CN220985957U - Multifunctional chip mounter for chip mounting, tin dispensing and glue dispensing - Google Patents

Abstract

The utility model discloses a multifunctional chip mounter for mounting, dispensing and dispensing, which comprises a machine table, wherein a circuit board conveying mechanism, a two-dimensional material taking module and a feeding assembly are arranged on the machine table, a mounting assembly is arranged at the output end of the two-dimensional material taking module, the two-dimensional material taking module can drive the mounting assembly to be respectively connected with the circuit board conveying mechanism and the feeding assembly, and the circuit board conveying mechanism is used for conveying a circuit board; the mounting assembly comprises a sucking mechanism and a tin dispensing mechanism, the sucking mechanism can suck components from the feeding assembly and place the components on the circuit board conveying mechanism, and the tin dispensing mechanism is used for dispensing tin and/or dispensing glue on the circuit board conveying mechanism. The utility model can simultaneously finish the processing procedures of pasting, dispensing and tin dispensing, improves the efficiency of small-batch or proofing processing, can meet the processing requirements of small places and improves the practicability.

Description

Multifunctional chip mounter for chip mounting, tin dispensing and glue dispensing

Technical Field

The utility model relates to the technical field of circuit board processing equipment, in particular to a multifunctional chip mounter for mounting tin and dispensing.

Background

The chip mounter is a device that accurately places surface mount components (capacitors, resistors, ICs, etc.) onto pads of a PCB by moving a mounting head. In actual production, the chip mounter generally can be matched with a dispensing machine or a tin dispensing machine for use, and after the dispensing machine or the tin dispensing machine accurately smears glue or tin paste on a PCB, the chip mounter is used for placing components at corresponding positions, so that the components are welded or adhered with the PCB.

Therefore, in the prior art, at least two devices are needed to finish processing in production, namely a chip mounter and a glue dispenser, or a chip mounter and a tin dispenser; even when some products are processed, three devices are required to work together. For mass production, a plurality of independent devices are adopted to work together, which is not problematic. However, if a plurality of devices are needed to be matched in the process of processing or proofing small batches, the cost of purchasing the devices is increased on one hand; on the other hand, the processing of a plurality of devices is certainly required to consume more time for debugging the devices, so that the efficiency is reduced; moreover, the use of multiple devices requires a larger processing site, which is not conducive to the processing requirements of small sites.

Disclosure of utility model

In order to solve the problems in the prior art, the utility model provides a multifunctional chip mounter capable of mounting and dispensing tin, which comprises a machine table and a controller, wherein a circuit board conveying mechanism, a two-dimensional material taking module and a feeding assembly which are respectively connected with the controller are arranged on the machine table; the mounting assembly comprises a material sucking mechanism and a tin dispensing mechanism, the material sucking mechanism can suck components from the feeding assembly, the components are placed on a circuit board on the circuit board conveying mechanism, and the tin dispensing mechanism is used for dispensing tin and/or dispensing glue on the circuit board conveying mechanism.

As a further improvement of the utility model, the material sucking mechanism comprises a material sucking fixed plate, the material sucking fixed plate is connected with the output end of the two-dimensional material taking module, a material sucking lifting assembly is arranged on the material sucking fixed plate, a material sucking rod is arranged on the output end of the material sucking lifting assembly, the material sucking lifting assembly can drive the material sucking rod to lift, and a material sucking head is arranged at one end of the material sucking rod, which is close to the circuit board conveying mechanism; the material sucking fixing plate is provided with a material sucking rotating assembly, the output end of the material sucking rotating assembly is connected with the material sucking rod, and the material sucking rotating assembly can drive the material sucking rod and the material sucking head to rotate.

As a further improvement of the utility model, the material sucking fixing plate is provided with a first camera and a first light supplementing lamp, the first camera is connected with the controller, the first camera is arranged above the first light supplementing lamp, and the first camera is used for shooting the image of the circuit board on the circuit board conveying mechanism.

As a further improvement of the utility model, the suction fixing plate is provided with a suction head vision component which is used for shooting images of components sucked on the suction head; the suction head vision assembly comprises a camera fixing frame, a second camera and a second light supplementing lamp are arranged on the camera fixing frame, the second camera can shoot images of components and parts absorbed by the suction head, a light condensation driving assembly is arranged on the camera fixing frame, the second camera and the light condensation driving assembly are respectively connected with the controller, a reflector frame is arranged on the camera fixing frame in a sliding mode, the output end of the light condensation driving assembly is connected with the reflector frame, and the light condensation driving assembly can drive the reflector frame to slide on the camera fixing frame and further drive the reflector to be aligned with the second camera.

As a further improvement of the utility model, the tin dispensing mechanism comprises a tin dispensing cylinder, the tin dispensing cylinder is externally connected with a casting pump body, one end of the tin dispensing cylinder, which is close to the circuit board conveying mechanism, is provided with a nozzle, the material sucking fixing plate is provided with a tin dispensing lifting assembly, the output end of the tin dispensing lifting assembly is connected with the tin dispensing cylinder, and the tin dispensing lifting assembly can drive the tin dispensing cylinder to move up and down.

As a further improvement of the utility model, the machine is provided with the through nozzle mechanism, and the two-dimensional material taking module can drive the tin spot gluing mechanism to move to the corresponding position of the through nozzle mechanism; the through nozzle mechanism comprises a through nozzle fixing block, a negative pressure suction head and a test plate are arranged on the through nozzle fixing block, a negative pressure device is externally connected with the negative pressure suction head, and the tin-dispensing lifting assembly can drive the tin-dispensing cylinder to be respectively connected with the test plate and the negative pressure suction head.

As a further improvement of the utility model, the feeding assembly comprises a small material feeder and an IC feeding mechanism, the IC feeding mechanism comprises an IC tray frame and a suction head exchanging assembly, the small material feeder and the IC tray frame are respectively connected with the machine, the IC tray frame is used for placing an IC product to be pasted, the suction head exchanging assembly is used for exchanging a suction head on the suction rod, and the two-dimensional material taking module can drive the suction mechanism to respectively move to the corresponding positions of the small material feeding mechanism, the IC tray frame and the suction head exchanging assembly; the suction head replacing assembly comprises a suction head replacing fixed block, the suction head replacing fixed block is connected with the machine table, a suction head placing seat is arranged on the suction head replacing fixed block, a plurality of suction head placing grooves are formed in the suction head placing seat, clamping plates are arranged in the suction head placing seat, through holes are respectively formed in the corresponding positions of the clamping plates and the suction head placing grooves, suction head replacing cylinders are arranged on the suction head fixed block, the output ends of the suction head replacing cylinders are connected with the clamping plates, and the suction head replacing cylinders can drive the clamping plates to slide on the suction head placing seat so as to drive the through holes to be communicated with the suction head placing grooves or dislocated.

