CN215529697U - Vacuum soaking plate - Google Patents
Vacuum soaking plate Download PDFInfo
- Publication number
- CN215529697U CN215529697U CN202121491184.8U CN202121491184U CN215529697U CN 215529697 U CN215529697 U CN 215529697U CN 202121491184 U CN202121491184 U CN 202121491184U CN 215529697 U CN215529697 U CN 215529697U
- Authority
- CN
- China
- Prior art keywords
- capillary structure
- heat dissipation
- heat
- hollow cylindrical
- cylindrical section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000002791 soaking Methods 0.000 title claims abstract description 28
- 230000017525 heat dissipation Effects 0.000 claims abstract description 82
- 230000008859 change Effects 0.000 claims abstract description 4
- 239000007788 liquid Substances 0.000 abstract description 40
- 238000010521 absorption reaction Methods 0.000 abstract description 34
- 230000000694 effects Effects 0.000 abstract description 7
- 238000006243 chemical reaction Methods 0.000 abstract description 6
- 230000005540 biological transmission Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 17
- 230000008569 process Effects 0.000 description 16
- 238000001816 cooling Methods 0.000 description 13
- 239000012071 phase Substances 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a vacuum soaking plate which comprises a heat absorption assembly, a heat dissipation assembly and a capillary structure; the heat absorption assembly is internally hollow to form a hollow cavity used for filling a phase change working medium, one end of the heat dissipation assembly is connected to the heat absorption assembly, a heat dissipation channel communicated with the hollow cavity is formed in the heat dissipation assembly, a first capillary structure is formed on the inner wall surface of the heat dissipation channel, a second capillary structure is formed on the wall surface of one side, far away from the heat dissipation channel, in the hollow cavity, the capillary structure is arranged in the hollow cavity, and the two opposite ends of the capillary structure are directly or indirectly connected with the first capillary structure and the second capillary structure respectively. Compared with the mode that the liquid working medium directly enters the second capillary structure, the liquid working medium flows out of the heat dissipation assembly and enters the capillary structure through the first capillary structure, the flow resistance can be reduced, the transmission performance is improved, the gas-liquid conversion rate of the working medium is increased, and the heat dissipation effect of the vacuum vapor chamber is improved.
Description
Technical Field
The utility model relates to the technical field of electronic heat dissipation equipment, in particular to a vacuum vapor chamber.
Background
The existing 3D vacuum vapor chamber is generally provided with a heat pipe on the surface of a heat dissipation plate of a 2D vacuum vapor chamber, the heat pipe is a heat dissipation assembly with a capillary structure, and the distance from the liquefied working medium to the surface of the heat source through the capillary structure of the heat pipe is longer, so that the flow resistance in the working medium flowing process is increased, and the heat dissipation efficiency is influenced.
In summary, how to improve the heat dissipation efficiency of the vacuum soaking plate is a problem to be solved urgently by those skilled in the art.
SUMMERY OF THE UTILITY MODEL
In view of this, the present invention provides a vacuum vapor chamber, which can shorten the back flow distance of the liquefied working medium flowing out of the heat dissipation assembly, reduce the flow resistance in the process, and improve the efficiency of working medium circulation, thereby improving the heat dissipation effect.
In order to achieve the above purpose, the utility model provides the following technical scheme:
a vacuum soaking plate comprises a heat absorption component, a heat dissipation component and a capillary structure;
the heat absorption assembly is characterized in that a hollow cavity used for filling a phase change working medium is formed in the heat absorption assembly, one end of the heat dissipation assembly is connected to the heat absorption assembly, a heat dissipation channel communicated with the hollow cavity is formed in the heat dissipation assembly, a first capillary structure is formed on the inner wall face of the heat dissipation channel, the hollow cavity is internally kept away from the wall face on one side of the heat dissipation channel, a second capillary structure is formed on the wall face on one side of the heat dissipation channel, the capillary structure is arranged in the hollow cavity, and the two opposite ends of the capillary structure are directly or indirectly connected with the first capillary structure and the second capillary structure respectively.
