JP2001168172A - Wafer transfer apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a wafer transfer apparatus which can suppress wafer transfer error and wafer damage involved thereby. SOLUTION: A wafer transfer apparatus 1 has a first stage 6 for holding a first housing 2, a second stage 7 for holding a second housing 3, a first push arm 4 for transferring a plurality of wafers 9 from the first housing 2 to the second housing 3, a second push arm 5 for transferring the wafers 9 from the second housing 3 to the first housing, and a vertical position adjusting mechanism 8 for moving up or down the first housing 2. The first and second housings 2 and 3 can contain a plurality of wafers 9 kept with a predetermined spacing in the vertical direction. The wafer transfer apparatus 1 can adjust a vertical relative position between the first and second housings 2 and 3 by the mechanism 8 which moves up or down the first housing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

[0001] The present invention relates to a semiconductor integrated circuit,
The present invention relates to a wafer transfer device for transferring a semiconductor wafer from one container to another in a manufacturing process of a semiconductor laser or a solar cell.

[0002]

2. Description of the Related Art A wafer transfer apparatus is used for transferring a semiconductor wafer from one container to another in a manufacturing process of a semiconductor integrated circuit, a semiconductor laser, a solar cell, or the like.

FIG. 5 is a schematic diagram showing a conventional wafer transfer apparatus 20. The wafer transfer device 20 includes a first stage 25 that holds the first container 21 and a second container 22.
, A third stage 27 for holding the third container 23, a fourth stage 28 for holding the fourth container 24, and a plurality of wafers 9 from the first container 21 to the second container 22. And a second pushing arm 30 for transferring each wafer 9 from the fourth container 24 to the third container 23.

In this prior art, the first container 21 and the second
The unit including the container 22 transfers each wafer 9 only to the right in FIG. 5, and the fourth container 24 and the third container 2
3 is configured to transfer each wafer 9 only to the left, and by providing two units, bidirectional transfer of each wafer 9 is enabled.

The prior art wafer transfer apparatus disclosed in Japanese Patent Application Laid-Open No. 9-321121 has a mechanism for extruding and transferring every several wafers.

FIG. 6 shows another conventional wafer transfer apparatus 3.
FIG. The wafer transfer device 31 includes first and second stages 36 and 37 for holding the first container 32 and the second container 33 so as to face each other at the same level or at an arbitrary level. The first pushing arm 34 for transferring each wafer 9 to the second container 33 and the second pushing arm 34
A second pushing arm 35 for transferring each wafer 9 from the container 33 to the first container 32, and one unit can transfer each wafer 9 in two directions.

Further, the prior art wafer transfer apparatus disclosed in Japanese Patent Application Laid-Open No. 6-72508 has a plurality of transfer plates on which each wafer can be mounted. This wafer transfer device moves each transfer plate in the horizontal direction toward the first container, and moves the vertical position of each transfer plate and the first container in the first container relative to each other. By changing to the first
Each wafer in the container is placed on each transfer plate, and then each transfer plate is moved in the horizontal direction toward the second container, and each transfer plate and the second container in the second container are placed. By changing the vertical position relative to the above, each wafer on each transfer plate is transferred to the second container.

[0008]

However, in the above-described wafer transfer device disclosed in Japanese Patent Application Laid-Open No. 9-321121, the vertical position of each container is fixed. For this reason, the wafer transfer apparatus can to some extent cope with variations such as deformation such as warpage and return due to the thermal process of each wafer, initial shape accuracy of each container or deformation due to long-term use of each container. However, when the degree of variation is large, there is a problem that many errors occur in transferring wafers, and the wafers are easily damaged.

In particular, in the case of manufacturing a silicon crystal based solar cell, which has been increasing in demand for solar power generation in recent years, among which a polycrystalline silicon solar cell is manufactured, a metal electrode is formed on almost the entire surface of one side of the silicon wafer. Each wafer is greatly warped due to a difference in thermal expansion coefficient between the wafer and the metal, so that many wafer transfer errors occur.