As a further improvement of the utility model, the circuit board conveying mechanism comprises a conveying support and a conveying belt, the conveying support is connected with the machine table, a conveying motor and a plurality of driving wheels are arranged on the conveying support, the driving wheels are respectively and rotatably connected with the conveying support, a driving wheel is arranged at the output end of the conveying motor, and the conveying belt is respectively sleeved on the driving wheel and the driving wheels.

As a further improvement of the utility model, a limiting mechanism is arranged on the conveying support, the limiting mechanism is used for limiting a circuit board to be mounted on the conveying support, the limiting mechanism comprises a limiting cylinder and a limiting plate, the limiting cylinder and the limiting plate are respectively connected with the conveying support, a limiting block is arranged at the output end of the limiting cylinder, and the limiting cylinder can drive the limiting block to move so as to further push the circuit board on the conveying belt to be connected with or separated from the limiting plate; the lifting device is characterized in that a lifting cylinder is arranged at a position on the machine table corresponding to the limiting mechanism, a lifting mounting plate is arranged at the output end of the lifting cylinder, a plurality of ejector rods are arranged on the lifting mounting plate, and the lifting cylinder can drive the ejector rods to be connected with or separated from a circuit board on the conveying belt.

As a further improvement of the utility model, the two-dimensional material taking module comprises a material taking fixing frame, an X-axis linear motor and an X-axis guide rail are arranged on the material taking fixing frame, an X-axis sliding block is arranged on the X-axis guide rail in a sliding mode, the X-axis sliding block is connected with a rotor of the X-axis linear motor, a Y-axis linear motor is arranged on the X-axis sliding block, and the mounting assembly is connected with the rotor of the Y-axis linear motor.

Compared with the prior art, the utility model has the beneficial effects that:

According to the utility model, the processing processes of pasting, dispensing and tin dispensing can be completed simultaneously through one piece of equipment, the cost of equipment purchasing can be reduced, and the efficiency of small-batch or proofing processing can be improved; on the other hand, the floor area of the equipment can be reduced by using one piece of equipment for processing, so that the equipment can meet the processing requirement of a small place and the practicability is improved.

During specific processing, an operator places a circuit board to be mounted on the circuit board conveying mechanism, and the circuit board to be mounted is conveyed to a processing position by controlling the circuit board conveying mechanism to work; controlling the two-dimensional material taking assembly to drive the material sucking mechanism to move to the upper part of the feeding assembly, and controlling the material sucking mechanism to suck components to be mounted from the feeding assembly; then controlling the two-dimensional material taking assembly to drive the tin dispensing mechanism to move to the position above the circuit board on the circuit board conveying mechanism, and controlling the tin dispensing mechanism to operate to perform tin dispensing and/or glue dispensing operation on the circuit board; controlling the two-dimensional material taking assembly to drive the material sucking mechanism to move to the position above the circuit board on the circuit board conveying mechanism, and controlling the material sucking mechanism to place the sucked components on the circuit board; after the mounting is completed, the circuit board conveying mechanism is controlled to convey the processed circuit board out of the machine table, and then the processed circuit board is taken out of the circuit board conveying mechanism.

Drawings

In order to more clearly illustrate the utility model or the solutions of the prior art, a brief description will be given below of the drawings used in the description of the embodiments or the prior art, it being obvious that the drawings in the description below are some embodiments of the utility model and that other drawings can be obtained from them without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an embodiment of the present invention;

FIG. 2 is a schematic view of the internal perspective structure of an embodiment of the present invention;

FIG. 3 is a schematic top view of the interior of an embodiment of the present invention;

FIG. 4 is a schematic diagram of a two-dimensional pick-up module and a mounting assembly according to an embodiment of the present invention;

FIG. 5 is a schematic view of a mounting assembly according to an embodiment of the present invention;

FIG. 6 is a schematic view of a visual assembly of a suction head according to an embodiment of the present invention;

FIG. 7 is a schematic view of a nozzle mechanism in accordance with an embodiment of the present invention;

FIG. 8 is a schematic view of a suction head replacement assembly according to an embodiment of the present invention;

FIG. 9 is a schematic view of a clamping plate structure in an embodiment of the invention;

FIG. 10 is a schematic view of a circuit board conveying mechanism according to an embodiment of the present invention;

FIG. 11 is an enlarged schematic view of the portion A in FIG. 10;

Fig. 12 is a schematic structural view of a material ejection mechanism in the embodiment of the invention.

Detailed Description

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs; the terminology used in the description is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model; the terms "comprising" and "having" and any variations thereof in the description of the utility model and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion. The terms first, second and the like in the description and in the claims or in the above-described figures, are used for distinguishing between different objects and not necessarily for describing a sequential or chronological order.

Reference in the specification to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the utility model. The appearances of the phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the described embodiments of the utility model may be combined with other embodiments.

In order to enable those skilled in the art to better understand the present utility model, a technical solution in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings.

As shown in fig. 1-12, a multifunctional chip mounter for dispensing tin and glue comprises a machine table 1 and a controller, wherein a circuit board conveying mechanism 2, a two-dimensional material taking module 3 and a feeding assembly which are respectively connected with the controller are arranged on the machine table 1, a mounting assembly is arranged at the output end of the two-dimensional material taking module 3, the two-dimensional material taking module 3 can drive the mounting assembly to be respectively connected with the circuit board conveying mechanism 2 and the feeding assembly, so that the mounting assembly can absorb components from the feeding assembly, and the circuit board on the circuit board conveying mechanism 2 is subjected to tin dispensing and/or glue dispensing operation, and the absorbed components are placed on a circuit board to-be-mounted position on the circuit board conveying mechanism 2. The circuit board conveying mechanism 2 can convey the circuit board to be mounted to a processing position of the mounting assembly, and convey the mounted circuit board out of the machine table 1, and the feeding assembly is used for conveying components to be mounted to the mounting assembly.

