CN214756810U - Bone voiceprint sensor and electronic equipment - Google Patents
Bone voiceprint sensor and electronic equipment Download PDFInfo
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- CN214756810U CN214756810U CN202120875981.XU CN202120875981U CN214756810U CN 214756810 U CN214756810 U CN 214756810U CN 202120875981 U CN202120875981 U CN 202120875981U CN 214756810 U CN214756810 U CN 214756810U
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- vibration
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- 210000000988 bone and bone Anatomy 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 claims abstract description 59
- 239000002184 metal Substances 0.000 claims description 5
- 230000001755 vocal effect Effects 0.000 claims 3
- 238000000034 method Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 6
- 230000004044 response Effects 0.000 description 7
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
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Abstract
The disclosure discloses a bone voiceprint sensor and an electronic device. The bone voiceprint sensor comprises a circuit substrate, a sensor unit and a vibration pickup unit, wherein the circuit substrate is provided with a first surface and a second surface which are arranged in a back-to-back manner, and the circuit substrate is provided with a ground wire bonding pad; the sensor unit is connected to the first surface of the circuit substrate; the vibration pickup unit is connected to the second surface of the circuit substrate; the vibration pickup unit comprises a conductive shell, a conductive bonding pad is arranged on the second surface of the circuit substrate and electrically connected with the ground wire bonding pad, and the conductive shell is connected with the conductive bonding pad. In the bone voiceprint sensor provided by the embodiment of the application, the conductive shell is grounded, so that electrostatic charges on the conductive shell can be effectively transferred, the electrostatic hidden danger of the bone voiceprint sensor in the use process is avoided, and the use reliability of the bone voiceprint sensor is improved.
Description
Technical Field
The present disclosure relates to the field of electronic product technologies, and more particularly, to a bone voiceprint sensor and an electronic device.
Background
The bone voiceprint sensor is a vibration sensor which collects sound signals and converts the sound signals into electric signals by utilizing slight vibration of bones of the head and the neck caused by speaking of a person. Because it collects sound through air conduction unlike a conventional microphone, sound can be transmitted with high clarity in a very noisy environment. In many situations, such as fire scenes, a firefighter wearing a gas mask cannot speak directly into the microphone using his mouth, in which case the bone voiceprint sensor can be used for sound conduction. With the development of electronic products, the application of the bone voiceprint sensor is more and more extensive.
The bone voiceprint sensor generally includes a vibration component and a microphone component, wherein the vibration component is used for sensing external vibration information, and changes of air flow generated during vibration are converted into electric signals through the microphone component, so that the vibration information is expressed.
In the existing bone voiceprint sensor, when the sensor is subjected to electrostatic discharge, electrostatic charges on a shell of a vibration assembly cannot be effectively transferred, so that electrostatic damage is easily caused to a device, and the reliability of a product is reduced.
In view of the above, a new technical solution is needed to solve the above technical problems.
SUMMERY OF THE UTILITY MODEL
An object of the present disclosure is to provide a new technical solution for a bone voiceprint sensor and an electronic device.
According to a first aspect of the present disclosure, there is provided a bone voiceprint sensor comprising:
the circuit board is provided with a first surface and a second surface which are arranged in an opposite mode, and the circuit board is provided with a ground wire bonding pad;
a sensor unit connected to a first surface of the circuit substrate;
a vibration pickup unit connected to the second surface of the circuit substrate;
the vibration pickup unit comprises a conductive shell, a conductive bonding pad is arranged on the second surface of the circuit substrate, the conductive bonding pad is electrically connected with the ground wire bonding pad, and the conductive shell is connected with the conductive bonding pad.
Optionally, the conductive pad is provided in a ring shape.
Optionally, the conductive pad is provided in a rectangular ring shape.
Optionally, the sensor unit includes a package cover, a microphone chip, and an ASIC chip, the package cover is connected to the first surface of the circuit substrate and encloses to form a first cavity, the microphone chip and the ASIC chip are located in the first cavity, and both the microphone chip and the ASIC chip are electrically connected to the circuit substrate.
Optionally, a sound hole is formed in the circuit substrate at a position corresponding to the microphone chip.
Optionally, the conductive housing and the circuit substrate enclose to form a second cavity, the vibration pickup unit further includes a vibration assembly, the vibration assembly is disposed in the second cavity, and the vibration assembly is connected to the second surface of the circuit substrate.
