CN210334656U - Laser soldering automation assembly line - Google Patents

Abstract

The utility model discloses a laser soldering automatic assembly line, which comprises a feeding track, and a glue dispensing device, an assembling tin ring device and a laser welding device which are arranged in sequence along the feeding direction of the feeding track; the dispensing device is used for dispensing soldering flux to a workpiece, the tin ring assembling device is used for installing a tin ring at the welding position of the workpiece, and the laser welding device is used for welding the workpiece. The utility model discloses technical scheme's automatic assembly line of laser soldering has the efficient advantage of work piece.

Description

Laser soldering automation assembly line

Technical Field

The utility model relates to a laser welding technical field, in particular to laser soldering automation assembly line.

Background

Laser welding is an efficient precision welding method using a laser beam with high energy density as a heat source. Laser welding is one of the important aspects of the application of laser material processing techniques. Currently, the laser welding process is gradually mature, and therefore, an automatic assembly line adapted to the laser welding process needs to be provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing an automatic assembly line of laser soldering, aim at adaptation laser welding technology to improve the machining efficiency of work piece.

In order to achieve the above purpose, the utility model provides a laser soldering automation assembly line, which comprises a feeding track, and a glue dispensing device, an assembling tin ring device and a laser welding device which are arranged in sequence along the feeding direction of the feeding track;

the dispensing device is used for dispensing soldering flux to a workpiece, the tin ring assembling device is used for assembling a tin ring at the welding position of the workpiece, and the laser welding device is used for welding the workpiece.

Optionally, the dispensing device comprises a dispensing cylinder and a first CCD vision module, the dispensing cylinder is used for dispensing the soldering flux at the welding position of the workpiece, and the first CCD vision module is used for capturing the welding position of the workpiece.

Optionally, the tin ring assembling device comprises a grabbing piece and a second CCD vision module, the grabbing piece is used for grabbing the tin ring, and the second CCD vision module is used for capturing the welding position of the workpiece and the tin ring.

Optionally, the second CCD vision module includes an upper CCD camera and a lower CCD camera, the lens of the upper CCD camera faces downward for capturing a welding point of the workpiece, and the lens of the lower CCD camera faces upward for capturing a tin ring.

Optionally, the gripping member is a suction nozzle, which is retractable in a vertical direction.

Optionally, the laser welding device includes laser emitter, third CCD vision module and a refraction section of thick bamboo, first installing port and second installing port have been seted up to a one end of a refraction section of thick bamboo, and the light-emitting window has been seted up to the other end, the light-emitting window with be formed with laser channel between the first installing port, the light-emitting window with be formed with between the second installing port and catch optical channel, laser emitter install in first installing port, third CCD vision module install in the second installing port for catch the welding department of work piece.

Optionally, an entrance port is formed in a side wall of the light capturing channel, and the laser channel is communicated with the entrance port; the refraction section of thick bamboo includes speculum and beam combiner, the speculum install in laser passageway, beam combiner install in catch the light channel, and correspond the entrance set up, the speculum slope set up in first installation mouth with between the entrance, be used for with laser emitter transmitted laser reflection extremely beam combiner, beam combiner slope set up in between the entrance with the light-emitting window, be used for with the laser reflection of speculum extremely the light-emitting window.

Optionally, the feeding track comprises a processing section, the processing section comprises a feeding section, a jacking section and a discharging section, the feeding section, the jacking section and the discharging section are arranged in a segmented mode along the feeding direction of the feeding track, and the adhesive dispensing device, the tin ring assembling device and the laser welding device are internally provided with the processing section.

Optionally, the automatic assembly line of laser soldering still includes jacking platform, jacking platform corresponds the jacking section sets up, jacking platform be used for the jacking section rises, in order to push away the work piece jacking section, jacking platform be used for the jacking section descends, so that the work piece after the processing fall back extremely the jacking section, and continue to follow the pay-off track is carried.

Optionally, the laser soldering automation assembly line further comprises a backflow track, one end of the backflow track is connected to the discharge side of the laser welding device, the other end of the backflow track is connected to the feed side of the dispensing device, and the backflow track is conveyed from the laser welding device to the dispensing device in the direction to convey a tool jig of a workpiece.

