WO2024178850A1

WO2024178850A1 - Heat dissipation device and industrial control device

Info

Publication number: WO2024178850A1
Application number: PCT/CN2023/095132
Authority: WO
Inventors: 王能飞; 陶安发; 邓小池; 白一博
Original assignee: 苏州汇川控制技术有限公司
Priority date: 2023-02-28
Filing date: 2023-05-18
Publication date: 2024-09-06
Also published as: CN219577681U

Abstract

The present application relates to the technical field of power electronics. Disclosed are a heat dissipation device and an industrial control device. The heat dissipation device comprises an evaporator and a condenser, wherein the evaporator comprises an evaporation cold plate, a gas-collecting end cap and a liquid-collecting end cap; the gas-collecting end cap is internally provided with a gas-collecting groove, the liquid-collecting end cap is internally provided with a liquid-collecting groove, and the evaporation cold plate is internally provided with evaporation cavities, the top of each evaporation cavity being in communication with the gas-collecting groove, and the bottom of each evaporation cavity being in communication with the liquid-collecting groove; and the evaporation cavity is filled with a phase-change working medium, which enters the condenser after undergoing phase change for heat absorption in the evaporation cavity, and flows back to the evaporation cavity after undergoing phase change for heat release in the condenser.

Description

Cooling devices and industrial control devices

Related Applications

This application claims priority to Chinese patent application No. 202320336886.1 filed on February 28, 2023, the entire contents of which are incorporated by reference into this application.

Technical Field

The present application relates to the field of power electronics technology, and in particular to a heat dissipation device and an industrial control device.

Background Art

At present, in the power electronics industry, the main heat generating devices in industrial control devices such as frequency converters are high-power IGBTs (Insulated Gate Bipolar Transistors), rectifier bridges and other power devices. In existing equipment, a heat dissipation device based on aluminum profiles is generally used to cool high-power IGBTs, rectifier bridges and other power devices. The aluminum profile heat dissipation device includes a base and a heat sink arranged on the base, wherein the base is an aluminum base and a copper block is embedded in the aluminum base. In order to ensure a certain heat dissipation capacity, this type of heat dissipation device is usually large in size and occupies a large installation space.

Technical Solutions

The main purpose of the present application is to provide a heat dissipation device, aiming to reduce the installation space occupied.

To achieve the above-mentioned purpose, the heat dissipation device proposed in the present application includes an evaporator and a condenser; the evaporator includes an evaporative cold plate and a gas collecting end cover and a liquid collecting end cover respectively covering the top and bottom ends of the evaporative cold plate, the gas collecting end cover is provided with a gas collecting groove, the liquid collecting end cover is provided with a liquid collecting groove, the evaporative cold plate is provided with at least one evaporation chamber, the top of each evaporation chamber is connected with the gas collecting groove, and the bottom of each evaporation chamber is connected with the liquid collecting groove; the condenser has multiple steam inlets and multiple liquid return outlets, multiple steam inlets are connected with the gas collecting groove, multiple liquid return outlets are connected with the liquid collecting groove, the evaporation chamber is filled with a phase change working medium, the phase change working medium enters the condenser through the steam inlet after absorbing heat through phase change in the evaporation chamber, and flows back to the evaporation chamber through the liquid return outlet after releasing heat through phase change in the condenser.

In one embodiment, a plurality of mutually independent evaporation channels are provided in each of the evaporation chambers, and two ends of the evaporation channels of each of the evaporation chambers are respectively connected to the gas collecting tank and the liquid collecting tank.

In one embodiment, the condenser includes an air collecting pipe, a liquid collecting pipe, a condensing pipe and a heat sink; wherein: the two ends of the condensing pipe are respectively connected to the air collecting pipe and the liquid collecting pipe, the air collecting pipe is provided with the steam inlet, the liquid collecting pipe is provided with the liquid return outlet, and the heat sink is arranged on the outer periphery of the condensing pipe.

In one embodiment, the evaporative cooling plate is a closed profile.

In one embodiment, the heat dissipation device further comprises a plurality of liquid return pipes, and two ends of each of the liquid return pipes are respectively connected to the liquid collecting pipe and the liquid collecting tank in the liquid collecting end cover;

And/or, the heat dissipation device further includes a plurality of exhaust pipes, and both ends of each of the exhaust pipes are respectively connected to the gas collecting pipe and the gas collecting groove in the gas collecting end cover.