The machine 1 is fixedly provided with the protective cover 4, and the protective cover 4 is sleeved on the periphery of the two-dimensional material taking module 3, so that interference of external things on the movement process of the two-dimensional material taking module 3 during processing is prevented, the processing safety is improved, and the human body is prevented from extending into the machine 1 during processing; the protective cover 4 is provided with an opening and closing door 41 and an alarm lamp 42, and the opening and closing door 41 is connected with the protective cover 4 in an opening and closing way, so that the protective cover 4 is conveniently opened to debug or overhaul equipment; the warning light 42 is connected to the controller for lighting up to alert the operator when an abnormality occurs in the process.

Specifically, the mounting assembly comprises a sucking mechanism 5 and a tin dispensing mechanism 6, the sucking mechanism 5 is used for sucking components from the feeding assembly and placing the sucked components on the circuit board conveying mechanism 2, and the tin dispensing mechanism 6 is used for carrying out tin dispensing and/or glue dispensing operation on the circuit board conveying mechanism 2. The tin spot gluing mechanism 6 performs different operations according to different processed circuit boards; some circuit boards need dispensing, some need dispensing tin, some are both dispensing and dispensing tin. According to the multifunctional chip mounter for chip mounting, dispensing and tin dispensing, one piece of equipment can finish processing operations of chip mounting, dispensing and tin dispensing at the same time, and efficiency of small-batch or proofing processing can be improved; on the other hand, the floor area of the equipment can be reduced by using one piece of equipment for processing, so that the equipment can meet the processing requirement of a small place and the practicability is improved.

During operation, an operator places a circuit board to be mounted on the circuit board conveying mechanism 2, and the circuit board to be mounted is conveyed to a processing position by controlling the circuit board conveying mechanism 2 to work; controlling the two-dimensional material taking module 3 to drive the material sucking mechanism 5 to move to the upper part of the feeding assembly, and controlling the material sucking mechanism 5 to suck components to be pasted from the feeding assembly; then controlling the two-dimensional material taking module 3 to drive the tin dispensing mechanism 6 to move to the position above the circuit board on the circuit board conveying mechanism 2, and controlling the tin dispensing mechanism 6 to work to perform tin dispensing and/or glue dispensing operation on the circuit board; then controlling the two-dimensional material taking module 3 to drive the material sucking mechanism 5 to move to the position above the circuit board on the circuit board conveying mechanism 2, and controlling the material sucking mechanism 5 to place the sucked components on the circuit board; after the mounting is completed, the circuit board conveying mechanism 2 is controlled to convey the processed circuit board out of the machine table 1, and then the processed circuit board is taken out from the circuit board conveying mechanism 2.

As shown in fig. 5, the material sucking mechanism 5 comprises a material sucking fixing plate 51, the material sucking fixing plate 51 is fixedly connected with the output end of the two-dimensional material taking module 3, a material sucking lifting assembly 52 is arranged on the material sucking fixing plate 51, a material sucking rod 53 is arranged at the output end of the material sucking lifting assembly 52, the material sucking lifting assembly 52 can drive the material sucking rod 53 to move in a lifting manner, a material sucking head 54 is arranged at one end, close to the circuit board conveying mechanism 2, of the material sucking rod 53, and the material sucking head 54 is connected with the material sucking rod 53 in a pluggable manner, so that the material sucking head 54 can be replaced conveniently; during operation, the sucking rod 53 is driven to move up and down by controlling the sucking lifting assembly 52 to drive the sucking head 54 to move up and down, so that the components are sucked from the feeding assembly, and the components are placed on the circuit board conveying mechanism 2. The suction fixing plate 51 is also provided with a suction rotating assembly 55, the output end of the suction rotating assembly 55 is connected with a suction rod 53, and the suction rotating assembly 55 can drive the suction rod 53 and the suction head 54 to rotate; according to the position difference of waiting the paster of circuit board, it is probably to need adjust the orientation of components and parts on the suction head 54 to make it and waiting the paster position on the circuit board counterpoint, during operation, when the suction head 54 draw to components and parts from the feed subassembly back, through controlling the rotatory subassembly 55 work of suction, and then drive suction rod 53 and suction head 54 are rotatory, make the components and parts that suck on the suction head 54 rotate to suitable angle, the rethread is inhaled the material lifting assembly 52 and is driven suction rod 53 and suction head 54 decline, laminating the components and parts that suck to the circuit board.

In this embodiment, the material sucking lifting component 52 and the material sucking rotating component 55 are all structures of a motor, a belt wheel and a driving belt, and the belt wheel and the driving belt are driven to rotate by the motor, so as to drive the material sucking rod 53 to lift or rotate, and specific structures are not described herein.

In this embodiment, the number of the suction rods 53 and the suction heads 54 is four, and the four suction rods 53 are equidistantly distributed on the suction fixing plate 51, each suction rod 53 corresponds to one suction lifting component 52, and one suction rotating component 55 can rotate by driving two suction rods 53.

The first camera 56 and the first light supplementing lamp 57 are arranged on the material sucking fixed plate 51, the first camera 56 and the first light supplementing lamp 57 are respectively connected with the controller, the first camera 56 is arranged above the first light supplementing lamp 57, and the first light supplementing lamp 57 is used for illuminating a circuit board on the circuit board conveying mechanism 2, so that the first camera 56 can shoot clear images of the circuit board conveniently; the first camera 56 can photograph the circuit board on the circuit board conveying mechanism 2, thereby facilitating accurate positioning to the positions of the patch, the dispensing or the tin dispensing, and improving the accuracy of control.