The utility model discloses an automatic assembly line of laser soldering through set gradually adhesive deposite device, equipment tin ring device and laser welding device in the orbital pay-off direction of pay-off, can carry out some scaling powder, equipment tin ring and laser welding operation to the work piece in proper order to accomplish the required all steps of welding of work piece, and improved the machining efficiency of work piece.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an embodiment of the laser soldering automation assembly line of the present invention;

FIG. 2 is a schematic view of a portion of the structure of the embodiment shown in FIG. 1;

FIG. 3 is a schematic view of the dispensing apparatus shown in FIG. 1;

FIG. 4 is a schematic view of a portion of the dispensing apparatus shown in FIG. 3;

FIG. 5 is a schematic view of the structure of a processing section in the dispensing apparatus;

FIG. 6 is a schematic view of the processing station of FIG. 5 from another perspective;

fig. 7 is a schematic view of a partial structure of the dispensing device of fig. 3 showing a dispensing cylinder and a first CCD module;

FIG. 8 is a schematic view of an assembly of the solder ring apparatus in the embodiment shown in FIG. 8;

FIG. 9 is a schematic view of a portion of the assembled solder ring apparatus shown in FIG. 8;

FIG. 10 is a schematic view of the structure of the upper CCD camera and the grasping member of the solder ring assembling apparatus shown in FIG. 8;

FIG. 11 is a schematic view showing the construction of the laser welding apparatus in the embodiment shown in FIG. 1;

FIG. 12 is a schematic view of a portion of the laser welding apparatus shown in FIG. 11;

FIG. 13 is a schematic structural view of a laser transmitter, a camera of a third CCD module, and a refractive cylinder in the laser welding apparatus shown in FIG. 11;

fig. 14 is an exploded view and a sectional view of fig. 13.

The reference numbers illustrate:

the objects, features and advantages of the present invention will be further described with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.

It should be noted that, if directional indications (such as upper, lower, left, right, front and rear … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative position relationship between the components, the motion situation, etc. in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are changed accordingly.

In addition, if there is a description relating to "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B" including either scheme A, or scheme B, or a scheme in which both A and B are satisfied. In addition, the technical solutions in the embodiments may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should not be considered to exist, and is not within the protection scope of the present invention.

The utility model provides an automatic assembly line of laser soldering.

In the embodiment of the present invention, as shown in fig. 1, the laser soldering automated assembly line includes a feeding track 100, a dispensing device 200, an assembling tin ring device 300, and a laser welding device 400. The dispensing device 200, the solder ring assembling device 300, and the laser welding device 400 are sequentially disposed along the feeding direction of the feeding track 100.

Specifically, the dispensing device 200 is used for dispensing flux to a workpiece, the solder ring device 300 is used for mounting a solder ring on a welding position of the workpiece, and the laser welding device 400 is used for welding the workpiece. In particular, when the workpiece enters the laser welding apparatus 400, the laser welding apparatus 400 melts a tin ring on the workpiece and welds a weld material to the workpiece. For example, in this embodiment, the workpiece is a PCB (Printed Circuit Board), and the solder is an FPCB (Flexible Printed Circuit Board).

It can be understood that the utility model discloses an automatic assembly line of laser soldering through set gradually adhesive deposite device 200, equipment tin ring device 300 and laser welding device 400 in the pay-off direction at pay-off track 100, can carry out some scaling powder, equipment tin ring and laser welding operation to the work piece in proper order to each item operation is accomplished to adaptation laser welding technology, and then improves the machining efficiency of work piece.

Referring to fig. 1, the laser soldering automated assembly line of the present embodiment further includes a reflow rail 500, one end of the reflow rail 500 is connected to the discharging side of the laser welding device 400, and the other end is connected to the feeding side of the dispensing device 200, and the reflow rail 500 is transported from the laser welding device 400 to the dispensing device 200 to transport the tooling fixture 700 of the workpiece.