In one embodiment, any one of the gas collecting pipe, the liquid collecting pipe and the liquid return pipe is a flat pipe. When the liquid return pipe is a flat pipe, the liquid return pipe includes a first pipe section and a second pipe section which are bent.

The present application also provides an industrial control device, which includes a power device and the above-mentioned heat dissipation device, wherein the power device is arranged on an evaporative cold plate of the heat dissipation device.

In one embodiment, a surface area of the evaporative cold plate directly facing the evaporation chamber is a main heat dissipation area, and the power device is arranged in the main heat dissipation area.

In one embodiment, the industrial control device further includes a fan, a filter device and a shell, an air duct is provided in the shell, the fan, the heat dissipation device and the filter device are all arranged in the air duct, and the condensers of the filter device and the heat dissipation device are arranged sequentially in the air flow direction of the air duct.

In one embodiment, the filter device includes a capacitor and a reactor, the reactor is located between the evaporative cold plate of the evaporator and the inner wall of the shell, and the capacitor, the reactor and the condenser of the heat dissipation device are arranged in sequence in the air flow direction of the air duct.

The technical solution of the present application is to fill the evaporation chamber of the evaporative cold plate with a phase change medium, which absorbs the heat released by the power device through phase change in the evaporative cold plate, and enters the next heat dissipation cycle after phase change heat dissipation in the condenser. The gas collecting end cover can collect steam, and the liquid collecting end cover can collect condensate, thereby improving the circulation efficiency of the phase change medium and thus improving the heat dissipation efficiency of the heat dissipation device. Under the same heat dissipation requirements, reducing the volume of the heat dissipation device is conducive to reducing the installation space occupied by the heat dissipation device.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying any creative work.

FIG. 1 is a perspective view of an embodiment of a heat dissipation device of the present application.

FIG. 2 is a partial enlarged view of point A in FIG. 1 .

FIG. 3 is a left side view of an embodiment of the heat dissipation device of the present application.

Fig. 4 is a stepped cross-sectional view of the B-B position in Fig. 3.

FIG. 5 is a perspective view of an embodiment of an industrial control device of the present application.

FIG. 6 is a three-dimensional diagram of an embodiment of the industrial control device of the present application from another perspective (part of the housing is hidden).

FIG. 7 is a three-dimensional diagram of another embodiment of the industrial control device of the present application (part of the housing is hidden).

FIG8 is a left view of another embodiment of the industrial control device of the present application (partial structure is hidden).

Description of Figure Numbers:

Label	name	Label	name
1000	Heat dissipation device	1100	Evaporator
1110	Evaporative cooling panel	1111	Evaporation channel
1120	Gas collecting end cap	1121	Gas Tank
1130	Liquid collecting end cap	1131	Liquid collection tank
1200	Condenser	1210	Gas collector
1211	Steam inlet	1220	Liquid collecting pipe
1221	Liquid return outlet	1230	Condenser
1240	Heat sink	1300	Liquid return pipe
1310	First pipe section	1320	Second pipe section
2100	Power Devices	2200	fan
2300	Filter components	2310	Capacitors
2320	Reactor	2400	case
2401	Air duct

The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings.

Embodiments of the present invention

The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

It should be noted that if the embodiments of the present application involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.

In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the present application, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and/or" or "and/or" appears in the full text, its meaning includes three parallel schemes. Taking "A and/or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by this application.

The present application proposes a heat dissipation device, which can be applied to industrial control devices such as frequency converters, power converters, and UPS inverters.