[0010] In addition to the disk-shaped wafer used for semiconductor integrated circuit devices, there are also square-plate-shaped wafers, and when the square-plate-shaped wafer is transferred, the warp of each wafer is required. Variations such as deformation, such as return and return, initial shape accuracy of each container, or deformation of each container, have a particularly large effect on the transfer of each wafer. Likely to happen.

In the configuration of the wafer transfer device 20 shown in FIG. 5, the vertical position of each of the containers 21 to 24 of each unit is set in an optimal relationship in each transfer direction, so that each wafer 9 is warped by a thermal process. In addition, it is possible to suppress to a certain extent the possibility of occurrence of a transfer error of each wafer 9 due to variations such as deformation such as return, variations in the initial shape accuracy of each of the containers 21 to 24 or deformation of each of the containers 21 to 24. However, the wafer transfer apparatus 20 has a problem that the apparatus is larger and the manufacturing cost of the apparatus is higher than a wafer transfer apparatus that performs bidirectional transfer in one unit.

The wafer transfer device 3 shown in FIG.
1 can transfer the wafers 9 in one direction in one unit, but the positions of the first container 32 and the second container 33 in the vertical direction are fixed. Therefore, for example, when the wafer 9 is set at an optimal position for transfer from the first container 32 to the second container 33, each wafer 9 is transferred from the second container 33 to the first container 32 in reverse. In some cases, the positions of the containers 32 and 33 cannot be set in an optimal relationship, and a transfer error of the wafer 9 is likely to occur.

That is, in the wafer transfer device 31, when each wafer 9 is transferred in both directions, it is impossible to set the respective containers 32 and 33 at the positions that are optimal for transfer in any direction. is there. Therefore, in particular, deformation of each wafer 9 such as warpage and return due to a thermal process,
Due to variations in the initial shape accuracy of the wafers 2 and 33 or deformation due to long-term use of each of the containers 32 and 33, each wafer 9
There is a drawback that transfer mistakes are likely to occur.

Further, the configuration and operation of the wafer transfer apparatus disclosed in Japanese Patent Application Laid-Open No. 6-72508 are complicated because each wafer must be moved horizontally and vertically.

According to the present invention, it is possible to reduce a wafer transfer error caused by deformation of each wafer such as warpage and bending, an initial shape accuracy of each container or a deformation of each container, and a damage of the wafer accompanying the deformation. It is an object of the present invention to provide a wafer transfer apparatus capable of performing the above.

[0016]

SUMMARY OF THE INVENTION According to the present invention, a plurality of wafers are stored at predetermined intervals in a vertical direction from a first storage body in which a plurality of wafers are stored at predetermined intervals in a vertical direction. In a wafer transfer device for transferring a wafer by sliding the wafer to a second container, the relative position of the first container and the second container in the vertical direction can be adjusted. It is a transfer device.

In the wafer transfer device according to the present invention, the transfer of each wafer from the first container to the second container is
The relative vertical position of each container can be adjusted to be optimal. Therefore, deformation of each wafer,
Transfer errors of each wafer due to variations in the initial shape accuracy of each container or deformation of each container can be significantly reduced, and damage to each wafer due to the transfer error can be reduced.

Further, according to the present invention, an intermediate stage having a plurality of mounting plates for holding wafers at predetermined intervals in the vertical direction is provided between the first housing and the second housing. Features.

According to the present invention, an intermediate stage is provided between the first and second containers, so that the wafer transfer device can transfer each wafer from the first to the second container. On the way, each wafer can be held at an interval in the vertical direction.

The present invention also provides a second container for accommodating a plurality of wafers at predetermined vertical intervals from a first container for accommodating a plurality of wafers at predetermined vertical intervals. In a wafer transfer apparatus for transferring wafers, an intermediate stage including a plurality of mounting plates for holding wafers at predetermined intervals in a vertical direction is provided between a first storage body and a second storage body. A wafer transfer device is provided.

According to the present invention, since the intermediate stage is provided between the first and second storage bodies, the wafer transfer device can transfer each wafer from the first storage body to the second storage body. On the way, each wafer can be held at an interval in the vertical direction.

Further, the present invention is characterized in that at least the relative position in the vertical direction between the first container and the intermediate stage or between the intermediate stage and the second container can be adjusted.