It should be noted that, the assembly platform 510 is disposed on the feeding side of the dispensing device 200 in the laser soldering automated assembly line of the embodiment, and a worker assembles a workpiece on the tooling fixture 700 (indicated in fig. 4) on the assembly platform 510. The tool jig 700 is adaptable to fix workpieces of different specifications, and the workpieces can be assembled on the tool jig 700 to fix the workpieces and ensure the machining precision of the workpieces.

The sorting platform 520 is arranged on the discharging side of the laser welding device 400, the machined workpiece is transported to the sorting platform 520, and the machined workpiece can be separated from the tooling fixture 700 by the worker through the sorting platform 520.

Specifically, in the present embodiment, the two ends of the reflow soldering track 500 are respectively connected to the assembling platform 510 and the sorting platform 520. It can be understood that the tool jig 700 can be reflowed through the reflow rail 500, so that the utilization rate of the tool jig 700 is improved, and the demand of the tool jig 700 is reduced. Of course, in other embodiments of the present application, the return track 500 may not be provided.

For convenience of description, referring to the drawings of the present embodiment, coordinate axes consisting of three axes x, y, and z are defined, wherein the x axis is parallel to the conveying direction of the feeding track 100, the y axis is perpendicular to the x axis, the x axis and the y axis are in the same plane, and the z axis is perpendicular to the plane of the x axis and the y axis.

Referring to fig. 2 to 6, in the present embodiment, the feeding rail 100 includes a processing section 110, and the processing section 110 includes a feeding section 111, a lifting section 112 and a discharging section 113. The feeding section 111, the jacking section 112 and the blanking section 113 are arranged along the feeding direction of the feeding track 100 in a segmented manner, and the processing sections 110 pass through the glue dispensing device 200, the tin ring assembling device 300 and the laser welding device 400.

Specifically, the dispensing device 200, the solder ring assembly device 300, and the laser welding device 400 each include a housing, the housing has openings on both sides along the feeding direction of the feeding track 100, the feeding track 100 passes through the two openings and passes through the dispensing device 200, the solder ring assembly device 300, and the laser welding device 400, and the dispensing device 200, the solder ring assembly device 300, and the laser welding device 400 perform different types of processing on the workpiece in the respective housings.

It can be understood that the processing section 110 is configured as a three-section structure of the feeding section 111, the lifting section 112 and the discharging section 113, and the conveying speeds of the feeding section 111, the lifting section 112 and the discharging section 113 can be controlled to control the conveying speeds of the workpieces in the dispensing device 200, the assembling tin ring device 300 and the laser welding device 400, respectively, so as to adapt to different types of processing. In addition, because the processing section 110 is arranged in sections, when the front conveying track breaks down, the conveying of the workpieces by the rear conveying track and the processing of the workpieces by the rear equipment are not influenced, and the stability of the assembly line operation is improved. Meanwhile, the processing section 110 is provided in sections, and has another advantage that the feeding section 111, the jacking section 112 and the blanking section 113 can be maintained and maintained independently, and the operation is convenient.

Referring to fig. 4 to fig. 6, taking the processing segment 110 in the dispensing apparatus 200 as an example, the structure of the processing segment 110 of the present embodiment will be further described.

Specifically, in this embodiment, the feeding section 111, the jacking section 112, and the discharging section 113 are composed of two parallel transmission belts, and the power of the two belts can be from the same motor or from different motors. It should be noted that in other embodiments of the present application, the feeding section 111, and/or the jacking section 112, and/or the blanking section 113 may also be formed by a conveyor belt.

Further, in this embodiment, the laser soldering automated assembly line further includes a jacking platform 600, the jacking platform 600 is liftably installed on the base of the dispensing device 200 and is disposed corresponding to the jacking section 112 (on the assembling tin ring device 300, the jacking platform 600 is correspondingly disposed on the base of the assembling tin ring device 300 and is disposed corresponding to the jacking section 112 on the assembling tin ring device 300, and the same reasoning is performed on the laser welding device 400), the jacking platform 600 can be raised relative to the jacking section 112 to jack the workpiece away from the jacking section 112 for processing the workpiece, and the jacking platform 600 can be lowered relative to the jacking section 112 to enable the processed workpiece to return to the jacking section 112 and continue to be conveyed along the feeding track 100. That is, the lifting platform 600 can move along the z-axis direction to lift or lower the workpiece.

