CN210579831U

CN210579831U - Electronic device

Info

Publication number: CN210579831U
Application number: CN201921212400.3U
Authority: CN
Inventors: 严幸锋; 周晶晶
Original assignee: Xian Novastar Electronic Technology Co Ltd
Current assignee: Pixelhue Technology Ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-05-19
Anticipated expiration: 2029-07-30

Abstract

An embodiment of the utility model provides an electronic equipment, include: a front panel; the circuit board is connected with the front panel, and a heating chip is arranged on one side of the circuit board, which is far away from the front panel; a heat conducting block, a first side of which covers the heat generating chip; and the rear cover plate is connected with the front panel and is fixedly connected with a second side of the heat-conducting block, which is opposite to the first side. The utility model discloses an electronic equipment has solved electronic equipment heat dissipation problem, has prolonged electronic equipment's stability, and simple structure, has replaced to use the fan to carry out radiating technical scheme among the prior art, has solved the little problem of electronic equipment inner space, makes the meticulous smallclothes of electronic equipment, has also reduced electronic equipment's noise simultaneously.

Description

Electronic device

Technical Field

The utility model relates to an electronic product technical field especially relates to an electronic equipment.

Background

Along with the development of the times, electronic equipment increasingly approaches to fine and small design, and the functions of products are rich, but the power consumption is also increasingly large, and high requirements are made on the stability and the heat dissipation of the electronic equipment. At present, more electronic equipment is forced to cool by designing a fan so as to meet the heat dissipation requirement of a product. However, the size of the product cannot be fine and small due to the addition of the fan, the service life of the fan affects the service life of the electronic equipment, and the use of the fan causes noise to the electronic equipment.

SUMMERY OF THE UTILITY MODEL

Therefore, for overcoming prior art's shortcoming and not enough, the embodiment of the utility model provides an electronic equipment to realize good heat dissipation and simple structure, product meticulous small and exquisite, improve the stability and the radiating effect of product.

In one aspect, an embodiment of the present invention provides an electronic device, including: a front panel; the circuit board is connected with the front panel, and a heating chip is arranged on one side of the circuit board, which is far away from the front panel; a heat conducting block, a first side of which covers the heat generating chip; and the rear cover plate is connected with the front panel and is fixedly connected with a second side of the heat-conducting block, which is opposite to the first side.

The technical scheme has the following advantages or beneficial effects: the embodiment of the utility model provides a through covering the heat conduction piece on the chip generates heat, with the heat conduction piece rigid coupling on the back shroud for on the heat of the chip that generates heat conducts the back shroud through the heat conduction piece, the back shroud forces the electronic equipment temperature to reduce with the outside air convection current, reaches the thermal balance of electronic equipment temperature and outside air.

In an embodiment of the present invention, the heat conducting block includes a first region covering the heat generating chip and a second region not covering the heat generating chip, and the second region is provided with a plurality of heat dissipation grooves.

In an embodiment of the present invention, the heat generating chip includes a first heat generating chip and a second heat generating chip, the heat conducting block includes a first heat conducting portion and a second heat conducting portion, the first heat conducting portion covers the first heat generating chip, and the second heat conducting portion covers the second heat generating chip; the first heat generating chip and the second heat generating chip are different in thickness, and the first heat conducting portion and the second heat conducting portion are different in thickness.

In one embodiment of the present invention, the sum of the thicknesses of the first heat generating chip and the first heat conduction portion is equal to the sum of the thicknesses of the second heat generating chip and the second heat conduction portion.

In an embodiment of the present invention, the electronic device further includes a heat conducting medium, the heat conducting medium is attached to the heat generating chip and between the heat conducting blocks.

In an embodiment of the present invention, the heat conducting medium includes a heat conducting glue filled between the heat generating chip and the heat conducting block; or the heat conducting medium comprises a heat conducting pad adhered between the heating chip and the heat conducting block.

In an embodiment of the present invention, a plurality of heat dissipation holes are disposed on the rear cover plate.