As shown in fig. 6, a suction head vision assembly 7 is disposed on the suction fixing plate 51, and the suction head vision assembly 7 is used for capturing images of components sucked on the suction head 54, so that the suction rotating assembly 55 can accurately adjust angles of the components sucked on the suction head 54. Specifically, the suction head vision assembly 7 includes a camera fixing frame 71, the camera fixing frame 71 is connected with the suction fixing plate 51, a second camera 72 and a second light supplementing lamp 73 are arranged on the camera fixing frame 71, the second camera 72 can shoot the component images sucked by the suction heads 54, each suction head 54 corresponds to one second camera 72 respectively, when the suction heads 54 suck the components, the suction head lifting assembly 52 can drive the suction heads 54 to rise to the position where the second camera 72 can shoot, the suction heads 54 are illuminated through the second light supplementing lamp 73, the component images on the suction heads 54 are shot through the second camera 72, the images are fed back to the controller, the suction rotating assembly 55 is controlled to work through the controller, the suction rods 53 and the suction heads 54 are driven to rotate by a certain angle, so that the images can be aligned with the mounting positions on the circuit board, and then the suction heads 54 are driven to descend by the suction lifting assembly 52 to attach the components to the circuit board, so that the chip mounting is completed.

In order to enable the second camera 72 to clearly shoot the components on the suction head 54, a light-gathering driving component is arranged on the camera fixing frame 71, the second camera 72 and the light-gathering driving component are respectively connected with the controller, a reflector frame 74 is slidably arranged on the camera fixing frame 71, a reflector 75 is arranged on the reflector frame 74, the output end of the light-gathering driving component is connected with the reflector frame 74, the light-gathering driving component can drive the reflector frame 74 to slide on the camera fixing frame 71 so as to drive the reflector 75 to align with the second camera 72, and after the reflector 75 is aligned with the second camera 72, the second light-compensating lamp 73 emits light to irradiate the reflector 75 and then reflect, so that the brightness right in front of the second camera 72 is improved, and clear images can be shot by the second camera 72. When the device is specifically working, after the suction head 54 sucks the component, the suction lifting assembly 52 is controlled to drive the suction head 54 to rise to a height corresponding to the second camera 72, and then the light condensation driving assembly is controlled to drive the reflector 74 and the reflector 75 to move until the reflector 75 is aligned with the second camera 72, and then the component on the suction head 54 is photographed by the second camera 72, so that a clear image can be photographed by the second camera 72.

In this embodiment, the spotlight drive assembly includes spotlight motor 76 and spotlight drive belt 77, spotlight motor 76 fixed mounting is on camera mount 71, be provided with spotlight drive wheel 78 on the output of spotlight motor 76, install spotlight from driving wheel 79 and spotlight guide rail 710 on the camera mount 71, spotlight drive belt 77 cup joints on spotlight drive wheel 78 and spotlight from driving wheel 79, be equipped with spotlight slider 711 on the mirror holder 74, spotlight slider 711 and spotlight guide rail 710 slip joint, spotlight slider 711 and spotlight drive belt 77 fixed connection. When the camera is in operation, the condensing motor 76 is controlled to work, the condensing driving wheel 78 is driven to rotate, the condensing slider 711 is pulled to slide on the condensing guide rail 710, and the reflector 74 and the reflector 75 are driven to synchronously move, so that the reflector 75 can be aligned with the second camera 72.

As shown in fig. 5, in the present embodiment, there are two dispensing mechanisms 6, and the two dispensing mechanisms 6 are symmetrically distributed on the left and right sides of the suction mechanism 5. The tin dispensing mechanism 6 comprises a tin dispensing cylinder 61, the tin dispensing cylinder 61 is externally connected with a casting pump body, and one end of the tin dispensing cylinder 61, which is close to the circuit board conveying mechanism 2, is provided with a nozzle 62. When a circuit board needing to be glued is processed, glue is contained in the tin dispensing cylinder 61, the tin dispensing cylinder 61 can be extruded through an externally connected pouring pump body, the glue is extruded from the nozzle 62, and the circuit board is subjected to glue dispensing processing; when a circuit board requiring tin plating is processed, tin plating dispensing cylinder 61 is filled with tin paste, and tin plating dispensing cylinder 61 can be extruded by an externally connected casting pump body, the tin paste is extruded from nozzle 62, and tin plating processing is performed on the circuit board; when a circuit board requiring both tin dispensing and glue dispensing is processed, only one tin dispensing cylinder 61 is required to hold tin paste, and the other tin dispensing cylinder 61 is required to hold glue, so that the processing process is consistent with the processing process.

The material sucking fixed plate 51 is provided with a tin dispensing lifting assembly, the output end of the tin dispensing lifting assembly is connected with a tin dispensing cylinder 61, and the tin dispensing lifting assembly is controlled to work so as to drive the tin dispensing cylinder 61 to lift and move, so that the processing process of tin dispensing and/or glue dispensing is realized. Specifically, the tin dispensing and lifting assembly comprises a tin dispensing fixed block 63, the tin dispensing fixed block 63 is connected with a material sucking fixed plate 51, a tin dispensing motor 64 is arranged on the tin dispensing fixed block 63, a tin dispensing lifting screw rod 65 is arranged at the output end of the tin dispensing motor 64, a tin dispensing lifting guide rail 66 is arranged on the material sucking fixed plate 51, a tin dispensing lifting slide block 67 is arranged on the tin dispensing lifting guide rail 66 in a sliding mode, the tin dispensing lifting slide block 67 is connected with the tin dispensing lifting screw rod 65 in a sliding mode, and the tin dispensing cylinder 61 is connected with the tin dispensing lifting slide block 67. During specific operation, the tin-dispensing motor 64 is controlled to work, and then the tin-dispensing lifting screw rod 65 is driven to rotate, so that the tin-dispensing lifting slide block 67 is driven to lift and slide on the tin-dispensing lifting guide rail 66, and the tin-dispensing cylinder 61 moves synchronously along with the tin-dispensing lifting slide block 67, so that the tin-dispensing cylinder 61 can be connected with a circuit board on the circuit board conveying mechanism 2, and the processing process of tin dispensing or glue dispensing of the circuit board is realized.