Specifically, when the workpiece is transferred from the feeding section 111 to the position, corresponding to the position where the jacking platform 600 is disposed, of the jacking section 112, the jacking section 112 stops transportation, at this time, the workpiece is at least partially located on the jacking platform 600, the jacking platform 600 is lifted, so that the workpiece is separated from the transportation track, and after the jacking platform 600 is lifted to a certain height, the dispensing device 200 can perform flux dispensing operation on the workpiece (i.e., the tin ring assembling operation is performed in the tin ring assembling device 300, and the laser welding operation is performed in the laser welding device 400). After the workpiece is machined, the lifting platform 600 is lowered to return the workpiece to the lifting section 112, and the lifting section 112 returns to operate to transport the machined workpiece to the next working position.

It can be understood that the workpiece is lifted by the lifting platform 600, and each workpiece is located at the same position in the machining process, so that the positioning difficulty of the workpiece is reduced, and the machining precision of the workpiece is improved. Meanwhile, the workpiece is processed on the lifted jacking platform 600, so that a space exists between the processing position of the workpiece and the feeding rail 100, the feeding rail 100 can be protected from being influenced by processing equipment, and the service life of the feeding rail 100 is prolonged.

Specifically, in the present embodiment, the jacking platform 600 extends along the y-axis direction, i.e., the extending direction of the jacking platform 600 is perpendicular to the feeding direction of the feeding rail 100. Correspondingly, the jacking section 112 is provided with a position avoiding opening for the jacking platform 600 to pass through. Set up like this, not only multiplicable jacking platform 600's bearing area guarantees the stability of placing on the work piece jacking platform 600, still can reduce jacking platform 600 and occupy the area of jacking section 112, and makes the work piece fall back behind jacking section 112, guarantees the normal transportation of work piece.

Specifically, in the present embodiment, the jacking platform 600 is driven by a cylinder to ascend and descend relative to the jacking section 112, and in other embodiments, the jacking platform 600 may also be driven by a hydraulic cylinder or a motor.

Referring to fig. 6, in the present embodiment, the laser soldering automated assembly line further includes a first sensor 610 and an interception member 620, wherein the first sensor 610 is installed on the feeding section 111 to sense whether a workpiece passes through, the interception member 620 is movably installed on the lifting section 112 and located behind the lifting platform 600 along the feeding direction of the feeding rail 100, and the interception member 620 is used to extend relative to the lifting section 112 and intercept the workpiece on the lifting section 112 or retract relative to the lifting section 112 so that the workpiece normally passes through the lifting section 112. It can be understood that when the workpiece is transported by the jacking section 112 to the position where the jacking platform 600 is located, a certain response time is required for the jacking section 112 to be switched from the operating state to the stopping state, and the workpiece still moves in the response time, so that the workpiece cannot be accurately positioned on the jacking platform 600. And the first sensor 610 is matched with the interception piece 620, so that the workpiece can be intercepted on the jacking platform 600, and the positioning accuracy of the workpiece is improved.

Specifically, the blocking member 620 is a baffle plate disposed at the bottom of the jacking section 112, the baffle plate can be raised or lowered relative to the jacking section 112, the jacking section 112 is correspondingly provided with a through hole for the baffle plate to pass through, and in this embodiment, the baffle plate is disposed between two conveyor belts forming the jacking section 112. Specifically, in the present embodiment, the baffle is driven by the cylinder to move up and down relative to the jacking section 112, and in other embodiments, the baffle may also be driven by the hydraulic cylinder or the motor. It should be noted that in other embodiments of the present application, the intercepting member 620 may also extend relative to the lifting section 112 by rotating, telescoping, etc. to form a stop on the lifting section 112 to intercept the workpiece.