In an embodiment of the present invention, the heat conducting block and the back cover plate are integrally formed as a heat dissipating cover plate.

The utility model discloses an embodiment, the front panel is provided with display screen and operating button, the circuit board is connected the display screen with operating button.

In one embodiment of the present invention, the electronic device is a video monitor.

The technical scheme has the following advantages or beneficial effects: the embodiment of the utility model provides a through covering the heat conduction piece on the chip generates heat, with the heat conduction piece rigid coupling on the back shroud for on the heat of the chip that generates heat conducts the back shroud through the heat conduction piece, the back shroud forces the electronic equipment temperature to reduce with the outside air convection current, reaches the thermal balance of electronic equipment temperature and outside air. In addition, the heat dissipation groove is arranged in the area, which is not covered by the heating chip, of the heat conduction block, so that the heat of the heating chip can be dissipated through the heat dissipation groove; in addition, a heat-conducting medium is attached between the heating chip and the heat-conducting block, and the heating device is tightly connected with the heat-conducting medium, so that the heat-conducting property is enhanced. Secondly, the heat conduction block and the rear cover plate are integrally formed into the heat dissipation cover plate, when heat is conducted to the rear cover plate, the heat dissipation cover plate can better achieve heat dissipation, and the temperature of the electronic equipment is reduced. Moreover, the rear cover plate is provided with the plurality of heat dissipation holes, heat in the electronic equipment can be dissipated through the heat dissipation holes and dissipated together with the heat conduction block, heat dissipation efficiency is improved, and heat dissipation performance of the product is better improved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to a first embodiment of the present invention.

Fig. 2 is another schematic structural diagram of an electronic device according to a first embodiment of the present invention.

Fig. 3 is a schematic structural diagram of the electronic device shown in fig. 2 from another angle.

Fig. 4 is a schematic structural diagram of the heat conduction block 400 in the electronic device shown in fig. 3.

Fig. 5 is another structural diagram of the heat conduction block 400 in the electronic device shown in fig. 3.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

As shown in fig. 1 and fig. 2, an embodiment of the present invention provides an electronic device. The electronic apparatus includes, for example, a front panel 100, a circuit board 200, a heat conduction block 400, and a rear cover plate 500. Typically, the front panel 100 and the rear cover 500 are joined to form a housing or case of the electronic device, which accommodates the circuit board 200 and the heat conductive block 400.

The circuit board 200 is fixedly disposed on the front panel 100, for example, inside the front panel 100. The Circuit Board 200 is, for example, a Printed Circuit Board (PCB), and has the characteristics of high wiring density, light weight, thin thickness, and the like. A side of the circuit board 200 facing away from the front panel 100 is provided with a heat generating chip 210, and the heat generating chip 210 is, for example, an integrated circuit chip (ic chip) or an FPGA (Field-Programmable Gate Array) chip provided on a circuit board (PCB). The heating chip 210 generates a large amount of heat during operation, the temperature of the heating chip 210 rapidly rises in a short time, and heat must be dissipated to ensure stable operation of the heating chip 210.

The heat-generating chip 210 is covered on a first side of the heat-conducting block 400, and a second side opposite to the first side is connected to the rear cover plate 500, and the rear cover plate 500 is fixed to the front panel 100. The heat conducting block 400 is covered on the heating chip 210, and the heat conducting block 400 is fixedly connected to the rear cover plate 500, so that the heat of the heating chip 210 is conducted to the rear cover plate 500 through the heat conducting block 400, the rear cover plate 500 is in convection with the outside air, the temperature of the electronic equipment is forced to be reduced, and the thermal balance between the temperature of the electronic equipment and the outside air is achieved. The heat-conducting block 400 is, for example, a heat-conducting aluminum block, which has a good heat-conducting property and can conduct heat to the back cover plate 500 quickly.