1 and 3, in one embodiment of the present application, the heat dissipation device 1000 includes an evaporator 1100 and a condenser 1200; the evaporator 1100 includes an evaporative cold plate 1110 and a gas collecting end cover 1120 and a liquid collecting end cover 1130 respectively covering the top and bottom of the evaporative cold plate 1110, a gas collecting groove 1121 is provided in the gas collecting end cover 1120, a liquid collecting groove 1131 is provided in the liquid collecting end cover 1130, at least one evaporation chamber is provided in the evaporative cold plate 1110, the top of each evaporation chamber is connected to the gas collecting groove 1121, and the bottom of each evaporation chamber is connected to the gas collecting groove 1121. The condenser 1200 has a plurality of steam inlets 1211 and a plurality of liquid return outlets 1221, the plurality of steam inlets 1211 are all connected to the gas collecting tank 1121, the plurality of liquid return outlets 1221 are all connected to the liquid collecting tank 1131, the evaporation chamber is filled with a phase change medium (such as a evaporable phase change fluid), the phase change medium enters the condenser 1200 through the steam inlet 1211 after absorbing heat in the evaporation chamber, and returns to the evaporation chamber of the evaporative cold plate 1110 through the liquid return outlet 1221 after releasing heat in the condenser 1200. At this time, heat-generating components such as high-power IGBTs, rectifier bridges and other power devices that need heat dissipation can be installed on the evaporative cold plate 1110. In addition, each evaporation chamber can correspond to a heat-generating component such as a power device alone to improve the heat dissipation independence of heat-generating components such as power devices.

At this time, the phase change medium in the evaporation chamber of the evaporative cold plate 1110 can boil and evaporate to form steam after absorbing the heat of the power device. The corresponding steam will flow into the condenser 1200 due to the density and pressure, and be cooled and condensed into liquid; under the action of gravity, the condensate flows back to the evaporation chamber of the evaporative cold plate 1110, forming a stable heat dissipation cycle.

In this solution, the heat dissipation device is formed by filling the evaporation chamber of the evaporative cold plate 1110 with a phase change medium. The phase change medium can absorb heat from the evaporative cold plate 1110 by phase change and can be used to dissipate heat from the power device. The phase change medium can dissipate heat by phase change in the condenser 1200 and carry out the next heat dissipation cycle. The gas collecting end cover 1120 and the liquid collecting end cover 1130 respectively collect steam and condensate to improve the circulation efficiency of the phase change medium, thereby improving the heat dissipation efficiency of the heat dissipation device 1000. Under the same heat dissipation requirements, it is beneficial to reduce the volume of the heat dissipation device 1000 and reduce the installation space occupied by the heat dissipation device.

In one embodiment, referring to FIG. 4 , a plurality of mutually independent evaporation channels 1111 are provided in each evaporation chamber, and the two ends of the evaporation channels 1111 of each evaporation chamber are connected to the gas collecting tank 1121 and the liquid collecting tank 1131 respectively. Referring to FIG. 4 , the evaporative cold plate 1110 can be set as a closed profile, such as a harmonica pipe. Of course, the evaporative cold plate 1110 can also be formed into a plate shape by arranging a plurality of independent heat dissipation pipes side by side, and this embodiment does not limit this. A plurality of mutually independent evaporation channels 1111 are provided in each evaporation chamber, which is beneficial to avoid the accumulation of phase change working fluid in the evaporation chamber and to improve the phase change efficiency of the phase change working fluid.

In one embodiment, referring to FIG. 1 and FIG. 2 , the condenser 1200 includes an air collecting pipe 1210, a liquid collecting pipe 1220, a condensing pipe 1230 and a heat sink 1240; both ends of the condensing pipe 1230 are respectively connected to the air collecting pipe 1210 and the liquid collecting pipe 1220, the air collecting pipe 1210 is provided with a steam inlet 1211, the liquid collecting pipe 1220 is provided with a liquid return outlet 1221, and the heat sink 1240 is arranged on the outer periphery of the condensing pipe 1230, thereby forming a flow channel for air flow to pass through.

In one embodiment, referring to FIG. 1 and FIG. 2 , the heat sink 1000 further includes a plurality of liquid return pipes 1300, and the two ends of each liquid return pipe 1300 are respectively connected to the liquid collecting pipe 1220 and the liquid collecting tank 1131 in the liquid collecting end cover 1130, and/or, the heat sink 1000 further includes a plurality of exhaust pipes (not marked in the figure), and the two ends of each exhaust pipe are respectively connected to the gas collecting pipe 1210 and the gas collecting tank 1121 in the gas collecting end cover 1120. By providing the liquid return pipe 1300, the phase change working medium in the form of condensate can smoothly flow back to the liquid collecting tank 1131 in the liquid collecting end cover 1130, which is conducive to further improving the heat dissipation efficiency. While the exhaust pipe realizes the discharge of steam to the condenser, the longitudinal dimension of the entire heat sink 1000 can be changed, so that the heat sink 1000 can be conveniently applied to whole machine scenes of different sizes.