Further, the laser soldering automated assembly line of the present embodiment further includes a second sensor (not shown) disposed on the lifting platform 600 for sensing whether the workpiece stays on the lifting platform 600. It can be understood that the first sensor 610 can sense whether a workpiece passes through the feeding section 111, and the following operations can be realized by cooperating with the second sensor: when the first sensor 610 senses that the workpiece passes through the feeding section 111, if the second sensor feeds back that the workpiece does not stay on the jacking platform 600, the feeding section 111 conveys the workpiece to the jacking section 112; if the workpiece stays on the second sensor feedback lifting platform 600, the feeding section 111 stops running, and the workpiece is kept on the feeding section 111 until no workpiece stays on the second sensor feedback lifting platform 600. Therefore, two or more workpieces can be prevented from simultaneously existing in the jacking section 112, and the stability of the operation of the production line is ensured.

As shown in fig. 3, 4 and 7, in the present embodiment, the dispensing device 200 includes a dispensing cylinder 210 and a first CCD vision module 220. The dispensing cylinder 210 is communicated with the dispensing valve for dispensing flux at the welding position of the workpiece, and the first CCD vision module 220 is used for capturing the welding position of the workpiece. Specifically, the vision module can measure and judge by a robot instead of a human eye to capture the welding position of the workpiece. Generally, to achieve accurate positioning of the vision module, an identification signal is set on the captured object. The CCD vision module is a type of vision module, and uses a CCD camera as a capture device. It can be understood that the dispensing device 200 captures the welding position of the workpiece through the first CCD vision module 220, and then controls the dispensing cylinder 210 to move, so as to automatically, accurately and efficiently dispense the flux on the workpiece.

Further, the dispensing apparatus 200 further includes a first gantry 240 and a first moving module 230. The first gantry 240 is erected above the feeding track 100, and the first moving module 230 is disposed on the first gantry 240 and can move along the x-axis direction, the y-axis direction and the z-axis direction. The first motion module 230 includes a first x-axis module 231, a first y-axis module 232, and a first z-axis module 233. The first y-axis module 232 is movable in the y-axis direction, the first x-axis module 231 is mounted on the first y-axis module 232 and is movable in the x-axis direction, and the first z-axis module 233 is mounted on the first x-axis module 231 and is movable in the z-axis direction. The dispensing cylinder 210 and the CCD camera of the first CCD vision module 220 are both mounted on the first z-axis module 233. It is understood that the camera of the first CCD vision module 220 and the dispensing cylinder 210 can be driven to move along the x-axis, the y-axis and the z-axis by the first movement module 230.

Specifically, when the flux is dispensed on the workpiece, the welding position of the workpiece is captured by the first CCD vision module 220 and fed back to the control system of the dispensing device 200 in real time, the control system of the dispensing device 200 controls the first movement module 230 to move, so that the dispensing cylinder 210 is aligned with the welding position of the workpiece, and then the opening and closing of the dispensing valve is controlled, and a proper amount of flux is dispensed on the welding position of the workpiece. It can be understood that the first CCD vision module 220 and the dispensing cylinder 210 cooperate to perform the flux dispensing operation on a plurality of welding positions of the workpiece.

As shown in fig. 2, 8 and 9, in the present embodiment, the apparatus 300 for assembling a solder ring includes a gripping member 310 and a second CCD vision module 320. The grabbing member 310 is used for grabbing a solder ring and assembled to a solder joint of a workpiece, and the second CCD vision module 320 is used for capturing the solder joint and the solder ring of the workpiece. It can be understood that, the assembly of the solder ring apparatus 300 captures the solder joints and solder rings of the workpiece through the second CCD vision module 320, and then controls the grasping member 310 to grasp the solder rings first, and then controls the grasping member 310 that grasps the solder rings to move, so as to assemble the solder rings at the solder joints of the workpiece, thereby automatically, accurately, and efficiently assembling the solder rings on the workpiece.

Specifically, the apparatus 300 for assembling solder rings of the present embodiment further includes a flying head 350, and the flying head 350 is used for providing solder rings for the pick-up member 310. It should be noted that the booms 350, also called feeders or feeders, are well-established technologies in the SMT (Surface mounting technology) field, and are not described in detail herein, and specific operation principles and structures thereof can be referred to the conventional booms 350.