Preferably, the heat absorbing assembly comprises a first plate body and a second plate body, the first plate body covers the second plate body to form the hollow cavity, the heat radiating assembly is connected to the first plate body, and the second capillary structure is arranged on the second plate body.
Preferably, the inner surface of the first plate body opposite to the inner surface of the second plate body is provided with a third capillary structure, and the third capillary structure is connected with the second capillary structure.
Preferably, the capillary structure is a hollow cylindrical structure.
Preferably, the central axis of the hollow cylindrical structure is collinear with or parallel to the central axis of the heat dissipation assembly.
Preferably, the capillary structure includes a first hollow cylindrical section connected to the first capillary structure and a second hollow cylindrical section connected to the second capillary structure, and an outer diameter of the second hollow cylindrical section is greater than an outer diameter of the first hollow cylindrical section.
Preferably, the capillary structure further includes a third hollow cylindrical section, the third hollow cylindrical section is connected between the first hollow cylindrical section and the second hollow cylindrical section, and an outer diameter of the third hollow cylindrical section is larger than an outer diameter of the first hollow cylindrical section and smaller than an outer diameter of the second hollow cylindrical section.
Preferably, the side surface of the capillary structure has a groove that penetrates the capillary structure in the height direction thereof.
Preferably, the number of the grooves is multiple, and the multiple grooves are uniformly distributed along the circumferential direction of the capillary structure.
Preferably, the heat dissipation component is a heat pipe or a groove flat pipe.
In the process of using the vacuum soaking plate provided by the utility model, the working medium is heated by the heat absorption assembly and then vaporized, the gaseous working medium enters the heat dissipation channel of the heat dissipation assembly from the lower part of the heat dissipation assembly, rises and liquefies in the heat dissipation assembly, the heat is released in the process of liquefying the working medium to form a liquid working medium, the liquid working medium flows downwards under the action of gravity, at least part of the liquid working medium enters the capillary structure through the first capillary structure in the flowing-out process, and enters the second capillary structure through the capillary structure until the liquid working medium is contacted with or flows to a position close to the heat absorption assembly, the liquid working medium is vaporized and absorbs heat due to the higher temperature of the heat absorption assembly, the vaporized gaseous working medium enters the heat dissipation assembly again, and the steps are repeated, so that the conversion and the circulation of the gas phase and the liquid phase of the working medium are realized.
Compared with the prior art, the liquid working medium is vaporized by the heat absorption assembly, heat exchange is carried out between the liquid working medium and an external cooling system through the heat dissipation channel of the heat dissipation assembly, after the liquid working medium is condensed into the liquid working medium, the liquid working medium directly flows back to the second capillary structure of the heat absorption assembly through the first capillary structure and the capillary structural part inside the heat dissipation assembly, the backflow distance is shortened compared with the situation that the capillary structure in the heat dissipation plate of the vapor chamber plate flows back to the heat absorption bottom surface all around, the contact area of the capillary structure of the heat absorption assembly is increased, the flow resistance can be reduced, the transmission performance is improved, the gas-liquid conversion rate of the working medium is increased, and the heat dissipation effect of the vacuum vapor chamber plate is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.
FIG. 1 is a schematic top view of a vacuum soaking plate according to the present invention;
FIG. 2 is a schematic side view of the vacuum soaking plate of FIG. 1;
FIG. 3 is a schematic cross-sectional view taken along the line A-A in FIG. 1;
FIG. 4 is a schematic top view of a first embodiment of a capillary structure according to the present invention;
FIG. 5 is a schematic cross-sectional view taken along line C-C of FIG. 4;
FIG. 6 is a schematic top view of a second embodiment of a capillary structure according to the present invention;
FIG. 7 is a schematic cross-sectional view taken along line B-B of FIG. 6;
FIG. 8 is a side view of the capillary structure of FIG. 6;
fig. 9 is a schematic cross-sectional structure view of a specific embodiment of a groove flat tube provided in the present invention;
fig. 10 is a partially enlarged view of portion F in fig. 9.