After the dispensing mechanism 6 is used and is deactivated for a certain period of time, the nozzle 62 on the dispensing cartridge 61 may be blocked due to solidification of glue or solder paste. As shown in fig. 2, 3 and 7, in order to solve this problem, a through nozzle mechanism 8 is provided on the machine 1 for opening the nozzle 62, and the two-dimensional material taking module 3 can drive the spot tin dispensing mechanism 6 to move to a corresponding position of the through nozzle mechanism 8. Specifically, the nozzle mechanism 8 includes a nozzle fixing block 81, the nozzle fixing block 81 is connected with the machine 1, a negative pressure suction head 82 and a test plate 83 are arranged on the nozzle fixing block 81, the negative pressure suction head 82 is externally connected with a negative pressure device, and the tin dispensing motor 64 and the two-dimensional material taking module 3 are matched to drive the tin dispensing cylinder 61 to be connected with the test plate 83 and the negative pressure suction head 82 respectively. When the nozzle 62 needs to be dredged, the two-dimensional material taking module 3 drives the tin dispensing cylinder 61 to move to the position right above the negative pressure suction head 82, and the tin dispensing motor 64 is controlled to work to drive the tin dispensing cylinder 61 to descend until the nozzle 62 is inserted into the negative pressure suction head 82, and the negative pressure suction head 82 has negative pressure suction force to suck out the tin paste or glue blocked at the nozzle 62, so that the purpose of dredging the nozzle 62 is realized. After dredging, the two-dimensional material taking module 3 drives the tin dispensing cylinder 61 to move to the upper side of the test plate 83, then the tin dispensing motor 64 is controlled to work to drive the tin dispensing cylinder 61 to descend until the nozzle 62 is connected with the test plate 83, then the two-dimensional material taking module 3 drives the first camera 56 to move to the position right above the test plate 83, and by shooting an image on the test plate 83, the controller is fed back to judge whether solder paste or glue exists on the test plate 83, if the solder paste or glue exists on the test plate 83, the nozzle 62 is indicated to be dredged, otherwise, the nozzle 62 is indicated to be not dredged, and the operation of dredging the nozzle 62 can be repeatedly executed until the nozzle 62 is dredged. Through setting up the test board 83 so that this paster point tin point glues multi-functional paster can judge whether nozzle 62 dredge by oneself, has improved the degree of automation of equipment.

As shown in fig. 2 and 3, the feeding assembly includes a small material feeder 10 and an IC feeding mechanism, where the small material feeder 10 is fixedly installed on the machine 1, and is mainly used for feeding smaller components, for example: the capacitor, resistor, etc. may be any of the prior art, and the construction of the pellet feeder 10 is not described in detail herein. The IC feeding mechanism comprises an IC tray frame 11 and a suction head exchanging assembly 9, the IC tray frame 11 is arranged on a machine table 1 arranged on the IC tray frame 11, the IC tray frame 11 is used for placing an IC product to be pasted, the suction head exchanging assembly 9 is used for exchanging a suction head 54 on a suction rod 53, and the two-dimensional material taking module 3 can drive the suction mechanism 5 to respectively move to the corresponding positions of the small material feeding mechanism, the IC tray frame 11 and the suction head exchanging assembly 9; in the actual processing process, the area of the IC product is generally larger than that of other components, so that the suction heads 54 with different sizes can be used for sucking and mounting the IC product and other components; in order to ensure that the material sucking mechanism 5 of the device can be used for sucking IC products and other components at the same time, in the processing process, after any one of the IC products or other components is pasted, the two-dimensional material taking module 3 is controlled to drive the material sucking mechanism 5 to move to the corresponding position of the suction head changing assembly 9, and then the suction head 54 on the suction rod 53 is replaced through the cooperation of the material sucking mechanism 5 and the suction head changing assembly 9.

As shown in fig. 8 and 9, specifically, the suction head exchanging assembly 9 includes a suction head exchanging fixing block 91, the suction head exchanging fixing block 91 is connected with the machine table 1, a suction head placing seat 92 is arranged on the suction head exchanging fixing block 91, a plurality of suction head placing grooves 93 are arranged in the suction head placing seat 92, a clamping plate 94 is arranged in the suction head placing seat 92, through holes 95 are respectively arranged at corresponding positions of the clamping plate 94 and the suction head placing grooves 93, a suction head exchanging cylinder 96 is arranged on the suction head exchanging fixing block 91, an output end of the suction head exchanging cylinder 96 is connected with the clamping plate 94, and the suction head exchanging cylinder 96 can drive the clamping plate 94 to slide on the suction head placing seat 92, so that the through holes 95 are driven to be communicated or misplaced with the suction head placing grooves 93. Before processing, the replaceable suction head 54 is placed in the suction head placing groove 93 in the suction head placing seat 92 in advance; in the initial state, the suction head placing groove 93 and the through hole 95 are in a conducting state, when the suction head 54 needs to be replaced, the two-dimensional material taking module 3 drives the suction mechanism 5 to move to the position right above the suction head placing seat 92, then controls the suction mechanism 5 to descend, inserts the suction head 54 into the suction head placing groove 93, enables the suction head 54 to pass through the through hole 95, then controls the suction head replacing cylinder 96 to work, drives the clamping plate 94 to slide, enables the through hole 95 on the clamping plate 94 to be properly misplaced with the suction head placing groove 93, clamps the suction head 54 through the cooperation of the clamping plate 94 and the suction head placing groove 93, and then controls the suction mechanism 5 to ascend, and then the suction head replacing fixing block 91 can pull out the suction head 54 on the suction rod 53; then the two-dimensional material taking module 3 is controlled to drive the material sucking rod 53 to move to the position right above the material sucking head 54 to be replaced, the material sucking mechanism 5 is controlled to work, the material sucking rod 53 is driven to descend and insert onto the material sucking head 54, the new material sucking head 54 is fixedly connected with the material sucking rod 53, and the material sucking mechanism 5 is controlled to drive the material sucking rod 53 and the material sucking head 54 to ascend, so that the process of replacing the material sucking head 54 is completed.

As shown in fig. 10 and 11, the circuit board conveying mechanism 2 comprises a conveying bracket 21, the conveying bracket 21 is connected with the machine table 1, a conveying belt and a conveying driving assembly for driving the conveying belt to move are sleeved on the conveying bracket 21, and the conveying driving assembly is connected with the controller; during processing, the circuit board is placed on the conveying belt, the conveying belt can be driven to move on the conveying support 21 by controlling the conveying driving assembly to work, and then the circuit board is driven to move, so that the conveying process of the circuit board is realized.

Specifically, the conveying driving mechanism comprises a conveying motor 22 and a plurality of driving wheels 23, the conveying motor 22 is fixedly arranged on the conveying support 21, the driving wheels 23 are respectively in rotatable limiting connection with the conveying support 21, conveying driving wheels 24 are arranged at the output ends of the conveying motor 22, conveying belts are respectively sleeved on the conveying driving wheels 24 and all the driving wheels 23, the conveying driving wheels 24 can be driven to rotate by controlling the conveying motor 22 to work, then the conveying belts are driven to move, the driving wheels 23 rotate along with the movement of the conveying belts, and then the function of conveying a circuit board is realized.

