CN216673390U - Prevent static multilayer HDI high density circuit board - Google Patents
Prevent static multilayer HDI high density circuit board Download PDFInfo
- Publication number
- CN216673390U CN216673390U CN202123043177.4U CN202123043177U CN216673390U CN 216673390 U CN216673390 U CN 216673390U CN 202123043177 U CN202123043177 U CN 202123043177U CN 216673390 U CN216673390 U CN 216673390U
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- China
- Prior art keywords
- circuit board
- copper
- protection frame
- wall
- protective frame
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- 230000003068 static effect Effects 0.000 title claims abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 30
- 229910052802 copper Inorganic materials 0.000 claims abstract description 29
- 239000010949 copper Substances 0.000 claims abstract description 29
- 230000000670 limiting effect Effects 0.000 claims description 23
- 230000001681 protective effect Effects 0.000 claims description 22
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000000741 silica gel Substances 0.000 claims description 10
- 229910002027 silica gel Inorganic materials 0.000 claims description 10
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 238000009434 installation Methods 0.000 abstract 1
- 230000005611 electricity Effects 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 3
- 230000002829 reductive effect Effects 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000036961 partial effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an anti-static multilayer HDI high-density circuit board, which adopts the technical scheme that: including the circuit board, the fixed copper that is provided with on the circuit board covers, it is equipped with the protection frame to cover the copper edge, the protection frame matches with covering the copper shape, protection frame and circuit board fixed connection, protection frame inner wall fixedly connected with locating frame, the locating frame top is equipped with the clamp plate, the clamp plate matches with covering the copper shape, the square groove has been seted up to the protection frame inner wall, the through-hole has been seted up to the square groove inner wall, through-hole intercommunication square groove and protection frame outer wall, the protection frame lateral wall is equipped with spacing subassembly, the clamp plate is connected with the protection frame through spacing subassembly, an prevent static multilayer HDI high density circuit board beneficial effect is: through set up on the circuit board with cover the protection frame that the copper shape matches to installation clamp plate in the protection frame, can avoid covering the copper parcel, cover the copper and expose in humid environment, and then can significantly reduce GND covers the corrosion of copper, improved life.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an anti-static multilayer HDI high-density circuit board.
Background
A circuit board with high line distribution density by using a micro-blind buried hole technology, an HDI is a compact product specially designed for small-capacity users, under the premise that electronic products tend to have multiple functions and complexity, the contact distance of integrated circuit components is reduced, the signal transmission speed is relatively increased, the number of connecting wires is increased, the length of wiring among the points is locally shortened, these needs to be achieved by applying high density circuit configuration and micro-porous technology, the current multilayer HDI high density circuit board is vulnerable to static electricity, which firstly tends to adsorb dust, if the adsorbed dust particles are large, the electronic product is easily scrapped, secondly, electrostatic discharge can cause breakdown damage of electronic devices, electric charges accumulated on the circuit board generate paying-off when conductors approach, the service life of electronic components is shortened after the electronic components are attacked by static electricity, and in addition, the static electricity can also generate electronic interference. The existing HDI circuit board is generally provided with GND representing ground or 0 line, which is not a true ground but a ground assumed for application, and for a power supply, it is a negative pole of the power supply and is connected with the ground through a lead, so as to prevent the circuit board from being damaged by static electricity.
Most of the existing circuits are designed with GND, copper is coated on a large area of a circuit board, and the copper is easy to corrode and damage due to contact with moisture in the air, so that grounding of the GND is influenced, and further protection is needed.
Disclosure of Invention
Therefore, the utility model provides an anti-static multilayer HDI high-density circuit board, which is characterized in that a protective frame matched with a copper-clad shape is arranged on a circuit board, and a pressing plate is arranged in the protective frame, so that the copper-clad can be wrapped, the copper-clad can be prevented from being exposed in a humid environment, the corrosion of GND copper-clad can be greatly reduced, the service life is prolonged, and the problems that when most of conventional circuits are designed to GND, the circuit board is coated with large area of copper, the copper-clad is easy to corrode and damage due to the contact with moisture in the air, the grounding of the GND is influenced, and the grounding of the GND is required to be further protected are solved.