In FIGS. 1-10:
the heat pipe comprises a first plate body 1, a third capillary structure 2, a heat pipe 3, a first capillary structure 31, a capillary structure 4, a groove 41, a first hollow cylindrical section 42, a third hollow cylindrical section 43, a second hollow cylindrical section 44, a hollow cavity 5, a second plate body 6, a groove flat pipe 7 and a micro-groove 71.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The core of the utility model is to provide a vacuum soaking plate which can shorten the backflow distance of the liquefied working medium, reduce the flow resistance in the process and improve the efficiency of working medium circulation, thereby improving the heat dissipation effect.
Referring to fig. 1 to 10, fig. 1 is a schematic top view of a vacuum soaking plate according to the present invention; FIG. 2 is a schematic side view of the vacuum soaking plate of FIG. 1; FIG. 3 is a schematic cross-sectional view taken along the line A-A in FIG. 1; FIG. 4 is a schematic top view of a first embodiment of a capillary structure according to the present invention; FIG. 5 is a schematic cross-sectional view taken along line C-C of FIG. 4; FIG. 6 is a schematic top view of a second embodiment of a capillary structure according to the present invention; FIG. 7 is a schematic cross-sectional view taken along line B-B of FIG. 6; FIG. 8 is a side view of the capillary structure of FIG. 6; fig. 9 is a schematic cross-sectional structure view of a specific embodiment of a groove flat tube provided in the present invention; fig. 10 is a partially enlarged view of portion F in fig. 9.
The specific embodiment provides a vacuum soaking plate, which comprises a heat absorbing component 1, a heat radiating component and a capillary structural component 4; the heat absorption assembly is internally hollow to form a hollow cavity 5 used for filling a phase change working medium, one end of the heat dissipation assembly is connected to the heat absorption assembly, a heat dissipation channel communicated with the hollow cavity is formed in the heat dissipation assembly, a first capillary structure 31 is formed on the inner wall surface of the heat dissipation channel, a second capillary structure is formed on the wall surface of one side, far away from the heat dissipation channel, of the hollow cavity 5, the capillary structure 4 is arranged in the hollow cavity, and the two opposite ends of the capillary structure 4 are directly or indirectly connected with the first capillary structure 31 and the second capillary structure respectively.
It should be noted that the vacuum soaking plate mentioned in this embodiment includes a heat absorbing assembly 1, a heat dissipating assembly and a capillary structure 4, the vacuum soaking plate may have a cavity structure or other structural forms, the heat absorbing assembly 1 may have a plate structure or other shapes, the heat absorbing assembly 1 may be separately disposed on one side, the heat dissipating assembly may be disposed on the other side, the heat absorbing assembly 1 may also include a plurality of heating plates, different heating plates are disposed at different positions, the heat dissipating assembly includes a plurality of heat dissipating plates, and different heat dissipating plates are disposed at different positions, which is specifically determined according to actual conditions.
The two opposite ends of the capillary structure 4 are respectively connected with the first capillary structure 31 and the second capillary structure directly or indirectly, that is, the two opposite ends of the capillary structure 4 are respectively connected with the first capillary structure 31 and the second capillary structure, or that one end of the capillary structure 4 is not directly connected with the first capillary structure 31, and in the using process, the liquid working medium in the first capillary structure 31 can flow to the capillary structure 4 through other media; or one end of the capillary structure 4 is not directly connected with the second capillary structure, and in the using process, the liquid working medium in the capillary structure can flow to the second capillary structure through other media.
It should be noted that one end of the capillary structure 4 is in contact with the heat absorbing assembly 1, the lower end of the capillary structure 4 is in contact with the heat absorbing assembly 1, the right end of the capillary structure 4 is in contact with the heat absorbing assembly 1, or other positions of the capillary structure 4 are in contact with the heat absorbing assembly, which is not described herein again.