As shown in fig. 4, in a specific embodiment, the area of the heat conduction block 400 is larger than that of the heat generating chip 210, the heat conduction block 400 includes a first region 410 covering the heat generating chip 210 and a second region 420 not covering the heat generating chip 210, and the second region 420 is provided with a heat dissipation groove 421. Preferably, the heat-generating chip 210 is covered in the middle area of the heat-conducting block 400, the heat-dissipating groove 421 is disposed in the edge area, and the heat-dissipating groove 421 is more preferably disposed as a long groove, so that after the heat of the heat-generating chip 210 is conducted to the heat-generating block 400, part of the heat can be dissipated into the internal space of the electronic device through the heat-dissipating groove 421.

In a specific embodiment, as shown in fig. 5, the heat generating chip 210 includes a first heat generating chip and a second heat generating chip, the heat conduction block 400 includes a first heat conduction part 430 and a second heat conduction part 440, the first heat conduction part 430 covers the first heat generating chip, and the second heat conduction part 440 covers the second heat generating chip; the first heat generating chip and the second heat generating chip have different thicknesses, and the first heat conduction part 430 and the second heat conduction part 440 have different thicknesses. The sum of the thicknesses of the first heat generating chip and the first heat conductive part 430 is equal to the sum of the thicknesses of the second heat generating chip and the second heat conductive part 440. Preferably, when the heating chips 210 are multiple and close in position, one heat conduction block 400 is used to cover the multiple heating chips 210, and when the heating chips 210 are different in thickness, the heat conduction block 400 can be provided with protrusions according to conditions, so that the heat conduction block 400 is close to the heating chips 210, and a better heat dissipation effect is achieved.

In a specific embodiment, as shown in fig. 2 and fig. 3, the electronic device of this embodiment may further include a heat conducting medium 300, where the heat conducting medium 300 is attached between the heat generating chip 210 and the heat conducting block 400. Specifically, the heat conductive medium 300 includes, for example, a heat conductive paste and a heat conductive pad. The heat conducting glue is filled between the heating chip 210 and the heat conducting block 400; the shape of the thermal pad corresponds to the shape of the heat-generating chip 210, and the thermal pad is adhered between the heat-generating chip 210 and the thermal block 400, and is closely adhered to the heat-generating chip 210 and the thermal block 400. The heat conductivity can be enhanced by the arrangement of the heat-conducting medium 300, the heat of the heating chip 210 is conducted to the heat-conducting medium 300, then the heat is conducted to the heat-conducting block 400 through the close fit of the heat-conducting medium 300 and the heat-conducting block 400, and finally the heat is conducted to the rear cover plate 500. The rear cover 500 directly convects with the outside air, forcing the electronic device to decrease in temperature.

In a specific embodiment, a plurality of heat dissipation holes 510, such as a plurality of rectangular through holes in multiple rows as shown in fig. 1, are formed in the rear cover plate 500, and a filter screen is disposed inside the rear cover plate 500 at a position corresponding to the heat dissipation holes 510. Can distribute away the inside heat of electronic equipment through louvre 510 to reach better radiating effect, the filter screen can avoid debris such as dust, winged insect to get into inside the electronic equipment when not influencing louvre 510 heat dissipation.

In a specific embodiment, the rear cover 500 is a heat dissipation cover, such as a metal cover, which has good heat dissipation performance, and when heat is conducted to the rear cover 500, the area of the rear cover is large and the heat dissipation performance is good, so that heat can be better dissipated. Further, the rear cover plate 500 and the heat conducting block 400 are integrally formed, for example, integrally made of a material with good heat dissipation performance, so that the heat dissipation performance of the electronic device can be further improved.

In one embodiment, the front panel 100 may be provided with a display screen 110 and a manipulation button 120, and the circuit board 200 connects the display screen 110 and the manipulation button 120. The display screen 110 is, for example, a liquid crystal display screen or an LED display screen, and can be used for image display; the manipulation buttons 120 are used to control the electronic device.

In a specific embodiment, the electronic device of this embodiment may be, for example, a video monitor, which may be used for post-production, broadcasting, on-site monitoring and video input pre-monitoring, and may be installed in a flight box, a relay van, a clipping workshop, and other places where high-quality video monitoring is required, a display screen on a front panel of the video monitor may be used for displaying images for video monitoring, and the operation button may control functions of the video monitor, such as turning on and off, switching output sources, and the like.

