comprises: feed inlet 91, premixing groove 92, magnetic stirrers 93, magnetic rotor 94 and filter screen 95, feed inlet 91 is fixed to be settled at the top of workstation 1, premixing groove 92 is fixed to be settled in the top one side of etching pond 6, and be located the below of feed inlet 91, magnetic stirrers 93 is fixed to be settled in the bottom that is premixing groove 92, magnetic rotor 94 places the inner chamber bottom in premixing groove 92, filter screen 95 is along upper and lower direction fixed mounting in the junction of premixing groove 92 and etching pond 6, can improve the convenience in the preparation of etchant through premixing subassembly 9, and guarantee the dilution effect of etchant.
The detailed connection means is a technique known in the art, and the following mainly describes the working principle and process, and the specific operation is as follows.
The method comprises the following steps: in the actual use process of the device, firstly, solution is added into the etching pool 6 until the water level is lower than the magnetic rotor 94, then, the etchant is added into the feed inlet 91 by a worker, when the etchant enters the premixing tank 92, the magnetic stirrer 93 is started to drive the magnetic stirring rotor, the etchant can be quickly melted under the stable stirring action of the magnetic stirring rotor, the melted etchant enters the etching pool 6 after being filtered by the filter screen 95, meanwhile, the etchant can be heated by the heating plate 10 and is kept at a higher temperature, the reaction rate is improved, then, the electric push rod 34 is controlled to extend upwards, the connecting rod 54 is pushed to move upwards, so that the whole etching component 8 is driven to move to the upper part of the workbench 1, and then, the worker installs a lead frame on the connecting plate 83;
step two: in the process of installing the lead frames, firstly, two lead frames are respectively placed at the upper end and the lower end of a connecting plate 83, then a worker rotates a rotating block 86, the rotating block 86 is screwed with a driving block 85, the driving block 85 is driven to move in the motion process, and the two ends of the driving block 85 are respectively connected to a moving block 84 through T-shaped grooves, so that the moving effect of synchronously controlling the two moving blocks 84 is realized, the lead frames are fixed until the two moving blocks are completely connected with the lead frames, and after all the lead frames are installed, the whole etching assembly 8 is driven to enter etching liquid by controlling the electric push rod 34 to contract;
step three: then the motor 4 is started, after the motor 4 is started, the output end of the motor drives the fixture block 53 to synchronously rotate, and drives the connecting rod 54 to synchronously rotate, and because the outer wall of the connecting rod 54 is provided with the limiting column, in the moving process, the whole connecting rod 54 moves up and down along with the shape of the second limiting groove 55 in a reciprocating regular manner, and simultaneously, the rotation is realized under the driving of the motor 4, so that the moving effect of the lead frame in the etching solution is fully ensured, and the reaction efficiency of the etching solution is accelerated.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a semiconductor high accuracy lead frame etching processing equipment which characterized in that includes:
a table (1);
the supporting legs (2), a plurality of the supporting legs (2) are respectively and fixedly arranged at four corners of the bottom end of the workbench (1) along the vertical direction;
the supporting component (3), the supporting component (3) is arranged at the top end of the workbench (1);
the motor (4), the said motor (4) is fixedly arranged in the middle of top end of the said supporting component (3);
the auxiliary assembly (5), the auxiliary assembly (5) is arranged in the middle of the bottom end of the supporting assembly (3);
the etching pool (6), the etching pool (6) is fixedly arranged in the middle of the bottom end of the workbench (1);
the bottom plate (7), the bottom plate (7) is fixedly arranged at the bottom end of the etching pool (6);
an etching component (8), the etching component (8) being disposed below the auxiliary component (5);
a pre-mixing assembly (9), the pre-mixing assembly (9) being arranged at the top end of the etching bath (6);
a heating plate (10), wherein the heating plate (10) is fixedly arranged in the inner cavity of the bottom plate (7).
2. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the support assembly (3) comprises:
the supporting frames (31), a plurality of the supporting frames (31) are respectively and fixedly arranged at the top end of the workbench (1);
the inserted bar (32), the inserted bar (32) can move along the up-down direction and is clamped at the top end of the inner side of the supporting frame (31);
the connecting pieces (33), the connecting pieces (33) are fixedly arranged at the top ends of the inserting rods (32) along the horizontal direction;
the electric push rod (34), the electric push rod (34) is fixedly arranged at the rear side of the top end of the workbench (1) along the up-down direction, and the extending end of the top end of the electric push rod is fixedly connected to the connecting piece (33);
the protection frame (35) is fixedly arranged at the top end of the connecting piece (33).
3. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the auxiliary assembly (5) comprises:
the sleeve (51), the said sleeve (51) is connected to the outside of the end that stretches out of the bottom of the said electrical machinery (4) movably;
the first limiting groove (52), the first limiting groove (52) is fixedly arranged on the inner wall of the sleeve (51);
the fixture block (53), the said fixture block (53) is fixedly arranged on one side of the output end of the said electrical machinery (4);
the connecting rod (54), the said connecting rod (54) activity joint is in the inboard of the said bush (51);
the second limiting groove (55) is fixedly arranged on the inner wall of the top end of the connecting rod (54) along the vertical direction, and is movably clamped and connected to the outer side of the clamping block (53);
the clamping column (56) is fixedly arranged on the outer side of the outer wall of the connecting rod (54), and is clamped on the inner side of the first limiting groove (52).
4. The etching equipment for semiconductor high-precision lead frames according to claim 3, characterized in that: the shape of the first limiting groove (52) is wavy.
5. The etching equipment for semiconductor high-precision lead frames according to claim 3, characterized in that: the etching component (8) comprises:
the column body (81), the column body (81) is fixedly arranged at the bottom end of the clamping column (56);
the fixing frame (82), the fixing frame (82) is fixedly arranged on the outer side of the outer wall of the column body (81);
the connecting plates (83), a plurality of the connecting plates (83) are fixedly arranged on the inner side of the fixing frame (82) along the vertical direction;
the two moving blocks (84) can move up and down and are clamped at the upper side and the lower side of the middle part of the connecting plate (83);
the driving block (85), the said driving block (85) activity joint is in two said inboard of moving block (84);
the rotating block (86) is rotatably arranged in the middle of the connecting plate (83) around the axis of the rotating block (86) and is simultaneously screwed with the driving block (85).
6. The etching equipment for semiconductor high-precision lead frames according to claim 5, characterized in that: two ends of the driving block (85) are movably clamped with the two moving blocks (84) through T-shaped grooves.
7. The etching equipment for semiconductor high-precision lead frames according to claim 1, characterized in that: the premixing assembly (9) comprises:
the feeding hole (91), the feeding hole (91) is fixedly arranged at the top end of the workbench (1);
the premixing groove (92) is fixedly arranged on one side of the top end of the etching pool (6) and is positioned below the feed port (91);
the magnetic stirrer (93), the said magnetic stirrer (93) is fixed to the bottom end of the premixing trough (92);
a magnetic rotor (94), wherein the magnetic rotor (94) is placed at the bottom end of the inner cavity of the premixing groove (92);
and the filter screen (95) is fixedly arranged at the joint of the premixing groove (92) and the etching pool (6) along the up-down direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110894991.2A CN113675095B (en) | 2021-08-04 | 2021-08-04 | Semiconductor high-precision lead frame etching processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110894991.2A CN113675095B (en) | 2021-08-04 | 2021-08-04 | Semiconductor high-precision lead frame etching processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113675095A true CN113675095A (en) | 2021-11-19 |
| CN113675095B CN113675095B (en) | 2024-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110894991.2A Active CN113675095B (en) | 2021-08-04 | 2021-08-04 | Semiconductor high-precision lead frame etching processing equipment |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208873706U (en) * | 2018-12-05 | 2019-05-17 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame etching machines |
| CN210151219U (en) * | 2019-06-17 | 2020-03-17 | 天水迈格智能设备有限公司 | Etching equipment for producing lead frame |
| CN212577812U (en) * | 2020-06-02 | 2021-02-23 | 常州弘盛达电子设备有限公司 | Semiconductor high-precision lead frame etching processing equipment |
| CN212812190U (en) * | 2020-09-07 | 2021-03-26 | 深圳市龙涛电子科技有限公司 | Etching device is used in circuit board processing |
-
2021
- 2021-08-04 CN CN202110894991.2A patent/CN113675095B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN208873706U (en) * | 2018-12-05 | 2019-05-17 | 四川金湾电子有限责任公司 | A kind of semiconductor lead frame etching machines |
| CN210151219U (en) * | 2019-06-17 | 2020-03-17 | 天水迈格智能设备有限公司 | Etching equipment for producing lead frame |
| CN212577812U (en) * | 2020-06-02 | 2021-02-23 | 常州弘盛达电子设备有限公司 | Semiconductor high-precision lead frame etching processing equipment |
| CN212812190U (en) * | 2020-09-07 | 2021-03-26 | 深圳市龙涛电子科技有限公司 | Etching device is used in circuit board processing |
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| CN113675095B (en) | 2024-04-02 |
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