In one embodiment, referring to FIG. 1 and FIG. 4 , any one of the gas collecting pipe 1210, the liquid collecting pipe 1220 and the liquid return pipe 1300 is a flat pipe, such as the gas collecting pipe 1210, the liquid collecting pipe 1220 and the liquid return pipe 1300 are all configured as flat pipes. When the liquid return pipe 1300 is a flat pipe, the liquid return pipe 1300 includes a first pipe section 1310 and a second pipe section 1320 that are bent, that is, the liquid return pipe 1300 includes at least one bending portion; the two adjacent pipe sections in the bending portion are the first pipe section 1310 and the second pipe section 1320. The liquid return pipe 1300 is a flat pipe, which is conducive to improving the support strength of the liquid return pipe 1300 to the liquid collecting pipe 1220 and the liquid collecting end cover 1130. The liquid return pipe 1300 includes a first pipe section 1310 and a second pipe section 1320 which are bent, so that the overall shape of the heat dissipation device 1000 is closer to a triangle, which is beneficial to further improve the supporting stability of the liquid return pipe 1300 to the evaporator 1100 and the condenser 1200.

5 and 6 , the present application further proposes an industrial control device, which can be configured as a frequency converter, a power converter, a UPS inverter, etc. The industrial control device includes a power device 2100 and the above-mentioned heat dissipation device 1000 , and the power device 2100 is disposed on an evaporative cold plate 1110 of the heat dissipation device 1000 .

In one embodiment, the surface area of the evaporative cold plate 1110 facing the evaporation chamber is the main heat dissipation area (refer to the left side or right side in FIG. 6 ), and the power device 2100 is disposed in the main heat dissipation area. The surface area of the evaporative cold plate 1110 facing the evaporation chamber is the main heat dissipation area, and the direct facing form is conducive to improving the heat dissipation efficiency of the power device.

In one embodiment, referring to Figure 6, the industrial control device also includes a fan 2200, a filter device 2300 and a shell 2400, and an air duct 2401 is provided in the shell 2400. The fan 2200, the heat dissipation device 1000 and the filter device 2300 are all arranged in the air duct 2401, and the filter device 2300 and the condenser 1200 of the heat dissipation device 1000 are arranged in sequence in the air flow direction of the air duct 2401.

In this embodiment, the airflow in the air duct 2401 first dissipates heat to the filter device 2300 and then to the condenser of the heat dissipation device 1000, thereby improving the heat dissipation efficiency of the heat dissipation airflow and the heat dissipation efficiency of the industrial control device.

In one embodiment, referring to Figure 6, the filter device 2300 includes a capacitor 2310 and an inductor 2320, the inductor 2320 is located between the evaporative cold plate 1110 of the evaporator 1100 and the inner wall of the shell 2400, and the capacitor 2310, the inductor 2320 and the condenser 1200 of the heat dissipation device 1000 are arranged in sequence in the air flow direction of the air duct 2401.

At this time, the capacitor 2310 is located upstream of the airflow, in a relatively low temperature area, with good heat dissipation conditions, and the reliability and service life of the capacitor 2310 are improved. The reactor 2320 is usually relatively heavy. At this time, the reactor 2320 is located in a relatively central position of the industrial control device, which is conducive to improving the coincidence of the center of gravity of the whole machine and the center of gravity of the volume, and is conducive to transportation and installation. After passing through the capacitor 2310 and the reactor 2320, the airflow still has a certain heat dissipation capacity and can continue to dissipate heat for the condenser 1200.

The installation position of the fan 2200 can refer to FIG6 and be set on the side of the reactor 2320 away from the capacitor 2310 (such as being set on the upper side in the figure) to draw the airflow away from the industrial control device. At this time, the fan 2200 adopts the method of exhausting and cooling, which is conducive to making the airflow more uniform and improving the heat dissipation efficiency of the condenser 1200. Of course, the installation position of the fan 2200 can also refer to FIG7 and be set on the side of the capacitor 2310 away from the reactor 2320 (such as being set on the lower side in FIG7) to allow the airflow to enter the industrial control device. At this time, the fan 2200 is in a relatively low temperature area, which is conducive to improving the service life.