It should be noted that, a heat dissipation plate may be disposed on the heat dissipation side of the vacuum soaking plate, the heat dissipation assembly is disposed on the heat dissipation plate, the number of the heat dissipation assemblies disposed in the heat dissipation plate needs to be determined according to actual conditions, in order to avoid loss of the working medium, the heat absorption assembly 1 and the heat dissipation plate form a sealed housing structure, as shown in fig. 2, the heat absorption assembly 1 is generally disposed on the lower portion, and the heat dissipation plate is disposed on the upper portion, of course, the upper portion and the lower portion mentioned in this embodiment are defined according to the placement angle in fig. 2, and after the placement angle and the position of the vacuum soaking plate are changed, the adjustment may be performed according to actual conditions.
In the process of using the vacuum vapor chamber provided by the embodiment, the working medium is heated by the heat absorption assembly 1 and then vaporized, the gaseous working medium enters the heat dissipation assembly from the lower part of the heat dissipation assembly and rises in the heat dissipation assembly, when encountering the cooling structure, the gaseous working medium is liquefied and releases heat to form a liquid working medium, the liquid working medium flows out from the first capillary structure 31 under the action of gravity or capillary force, in the process of flowing out, at least part of the liquid working medium enters the capillary structure 4 through the first capillary structure 31 and enters the second capillary structure through the capillary structure 4 until contacting with or flowing to a position close to the heat absorption assembly, because the temperature of the heat absorption assembly 1 is higher, the liquid working medium is vaporized and absorbs heat, the vaporized gaseous working medium enters the heat dissipation assembly again, and the steps are repeated, so that the working medium gas, the vapor gas and the vapor are generated by the working medium, Liquid-two phase conversion and circulation.
It should be noted that, because the temperature of the heat absorbing assembly 1 is higher, when the liquid working medium is in the hollow chamber 5, the hollow chamber 5 is a chamber surrounded by the heat absorbing assembly 1 and the plate on the heat dissipation side in the vacuum soaking plate, and can also be heated and vaporized, but the closer to the position of the heat absorbing assembly 1, the faster the vaporization speed is.
Compared with the prior art, the liquid working medium in the embodiment is vaporized by the heat absorption assembly 1, heat exchange is carried out between the liquid working medium and an external cooling system through the heat dissipation channel of the heat dissipation assembly, the liquid working medium is condensed into the liquid working medium and then directly flows back to the second capillary structure of the heat absorption assembly 1 through the first capillary structure 31 and the capillary structure 4 inside the heat dissipation assembly, compared with the case that the capillary structure in the heat dissipation plate of the vapor chamber plate flows back to the heat absorption bottom surface all around, the backflow distance is shortened, the contact area of the capillary structure of the heat absorption assembly is increased, the flow resistance can be reduced, the transmission performance is improved, the gas-liquid conversion rate of the working medium is increased, and the heat dissipation effect of the vacuum vapor chamber plate is improved.
Preferably, the first capillary structure 31 may be at least partially in contact with the capillary structure 4, and the liquid working medium flowing out from the first capillary structure 31 may directly flow into the capillary structure 4; here, the upper end of the capillary structure 4 may be in contact with the first capillary structure 31, or other portions of the capillary structure 4 may be in contact with the first capillary structure 31, which is determined according to actual conditions.
On the basis of the above embodiment, the first capillary structure 31 may be disposed in the heat dissipation assembly, and the capillary structure 4 is in contact with at least a part of the first capillary structure 31, so that the flowing rate of the liquid working medium may be increased under the action of capillary force.
In order to further improve the gas-liquid conversion rate of the working medium, the capillary structure 4 can completely cover the first capillary structure 31 in the heat dissipation assembly, the projection of the first capillary structure 31 to the capillary structure 4 is completely positioned in the capillary structure 4, that is, the size of the upper end surface of the capillary structure 4 is larger than or equal to the size of the lower surface of the heat dissipation assembly, and all the liquid working medium flowing out of the first capillary structure 31 enters the capillary structure 4; and the influence of partial liquid working medium on the heat dissipation efficiency due to the fact that the partial liquid working medium enters the capillary structure of the heat dissipation plate is avoided.
The capillary structure 4 can be a hollow columnar structure, the upper end face of the hollow columnar structure is in contact with the lower surface of the heat dissipation assembly, and the lower end face of the hollow columnar structure is in contact with the heat absorption assembly 1.
