CN216834984U - Film box and film box positioning device - Google Patents
Film box and film box positioning device Download PDFInfo
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- CN216834984U CN216834984U CN202220183919.9U CN202220183919U CN216834984U CN 216834984 U CN216834984 U CN 216834984U CN 202220183919 U CN202220183919 U CN 202220183919U CN 216834984 U CN216834984 U CN 216834984U
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Abstract
The utility model discloses a spool box and spool box positioner, the spool box includes: the wafer support device comprises two wafer support components which are oppositely arranged, wherein each wafer support component is provided with a plurality of wafer mounting plates which are longitudinally arranged; the wafer mounting plates on the two wafer supporting assemblies are arranged oppositely in pairs, and each group of the wafer mounting plates arranged oppositely is used for placing a wafer; the wafer mounting plate is provided with a wafer supporting surface, and the wafer supporting surface is obliquely arranged. The utility model provides a spool box and the area of contact of wafer great, lead to the problem of photoresist adhesion spool box.
Description
Technical Field
The utility model relates to a semiconductor trade wafer wet processing field especially relates to a spool box and spool box positioner.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit. In the manufacturing process of the wafer, a wet processing process is generally adopted, and cleaning is needed. Before cleaning wafers, a plurality of wafers are generally placed in a wafer box, and then the whole wafer box is placed in a soaking pool for cleaning, so that the wafer box needs to be positioned so as to be convenient for carrying the wafer box.
Currently, a plurality of horizontally oriented slots are provided in a wafer cassette for placing wafers, and the wafers are in surface contact with the slots. The wafer is attached with the photoresist, and when the contact area between the wafer and the groove is large, the photoresist is easy to adhere to the wafer box, so that the wafer box is polluted.
SUMMERY OF THE UTILITY MODEL
Therefore, the embodiment of the utility model provides a spool box and spool box positioner effectively solves the area of contact of spool box and wafer great, leads to the problem of photoresist adhesion spool box.
In one aspect, the utility model provides a wafer box, include: the wafer support device comprises two wafer support components which are oppositely arranged, wherein each wafer support component is provided with a plurality of wafer mounting plates which are longitudinally arranged; the wafer mounting plates on the two wafer supporting assemblies are arranged oppositely in pairs, and each group of the wafer mounting plates arranged oppositely is used for placing a wafer; the wafer mounting plate is provided with a wafer supporting surface, and the wafer supporting surface is obliquely arranged.
The technical effect achieved after the technical scheme is adopted is as follows: the wafer supporting surface is obliquely arranged, when two ends of a wafer are placed on a group of oppositely arranged wafer supporting surfaces, the wafer is in a horizontal state, the corresponding wafer is in line contact with the wafer supporting surface, the contact area between the wafer and the wafer supporting surface is effectively reduced, and therefore photoresist adhesion on the wafer supporting surface is reduced.
In an embodiment of the present invention, a wafer mounting cavity is located between two of the wafer supporting assemblies, and one side of the wafer supporting surface close to the wafer mounting cavity is lower than one side of the wafer supporting surface away from the wafer mounting cavity.
The technical effect achieved after the technical scheme is adopted is as follows: after the wafer box carries the wafer to be soaked and cleaned, the cleaning liquid flows out from the wafer mounting cavity along the wafer supporting surface, so that the cleaning liquid is prevented from remaining on the wafer supporting surface.
In one embodiment of the present invention, each set of the wafer support surfaces disposed opposite each other is a mirror image of the two intermediate planes of the wafer support members.
The technical effect achieved after the technical scheme is adopted is as follows: each group of the wafer supporting surfaces are arranged in a mirror image mode, namely the slope and the width of each group of the wafer supporting surfaces are equal, two ends of each wafer are supported at the same position of the two wafer supporting surfaces, and the wafers cannot incline; in addition, in the vertical direction, the centers of all the wafers on the wafer supporting surface can correspond to each other and cannot incline or deviate, so that the positions of all the wafers on the manipulator are the same, and the manipulator can accurately take and place all the wafers; in addition, when the wafer box expands with heat and contracts with cold, the distance between the two wafer supporting components is changed simultaneously, and under the condition that the wafer supporting surfaces are inclined, one position is always arranged between the two opposite wafer supporting surfaces, so that the wafer can be stably supported.