In order to achieve the above purpose, the utility model provides the following technical scheme: the utility model provides a prevent static multilayer HDI high density circuit board, includes the circuit board, the fixed copper that is provided with on the circuit board covers, it is equipped with the protection frame to cover the copper edge, the protection frame matches with covering the copper shape, protection frame and circuit board fixed connection, protection frame inner wall fixedly connected with locating frame, the locating frame top is equipped with the clamp plate, the clamp plate matches with covering the copper shape, the square groove has been seted up to the protection frame inner wall, the through-hole has been seted up to the square groove inner wall, through-hole intercommunication square groove and protection frame outer wall, the protection frame lateral wall is equipped with spacing subassembly, the clamp plate is connected with the protection frame through spacing subassembly.
Preferably, the limiting assembly comprises a sleeve, the sleeve corresponds to the through hole and is fixedly connected with the outer wall of the protective frame, a bolt is arranged on the sleeve and penetrates through the sleeve and is movably connected with the sleeve, and one end of the bolt extends into the square groove and is provided with a limiting block.
Preferably, the limiting block is provided with a threaded hole, and the limiting block is in threaded connection with the bolt through the threaded hole.
Preferably, one side of the limiting block, which is close to the pressure plate, is provided with a cambered surface, and the cambered surface is tightly attached to the edge of the pressure plate.
Preferably, the bottom of the pressing plate is fixedly connected with a heat-conducting silica gel pad, and the heat-conducting silica gel pad is tightly attached to the surface of the copper coating.
Preferably, the top surface of the pressure plate is fixedly connected with uniformly distributed radiating fins.
Preferably, the top surface of the positioning frame is fixedly connected with a rubber pad.
Preferably, the circuit board is fixedly connected with mounting holes at corners thereof.
The embodiment of the utility model has the following advantages:
1. the protection frame matched with the shape of the copper-clad layer is arranged on the circuit board, and the pressing plate is arranged in the protection frame, so that the copper-clad layer can be wrapped, the copper-clad layer is prevented from being exposed in a humid environment, the corrosion of the GND copper-clad layer can be greatly reduced, and the service life is prolonged;
2. through setting up spacing subassembly, make things convenient for the dismouting clamp plate, be favorable to covering copper to detect and overhaul, through setting up heat conduction silica gel pad and radiating fin, guaranteed the heat dispersion of covering copper.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. It should be apparent that the drawings in the following description are merely exemplary, and that other embodiments can be derived from the drawings provided by those of ordinary skill in the art without inventive effort.
The structures, ratios, sizes, and the like shown in the present specification are only used for matching with the contents disclosed in the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions that the present invention can be implemented, so that the present invention has no technical significance, and any structural modifications, changes in the ratio relationship, or adjustments of the sizes, without affecting the effects and the achievable by the present invention, should still fall within the range that the technical contents disclosed in the present invention can cover.
FIG. 1 is a schematic view of the overall structure provided by the present invention;
FIG. 2 is a partial cross-sectional view of the present invention;
FIG. 3 is an enlarged view of the portion A of FIG. 2 according to the present invention;
fig. 4 is an exploded view of the structure provided by the present invention.
In the figure: the heat-conducting and heat-dissipating double-layer circuit board comprises a circuit board 1, copper-clad layers 2, a protective frame 3, a positioning frame 4, a pressing plate 5, a square groove 6, a through hole 7, a sleeve 8, a bolt 9, a limiting block 10, a threaded hole 11, a heat-conducting silica gel pad 12, a heat-dissipating fin 13, a rubber pad 14 and a mounting hole 15.
Detailed Description
The present invention is described in terms of particular embodiments, other advantages and features of the utility model will become apparent to those skilled in the art from the following disclosure, and it is to be understood that the described embodiments are merely exemplary of the utility model and that it is not intended to limit the utility model to the particular embodiments disclosed. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.
Referring to the attached drawings 1-4, the anti-static multilayer HDI high-density circuit board provided by the utility model comprises a circuit board 1, wherein copper-clad 2 is fixedly arranged on the circuit board 1, a protective frame 3 is arranged at the edge of the copper-clad 2, the protective frame 3 is matched with the shape of the copper-clad 2, the protective frame 3 is fixedly connected with the circuit board 1, a positioning frame 4 is fixedly connected with the inner wall of the protective frame 3, a pressing plate 5 is arranged at the top of the positioning frame 4, the pressing plate 5 is matched with the shape of the copper-clad 2, a square groove 6 is arranged on the inner wall of the protective frame 3, a through hole 7 is arranged on the inner wall of the square groove 6, the through hole 7 is communicated with the square groove 6 and the outer wall of the protective frame 3, a limiting assembly is arranged on the side wall of the protective frame 3, and the pressing plate 5 is connected with the protective frame 3 through the limiting assembly;
in the embodiment, the edge of the pressing plate 5 is tightly attached to the top surface of the positioning frame 4, and the copper-clad plate 2 is completely wrapped by matching with the limiting frame, so that the copper-clad plate 2 is prevented from contacting with water vapor in the air, the copper-clad plate 2 is prevented from being corroded and damaged due to the contact with the water vapor, and the service life of the copper-clad plate 2 is prolonged;
wherein, in order to realize carrying out the purpose of dismouting to clamp plate 5, this device adopts following technical scheme to realize: the limiting component comprises a sleeve 8, the sleeve 8 corresponds to the through hole 7 and is fixedly connected with the outer wall of the protective frame 3, a bolt 9 is arranged on the sleeve 8, the bolt 9 penetrates through the sleeve 8 and is movably connected with the sleeve 8, one end of the bolt 9 extends into the square groove 6 and is provided with a limiting block 10, a threaded hole 11 is arranged on the limiting block 10, the limiting block 10 is in threaded connection with the bolt 9 through the threaded hole 11, one side of the limiting block 10, which is close to the pressing plate 5, is provided with a cambered surface, and the cambered surface is tightly attached to the edge of the pressing plate 5, the bolt 9 is movably connected with the sleeve 8 through a bearing, the shape of the limited block 10 is matched with the square groove 6, the pressing plate 5 can be fixed through the extrusion force of the cambered surface on the limiting block 10 to the edge of the pressing plate 5, the limiting block 10 can be driven to move along the square groove 6 when the bolt 9 is rotated, the fixation can be released, and the copper clad 2 can be conveniently detected and overhauled by disassembling the pressing plate 5;
wherein, in order to realize radiating purpose, this device adopts following technical scheme to realize: the bottom of the pressing plate 5 is fixedly connected with a heat-conducting silica gel pad 12, the heat-conducting silica gel pad 12 is tightly attached to the surface of the copper-clad plate 2, the top surface of the pressing plate 5 is fixedly connected with radiating fins 13 which are uniformly distributed, and the heat-conducting silica gel pad 12 is tightly attached to the surface of the copper-clad plate 2, so that the heat-conducting efficiency can be improved, the heat of the copper-clad plate 2 is quickly conducted to the pressing plate 5 and the radiating fins 13, and further the heat dissipation is realized;
wherein, in order to realize the purpose of improving the edge sealing performance of the pressure plate 5, the device adopts the following technical scheme: the top surface of the positioning frame 4 is fixedly connected with a rubber pad 14, and the pressing plate 5 is tightly attached to the rubber pad 14 when being installed, so that the sealing performance is good;
wherein, in order to realize the purpose of installing the circuit board 1, the device adopts the following technical scheme to realize: the circuit board 1 is fixedly connected with mounting holes 15 at the corners.
The using process of the utility model is as follows: when the copper-clad plate is used, the edge of the pressing plate 5 is tightly attached to the rubber pad 14 on the top surface of the positioning frame 4 in an initial state, so that the copper clad 2 is completely wrapped, the copper clad 2 is prevented from being contacted with water vapor in the air, meanwhile, the heat-conducting silica gel pad 12 at the bottom of the pressing plate 5 is tightly attached to the copper clad 2, the heat of the copper clad 2 can be conducted to the pressing plate 5, and then the heat dissipation is realized by the heat dissipation fins 13 at the top of the pressing plate 5;
if need detect covering copper 2, use screwdriver rotating bolt 9, bolt 9 can drive stopper 10 when rotating and remove to 6 insides in square groove, and then remove the fixed to 5 edges of clamp plate, can hand the fin and take out clamp plate 5, and then can detect covering copper 2, after maintenance work, place clamp plate 5 again on locating frame 4 earlier, rotating bolt 9 again, bolt 9 rotates and can drive stopper 10 and remove to 6 outsides in square groove, remove 5 edges of cambered surface contact clamp plate 5 on the in- process stopper 10 and 5 edges of extrusion clamp plate, can carry on spacingly to 5 edges of clamp plate with this.