In the using process, the gaseous working medium can enter the first capillary structure 31 in the heat dissipation assembly from the hollow area of the hollow columnar structure, and the cooling structure is arranged on the upper part of the heat dissipation assembly and close to the outer wall surface, so that the cooled liquid working medium can flow out along the capillary structure on the outer side of the heat dissipation assembly relatively. The cooling structure disposed on the upper portion of the heat dissipation assembly in this embodiment means that the cooling structure is located on the upper portion of the heat dissipation assembly in the height direction, so that the gaseous working medium enters the heat dissipation assembly and rises for a distance before being vaporized.
Preferably, the central axis of the hollow cylindrical structure and the central axis of the heat dissipation assembly can be arranged in a collinear manner, and the central axis of the hollow cylindrical structure and the central axis of the heat dissipation assembly can also be arranged in a parallel manner, so that the effective air intake efficiency is improved.
The capillary structure 4 may also be provided as a segmented structure, and includes a first hollow cylindrical section 42 in contact with the lower surface of the heat sink assembly and a second hollow cylindrical section 44 in contact with the heat sink assembly 1, and the outer diameter of the second hollow cylindrical section 44 is larger than that of the first hollow cylindrical section 42.
In the using process, because the outer diameter of the second hollow cylindrical section 44 is larger than that of the first hollow cylindrical section 42, the contact area between the capillary structure 4 and the heat absorption assembly 1 can be increased, and the vaporization efficiency of the liquid working medium is further improved.
It should be noted that one or more stepped cylindrical sections may be further disposed between the first hollow cylindrical section 42 and the second hollow cylindrical section 44, which is determined according to actual situations. For example, a third hollow cylindrical section 43 may be provided between the first hollow cylindrical section 42 and the second hollow cylindrical section 44, and the outer diameter of the third hollow cylindrical section 43 is larger than the outer diameter of the first hollow cylindrical section 42 and smaller than the outer diameter of the second hollow cylindrical section 44. Preferably, the centers of the first hollow cylindrical section 42, the second hollow cylindrical section 44 and the third hollow cylindrical section 43 may axially coincide.
Of course, the capillary structure 4 may be in other shapes and structures, and is not necessarily a cylindrical section.
On the basis of the above embodiment, at least one groove 41 may be disposed on the side surface of the capillary structure 4, and the groove 41 penetrates the capillary structure 4 in the height direction, so that the contact surface between the capillary structure 4 and the heat sink assembly can be adjusted in size according to the position facing the heat source, and the first capillary structure 31 of the heat sink assembly is maximally contacted.
One or more grooves 41 may be formed in one side of the capillary structure 4, or the grooves 41 may be formed in a plurality of circumferential positions of the capillary structure 4, and the grooves 41 are uniformly distributed along the circumferential direction of the capillary structure 4, which is specifically determined according to actual conditions. As shown in fig. 5 to 7, a groove 41 is provided, and the groove 41 penetrates the capillary structure 4 in the height direction thereof.
In the using process, the arrangement of the groove 41 can enable the gaseous working medium to enter the heat dissipation assembly from the groove 41, the air inlet area is increased, the gaseous working medium in the hollow cavity 5 can enter the heat dissipation assembly from the groove 41, and therefore the temperature equalization effect is improved.
Preferably, the capillary structure 4 is a hollow capillary structure, and the groove 41 communicates with the hollow area.
In order to further improve the cooling effect of the gaseous working medium after entering the heat dissipation assembly, the cooling structure can be designed in a bending mode, the cooling area is increased, the liquefaction efficiency is improved, and further the heat dissipation efficiency is improved.
It should be noted that the heat dissipation component may be a heat pipe 3, the heat pipe 3 is a circular pipe or a flat pipe, or may be a groove flat pipe 7, which is determined according to the actual situation; as shown in fig. 9 and 10, a plurality of micro grooves 71 are arranged inside the groove flat tube 7, and in the using process, the contact area between the gaseous working medium and the heat dissipation assembly can be increased by the arrangement of the micro grooves 71, so that the liquefaction efficiency is improved.