In this embodiment, the conveyor belt includes a first section of conveyor belt 25, a second section of conveyor belt 26, and a third section of conveyor belt 27, and two ends of the second section of conveyor belt 26 are connected to the first section of conveyor belt 25 and the second section of conveyor belt 26, respectively, and the first section of conveyor belt 25, the second section of conveyor belt 26, and the third section of conveyor belt 27 are connected to a corresponding one of the conveyor motors 22, respectively. The processing position of this equipment is the corresponding position department of second festival conveyer belt 26, and two-dimensional material taking module 3 can drive material sucking mechanism 5 and some tin point gum mechanism 6 and remove the corresponding position department of second festival conveyer belt 26, when the circuit board was carried the processing position of second festival conveyer belt 26, control two-dimensional material taking module 3 and drive the dress subassembly and carry out paster, some tin, some gum processing, this embodiment can improve the efficiency of carrying by a wide margin through setting up the conveyer belt into the mode of three festival.

In particular operation, an operator places a circuit board to be processed on the first conveyor 25 and transfers the circuit board to the second conveyor 26 via the first conveyor 25. After the circuit board is conveyed onto the second conveyor belt 26, the second conveyor belt 26 can pause movement because of the need to process the circuit board such as attaching the patch; at this time, a new circuit board to be processed may be placed on the first conveyor 25, and the circuit board may be conveyed to one end connected to the second conveyor 26 by the first conveyor 25; when the circuit board processing on the second section conveyer belt 26 is finished, the first section conveyer belt 25, the second section conveyer belt 26 and the third section conveyer belt 27 can be controlled to work simultaneously, the first section conveyer belt 25 conveys the next product to the second section conveyer belt 26, the second section conveyer belt 26 conveys the last processed product to the third section conveyer belt 27, at the moment, the second section conveyer belt 26 can be controlled to stop working, so that the surface-mounting and tin-plating integrated machine can carry out surface-mounting and other processing on the second circuit board, and therefore, simultaneously, the third section conveyer belt 27 and the first section conveyer belt 25 continue to work, the third section conveyer belt 27 conveys the first processed product out of the machine table 1, and the first section conveyer belt 25 conveys the third circuit board to be processed to one end connected with the second section conveyer belt 26.

The circuit board conveying mechanism 2 reduces the conveying stroke of each section of conveying belt, so that the conveying efficiency is improved, and in other embodiments, the conveying belts can be arranged into other numbers of sections of conveying belts or arranged on a single section of conveying belt.

The first section of conveyer belt 25 is close to the one end of second section of conveyer belt 26 and is equipped with first sensor 28, and the one end that the third section of conveyer belt 27 kept away from second section of conveyer belt 26 is equipped with second sensor 29, and first sensor 28 and second sensor 29 are connected with conveying support 21 respectively. The first sensor 28 and the second sensor 29 are respectively connected with the controller, the first sensor 28 is used for detecting whether the end of the first section of conveyer belt 25 is provided with a circuit board, and when the first sensor 28 detects that the end of the first section of conveyer belt 25 is provided with the circuit board, a feedback signal is fed back to the controller to control the first section of conveyer belt 25 to stop working; when the second sensor 29 detects that the circuit board is arranged at the tail end of the third section of conveyer belt 27, a feedback signal is sent to the controller to control the third section of conveyer belt 27 to stop working, so that an operator can conveniently move the processed circuit board out of the third section of conveyer belt 27.

A third sensor 210 is arranged at one end, close to the third section of conveyer belt 27, of the second section of conveyer belt 26, the third sensor 210 is fixedly arranged on the conveyer support 21, the third sensor 210 is connected with the controller, and the third sensor 210 is used for detecting whether a circuit board exists on the second section of conveyer belt 26; when the third sensor 210 detects a product, it indicates that the second conveyor 26 has conveyed the circuit board to be processed to the processing position, and then a feedback signal is sent to the controller to control the second conveyor 26 to stop working, and simultaneously control the two-dimensional material taking module 3 to cooperate with the mounting assembly to perform operations such as surface mounting and tin plating on the circuit board on the second conveyor 26.

The supporting plates 211 are respectively arranged at the positions on the conveying support 21 corresponding to the first section of conveying belt 25 and the third section of conveying belt 27, the supporting plates 211 are respectively connected with the first section of conveying belt 25 and the third section of conveying belt 27 in a sliding manner, and the supporting plates 211 are used for supporting circuit boards on the first section of conveying belt 25 and the third section of conveying belt 27. After the first section of conveying belt 25 or the third section of conveying belt 27 is provided with the circuit board, the first section of conveying belt 25 or the third section of conveying belt 27 can be bent by the gravity of the circuit board, the first section of conveying belt 25 or the third section of conveying belt 27 can be supported by the supporting plate 211, the first section of conveying belt 25 or the third section of conveying belt 27 is prevented from being bent downwards, and the transmission stability of the first section of conveying belt 25 and the third section of conveying belt 27 is improved.

The position of the conveying support 21 corresponding to the second section of conveying belt 26 is provided with a limiting cylinder 212 and a limiting plate 213 respectively, the limiting cylinder 212 and the limiting plate 213 are located on the upper side and the lower side of the second section of conveying belt 26 respectively, the output end of the limiting cylinder 212 is provided with a limiting block 214, and the limiting cylinder 212 can drive the limiting block 214 to move so as to push a circuit board on the second section of conveying belt 26 to be connected with or separated from the limiting plate 213. When the circuit board on the second section of conveyer belt 26 is detected by the third sensor 210, a feedback signal is sent to the controller to control the second section of conveyer belt 26 to stop working, meanwhile, the limiting cylinder 212 is controlled to work, the limiting block 214 is driven to move towards the direction close to the limiting plate 213, the limiting block 214 is connected with the circuit board on the second section of conveyer belt 26, the circuit board is pushed to move together until the other surface of the circuit board is connected with the limiting plate 213, the upper end surface and the lower end surface of the circuit board are respectively abutted with the limiting plate 213 and the limiting block 214, the circuit board is limited by the limiting plate 213 and the limiting block 214, and then the two-dimensional material taking module 3 is controlled to cooperate with the mounting assembly to carry out operations such as surface mounting and tin plating on the circuit board, so that the circuit board is prevented from shifting in the processing process, and the processing stability is improved. After the machining is finished, the limiting cylinder 212 is controlled to reset, the limiting block 214 is driven to move in the direction away from the limiting plate 213 until the second section of conveying belt 26 supports the circuit board, and then the second section of conveying belt 26 works to convey the machined circuit board to the third section of conveying belt 27.