The above description is only a preferred embodiment of the present invention, and any person skilled in the art may modify the present invention or modify it into an equivalent technical solution by using the technical solution described above. Therefore, any simple modifications or equivalent substitutions made in accordance with the technical solution of the present invention are within the scope of the claims of the present invention.
Claims (8)
1. The utility model provides an prevent static multilayer HDI high density circuit board, includes circuit board (1), its characterized in that: the copper-clad plate is characterized in that a copper (2) is fixedly arranged on the circuit board (1), a protective frame (3) is arranged at the edge of the copper (2), the protective frame (3) is matched with the shape of the copper (2) in a covering mode, the protective frame (3) is fixedly connected with the circuit board (1), a positioning frame (4) is fixedly connected with the inner wall of the protective frame (3), a pressing plate (5) is arranged at the top of the positioning frame (4), the pressing plate (5) is matched with the shape of the copper (2) in a covering mode, a square groove (6) is formed in the inner wall of the protective frame (3), a through hole (7) is formed in the inner wall of the square groove (6), the through hole (7) is communicated with the square groove (6) and the outer wall of the protective frame (3), a limiting assembly is arranged on the side wall of the protective frame (3), and the pressing plate (5) is connected with the protective frame (3) through the limiting assembly.
2. The anti-static multilayer HDI high-density circuit board according to claim 1, wherein: the limiting assembly comprises a sleeve (8), the sleeve (8) corresponds to the through hole (7) in position and is fixedly connected with the outer wall of the protective frame (3), a bolt (9) is arranged on the sleeve (8), the bolt (9) penetrates through the sleeve (8) and is movably connected with the sleeve (8), and one end of the bolt (9) extends to the inside of the square groove (6) and is provided with a limiting block (10).
3. The anti-static multilayer HDI high-density circuit board of claim 2, characterized in that: the limiting block (10) is provided with a threaded hole (11), and the limiting block (10) is in threaded connection with the bolt (9) through the threaded hole (11).
4. The anti-static multilayer HDI high-density circuit board according to claim 2, wherein: and one side of the limiting block (10) close to the pressure plate (5) is provided with a cambered surface, and the cambered surface is tightly attached to the edge of the pressure plate (5).
5. The anti-static multilayer HDI high-density circuit board according to claim 1, wherein: the bottom of the pressing plate (5) is fixedly connected with a heat-conducting silica gel pad (12), and the heat-conducting silica gel pad (12) is tightly attached to the surface of the copper-clad plate (2).
6. The anti-static multilayer HDI high-density circuit board according to claim 1, wherein: the top surface of the pressing plate (5) is fixedly connected with radiating fins (13) which are uniformly distributed.
7. The anti-static multilayer HDI high-density circuit board according to claim 1, wherein: the top surface of the positioning frame (4) is fixedly connected with a rubber pad (14).
8. The anti-static multilayer HDI high-density circuit board according to claim 1, wherein: the corner of the circuit board (1) is fixedly connected with a mounting hole (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123043177.4U CN216673390U (en) | 2021-12-06 | 2021-12-06 | Prevent static multilayer HDI high density circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123043177.4U CN216673390U (en) | 2021-12-06 | 2021-12-06 | Prevent static multilayer HDI high density circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216673390U true CN216673390U (en) | 2022-06-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123043177.4U Active CN216673390U (en) | 2021-12-06 | 2021-12-06 | Prevent static multilayer HDI high density circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216673390U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763396A (en) * | 2022-11-03 | 2023-03-07 | 江苏东海半导体股份有限公司 | Anti-static IGBT module |
-
2021
- 2021-12-06 CN CN202123043177.4U patent/CN216673390U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115763396A (en) * | 2022-11-03 | 2023-03-07 | 江苏东海半导体股份有限公司 | Anti-static IGBT module |
| CN115763396B (en) * | 2022-11-03 | 2024-02-02 | 江苏东海半导体股份有限公司 | Antistatic IGBT module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240321 Address after: No. 1, Group 12, Suhe Village, Xiejiang Town, Longhui County, Shaoyang City, Hunan Province, 422202 Patentee after: Chen Lifang Country or region after: Zhong Guo Address before: 215000 No. 8, Nanwan Road, Qiandeng Town, Suzhou City, Jiangsu Province Patentee before: Kunshan Qiandeng electromechanical circuit board factory Country or region before: Zhong Guo |
|
| TR01 | Transfer of patent right |