In another embodiment, as shown in fig. 2, the vacuum soaking plate generally comprises a heat absorbing assembly 1, a heat dissipating plate and a heat pipe 3 disposed on the heat dissipating plate, the heat dissipating plate is provided with a third capillary structure 2 connected with the heat absorbing assembly 1, the heat absorbing assembly 1 and the heat dissipating plate are enclosed to form a shell structure with a hollow chamber 5, and the heat pipe 3 is provided with a first capillary structure 31 and a cooling structure therein; of course, the vacuum soaking plate can also be in other structural forms, which are not described in detail herein.
Specifically, the vacuum soaking plate is a 3D special-shaped vacuum soaking plate, the capillary structure 4 is a hollow structure with steps, and the upper end surface of the capillary structure 4 is in contact with the first capillary structure 31 in part of the heat pipe 3. In the process that the liquid working medium liquefied by the cooling structure in the heat pipe 3 flows out along the first capillary structure 31, the liquid working medium positioned on the outer ring of the heat pipe 3 enters the third capillary structure 2, the rest liquid working medium enters the capillary structure 4, the liquid working medium entering the capillary structure 4 flows in the direction of the heat absorption assembly 1 in the capillary structure 4 and is vaporized in the flowing process or after reaching the heat absorption assembly 1, the liquid working medium entering the third capillary structure 2 flows in the direction of the heat absorption assembly 1 along the third capillary structure 2 and is vaporized at the position close to the heat absorption assembly 1 or after reaching the heat absorption assembly 1. Most of the vaporized gaseous working medium is transmitted to the third capillary structure 2, flows to the cooling structure of the heat pipe 3 through the third capillary structure 2, and the condensed liquid working medium flows back to the heat absorption assembly 1; and the other part of the vaporized gaseous working medium enters the heat pipe 3 from the hollow area of the capillary structure 4, is condensed in the cooling structure in the heat pipe 3, and flows back to the heat absorption assembly 1.
It should be noted that the first, second and third capillary structures 2 in the first capillary structure 31, the second capillary structure and the third capillary structure are mentioned in this document only for distinguishing the position differences and not for distinguishing the sequence.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. Any combination of all the embodiments provided by the present invention is within the scope of the present invention, and will not be described herein.
The vacuum soaking plate provided by the utility model is described in detail above. The principles and embodiments of the present invention are explained herein using specific examples, which are presented only to assist in understanding the method and its core concepts. It should be noted that, for those skilled in the art, it is possible to make various improvements and modifications to the present invention without departing from the principle of the present invention, and those improvements and modifications also fall within the scope of the claims of the present invention.
Claims (10)
1. A vacuum soaking plate is characterized by comprising a heat absorbing component, a heat radiating component and a capillary structure component (4);
the heat sink component is characterized in that the hollow cavity inside the heat sink component is formed into a hollow cavity (5) used for filling a phase change working medium, one end of the heat sink component is connected onto the heat sink component, a heat dissipation channel communicated with the hollow cavity (5) is formed in the heat dissipation component, a first capillary structure (31) is formed on the inner wall face of the heat dissipation channel, a second capillary structure is formed on the wall face of one side of the heat dissipation channel, the capillary structure (4) is arranged in the hollow cavity (5), and two opposite ends of the capillary structure (4) are respectively connected with the first capillary structure (31) and the second capillary structure directly or indirectly.
2. The vacuum vapor chamber according to claim 1, wherein the heat absorbing assembly comprises a first plate body (1) and a second plate body (6), the first plate body (1) covers the second plate body (6) to form the hollow chamber (5), the heat dissipating assembly is connected to the first plate body (1), and the second capillary structure is arranged on the second plate body (6).
3. Vacuum soaking plate according to claim 2, characterized in that the inner surface of the first plate body (1) opposite to the second plate body (6) is provided with a third capillary structure (2), and the third capillary structure (2) is connected with the second capillary structure.