According to the present invention, the relative position in the vertical direction between the intermediate stage and the first or second container can be adjusted, so that the wafer transfer device can move from the first container to the second container. During transfer of each wafer to the body, each wafer can be held at a position optimal for transfer, and movement can be performed more smoothly.

Further, the present invention is characterized in that the inclination of each mounting plate of the intermediate stage is adjustable.

In the wafer transfer apparatus according to the present invention, in transferring each wafer from the first container to the second container,
Since the inclination of each mounting plate of the intermediate stage can be adjusted, even with such a configuration, it is possible to adjust the holding positions of the plurality of wafers on the mounting plate with respect to each container during wafer transfer. .

Further, the present invention is characterized in that a vertical position adjusting mechanism for raising and lowering the intermediate stage is provided.

According to the present invention, since the vertical position of the intermediate stage can be adjusted, the relative positions of the intermediate stage and the first and second housings in the vertical direction can be adjusted.

The present invention is characterized in that a vertical position adjusting mechanism for raising and lowering the first container is provided.

According to the present invention, the vertical position of the first container can be adjusted, so that the relative position of the first container and the second container in the vertical direction can be adjusted.

Further, the present invention is characterized in that a vertical position adjusting mechanism for raising and lowering the second container is provided.

According to the present invention, the vertical position of the second container can be adjusted, so that the relative position of the first container and the second container in the vertical direction can be adjusted.

[0032]

DESCRIPTION OF THE PREFERRED EMBODIMENTS A wafer transfer device is used for transferring a semiconductor wafer in a manufacturing process of a semiconductor integrated circuit, a semiconductor laser, a solar cell or the like. FIG. 1 is a schematic diagram of a wafer transfer apparatus 1 according to an embodiment of the present invention. The wafer transfer apparatus 1 includes a first stage 6 for holding the first container 2, a second stage 7 for holding the second container 3, and a plurality of wafers 9 from the first container 2 to the second container 3. The first pushing arm 4 to be transferred,
It has a second pushing arm 5 for transferring each wafer 9 from the second container 3 to the first container 2 and a vertical position adjusting mechanism 8 for raising and lowering the first container 2.

The first housing 2 and the second housing 3 are provided, for example, with a plurality of mounting plates 2c, 3c provided at equal intervals in the vertical direction.
Each wafer 9 is mounted on the top of the
Can be stored at predetermined intervals in the vertical direction. The interval between the mounting plates 2c is equal to the interval between the mounting plates 3c, and the respective containers 2 and 3 are the front 2a of the first container 2 and the front of the second container 3 into and out of which the respective wafers 9 are inserted. 3a is arranged in a state of facing.

The first stage 6 has a first clamp mechanism 6a, and the second stage 7 has a second clamp mechanism 7a. The first container 2 is fixed to the first stage 6 by a first clamp mechanism 6a, and the second container 3 is fixed to the second stage 7 by a second clamp mechanism 7a. Each of the clamping mechanisms 6a, 7a is such that each of the containers 2, 3 is attached to each of the stages 6, 7, and the shape of each of the containers 2, 3 and each of the stages 6, 7.
When fixed by the shape of 7, it may not be provided.

In the wafer transfer device 1, the vertical position adjusting mechanism 8 raises and lowers the first container 2, thereby causing the first
The relative movement of each of the containers 2 and 3 with respect to the transfer of each wafer 9 from the container 2 to the second container 3 and the transfer of each of the wafers 9 from the second container 3 to the first container 2. The position in the vertical direction can be adjusted to be optimal. Therefore,
In the bidirectional transfer, the transfer mistake of each wafer 9 due to variations in the deformation of each wafer 9, the initial shape accuracy of each of the containers 2, 3 or the deformation of each of the containers 2, 3 can be greatly reduced. Damage to each wafer 9 due to a replacement error can be reduced. The vertical position adjusting mechanism 8 raises and lowers the first container 2 in the present embodiment, but is a mechanism for raising and lowering the second container 3 or a mechanism for raising and lowering both the first and second containers 2 and 3. There may be.