Regarding the form in which the power device 2100 is arranged on the evaporative cold plate 1110 of the heat dissipation device 1000: when there are many power devices 2100, referring to Figure 8, power devices 2100 are installed on both sides of the evaporator 1100 to reduce the width dimension of the industrial control device, which is beneficial to improving the space utilization of the industrial control device and improving the overall compactness.

The specific structure of the heat dissipation device included in the industrial control device refers to the above-mentioned embodiments. Since the industrial control device adopts all the technical solutions of all the above-mentioned embodiments of the heat dissipation device, it at least has all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be described one by one here.

The above description is only a preferred embodiment of the present application, and does not limit the patent scope of the present application. All equivalent structural changes made by using the contents of the present application specification and drawings under the technical concept of the present application, or directly/indirectly applied in other related technical fields are included in the patent protection scope of the present application.

Claims

A heat dissipation device, wherein the heat dissipation device comprises an evaporator and a condenser;

The evaporator comprises an evaporative cold plate and a gas collecting end cover and a liquid collecting end cover respectively covering the top and bottom of the evaporative cold plate, the gas collecting end cover is provided with a gas collecting groove, the liquid collecting end cover is provided with a liquid collecting groove, the evaporative cold plate is provided with at least one evaporation chamber, the top of each evaporation chamber is communicated with the gas collecting groove, and the bottom of each evaporation chamber is communicated with the liquid collecting groove; and

The condenser has multiple steam inlets and multiple liquid return outlets, the multiple steam inlets are all connected to the gas collecting tank, the multiple liquid return outlets are all connected to the liquid collecting tank, the evaporation chamber is filled with a phase change working medium, the phase change working medium enters the condenser through the steam inlet after absorbing heat during phase change in the evaporation chamber, and flows back to the evaporation chamber through the liquid return outlet after releasing heat during phase change in the condenser.
The heat dissipation device according to claim 1, wherein each of the evaporation chambers is provided with a plurality of mutually independent evaporation channels, and two ends of the evaporation channels of each of the evaporation chambers are respectively connected to the gas collecting tank and the liquid collecting tank.
The heat dissipation device according to claim 1, wherein the condenser comprises an air collecting pipe, a liquid collecting pipe, a condensing pipe and a heat sink; wherein:

The two ends of the condenser are respectively connected to the gas collecting pipe and the liquid collecting pipe. The gas collecting pipe is provided with the steam inlet, and the liquid collecting pipe is provided with the liquid return outlet. The heat sink is arranged on the outer periphery of the condenser.
The heat dissipation device according to any one of claims 1 to 3, wherein the evaporative cooling plate is a closed profile.
The heat dissipation device according to claim 3, wherein the heat dissipation device further comprises a plurality of liquid return pipes, and two ends of each of the liquid return pipes are respectively connected to the liquid collecting pipe and the liquid collecting tank in the liquid collecting end cover;

And/or, the heat dissipation device further includes a plurality of exhaust pipes, and both ends of each of the exhaust pipes are respectively connected to the gas collecting pipe and the gas collecting groove in the gas collecting end cover.
The heat dissipation device according to claim 5, wherein any one of the gas collecting pipe, the liquid collecting pipe and the liquid return pipe is a flat pipe, and when the liquid return pipe is a flat pipe, the liquid return pipe includes a first pipe section and a second pipe section that are bent.
An industrial control device, wherein the industrial control device comprises a power device and a heat dissipation device according to any one of claims 1 to 6, and the power device is arranged on an evaporative cold plate of the heat dissipation device.
The industrial control device according to claim 7, wherein a surface area of the evaporative cold plate facing the evaporation chamber is a main heat dissipation area, and the power device is arranged in the main heat dissipation area.
The industrial control device as described in claim 7, wherein the industrial control device further comprises a fan, a filter device and a housing, an air duct is provided in the housing, the fan, the heat sink and the filter device are all arranged in the air duct, and the condensers of the filter device and the heat sink are arranged in sequence in the air flow direction of the air duct.
The industrial control device according to claim 9, wherein the filter device includes a capacitor and a reactor, the reactor is located between the evaporative cold plate of the evaporator and the inner wall of the shell, and the capacitor, the reactor and the condenser of the heat dissipation device are arranged in sequence in the air flow direction of the air duct.