In order to accurately limit the processing position of the circuit board on the second section of conveying belt 26, a material blocking cylinder 215 is arranged at one end, close to the third section of conveying belt 27, of the limiting plate 213, the material blocking cylinder 215 is connected with the conveying support 21, the output end of the material blocking cylinder 215 can be connected with the side wall of the circuit board on the second section of conveying belt 26, and the material blocking cylinder 215 is used for blocking the circuit board on the second section of conveying belt 26 to move towards the third section of conveying belt 27. In the initial state, the material blocking cylinder 215 is in an extending state, when the second section of conveying belt 26 conveys the circuit board to be processed to the position corresponding to the third section of conveying belt 210, the material blocking cylinder 215 is abutted with the side wall of the circuit board, so that the circuit board is prevented from continuously moving towards the direction of the third section of conveying belt 27, and meanwhile, the third section of conveying belt 26 is controlled to stop moving by feeding back a signal to the controller by the third section of conveying belt 210; after the mounting assembly processes the circuit board, such as mounting, tin plating, and the like, the material blocking cylinder 215 is controlled to reset, so that the output end of the material blocking cylinder 215 is retracted to separate from the circuit board on the second section of conveying belt 26, and then the second section of conveying belt 26 is controlled to work to convey the processed circuit board to the third section of conveying belt 27. By arranging the material blocking cylinder 215, the processing position of the circuit board on the second section of conveying belt 26 can be limited, and the processing stability is improved.

As shown in fig. 12, in order to prevent the circuit board on the second conveyor 26 from being bent by the suction mechanism 5 or the solder dispensing mechanism 6 during processing, a lifting mechanism is disposed at a position on the machine 1 corresponding to the position below the second conveyor 26, the lifting mechanism is used for supporting the circuit board on the second conveyor 26, the lifting mechanism includes a lifting cylinder 216, a lifting mounting plate 217 is disposed at an output end of the lifting cylinder 216, a plurality of lifting rods 218 are disposed on the lifting mounting plate 217, and the lifting cylinder 216 can drive the lifting rods 218 to be connected with or separated from the circuit board on the second conveyor 26. When the third sensor 210 detects the circuit board on the second section of conveyer belt 26, the ejection cylinder 216 is controlled to work, the ejection mounting plate 217 and the ejector rod 218 are pushed to rise until the ejector rod 218 is connected with the lower end face of the circuit board on the second section of conveyer belt 26, and the circuit board is supported by the ejector rod 218, so that the circuit board is prevented from bending downwards during processing, and the processing stability is improved. After the processing is finished, the material blocking cylinder 215 is controlled to reset, and the material ejection cylinder 216 is also controlled to reset, so that the ejector rod 218 is lowered to be separated from the circuit board on the second section of conveying belt 26.

In this embodiment, the number of the ejector pins 218 is four, and the four ejector pins 218 are rectangular and distributed on the ejector mounting plate 217; in other embodiments, the number of push rods 218 may be any other number.

As shown in fig. 4, the two-dimensional material taking module 3 includes a material taking fixing frame 31, the material taking fixing frame 31 is fixedly installed on the machine 1, an X-axis linear motor 32 and an X-axis guide rail 33 are arranged on the material taking fixing frame 31, a Y-axis installation block 34 is arranged on a rotor of the X-axis linear motor 32, an X-axis sliding block 35 is arranged at one end, far away from the X-axis linear motor 32, of the Y-axis installation block 34, the X-axis sliding block 35 is in sliding clamping connection with the X-axis guide rail 33, a Y-axis linear motor 36 is arranged on the Y-axis installation block 34, and a material sucking fixing plate 51 is connected with the rotor of the Y-axis linear motor 36.

During specific operation, the Y-axis mounting block 34 can be driven to move forwards and backwards through the X-axis linear motor 32, the Y-axis mounting block 34 drives the X-axis sliding block 35 to slide on the X-axis guide rail 33, and the movement direction of the Y-axis mounting block 34 can be limited through the cooperation of the X-axis sliding block 35 and the X-axis guide rail 33; in the moving process of the Y-axis mounting block 34, the Y-axis linear motor 36 and the suction fixing plate 51 are driven to synchronously move, so that the purpose of driving the suction mechanism 5 and the tin dispensing mechanism 6 to move back and forth is achieved. The Y-axis linear motor 36 can drive the suction fixing plate 51 to move left and right, so as to drive the suction mechanism 5 and the tin dispensing mechanism 6 to move left and right. Therefore, the mounting assembly can be driven to move freely back and forth and left and right by the cooperation of the X-axis linear motor 32 and the Y-axis linear motor 36, so as to realize the processing procedures of sucking materials, mounting, tin dispensing and glue dispensing.

The foregoing embodiments are preferred embodiments of the present utility model, and are not intended to limit the scope of the utility model, which is defined by the appended claims, but rather by the following claims.

Claims (10)

1. A multifunctional chip mounter for mounting tin and dispensing is characterized in that: the device comprises a machine table and a controller, wherein a circuit board conveying mechanism, a two-dimensional material taking module and a feeding assembly which are respectively connected with the controller are arranged on the machine table, a mounting assembly is arranged at the output end of the two-dimensional material taking module, the two-dimensional material taking module can drive the mounting assembly to be respectively connected with the circuit board conveying mechanism and the feeding assembly, the circuit board conveying mechanism can convey a circuit board to be mounted to a processing position of the mounting assembly, the mounted circuit board is conveyed out of the machine table, and the feeding assembly is used for conveying components to be mounted to the mounting assembly;

the mounting assembly comprises a material sucking mechanism and a tin dispensing mechanism, the material sucking mechanism can suck components from the feeding assembly, the components are placed on a circuit board on the circuit board conveying mechanism, and the tin dispensing mechanism is used for dispensing tin and/or dispensing glue on the circuit board conveying mechanism.