Further, in the wafer transfer device 1, the first and second substrates provided on the back surfaces 2b and 3b of the containers 2 and 3 respectively.
Each of the wafers 9 is extruded by the extruding arms 4 and 5 and transferred to each of the containers 2 and 3 at the transfer destination. Note that the wafer transfer mechanism provided in the wafer transfer device 1 is not limited to the push-out mechanism using the first and second push-out arms 4 and 5, and for example, each wafer 9 is pulled out from each of the containers 2 and 3 as the transfer source and transferred. A mechanism or a mechanism in which the first and second stages 6 and 7 are entirely tilted and each wafer 9 is slid and transferred by gravity.

As described above, the wafer transfer apparatus 1 can transfer each wafer 9 in two directions, so that the apparatus is different from the conventional wafer transfer apparatus in which two units are transferred in two units. Can be configured small and inexpensively. Further, by alternately performing the transfer in each direction, it is possible to reduce the labor of attaching and detaching each of the containers 2 and 3, and to temporarily transfer each wafer 9 to a special container used only in a specific process. In particular, the stability is particularly effective when transferring is performed.

Further, a sensor for detecting the presence or absence of the wafer 9 in each of the containers 2 and 3 is provided, and based on this, the relative position of each of the containers 2 and 3 in the vertical direction is optimized. May be automatically adjusted.

Next, the flow of the operation for transferring each wafer 9 from the first container 2 to the second container 3 will be described. First, the first container 2 for accommodating each wafer 9 is set on the first stage 6, and the second container 3 not accommodating the wafer 9 is set on the second stage 7, and each of the containers 2, 3 is clamped. Mechanism 6
a, 7a.

Next, the presence or absence of the wafer 9 in each of the containers 2 and 3 before the transfer is recognized, and the transfer direction is confirmed. The first container 2 is positioned such that the relative position of the containers 2 and 3 in the vertical direction with respect to the confirmed transfer direction has an optimal relationship.
Is adjusted by the vertical position adjusting mechanism 8. When transferring each wafer 9 from the first container 2 to the second container 3, the first container 2 is adjusted to be slightly higher than the second container 3.

After that, by the first pushing arm 4,
Each wafer 9 is extruded and transferred from the first container 2 to the second container 3. After transferring each wafer 9, each clamp mechanism 6a,
7a is released and each container 2, 3 is taken out.

FIG. 2 is a schematic view of a wafer transfer apparatus 10 according to another embodiment of the present invention. The wafer transfer device 10 includes a first stage 6 that holds the first container 2,
Second stage 7 for holding second container 3, first container 2
Intermediate stage 1 provided between the second housing 3
2. A first pushing arm 4 for transferring a plurality of wafers 9 from the first container 2 to the second container 3, and a second pushing arm 5 for transferring each wafer 9 from the second container 3 to the first container 2. Having.

The first housing 2 and the second housing 3 are provided with a plurality of mounting plates 2c,
By mounting each wafer 9 on 3c, each wafer 9 can be accommodated at predetermined intervals in the vertical direction. The intervals between the mounting plates 2c and the intervals between the mounting plates 3c are equal, and the respective containers 2 and 3 are the front 2a of the first container and the front 3a of the second container 3 through which the respective wafers 9 are put in and out. Are arranged so as to face each other.

The intermediate stage 12 has a plurality of mounting plates 11 for holding the wafers 9 being transferred and an inclination adjusting mechanism 12a for adjusting the inclination of each mounting plate 11. The space between the mounting plates 11 in the vertical direction is equal to the space between the mounting plates 2c and 3c.

In the wafer transfer device 10, the transfer of each wafer 9 from the first container 2 to the second container 3 and the transfer of each wafer 9 from the second container 3 to the first container 2 are intermediate. Since the inclination of each mounting plate 11 of the stage 12 can be adjusted, the holding position of each wafer 9 on the intermediate stage 12 can be adjusted with respect to each of the containers 2 and 3.
Therefore, in the bidirectional transfer, the deformation of each wafer 9, the initial shape accuracy of each container 2, 3 or the
The transfer mistake of each wafer 9 due to the variation such as deformation of 3 can be greatly reduced, and the damage of each wafer 9 due to the transfer mistake can be reduced.

The first stage 6 has a first clamp mechanism 6a, and the second stage 7 has a second clamp mechanism 7a. The first container 2 is fixed to the first stage 6 by a first clamp mechanism 6a, and the second container 3 is fixed to the second stage 7 by a second clamp mechanism 7a. Each of the clamping mechanisms 6a, 7a is such that each of the containers 2, 3 is attached to each of the stages 6, 7, and the shape of each of the containers 2, 3 and each of the stages 6, 7.
When fixed by the shape of 7, it may not be provided.

In the wafer transfer device 10, each wafer 9 is pushed out by the first and second push-out arms 4, 5 provided on the back surface 2b, 3b of each of the containers 2, 3, and each of the containers 2, 2 at the transfer destination is pushed out. Transfer to 3. The wafer transfer mechanism provided in the wafer transfer device 10 is not limited to the push-out mechanism using the first and second push-out arms 4 and 5, and for example, each wafer 9 is pulled out from each of the transfer sources 2 and 3 and transferred. A mechanism or a mechanism in which the first and second stages 6 and 7 are entirely tilted and each wafer 9 is slid and transferred by gravity.

Further, a sensor for detecting the presence / absence of the wafer 9 in each of the containers 2 and 3 is provided, and based on this, the relative position of each of the containers 2 and 3 in the vertical direction is optimized. May be adjusted automatically.

Next, an operation flow for transferring each wafer 9 from the first container 2 to the second container 3 will be described. First, the first container 2 for accommodating each wafer 9 is set on the first stage 6, and the second container 3 not accommodating the wafer 9 is set on the second stage 7, and each of the containers 2, 3 is clamped. Mechanism 6
a, 7a.

Next, the presence or absence of the wafer 9 in each of the containers 2 and 3 before the transfer is recognized, and the transfer direction is confirmed. The tilt adjusting mechanism 1 is adjusted so that the containers 2 and 3 and the intermediate stage 12 have an optimal relationship with respect to the confirmed transfer direction.
The inclination of each mounting plate 11 of the intermediate stage 12 is adjusted by 2a. Each wafer 9 is transferred from the first container 2 to the second container 3.
Is transferred, each mounting plate 11 of the intermediate stage 12 is moved.
Of the first container 2 is slightly lower than the corresponding mounting plate 2c of the first container 2 and the intermediate stage 1
The end of each mounting plate 11 on the second container 3 side is the second container 3
The tilt angle is adjusted so as to be slightly higher than the corresponding mounting plate 3c.

After that, by the first pushing arm 4,
Each wafer 9 is extruded and transferred from the first container 2 to the second container 3. After transferring each wafer 9, each clamp mechanism 6a,
7a is released and each container 2, 3 is taken out.

FIG. 3 is a schematic view of a wafer transfer device 40 according to still another embodiment of the present invention. The wafer transfer device 40 is provided on a first stage 6 holding the first container 2, a second stage 7 holding the second container 3, and between the first container 2 and the second container 3. The intermediate stage 43, the plurality of wafers 9 from the first container 2 to the second container 3
Arm 4, which transports each wafer 9 from the second container 3 to the first container 3, a vertical position adjusting mechanism 41 which raises and lowers the first container 2, and a second container. It has a vertical position adjustment mechanism 42 for raising and lowering the body 3.

The first container 2 and the second container 3 are provided with a plurality of mounting plates 2c,
By mounting each wafer 9 on 3c, each wafer 9 can be accommodated at predetermined intervals in the vertical direction. The interval between the mounting plates 2c is equal to the interval between the mounting plates 3c, and the respective containers 2 and 3 are the front 2a of the first container 2 and the front of the second container 3 into and out of which the respective wafers 9 are inserted. 3a is arranged in a state of facing.

The intermediate stage 43 has a plurality of mounting plates 44 for holding the wafers 9 being transferred. Each mounting plate 44
Is equal to the distance between the mounting plates 2c and 3c.

In the wafer transfer device 40, the vertical position adjusting mechanism 41 controls the first container 2 and the vertical position adjusting mechanism 4
2 moves the second container 3 up and down, whereby the relative positions of the containers 2 and 3 and the intermediate stage 43 in the vertical direction are adjusted. Therefore, in the wafer transfer device 40, in the transfer of each wafer 9 from the first container 2 to the second container 3, and in the transfer of each wafer 9 from the second container 3 to the first container 2, Each wafer 9 can be held at an optimal position, and can be smoothly transferred.

Therefore, in the bidirectional transfer, the transfer mistake of each wafer 9 due to the variation of the deformation of each wafer 9, the initial shape accuracy of each of the containers 2, 3 or the deformation of each of the containers 2, 3 is greatly increased. It is also possible to reduce damage to each wafer 9 due to transfer mistakes.

The first stage 6 has a first clamp mechanism 6a, and the second stage 7 has a second clamp mechanism 7a. The first container 2 is fixed to the first stage 6 by a first clamp mechanism 6a, and the second container 3 is fixed to the second stage 7 by a second clamp mechanism 7a. Each of the clamping mechanisms 6a, 7a is such that each of the containers 2, 3 is attached to each of the stages 6, 7, and the shape of each of the containers 2, 3 and each of the stages 6, 7.
When fixed by the shape of 7, it may not be provided.

In the wafer transfer device 40, each wafer 9 is pushed out by the first and second push-out arms 4, 5 provided on the back surface 2b, 3b of each of the containers 2, 3, and each of the containers 2, 2 at the transfer destination is pushed out. Transfer to 3. The wafer transfer mechanism provided in the wafer transfer device 40 is not limited to the push-out mechanism using the first and second push-out arms 4 and 5, and, for example, pulls out and transfers each wafer 9 from each of the containers 2 and 3 as the transfer source. A mechanism or a mechanism in which the first and second stages 6 and 7 are entirely tilted and each wafer 9 is slid and transferred by gravity.

Further, a sensor for detecting the presence or absence of the wafer 9 in each of the containers 2 and 3 is provided, and based on the sensor, the relative position of each of the containers 2 and 3 in the vertical direction is optimized. May be adjusted automatically.

Next, the flow of the operation of transferring each wafer 9 from the first container 2 to the second container 3 will be described. First, the first container 2 for accommodating each wafer 9 is set on the first stage 6, and the second container 3 not accommodating each wafer 9 is set on the second stage 7. Clamp mechanism 6
a, 7a.

Next, the presence / absence of each wafer 9 in each of the containers 2 and 3 before transfer is recognized, and the transfer direction is confirmed. The vertical position of the first container 2 is adjusted vertically so that the relative positions of the containers 2 and 3 and the intermediate stage 43 in the vertical direction have an optimum relationship with the confirmed transfer direction. The adjustment is performed by the mechanism 41, and the vertical position of the second container 3 is adjusted by the vertical position adjustment mechanism 42. When each wafer 9 is transferred from the first container 2 to the second container 3, the first container 2 is slightly higher than the intermediate stage 43 and the second container 3 is
Adjust so that it is slightly lower than.

After that, by the first pushing arm 4,
Each wafer 9 is extruded and transferred from the first container 2 to the second container 3. After transferring each wafer 9, each clamp mechanism 6a,
7a is released and each container 2, 3 is taken out.

FIG. 4 is a schematic diagram of a wafer transfer apparatus 50 according to still another embodiment of the present invention. The wafer transfer device 50 is provided on a first stage 6 holding the first container 2, a second stage 7 holding the second container 3, and between the first container 2 and the second container 3. The intermediate stage 51, a plurality of wafers 9 from the first container 2 to the second container 3
Arm 4, which transfers the wafers 9 from the second container 3 to the first container 2, a vertical position adjusting mechanism 53 for raising and lowering the first container 2, and an intermediate stage 51. Vertical position adjustment mechanism 5 for raising and lowering
1a.