Referring to fig. 8 and 9, in the present embodiment, the second CCD vision module 320 includes an upper CCD camera 321 and a lower CCD camera 322, wherein a lens of the upper CCD camera 321 faces downward for capturing a solder joint of a workpiece, and a lens of the lower CCD camera 322 faces upward for capturing a solder ring. Specifically, when the solder ring is assembled to the solder joint of the workpiece, the position of the solder ring on the flying reach is determined by the lower CCD camera 321, then the grabbing piece 310 grabs the solder ring from the flying reach 350, after the grabbing piece 310 grabs the solder ring, the lower CCD camera 322 can also capture the solder ring on the grabbing piece 310 to feed back the position of the solder ring relative to the grabbing piece 310, and then the upper CCD camera 321 determines the position of the solder joint of the workpiece. The position of the solder ring determined by the lower CCD camera 322 relative to the position of the grabbing piece 310 and the position of the workpiece welding position determined by the upper CCD camera 321 can accurately position the solder ring on the grabbing piece 310 at the workpiece welding position, thereby completing the assembly of the solder ring. It can be appreciated that the accuracy of the solder ring assembly can be improved by the cooperation of the upper CCD camera 321 and the lower CCD camera 322.

Further, the apparatus 300 for assembling solder rings further includes a second gantry 340 and a second moving module 330. The second gantry 340 is erected above the feeding track 100, and the second moving module 330 is arranged on the second gantry 340 and can move along the x-axis direction, the y-axis direction and the z-axis direction. The second motion module 330 includes a second x-axis module, a second y-axis module, and a second z-axis module 331. The second y-axis module can move along the y-axis direction, the second x-axis module is mounted on the second y-axis module and can move along the x-axis direction, and the second z-axis module 331 is mounted on the second x-axis module and can move along the z-axis direction. The grasping element 310 and the upper CCD camera 321 are both mounted on the second z-axis module 331. It is understood that the second motion module 330 can drive the grasping element 310 and the upper CCD camera 321 to move along the x-axis, the y-axis and the z-axis.

Referring to fig. 10, in the present embodiment, the grabbing component 310 is a suction nozzle, and the suction nozzle can extend and contract along a vertical direction, i.e. along a z-axis direction. Specifically, the suction nozzle is communicated with the negative pressure device, and the suction nozzle is controlled to suck or release the tin ring through the opening and closing of the negative pressure device. Because the quality of tin ring is light, and intensity is low and yielding, consequently choose for use the suction nozzle as grabbing piece 310, can avoid the tin ring to warp because of receiving external force when guaranteeing to snatch the stability of tin ring, improve the machining precision of work piece. And the suction nozzle is arranged in a telescopic manner, so that the tin ring can be retracted after the tin ring is assembled, and the mutual interference between the suction nozzle and a workpiece is avoided.

In the present embodiment, the assembly solder ring apparatus 300 includes two parallel suction nozzles for simultaneously gripping two solder rings. After the two suction nozzles suck the tin rings, one suction nozzle shrinks, the tin ring assembling device 300 controls the movement of the grabbing part 310, the tin rings on the non-shrunk suction nozzle are assembled at a welding position of a workpiece, and the suction nozzle shrinks after releasing the tin rings. At this time, the suction nozzle still grasping the tin ring is extended, and the tin ring assembling device 300 controls the grasping member 310 to move, so as to assemble the tin ring at another welding position of the workpiece. Therefore, the mutual interference of the two suction nozzles can be avoided, the tin ring assembling operation of two welding positions on the workpiece is completed, and the operation efficiency is improved. For the embodiment with a plurality of suction nozzles, the basic working process for assembling the tin ring is the same, and the description is omitted here.

It should be noted that in other embodiments of the present application, the gripping member 310 may also be configured as a suction cup, a mechanical claw, or the like.

As shown in fig. 2 and 11, in the present embodiment, the laser welding apparatus 400 includes a laser emitter 410, a third CCD vision module 420, and a refractive cylinder 430.