2. The multifunctional chip mounter for dispensing tin and glue on chip according to claim 1, wherein: the material sucking mechanism comprises a material sucking fixed plate, the material sucking fixed plate is connected with the output end of the two-dimensional material taking module, a material sucking lifting assembly is arranged on the material sucking fixed plate, a material sucking rod is arranged on the output end of the material sucking lifting assembly, the material sucking lifting assembly can drive the material sucking rod to lift, and a material sucking head is arranged at one end, close to the circuit board conveying mechanism, of the material sucking rod;

The material sucking fixing plate is provided with a material sucking rotating assembly, the output end of the material sucking rotating assembly is connected with the material sucking rod, and the material sucking rotating assembly can drive the material sucking rod and the material sucking head to rotate.

3. The multifunctional chip mounter for dispensing tin and glue on chip according to claim 2, wherein: the material sucking fixing plate is provided with a first camera and a first light supplementing lamp, the first camera is connected with the controller, the first camera is arranged above the first light supplementing lamp, and the first camera is used for shooting a circuit board image on the circuit board conveying mechanism.

4. The multifunctional chip mounter for dispensing tin and glue on chip according to claim 2, wherein: a suction head visual assembly is arranged on the suction fixing plate and is used for shooting images of components sucked on the suction head;

The suction head vision assembly comprises a camera fixing frame, a second camera and a second light supplementing lamp are arranged on the camera fixing frame, the second camera can shoot images of components and parts absorbed by the suction head, a light condensation driving assembly is arranged on the camera fixing frame, the second camera and the light condensation driving assembly are respectively connected with the controller, a reflector frame is arranged on the camera fixing frame in a sliding mode, the output end of the light condensation driving assembly is connected with the reflector frame, and the light condensation driving assembly can drive the reflector frame to slide on the camera fixing frame and further drive the reflector to be aligned with the second camera.

5. The multifunctional chip mounter for dispensing tin and glue on chip according to claim 2, wherein: the tin spot gluing mechanism comprises a tin spot gluing cylinder, the tin spot gluing cylinder is externally connected with a pouring pump body, one end of the tin spot gluing cylinder, which is close to the circuit board conveying mechanism, is provided with a nozzle, the material sucking fixing plate is provided with a tin spot gluing lifting assembly, the output end of the tin spot gluing lifting assembly is connected with the tin spot gluing cylinder, and the tin spot gluing lifting assembly can drive the tin spot gluing cylinder to move up and down.

6. The multifunctional chip mounter for dispensing tin and glue on a chip according to claim 5, wherein: the two-dimensional material taking module can drive the tin spot gluing mechanism to move to a corresponding position of the through nozzle mechanism;

The through nozzle mechanism comprises a through nozzle fixing block, a negative pressure suction head and a test plate are arranged on the through nozzle fixing block, a negative pressure device is externally connected with the negative pressure suction head, and the tin-dispensing lifting assembly can drive the tin-dispensing cylinder to be respectively connected with the test plate and the negative pressure suction head.

7. The multifunctional chip mounter for dispensing tin and glue on chip according to claim 2, wherein: the feeding assembly comprises a small material feeder and an IC feeding mechanism, the IC feeding mechanism comprises an IC tray frame and a suction head exchanging assembly, the small material feeder and the IC tray frame are respectively connected with the machine table, the IC tray frame is used for placing an IC product to be pasted, the suction head exchanging assembly is used for exchanging a suction head on the suction rod, and the two-dimensional material taking module can drive the suction mechanism to respectively move to corresponding positions of the small material feeding mechanism, the IC tray frame and the suction head exchanging assembly;

The suction head replacing assembly comprises a suction head replacing fixed block, the suction head replacing fixed block is connected with the machine table, a suction head placing seat is arranged on the suction head replacing fixed block, a plurality of suction head placing grooves are formed in the suction head placing seat, clamping plates are arranged in the suction head placing seat, through holes are respectively formed in the corresponding positions of the clamping plates and the suction head placing grooves, suction head replacing cylinders are arranged on the suction head fixed block, the output ends of the suction head replacing cylinders are connected with the clamping plates, and the suction head replacing cylinders can drive the clamping plates to slide on the suction head placing seat so as to drive the through holes to be communicated with the suction head placing grooves or dislocated.

8. The multifunctional chip mounter for dispensing tin onto chip according to any one of claims 1 to 7, wherein: the circuit board conveying mechanism comprises a conveying support and a conveying belt, the conveying support is connected with the machine table, a conveying motor and a plurality of driving wheels are arranged on the conveying support, the driving wheels are respectively and rotatably connected with the conveying support, driving wheels are arranged at the output ends of the conveying motor, and the conveying belt is respectively sleeved on the driving wheels and the driving wheels.

9. The multifunctional chip mounter for dispensing tin and glue on a chip according to claim 8, wherein: the conveying support is provided with a limiting mechanism, the limiting mechanism is used for limiting a circuit board to be mounted on the conveying support, the limiting mechanism comprises a limiting cylinder and a limiting plate, the limiting cylinder and the limiting plate are respectively connected with the conveying support, the output end of the limiting cylinder is provided with a limiting block, and the limiting cylinder can drive the limiting block to move so as to push the circuit board on the conveying belt to be connected with or separated from the limiting plate;

The lifting device is characterized in that a lifting cylinder is arranged at a position on the machine table corresponding to the limiting mechanism, a lifting mounting plate is arranged at the output end of the lifting cylinder, a plurality of ejector rods are arranged on the lifting mounting plate, and the lifting cylinder can drive the ejector rods to be connected with or separated from a circuit board on the conveying belt.

10. The multifunctional chip mounter for dispensing tin and glue on a chip according to claim 8, wherein: the two-dimensional material taking module comprises a material taking fixing frame, an X-axis linear motor and an X-axis guide rail are arranged on the material taking fixing frame, an X-axis sliding block is arranged on the X-axis guide rail in a sliding mode, the X-axis sliding block is connected with a rotor of the X-axis linear motor, a Y-axis linear motor is arranged on the X-axis sliding block, and the mounting assembly is connected with the rotor of the Y-axis linear motor.