The first container 2 and the second container 3 are provided with a plurality of mounting plates 2c,
By mounting each wafer 9 on 3c, each wafer 9 can be accommodated at predetermined intervals in the vertical direction. The intervals between the mounting plates 2c and the intervals between the mounting plates 3c are equal, and the respective containers 2 and 3 are the front 2a of the first container and the front 3a of the second container 3 through which the respective wafers 9 are put in and out. The intermediate stage 51 disposed in a state where the wafers 9 face each other has a plurality of mounting plates 52 for holding the respective wafers 9 being transferred. The interval between the mounting plates 52 in the vertical direction is equal to the interval between the mounting plates 2c and 3c.

In the wafer transfer device 50, the vertical position adjusting mechanism 53 controls the first container 2 and the vertical position adjusting mechanism 5.
The vertical position of each of the containers 2 and 3 and the intermediate stage 51 is adjusted by raising and lowering the intermediate stage 51 by 1a. For this reason, in the wafer transfer device 50, in the transfer of each wafer 9 from the first container 2 to the second container 3, and in the transfer of each wafer 9 from the second container 3 to the first container 2, Each wafer 9 can be held at an optimal position, and can be smoothly transferred.

Therefore, in the wafer transfer device 50, in the bidirectional transfer, each wafer 9 is deformed due to variations in the deformation of each wafer 9, the initial shape accuracy of each of the containers 2, 3 and the deformation of each of the containers 2, 3. Transfer errors can be greatly reduced, and damage to each wafer 9 due to the transfer errors can be reduced.

The first stage 6 has a first clamp mechanism 6a, and the second stage 7 has a second clamp mechanism 7a. The first container 2 is fixed to the first stage 6 by a first clamp mechanism 6a, and the second container 3 is fixed to the second stage 7 by a second clamp mechanism 7a. Each of the clamping mechanisms 6a, 7a is such that each of the containers 2, 3 is attached to each of the stages 6, 7, and the shape of each of the containers 2, 3 and each of the stages 6, 7.
When fixed by the shape of 7, it may not be provided.

The wafer transfer device 50 includes
The wafers 9 are extruded by the first and second pushing arms 4 and 5 provided on the back surfaces 2 b and 3 b of the wafer 3, and are transferred to the containers 2 and 3 at the transfer destination. The wafer transfer mechanism provided in the wafer transfer device 50 includes first and second wafer transfer mechanisms.
The mechanism is not limited to the push-out mechanism by the push-out arms 4 and 5. For example, a mechanism for pulling out and transferring each wafer 9 from each of the transfer sources 2 and 3 or a method in which the first and second stages 6 and 7 are tilted entirely and gravity May be a mechanism for sliding and transferring each wafer 9.

Further, a sensor for detecting the presence or absence of the wafer 9 in each of the containers 2 and 3 is provided, and based on the sensor, the relative position of each of the containers 2 and 3 in the vertical direction is optimized. May be adjusted automatically.

Next, the flow of the operation for transferring each wafer 9 from the first container 2 to the second container 3 will be described. First, the first container 2 for accommodating each wafer 9 is set on the first stage 6, and the second container 3 not accommodating the wafer 9 is set on the second stage 7, and each of the containers 2, 3 is clamped. Mechanism 6
a, 7a.

Next, the presence or absence of the wafer 9 in each of the containers 2 and 3 before transfer is recognized, and the transfer direction is confirmed. The vertical position of the first container 2 is adjusted so that the relative positions of the containers 2 and 3 and the intermediate stage 51 in the vertical direction have an optimal relationship with the confirmed transfer direction. The adjustment is performed by the mechanism 53, and the vertical position of the intermediate stage 51 is adjusted by the vertical position adjustment mechanism 51a. When transferring each wafer 9 from the first container 2 to the second container 3, the first container 2 is slightly higher than the intermediate stage 51 and the second container 3 is
Adjust so that it is slightly lower than 1.

After that, the first pushing arm 4
Each wafer 9 is extruded and transferred from the first container 2 to the second container 3. After transferring each wafer 9, each clamp mechanism 6a,
7a is released and each container 2, 3 is taken out.

The wafer used in the wafer transfer apparatus of the present invention may be a polycrystalline silicon semiconductor wafer having a metal electrode formed on one side used for a solar cell, or a silicon single crystal used for a semiconductor integrated circuit device. It may be a semiconductor wafer, the shape may be a disk shape,
The shape may be a square plate.