Specifically, as shown in fig. 12 to 14, one end of the refraction tube 430 is provided with a first installation opening 431a and a second installation opening 431b, the other end is provided with a light outlet 431c, a laser channel is formed between the light outlet 431c and the first installation opening 431a, a light capturing channel is formed between the light outlet 431c and the second installation opening 431b, the laser emitter 410 is installed at the first installation opening 431a, and the third CCD vision module 420 is installed at the second installation opening 431b for capturing the welding position of the workpiece. Specifically, the camera of the third CCD vision module 420 is mounted to the second mounting opening 431b, and the lens faces the second mounting opening 431b, and since a light capturing channel is formed between the second mounting opening 431b and the light outlet 431c, the light reflected by the welded portion of the workpiece is captured by the camera of the third CCD vision module 420, and the position of the welded portion of the workpiece is determined and fed back to the control system of the laser welding apparatus 400. The laser emitted by the laser emitter 410 is emitted from the light outlet 431c through the laser channel to melt the tin ring on the welding position of the workpiece. It can be understood that the laser welding device 400 melts the tin ring by laser, and the third CCD vision module 420 captures the welding position of the workpiece and also needs to capture the light emitted from the workpiece. The refraction tube 430 enables the laser emitting module and the third CCD vision module 420 to share the same light outlet 431c, which can improve the processing precision of the laser welding device 400, make the structure between the laser emitter 410 and the third CCD vision module 420 more compact, and reduce the volume of the laser welding device 400.

Specifically, in the present embodiment, the side wall included in the capturing optical channel is clamped with the entrance port 431d, and the laser channel is communicated with the entrance port 431 d. Thus, the trapping optical channel and the laser channel can share a part of the channel, thereby increasing the utilization rate of the inner space of the refraction cylinder 430 and reducing the volume of the refraction cylinder 430.

Specifically, the refractive cylinder 430 includes a cylinder body 431, a collimator set 434, a filter 435, a reflecting mirror 432, a beam combiner 433, and a focusing set 436. The cylinder 431 has a first mounting port 431a, a second mounting port 431b and a light outlet port 431c, and the inner wall of the cylinder 431 forms an entrance port 431 d. The set of collimating mirrors 434 is mounted to the first mounting opening 431a for maintaining the collimation of the beam between the laser resonator and the focusing optics. A filter 435 is mounted on the second mounting hole 431b for filtering light to ensure that the third CCD vision module 420 can accurately capture the welding position of the workpiece. The reflecting mirror 432 is installed in the laser channel, the beam combining mirror 433 is installed in the capturing optical channel and is disposed corresponding to the incident port 431d, the reflecting mirror 432 is obliquely disposed between the first installation port 431a and the incident port 431d to reflect the laser light emitted by the laser emitter 410 to the beam combining mirror 433, and the beam combining mirror 433 is obliquely disposed between the incident port 431d and the light outlet port 431c to reflect the laser light reflected by the reflecting mirror 432 to the light outlet port 431 c. Meanwhile, the beam combiner 433 does not block the light from passing between the light outlet 431c and the second mounting hole 431 b. The focusing lens 436 is installed at the light exit 431c for focusing the laser. It can be understood that the transmission of the laser and the transmission of the light captured by the third CCD vision module 420 can be realized simultaneously by the cooperation of the reflecting mirror 432 and the beam combining mirror 433.

Further, as shown in fig. 11, the dispensing apparatus 200 further includes a third gantry 450 and a third moving module 440. The third gantry 440 is erected above the feeding track 100, and the third moving module 400 is arranged on the third gantry 450 and can move along the x-axis direction, the y-axis direction and the z-axis direction. The third motion module includes a third x-axis module, a third y-axis module and a third z-axis module 441. The third y-axis module can move along the y-axis direction, the third x-axis module is mounted on the third y-axis module and can move along the x-axis direction, and the third z-axis module 441 is mounted on the third x-axis module and can move along the z-axis direction. The refraction cylinder 430 is mounted on the third z-axis module 441. It is understood that the movement of the refraction cylinder 430 along the x-axis, the y-axis and the z-axis can be driven by the third movement module 440.

Specifically, when a workpiece is welded, the third CCD vision module 420 captures the welded position of the workpiece and feeds the welded position back to the control system of the laser welding device 400 in real time, and the control system of the laser welding device 400 controls the third motion module 440 to move, so as to drive the refraction cylinder 430 to move, so that the light outlet 431c of the refraction cylinder 430 is aligned with the welded position of the workpiece, and then the workpiece can be welded.

