CN2172590Y - Semiconductor cooling and heating element for beds - Google Patents

Abstract

The utility model relates to a semiconductor refrigerating and heating unit device for beds. The working surface of a ceramic flat plate TEC < 1 > 12703 type semiconductor refrigerating part of the prior art is tightly contacted with a metal quenching heat conducting aluminium plate, and the other surface of the ceramic flat plate TEC < 1 > 12703 type semiconductor refrigerating part is tightly contacted with a heat radiating fin to form a unit device. The utility model uses the Peltier effect principle of semiconductor temperature difference electric refrigerating to realize refrigeration, and can also change the positive and the negative poles of a direct current working voltage inversely into a heat conducting source. The semiconductor refrigerating and heating unit device can be arranged in a bed mattress to form a cold-warm bed mattress and can also be arranged in a sofa and the seat of a car driver to realize cold and warm two purposes. The utility model which has simple structure and shock resistance without noise and pollution is a novel and practical cooling and warming device.

Description

Semiconductor cooling and heating element for beds

The utility model belongs to the cool-warm convertible mattress that body-care is used; The basic refrigeration heating unit device of sofa and driver's seat etc.

The mankind create the various forms of warming articles of enjoying the cool for the health care of the warming of enjoying the cool in summer always.

At present, be used for human body both at home and abroad and often contact heatings such as articles for use such as the seat cushion mattress mode of enjoying the cool many kinds are arranged, as the under blanket of resistance wire heating, ice crystal water-cooled seat cushion or the like.But up to the present, all can only single heating or singlely enjoy the cool, the temperature of especially can not active adjusting enjoying the cool, like this, because human body causes side effect sometimes on the contrary to the difference of experiencing of the temperature of enjoying the cool.

The utility model purpose provides a kind of dual-purpose semiconductor refrigerating heating unit device of heating of enjoying the cool that mattress also can be used for sofa and driver's chair etc. that is used for.This device can adopt the size of regulating operating current directly to regulate temperature according to the different demands of human body, and when the direct-current working volts positive-negative polarity oppositely used, the poly-cold drawing of work transferred a heat conduction source to.

Technical essential of the present utility model is at prior art product TEC ₁The working face of 12703 earthenware slab type semiconductor temperature differences electricity refrigeration device tightens to connect airtight and touches a metal aluminum sheet, at the tight fin of contact of the another side of semiconductor cooling device, utilizes the heating that realizes enjoying the cool of semiconductor temperature difference electricity refrigeration Peltier effect principle.

Fig. 1 is a bed semiconductor refrigerating heating unit device schematic diagram.

［ 1 ］ is poly-cold, the heat conduction aluminium sheet of a metal among the figure, and its thickness is defined as 3～6(mm), area size preferably 200 * 200(mm) or 250 * 250(mm).Metal is poly-cold, heat conduction aluminium sheet lower surface is processed a boss ［ 8 ］, its size is consistent with semiconductor cooling device ［ 2 ］ appearance and size, boss is high by 2～4(mm), semiconductor cooling device upper surface and boss plane contact, lower surface contacts with a metal aluminum sheet or copper coin ［ 3 ］, and a fin ［ 4 ］ is installed below the metallic plate, in order to make its device good heat-conductive characteristic is arranged, its contact-making surface nonparallelism is best＜0.05(mm), all is coated with the thin layer heat-conducting silicone grease between all contact-making surfaces during installation.The whole unit device is tightened to one by screw ［ 5 ］, and in order to reduce the heat conduction between metal aluminum sheet and the fin, screw preferably selects for use the low nonmetallic materials of thermal conductivity factor to make.Lower surface at metal aluminum sheet ［ 1 ］ attaches one deck PE polyethylene heat barrier foam ［ 6 ］ simultaneously, will contain sealing with heat-barrier material ［ 7 ］ around the semiconductor cooling device.

Below be one of the present utility model and execute example:

At first three of the utility model cell arrangement peek amounts are in line in the evenly distributed single mattress that is installed in spring, the poly-cold metal aluminium sheet ［ 1 ］ of work closely leans against on the bed course of mattress the inside.Three such cell arrangements can a shared power supply, and its dc source rated operational voltage is 3～5V; Each working direct current is 0.7～1.4(A); Its electric current is adjustable, and external 220V electric main is as electrical source of power, and AC power becomes dc source by controllable silicon, and the DC voltage of use belongs to safe voltage, when regulating operating current, can directly regulate the working plate temperature, and during reversal of power, enjoying the cool transfers heating to.Radiating mode can gravity-flow ventilation, can also be with little electric fan air blast cooling heat radiation.Between work metallic plate and fin, to use the heat-barrier material thermal insulation, to keep the working face temperature efficiency.Can regulate temperature during the utility model refrigeration and be lower than 2 ℃～5 ℃ of environment temperatures, when operating voltage was reverse, heat conduction can be regulated temperature range and be higher than 5 ℃～20 ℃ of environment temperatures.

The utility model is simple in structure, and is safe in utilization, in light weight, and cost is low, noiseless, and non-environmental-pollution, shock resistance, anti-vibration can be used for the heating of enjoying the cool of articles for use such as mattress, sofa and seat cushions.

Claims (6)

1, a kind of with semiconductor refrigerating heating unit device, by TEC ₁Formations such as 12703 type earthenware slab type semiconductor cooling devices, it is characterized in that semiconductor cooling device [2] upper surface tightens to connect airtight touches poly-cold, the heat conduction aluminium sheet [1] of a metal, lower surface contacts a metallic plate [3] and fin [4], is fixed into a cell arrangement with screw [6].

2, by the described bed of claim 1 semiconductor refrigerating heating unit device, it is characterized in that described metal is poly-cold, heat conduction aluminium sheet ［ 1 ］ thickness is 3～6(mm); Area size preferably 200 * 200 or 250 * 250mm.Lower surface boss ［ 8 ］ size and semiconductor cooling device ［ 2 ］ consistent size, the boss height is 2～4mm.

3, by the described bed of claim 1 with semiconductor refrigerating heating unit device, it is characterized in that described semiconductor cooling device ［ 2 ］ adjustable direct-current working volts when work select 3～5(V) for use, electric current is 0.7～1.4(A).

4, by the described bed of claim 1 semiconductor refrigerating heating unit device, it is characterized in that described metal is poly-cold, heat conduction aluminium sheet ［ 1 ］ lower surface posts PE polyethylene heat barrier foam ［ 6 ］.

5,, it is characterized in that sealing with heat-barrier material ［ 7 ］ containing around described semiconductor cooling device ［ 2 ］ is after being fixed into one with poly-cold heat conduction aluminium sheet ［ 1 ］ of metal and fin ［ 4 ］ with screw ［ 6 ］ by described of claim 1 semiconductor refrigerating heating unit device.

6, by the described bed of claim 1 with semiconductor refrigerating heating unit device, it is characterized in that described semiconductor cooling device ［ 2 ］ and metal gather cold, heat conduction aluminium sheet ［ 1 ］, fin contact-making surfaces such as ［ 4 ］ all is coated with heat-conducting silicone grease when mounted.

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