In an embodiment of the present invention, a notch is formed on one side of the wafer mounting plate; and a wafer mounting groove is formed between the adjacent wafer mounting plates, and one side of the wafer mounting groove corresponding to the notch is a mounting inlet.
The technical effect achieved after the technical scheme is adopted is as follows: and the wafer is loaded into the wafer mounting groove from the mounting inlet, and the notch can prevent the wafer from interfering with the wafer mounting plate.
In an embodiment of the present invention, the wafer supporting assembly further includes: and the limiting baffle is abutted against one side of the wafer mounting plate, which is far away from the notch, and covers the wafer mounting groove.
The technical effect achieved after the technical scheme is adopted is as follows: the limiting baffle plate has a limiting effect on the wafer; when place the wafer on the wafer mounting panel, limit baffle can avoid the slope of wafer mounting panel improves the stability of wafer mounting panel.
In an embodiment of the present invention, the magazine further comprises: and the connecting plate is arranged on the upper side and/or the lower side of the wafer supporting component and is used for connecting the two wafer supporting components which are oppositely arranged.
The technical effect achieved after the technical scheme is adopted is as follows: the connecting plate can improve the stability of the wafer supporting component, avoid the wafer deviation caused by the inclination of the wafer supporting component and improve the position precision of the wafer.
On the other hand, the utility model provides a wafer cassette positioner, including the above-mentioned spool box that arbitrary embodiment provided, spool box positioner still includes: a cassette base plate; the wafer box bottom plate is arranged on the wafer box bottom plate, and the wafer box bottom plate is clamped at the bottom of the wafer supporting assembly.
The technical effect achieved after the technical scheme is adopted is as follows: the film box bottom plate is used for supporting the film box, the film box limiting assembly is used for positioning the film box, and a manipulator for clamping the film box can accurately grab the film box according to the position limited by the film box limiting assembly, so that the film box is accurately placed in a specified position for cleaning; the manipulator for clamping the wafer can also accurately place the wafer into the wafer box according to the position limited by the wafer box limiting component.
In an embodiment of the utility model, the spacing subassembly of spool box includes: the first limiting part is arranged on one side, away from the installation inlet, of the wafer supporting assembly and connected with the bottom plate of the wafer box through a strip-shaped hole.
The technical effect achieved after the technical scheme is adopted is as follows: the first limiting piece is used for limiting the limit position of one side, away from the installation opening, of the wafer box; the two wafer supporting assemblies respectively correspond to one first limiting part, and the position of the first limiting part on the wafer box bottom plate can be changed through the strip-shaped hole, so that the distance between the two first limiting parts is adjusted, and the size difference of the wafer box is compensated.
In an embodiment of the present invention, the cassette limiting assembly comprises: the second limiting piece is arranged on one side, corresponding to the installation inlet, of the wafer supporting assembly and is connected with the wafer box bottom plate; the second limiting part is provided with a pin hole, the wafer supporting assembly is provided with a positioning pin, and the positioning pin is matched with the pin hole.
The technical effect achieved after the technical scheme is adopted is as follows: the second limiting piece is used for limiting one side of the wafer supporting assembly, which corresponds to the installation inlet; the locating pin with the pinhole cooperation can further improve the spool box be in position accuracy on the spool box bottom plate improves the spool box with the joint strength of spool box bottom plate avoids the spool box is perpendicular move in the direction of wafer support assembly.
In an embodiment of the present invention, the cassette positioning device further comprises: the sensor is arranged on the film box bottom plate.
The technical effect achieved after the technical scheme is adopted is as follows: the sensor is used for detecting the existence of the wafer box and the type of the wafer box.
In summary, the above embodiments of the present application may have one or more of the following advantages or benefits: i) the contact area between the wafer supporting surface and the wafer can be reduced under the inclined state, and the photoresist on the wafer supporting surface is adhered by adopting line contact; ii) when the wafer box expands with heat and contracts with cold, the inclined wafer supporting surface is always provided with a contact point which can be matched with the width of the wafer, so that the wafer supporting surface can compensate errors caused by the expansion with heat and the contraction with cold, and the wafer is more stable; iii) one side of the wafer supporting surface close to the wafer mounting cavity is lower than one side of the wafer supporting surface far away from the wafer mounting cavity, so that cleaning liquid can be prevented from remaining on the wafer supporting surface; iv) the wafer box limiting component can improve the position precision of the wafer box, and the position of the wafer box limiting component can be changed to match the wafer boxes with different sizes; v) the sensor is capable of detecting the presence or absence of the cassette and the type of the cassette.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic structural view of a sheet box according to a first embodiment of the present invention.
Fig. 2 is a schematic structural diagram of the wafer mounting plate in fig. 1.
Figure 3 is an exploded view of the cassette of figure 1.
Fig. 4 is a schematic view of the structure of the sheet cassette of fig. 1 from another view angle.
Fig. 5 is a schematic structural diagram of a tablet cassette positioning device according to a second embodiment of the present invention.
Fig. 6 is a schematic structural view of the bottom plate of the cassette of fig. 5.
Fig. 7 is another schematic structural view of the cassette positioning device of fig. 6.
Description of the main element symbols:
100 is a sheet box; 110 is a wafer support assembly; 111 is a wafer mounting plate; 111a is a wafer support surface; 111b is a notch; 112 is a wafer installation cavity; 113 is a wafer mounting groove; 114 is a limit baffle; 115 is a positioning pin; 116 is a baffle locking groove; 120 is a connecting plate; 200 is a film box positioning device; 210 is a cassette bottom plate; 220 is a wafer box limiting component; 221 is a first limiting member; 222 is a second limiting member; 222a pin hole; and 230 is a sensor.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
[ first embodiment ] A method for manufacturing a semiconductor device
Referring to fig. 1-2, a first embodiment of the present invention provides a sheet cassette 100, including: two wafer supporting assemblies 110 which are oppositely arranged, wherein each wafer supporting assembly 110 is provided with a plurality of wafer mounting plates 111 which are longitudinally arranged; the wafer mounting plates 111 on the two wafer supporting assemblies 110 are arranged in pairs, and each group of the wafer mounting plates 111 arranged oppositely is used for placing a wafer; the wafer mounting plate 111 has a wafer support surface 111a, and the wafer support surface 111a is disposed obliquely.
In the present embodiment, the wafer supporting surface 111a is disposed obliquely, and both ends of the wafer are respectively contacted with a set of wafer mounting plates 111 disposed oppositely and kept in a horizontal state. Therefore, the wafer and the wafer supporting surface 111a are in line contact, which can effectively reduce the contact area between the wafer and the wafer supporting surface 111a, so that the photoresist on the wafer is not easy to adhere to the wafer supporting surface 111a, and the wafer supporting surface 111a is prevented from being polluted by the adhesive.
In one embodiment, a wafer mounting cavity 112 is formed between the two wafer support assemblies 110, and the side of the wafer support surface 111a close to the wafer mounting cavity 112 is lower than the side of the wafer support surface 111a away from the wafer mounting cavity 112. After the wafer box 100 carries the wafer for soaking and cleaning, the cleaning solution can flow out of the wafer mounting cavity 112 along the wafer supporting surface 111a, so as to prevent the cleaning solution from remaining on the wafer supporting surface 111 a; when the robot grips the wafer onto the wafer supporting surface 111a, any one end of the wafer can slide along the wafer supporting surface 111a until both ends of the wafer contact the wafer supporting surface 111a, so as to fix the wafer.
In addition, along the vertical upward direction, the distance between the oppositely arranged wafer supporting surfaces 111a is gradually increased, that is, the wafer supporting surfaces 111a can be used for placing wafers with different widths.
Preferably, all of the wafer support surfaces 111a of each wafer support assembly 110, which are away from the wafer mounting cavity 112, are vertically overlapped, and which are toward the wafer mounting cavity 112 are also vertically overlapped, so that all of the wafers placed in the cassette 100 can be overlapped at their centers; when the manipulator grabs any one wafer, the relative position relation between the manipulator and the center of the wafer can be fixed, so that the manipulator can conveniently position the wafer, and the position precision of taking and placing the wafer is improved.
In one embodiment, each set of oppositely disposed wafer support surfaces 111a is mirrored about a mid-plane of the two wafer support assemblies 110. Wherein the middle plane is a middle plane of the inner side surfaces of the two wafer support assemblies 110.
The wafer supporting surface 111a may be an inclined surface or a curved surface. Each group of wafer supporting surfaces 111a is arranged in a mirror image manner, and when the wafer supporting surfaces 111a are inclined, the slopes and the widths of the wafer supporting surfaces 111a which are oppositely arranged in each group are equal; when the wafer supporting surface 111a is curved, the curved state of the wafer supporting surface 111a is the same, so that the two ends of the wafer are supported at the same height position of the two wafer supporting surfaces 111a, and the wafer is prevented from tilting.
Further, before and after the wafer cassette 100 is cleaned with wafers, the distance between the two wafer support assemblies 110 changes due to the expansion and contraction caused by temperature difference. When the wafer supporting surfaces 111a are inclined, a position always exists between the two opposite wafer supporting surfaces 111a to stably support the wafer, for example, when the distance between the two wafer supporting assemblies 110 is reduced due to cold contraction, the wafer moves up slowly, and when the distance between the two wafer supporting assemblies 110 is increased due to heat and reduced, the wafer moves down slowly, and during the process, the wafer and the wafer supporting surfaces 111a always keep line contact, so that the wafer supporting surfaces 111a can compensate for errors caused by the heat expansion and the cold contraction.
In one embodiment, with continued reference to fig. 1, a notch 111b is provided in one side of the wafer mounting plate 111; a wafer mounting groove 113 is formed between the adjacent wafer mounting plates 111, and one side of the wafer mounting groove 113 corresponding to the notch 111b is a mounting inlet. The wafer is loaded into the wafer mounting groove 113 from the mounting inlet, and when the robot locates the wafer mounting groove 113, the wafer can be located between the two notches 111b, so that the wafer does not interfere with the wafer mounting plate 111. At this time, the robot is closer to the wafer mounting groove 113, and the positioning accuracy is higher.
In one specific embodiment, referring to fig. 3-4, the wafer support assembly 110 further comprises, for example: and a limit baffle 114 abutting against one side of the wafer mounting plate 111 far away from the notch 111b and covering the wafer mounting groove 113. For example, the limiting baffles 114 are longitudinally arranged and abut against the end portions of all the wafer mounting plates 111, so that the wafer mounting plates 111 are not easily bent or inclined, and the strength of the wafer mounting plates 111 is improved by the limiting baffles 114, so that the wafers on the wafer mounting plates 111 are more stable.
Further, the limiting baffle 114 limits the wafer, and particularly, a side of the limiting baffle 114 facing the wafer mounting plate 111 is, for example, an inclined surface or a curved surface, or a surface matched with an edge of the wafer, so that the position of the wafer is effectively limited, and the wafer is conveniently grabbed by a robot.
Preferably, a side of the wafer support assembly 110 away from the wafer mounting cavity 112 is provided with a baffle locking groove 116, for example, wherein an inner wall of the baffle locking groove 116 is provided with at least one fixing hole facing the limit baffle 114. The fastening member passes through the fixing hole and is connected to the limit stop plate 114, thereby fixing the limit stop plate 114 and pressing the limit stop plate 114 against the wafer mounting plate 111.
In a particular embodiment, cassette 100, for example, further comprises: the connection plate 120 is disposed on the upper side and/or the lower side of the wafer support assembly 110, and connects the two wafer support assemblies 110 disposed opposite to each other. For example, the wafer support assembly 110 may be provided with slots on the upper and/or lower sides thereof, and the ends of the connection plate 120 may be disposed in the slots and connected to the wafer support assembly 110 by fasteners. The connecting plate 120 is positioned through the slot during installation, so that the installation efficiency can be improved; meanwhile, the connecting plate 120 is not easy to loosen, so that the stability of the wafer supporting assembly 110 can be improved, and the wafer deviation caused by the inclination of the wafer supporting assembly 110 can be avoided, thereby improving the position precision of the wafer.
Preferably, the wafer mounting plate 111 and the limit baffle 114 can be made of a peek material, so that the high temperature resistance, the wear resistance and the corrosion resistance are improved; the rest part can be made of aluminum.
[ second embodiment ]
Referring to fig. 5-7, a second embodiment of the present invention provides a cassette positioning device 200, including the cassette 100 provided in any of the above embodiments. Cassette positioning device 200 further includes: the wafer cassette base plate 210 and at least one wafer cassette limiting component 220, wherein the wafer cassette limiting component 220 is arranged on the wafer cassette base plate 210 and clamped at the bottom of the wafer supporting component 110.
In this embodiment, the cassette base plate 210 is used to support the cassette 100, the cassette spacing assembly 220 is used to position the cassette 100, and the manipulator holding the cassette 100 can accurately grasp the cassette 100 according to the position defined by the cassette spacing assembly 220, so as to accurately place the cassette 100 in a designated position for cleaning; the robot holding the wafer can also accurately place the wafer into the cassette 100 according to the position defined by the cassette spacing assembly 220.
In one particular embodiment, cassette spacing assembly 220 includes, for example: the first limiting member 221 is disposed on a side of the wafer support assembly 110 away from the installation entrance, and the first limiting member 221 is connected to the cassette base plate 210 through a strip-shaped hole. For example, the two wafer supporting assemblies 110 respectively correspond to one first limiting member 221, and the direction of the strip-shaped hole is perpendicular to the wafer supporting assemblies 110, so that the distance between the two wafer supporting assemblies 110 can be adjusted, thereby compensating for the size difference of different cassettes 100.
Further, the first position-limiting member 221 is positioned with respect to the wafer support assembly 110 by two first positioning surfaces perpendicular to each other, i.e. limiting the extreme position of the cassette 100 away from the side of the mounting opening and the extreme position of the wafer support assembly 110 away from the wafer mounting cavity 112.
In a particular embodiment, cassette spacing assembly 220 further comprises, for example: a second stopper 222 disposed at a side of the wafer support assembly 110 corresponding to the mounting inlet, and connected to the cassette base plate 210; the second limiting member 222 has a pin hole 222a, the wafer support assembly 110 has a positioning pin 115, and the positioning pin 115 is engaged with the pin hole 222 a. The second limiting member 222 is used for limiting one side of the wafer support assembly 110 corresponding to the installation inlet; the positioning pins 115 are engaged with the pin holes 222a, and the positional accuracy of the sheet cassette 100 on the sheet cassette base plate 210 can be further improved. The coupling strength of the cassette 100 to the cassette base plate 210 is improved to prevent the cassette 100 from moving in a direction perpendicular to the wafer support assembly 110.
Further, a plurality of pin holes 222a may be provided, and the positioning pins 115 are matched with different pin holes 222a to realize specific adjustment between the two wafer support assemblies 110.
In a particular embodiment, cassette positioning device 200 further includes, for example: and a sensor 230 provided on the cassette base plate 210, the sensor 230 being used to detect the presence or absence of the cassette 100.
Further, cassette base plate 210 may be used to mount cassettes 100 of different sizes when cassette 100 has a plurality of cassette retaining members 220 secured to cassette base plate 210. At this time, sensor 230 may also be used to detect the type of cassette 100.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention in its corresponding aspects.
Claims (10)
1. A cartridge, comprising:
the wafer support device comprises two wafer support components which are oppositely arranged, wherein each wafer support component is provided with a plurality of wafer mounting plates which are longitudinally arranged;
the wafer mounting plates on the two wafer supporting assemblies are arranged oppositely in pairs, and each group of the wafer mounting plates arranged oppositely is used for placing a wafer; the wafer mounting plate is provided with a wafer supporting surface, and the wafer supporting surface is obliquely arranged.
2. A cartridge as claimed in claim 1 wherein a wafer mounting cavity is provided between the two wafer support assemblies, the side of the wafer support surface adjacent the wafer mounting cavity being lower than the side of the wafer support surface remote from the wafer mounting cavity.
3. A cartridge as claimed in claim 1 wherein each set of wafer support surfaces in opposing arrangement are mirrored about a mid-plane of two of the wafer support assemblies.
4. A cassette as claimed in any of claims 1 to 3, wherein a side of the wafer mounting plate is provided with a notch;
and a wafer mounting groove is formed between the adjacent wafer mounting plates, and one side of the wafer mounting groove corresponding to the notch is a mounting inlet.
5. The cartridge of claim 4, wherein the wafer support assembly further comprises: and the limiting baffle is abutted against one side of the wafer mounting plate, which is far away from the notch, and covers the wafer mounting groove.
6. The cartridge of claim 1, further comprising: and the connecting plate is arranged on the upper side and/or the lower side of the wafer supporting component and is used for connecting the two wafer supporting components which are oppositely arranged.
7. A cartridge positioning device comprising the cartridge of any one of claims 4-5, wherein the cartridge positioning device further comprises:
a cassette base plate;
the wafer box bottom plate is arranged on the wafer box bottom plate, and the wafer box bottom plate is clamped at the bottom of the wafer supporting assembly.
8. The cartridge positioning device of claim 7, wherein the cartridge retaining assembly comprises:
the first limiting part is arranged on one side, away from the installation inlet, of the wafer supporting assembly and connected with the wafer box bottom plate through the strip-shaped holes.
9. The cartridge positioning device of claim 7, wherein the cartridge retaining assembly comprises:
the second limiting piece is arranged on one side, corresponding to the installation inlet, of the wafer supporting assembly and connected with the wafer box bottom plate;
the second limiting part is provided with a pin hole, the wafer supporting assembly is provided with a positioning pin, and the positioning pin is matched with the pin hole.
10. The cassette positioning device of claim 7, further comprising:
the sensor is arranged on the film box bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220183919.9U CN216834984U (en) | 2022-01-24 | 2022-01-24 | Film box and film box positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220183919.9U CN216834984U (en) | 2022-01-24 | 2022-01-24 | Film box and film box positioning device |
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| Publication Number | Publication Date |
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| CN216834984U true CN216834984U (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220183919.9U Active CN216834984U (en) | 2022-01-24 | 2022-01-24 | Film box and film box positioning device |
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| CN (1) | CN216834984U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115676266A (en) * | 2022-09-27 | 2023-02-03 | 光旸科技(上海)有限公司 | Wafer detects uses blowing device |
| CN116280646A (en) * | 2023-05-19 | 2023-06-23 | 苏州锐杰微科技集团有限公司 | Wafer storage transfer box for chip packaging and working method |
-
2022
- 2022-01-24 CN CN202220183919.9U patent/CN216834984U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115676266A (en) * | 2022-09-27 | 2023-02-03 | 光旸科技(上海)有限公司 | Wafer detects uses blowing device |
| CN115676266B (en) * | 2022-09-27 | 2024-04-05 | 盖泽精密科技(苏州)有限公司 | Discharging device for wafer detection |
| CN116280646A (en) * | 2023-05-19 | 2023-06-23 | 苏州锐杰微科技集团有限公司 | Wafer storage transfer box for chip packaging and working method |
| CN116280646B (en) * | 2023-05-19 | 2023-08-15 | 苏州锐杰微科技集团有限公司 | Wafer storage transfer box for chip packaging and working method |
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