4. Vacuum soaking plate according to any of claims 1-3, wherein the capillary structure (4) is a hollow cylindrical structure.
5. The vacuum vapor chamber of claim 4, wherein the central axis of the hollow cylindrical structure is collinear with or parallel to the central axis of the heat sink assembly.
6. The vacuum vapor chamber according to claim 4, wherein the capillary structure (4) comprises a first hollow cylindrical section (42) connected to the first capillary structure (31) and a second hollow cylindrical section (44) connected to the second capillary structure, and the second hollow cylindrical section (44) has an outer diameter larger than that of the first hollow cylindrical section (42).
7. The vacuum soaking plate according to claim 6, wherein the capillary structure (4) further comprises a third hollow cylindrical section (43), the third hollow cylindrical section (43) is connected between the first hollow cylindrical section (42) and the second hollow cylindrical section (44), and the outer diameter of the third hollow cylindrical section (43) is larger than the outer diameter of the first hollow cylindrical section (42) and smaller than the outer diameter of the second hollow cylindrical section (44).
8. Vacuum soaking plate according to any of claims 1-3, characterized in that the sides of the capillary structure (4) have grooves (41), which grooves (41) penetrate the capillary structure (4) in the height direction thereof.
9. The vacuum soaking plate according to claim 8, wherein the number of the grooves (41) is plural, and the plural grooves (41) are uniformly distributed along the circumferential direction of the capillary structure (4).
10. Vacuum vapor chamber according to any of claims 1 to 3, characterized in that the heat dissipating component is a heat pipe (3) or a grooved flat tube (7).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121491184.8U CN215529697U (en) | 2021-06-30 | 2021-06-30 | Vacuum soaking plate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202121491184.8U CN215529697U (en) | 2021-06-30 | 2021-06-30 | Vacuum soaking plate |
Publications (1)
Publication Number | Publication Date |
---|---|
CN215529697U true CN215529697U (en) | 2022-01-14 |
Family
ID=79811788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202121491184.8U Active CN215529697U (en) | 2021-06-30 | 2021-06-30 | Vacuum soaking plate |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN215529697U (en) |
-
2021
- 2021-06-30 CN CN202121491184.8U patent/CN215529697U/en active Active
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI776497B (en) | Three-dimensional heat dissipating device | |
CN110243217B (en) | Flat plate type loop heat pipe evaporator with enclosed liquid storage chamber | |
CN110006019B (en) | Suspended structure steam generator | |
CN113108633B (en) | Plate radiator, plate radiator and heat exchanger | |
CN106033749A (en) | Parallel type parallel-microchannel multi-chip radiator | |
CN112033197B (en) | Temperature equalizing plate and manufacturing method thereof | |
CN209930821U (en) | Liquid-cooled heat conduction block and water-cooled radiator | |
CN109819635B (en) | Heat dissipation device | |
CN114777540A (en) | Multistage V-shaped groove liquid absorption core thermal diode and processing method thereof | |
CN110943058B (en) | Heat radiator | |
CN215529697U (en) | Vacuum soaking plate | |
CN112492853B (en) | Liquid cavity heat dissipation device based on pool boiling heat dissipation | |
CN219761747U (en) | High-power radiator combining VC and pulsating heat pipe | |
WO2024178850A1 (en) | Heat dissipation device and industrial control device | |
TWI802373B (en) | Heat dissipation module | |
CN206177110U (en) | Vapor chamber | |
CN203642761U (en) | Super-thermal-conduction column | |
CN210349822U (en) | Electronic component cooling device | |
TW202238063A (en) | Heat dissipation module | |
CN221962190U (en) | Immersed radiator | |
CN219611552U (en) | Heat conduction mechanism for cooling generator | |
CN217719576U (en) | Three-dimensional flat pulsating heat pipe device for radiating and cooling high-power chip | |
CN210641242U (en) | Air conditioner and flat tube phase change heat dissipation control box thereof | |
CN219697410U (en) | Be used for generator refrigerated water course structure | |
CN219693935U (en) | VC combined radiator for heat exchanger or condenser |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant |