CN2278903Y

CN2278903Y - High-efficiency temp. differential refrigerating and heating assemble

Info

Publication number: CN2278903Y
Application number: CN 96242510
Authority: CN
Inventors: 曹知光; 郭建平; 蒋平松
Original assignee: Individual
Current assignee: Individual
Priority date: 1996-11-28
Filing date: 1996-11-28
Publication date: 1998-04-15
Anticipated expiration: 2006-11-28

Abstract

The utility model relates to a high efficiency temperature differential refrigerating and heating assembly. The utility model is composed of a cold end ceramic plate, a hot end ceramic plate, a PN type couple, a power supply line, and heat insulation and heat preservation filling material having good quality. The utility model is characterized in that all space in the assembly is filled by the heat insulation and heat preservation filling material having good quality, thereby, heat radiation and heat convection between the cold end ceramic plate and the hot end ceramic plate, between the cold end ceramic plate and a hot end metal plate, and between the hot end ceramic plate and a cold end metal block in the assembly can be avoided, the inside electric loss in the semiconductor refrigeration assembly can be greatly reduced, and the refrigeration efficiency can be obviously improved. The utility model can be widely used as the refrigerating or the heating source of products, such as a refrigerator, an air conditioner, a cold storage and baking double purpose box, a cold and warm air heating radiator, a thermostatic bath, a cooling or heating headband, a cushion, a foot mat, a cooler, etc.

Description

Efficient electric temperature-difference refrigerating and heat assembly

The utility model relates to a kind of electric temperature-difference refrigerating and heats assembly, especially the electric temperature-difference refrigerating that galvanic couple, metal derby, ceramic wafer and wiring is made of semiconductor PN type and heat assembly.

Advantages such as at present, the semiconductor refrigerating assembly that utilizes paltie effect to make has that control is convenient, volume is little, noiselessness, non-environmental-pollution, life-span are long and being applied in the products such as refrigerator, air-conditioner, refrigeration, barbecue dual-purpose case.After particularly worldwide all proposed requirements at the higher level to atmospheric environment protection, the application of semiconductor refrigerating assembly was just day by day extensive.But existing semiconductor refrigerating assembly since exist hot and cold two ends than large space, make heat radiation and thermal convection current phenomenon cause the component internal power consumption, the assembly refrigerating efficiency is low, when especially hot junction in assembly and cold-end temperature difference are big, refrigerating efficiency is far below compressor cooling, thereby its range of application is restricted.

The purpose of this utility model is will provide a kind of to have more high efficiency electric temperature-difference refrigerating and heat assembly, especially semiconductor system assembly than prior art, thereby can obtain high efficiency semiconductor refrigerating and heat product.

According to thinking of the present utility model, analyze in the existing semiconductor refrigerating assembly and exist cold and hot two ends spacing, PN type the spacing between the spacing between the galvanic couple and P-type semiconductor and the N-type semiconductor, the space that these spacings form makes that the cold and hot both ends of the surface in the semiconductor refrigerating assembly are producing radiant heat transfer and convection heat transfer' heat-transfer by convection.And when the cold and hot two ends temperature difference was big, it was also strong more to conduct heat, and caused the internal loss of semiconductor refrigerating electrical component power to increase, and this is for causing the low major reason of refrigerating efficiency in the prior art.The utility model fills up good heat-insulation and heat-preservation material at this reason in the space of semiconductor refrigerating assembly, stop the radiant heat transfer and the convection heat transfer' heat-transfer by convection of hot and cold two ends, can reduce the internal electrical loss significantly, improves refrigerating efficiency.

Below in conjunction with accompanying drawing the utility model is described in detail.

Fig. 1 is a prior art semiconductor refrigerating assembly partial sectional view.

Fig. 2 is semiconductor refrigerating of the present utility model and heats assembly along the partial schematic sectional view of PN type to the galvanic couple direction.

Fig. 3 is semiconductor refrigerating of the present utility model and heats the partial schematic sectional view of assembly at ceramic wafer spacing position, cold and hot two ends.

In the prior art as shown in Figure 1, after connecting the PN type of forming with P-type semiconductor (7) and N-type semiconductor (8) galvanic couple (6) is together in series by power line with metal derby (4), (5), adopt double-surface ceramics plate (1) and (2) and all metal derbies (4), (5) integral planar to be formed by connecting again.Between cold junction ceramic wafer (1) and hot junction ceramic wafer (2), between cold side metal piece (5) and hot side metal piece (4) and two end ceramic wafers (2), (1), existing gap has constituted the confined space in the assembly (3) between P-type semiconductor (7) and the N-type semiconductor (8).These spaces account for cold junction face (1) and hot junction face (2) cover the volume that forms a greater part of more than, leave radiation bigger between hot and cold both ends of the surface (1), (2) and convection heat transfer' heat-transfer by convection leeway for, cause electric energy loss in the bigger assembly.

Fig. 2 Fig. 3 then is an embodiment of the present utility model.For avoiding electric energy loss in heat radiation and thermal convection current cause in original technology the assembly, present embodiment is to fill full institute shown in Figure 1 have living space (3) with effectively insulating insulation material (10), intercept between cold junction ceramic wafer (1) and hot side metal plate (4), the hot junction ceramic wafer (2) radiant heat transfer and convection heat transfer' heat-transfer by convection between hot junction ceramic wafer (2) and the cold side metal plate (5).The filling of effectively insulating insulation material (10) can be carried out after the semiconductor refrigerating assembly is formed, and also can carry out in manufacture process.

The utility model is not limited to a kind of embodiment, in all semiconductor refrigerating assemblies, though cold and hot biend be the plane or all being suitable for of curved surface.Also be applicable to the electric temperature-difference refrigerating assembly of forming by other materials.

The technical solution of the utility model is simple and reliable, can improve refrigerating efficiency significantly, can be widely used in the refrigeration of products such as refrigerator, air-conditioning, refrigeration, barbecue dual-purpose case, insulating box, cold and warm air heating radiator, cooling (heating) headband, seat cushion, step tread pad, cooler or heat the source.

Claims

Efficient electric thermoelectric cooling and heat assembly, comprise cold junction ceramic wafer (1), hot junction ceramic wafer (2), cold side metal piece (5), hot side metal piece (4), P-type semiconductor (7), N-type semiconductor (8), power line (9) and effectively insulating insulation material (10), it is characterized in that filling in the full semiconductor refrigerating assembly have living space (3) by existence between cold junction ceramic wafer (1) and the hot junction ceramic wafer (2), between hot junction ceramic wafer (2) and the cold side metal piece (5) and between cold junction ceramic wafer (2) and the hot side metal piece (4) with effectively insulating insulation material (10).