Further, in the present embodiment, two laser welding apparatuses 400 are provided in the line. It can be understood that the two laser welding devices 400 can make up for the defect of long operation time of the laser welding device 400 due to the short operation time of the spot soldering flux operation and the tin ring assembling operation and the long operation time required by the laser welding, so that the operation time of the laser welding operation can be matched with the operation time of the spot soldering flux operation and the tin ring assembling operation, and the work efficiency of the production line is improved to the maximum.

The above only is the preferred embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structure changes made by the contents of the specification and the drawings under the inventive concept of the present invention, or the direct/indirect application in other related technical fields are included in the patent protection scope of the present invention.

Claims (10)

1. The laser tin soldering automatic assembly line is characterized by comprising a feeding track, and a glue dispensing device, a tin ring assembling device and a laser welding device which are sequentially arranged along the feeding direction of the feeding track;

the dispensing device is used for dispensing soldering flux to a workpiece, the tin ring assembling device is used for assembling a tin ring at the welding position of the workpiece, and the laser welding device is used for welding the workpiece.

2. The laser soldering automated assembly line of claim 1, wherein the dispensing device comprises a dispensing cylinder for dispensing flux at the weld of the workpiece and a first CCD vision module for capturing the weld of the workpiece.

3. The laser soldering automated assembly line of claim 2, wherein the solder ring assembling device comprises a grabbing piece and a second CCD vision module, the grabbing piece is used for grabbing the solder ring, and the second CCD vision module is used for capturing the solder joint of the workpiece and the solder ring.

4. The laser-tin-soldering automated assembly line of claim 3, wherein the second CCD vision module comprises an upper CCD camera and a lower CCD camera, the upper CCD camera has a lens facing downwards for capturing a welding position of a workpiece, and the lower CCD camera has a lens facing upwards for capturing a tin ring.

5. The laser soldering automated line of claim 4, wherein the gripper is a suction nozzle that is vertically retractable.

6. The laser soldering automated assembly line of claim 5, wherein the laser welding device comprises a laser emitter, a third CCD vision module and a refraction barrel, one end of the refraction barrel is provided with a first mounting port and a second mounting port, the other end of the refraction barrel is provided with a light outlet, a laser channel is formed between the light outlet and the first mounting port, a light capturing channel is formed between the light outlet and the second mounting port, the laser emitter is mounted at the first mounting port, and the third CCD vision module is mounted at the second mounting port and used for capturing a welding position of a workpiece.

7. The laser soldering automated assembly line of claim 6, wherein an entrance port is formed in a side wall of the light capturing channel, and the laser channel is communicated with the entrance port;

the refraction section of thick bamboo includes speculum and beam combiner, the speculum install in laser passageway, beam combiner install in catch the light channel, and correspond the entrance set up, the speculum slope set up in first installation mouth with between the entrance, be used for with laser emitter transmitted laser reflection extremely beam combiner, beam combiner slope set up in between the entrance with the light-emitting window, be used for with the laser reflection of speculum extremely the light-emitting window.

8. The laser soldering automated assembly line of claim 7, wherein the feeding track comprises a processing section, the processing section comprises a feeding section, a jacking section and a discharging section, the feeding section, the jacking section and the discharging section are arranged along the feeding direction of the feeding track in a segmented manner, and the processing section is installed in the glue dispensing device, the assembling tin ring device and the laser welding device.

9. The laser soldering automated assembly line of claim 8, further comprising a jacking platform, the jacking platform being disposed corresponding to the jacking section, the jacking platform being configured to be raised relative to the jacking section to jack the workpiece away from the jacking section, and the jacking platform being configured to be lowered relative to the jacking section to enable the machined workpiece to fall back to the jacking section for further conveyance along the feeding track.

10. The laser soldering automated assembly line of any one of claims 1 to 9, further comprising a reflow rail, wherein one end of the reflow rail is connected to the discharge side of the laser welding device, and the other end of the reflow rail is connected to the feed side of the dispensing device, and the reflow rail is conveyed from the laser welding device to the dispensing device for conveying a tool of a workpiece.

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