[0074]

In the wafer transfer apparatus according to the present invention,
Variations in the deformation of each wafer, the initial shape accuracy of each container, and the deformation of each container with respect to the transfer from the first container to the second container and the transfer from the second container to the first container. Can significantly reduce the transfer error of each wafer, and can reduce the damage of each wafer due to the transfer error.

Further, according to the present invention, the wafer transfer device can transfer each wafer smoothly by providing the intermediate stage, and can further reduce the transfer error of each wafer.

Further, according to the present invention, the wafer transfer device is provided with the intermediate stage so that the wafers can be vertically moved during the transfer of each wafer from the first container to the second container. Can be held and held.

Further, according to the present invention, the wafer transfer device can adjust the relative position of the first or second container and the intermediate stage in the vertical direction. During transfer of each wafer to the two containers, each wafer can be held at a position optimal for transfer, and each wafer can be transferred smoothly.

Further, in the wafer transfer device according to the present invention, since the inclination of each mounting plate of the intermediate stage can be adjusted, the holding position of each wafer with respect to each container can be adjusted.
Each wafer can be transferred smoothly.

Further, according to the present invention, since the intermediate stage can be moved up and down, the relative positions of the intermediate stage and the first and second housings in the vertical direction can be adjusted.

Further, according to the present invention, since the first container can be moved up and down, the relative position of the first container and the second container in the vertical direction can be adjusted.

Further, according to the present invention, since the second container can be moved up and down, the relative position of the first container and the second container in the vertical direction can be adjusted.

[Brief description of the drawings]

FIG. 1 is a schematic diagram of a wafer transfer apparatus 1 according to an embodiment of the present invention.

FIG. 2 is a schematic view of a wafer transfer apparatus 10 according to another embodiment of the present invention.

FIG. 3 is a schematic view of a wafer transfer device 40 according to still another embodiment of the present invention.

FIG. 4 is a schematic view of a wafer transfer apparatus 50 according to still another embodiment of the present invention.

FIG. 5 is a schematic view showing a conventional wafer transfer device 20.

FIG. 6 is a schematic view showing a conventional wafer transfer device 31.

[Explanation of symbols]

 1, 10, 40, 50 Wafer transfer device 2 First container 3 Second container 4 First pushing arm 5 Second pushing arm 6 First stage 7 Second stage 8, 41, 42, 53, 51a Vertical position Adjustment mechanism 9 Wafer 11, 44, 52 Mounting plate 12, 43, 51 Intermediate stage 12a Inclination adjustment mechanism

Claims (8)

[Claims] 1. A first container, in which a plurality of wafers are stored at predetermined intervals in the vertical direction, to a second container, in which the plurality of wafers are stored at predetermined intervals in the vertical direction.
A wafer transfer device for transferring a wafer by sliding the wafer, wherein a relative position in a vertical direction between the first container and the second container is adjustable. 2. An intermediate stage having a plurality of mounting plates for holding wafers at predetermined intervals in a vertical direction is provided between the first storage body and the second storage body. The wafer transfer device according to claim 1. 3. From a first container in which a plurality of wafers are stored at predetermined intervals in a vertical direction, to a second container in which the plurality of wafers are stored at predetermined intervals in a vertical direction.
In a wafer transfer device for transferring a wafer, an intermediate stage including a plurality of mounting plates for holding a wafer at predetermined intervals in a vertical direction is provided between the first container and the second container. A wafer transfer apparatus characterized by the above-mentioned. 4. The apparatus according to claim 3, wherein the relative positions of the first container and the intermediate stage or the intermediate stage and the second container in the vertical direction can be adjusted.
A wafer transfer device as described in the above. 5. The wafer transfer device according to claim 2, wherein the inclination of each mounting plate of the intermediate stage is adjustable. 6. The wafer transfer apparatus according to claim 2, further comprising a vertical position adjusting mechanism for raising and lowering the intermediate stage. 7. The wafer transfer device according to claim 1, further comprising a vertical position adjusting mechanism for raising and lowering the first container. 8. The wafer transfer apparatus according to claim 1, further comprising a vertical position adjusting mechanism for raising and lowering the second container.