To sum up, the utility model discloses simple structural design will generate heat chip 210, heat conduction piece 400 and back shroud 500 and closely laminate for on the heat of chip 210 that generates heat is conducted to back shroud 500 by heat conduction piece 400 fast, by back shroud 500 and air convection, realize high-efficient heat dissipation. In addition, the heat dissipation groove 421 is disposed on the area of the heat conduction block 400 not covered by the heat generating chip 210, so that the heat of the heat generating chip 210 can be dissipated through the heat dissipation groove 421. In addition, a heat conducting medium 300 is further arranged between the heating chip 210 and the heat conducting block 400, so that heat conduction is enhanced, and the heat dissipation efficiency is improved. In addition, the rear cover plate 500 is a heat dissipation cover plate, so that the heat dissipation area is large, and meanwhile, the heat dissipation performance is good, and the heat dissipation can be better. The rear cover plate 500 and the heat conducting block 400 are integrally formed, so that the heat dissipation effect is further improved. Furthermore, the rear cover plate 500 is provided with a plurality of heat dissipation holes 510, and heat inside the electronic device can be dissipated through the heat dissipation holes 510, so that a better heat dissipation effect is achieved. The utility model discloses an electronic equipment has solved electronic equipment heat dissipation problem, has prolonged electronic equipment's stability, and simple structure, has replaced to use the fan to carry out radiating technical scheme among the prior art, has solved the little problem of electronic equipment inner space, makes the meticulous smallclothes of electronic equipment, has also reduced electronic equipment's noise simultaneously.

In addition, it should be understood that the foregoing embodiments are merely exemplary of the present invention, and the technical solutions of the embodiments can be arbitrarily combined and collocated without conflict between technical features and structures, and not departing from the purpose of the present invention.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other manners. For example, the above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and the actual implementation may have another division, for example, multiple units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on multiple network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.

Claims

1. An electronic device, comprising:

a front panel;

the circuit board is connected with the front panel, and a heating chip is arranged on one side of the circuit board, which is far away from the front panel;

a heat conducting block, a first side of which covers the heat generating chip;

and the rear cover plate is connected with the front panel and is fixedly connected with a second side of the heat-conducting block, which is opposite to the first side.

2. The electronic device according to claim 1, wherein the heat conductive block includes a first region covering the heat generating chip and a second region not covering the heat generating chip, the second region being provided with a plurality of heat dissipation grooves.

3. The electronic device of claim 1, wherein the heat generating chip comprises a first heat generating chip and a second heat generating chip, the thermal conduction block comprises a first thermal conduction portion and a second thermal conduction portion, the first thermal conduction portion covers the first heat generating chip, and the second thermal conduction portion covers the second heat generating chip; the first heat generating chip and the second heat generating chip are different in thickness, and the first heat conducting portion and the second heat conducting portion are different in thickness.

4. The electronic device according to claim 3, wherein a sum of thicknesses of the first heat generating chip and the first heat conductive portion is equal to a sum of thicknesses of the second heat generating chip and the second heat conductive portion.

5. The electronic device of claim 1, further comprising:

and the heat conducting medium is attached between the heating chip and the heat conducting block.

6. The electronic device according to claim 5, wherein the heat conductive medium includes a heat conductive paste filled between the heat generating chip and the heat conductive block; or

The heat conducting medium comprises a heat conducting pad adhered between the heating chip and the heat conducting block.

7. The electronic device of claim 1, wherein the rear cover plate is provided with a plurality of heat dissipation holes.

8. The electronic device of claim 1, wherein the heat conducting block is integrally formed with the back cover as a heat dissipating cover.

9. The electronic device of claim 1, wherein the front panel is provided with a display screen and manipulation buttons, and the circuit board connects the display screen and the manipulation buttons.

10. The electronic device of claim 1, wherein the electronic device is a video monitor.