Optionally, the conductive housing and/or the vibration assembly is provided with a pressure relief hole.
Optionally, the vibration assembly includes a diaphragm and a mass connected to each other.
Optionally, the conductive housing is a metal housing.
According to a second aspect of the present disclosure, there is provided an electronic device comprising a bone voiceprint sensor as described in the first aspect.
In the bone voiceprint sensor provided by the embodiment of the application, the conductive shell is grounded, so that electrostatic charges on the conductive shell can be effectively transferred, the electrostatic hidden danger of the bone voiceprint sensor in the use process is avoided, and the use reliability of the bone voiceprint sensor is improved.
Other features of the present disclosure and advantages thereof will become apparent from the following detailed description of exemplary embodiments thereof, which proceeds with reference to the accompanying drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of the specification, illustrate embodiments of the disclosure and together with the description, serve to explain the principles of the disclosure.
FIG. 1 is a schematic structural diagram of a bone voiceprint sensor according to one embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a partial structure of a bone voiceprint sensor according to one embodiment of the present disclosure.
Description of reference numerals:
1: a circuit substrate; 101: a sound hole; 2: a conductive housing; 3: a conductive pad; 4: packaging the cover body; 5: a microphone chip; 6: an ASIC chip; 7: vibrating diaphragm; 8: and a mass block.
Detailed Description
Various exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. It should be noted that: the relative arrangement of the components and steps, the numerical expressions, and numerical values set forth in these embodiments do not limit the scope of the present disclosure unless specifically stated otherwise.
The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the disclosure, its application, or uses.
Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate.
In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
Referring to fig. 1-2, according to one embodiment of the present disclosure, a bone voiceprint sensor is provided. The bone voiceprint sensor comprises a circuit substrate 1, a sensor unit and a vibration pickup unit; the circuit substrate 1 is provided with a first surface and a second surface which are arranged oppositely, and the circuit substrate 1 is provided with a ground wire bonding pad; the sensor unit is connected to a first surface of the circuit substrate 1; the vibration pickup unit is connected to the second surface of the circuit substrate 1; the vibration pickup unit comprises a conductive shell 2, a conductive bonding pad 3 is arranged on the second surface of the circuit substrate 1, the conductive bonding pad 3 is electrically connected with the ground wire bonding pad, and the conductive shell 2 is connected with the conductive bonding pad 3.
In the bone voiceprint sensor provided in the embodiment of the application, since the conductive pad 3 is provided on the second surface of the circuit substrate 1, the conductive shell 2 of the vibration pickup unit is not directly connected to the circuit substrate 1, but is connected to the second surface of the circuit substrate 1 through the conductive pad 3, and the conductive pad 3 is electrically connected to the ground pad in the circuit substrate 1; thus, when the conductive shell 2 is subjected to electrostatic discharge, electrostatic charges can be transferred from the conductive shell 2 to the circuit substrate 1 via the conductive pad 3 and to the ground through the ground pad of the circuit substrate 1. That is to say, in the bone voiceprint sensor provided by the embodiment of the application, the conductive shell 2 is grounded, so that electrostatic charges on the conductive shell 2 can be effectively transferred, the electrostatic hidden danger of the bone voiceprint sensor in the use process is avoided, and the use reliability of the bone voiceprint sensor is improved. Further specifically, the conductive case 2 is soldered on the conductive pad 3 by solder paste.
Referring to fig. 2, in one embodiment, the conductive pad 3 is provided in a ring shape.
In this specific example, the conductive pad 3 is disposed in an integral annular structure around the circuit substrate 1, so that when the conductive housing 2 and the circuit substrate 1 are connected by the conductive pad 3, for example, when the conductive housing 2 and the circuit substrate 1 are soldered by using solder paste, the contact area of the conductive housing 2 on the circuit substrate 1 is large, and the connection of the conductive housing 2 and the circuit substrate 1 is very firm. Of course, in other embodiments, the conductive pads 3 may also be arranged in a plurality in a discrete manner around the circuit substrate 1, i.e. the conductive shell 2 is connected with the circuit substrate 1 through a plurality of conductive pads 3.
Referring to fig. 2, in one embodiment, the conductive pad 3 is further configured in a rectangular ring shape.
In this specific example, the conductive pad 3 is provided in a rectangular ring-like structure around the circuit substrate 1; since the circuit substrate 1 is rectangular in most cases and the cross section of the conductive housing 2 is rectangular ring-shaped, the conductive pads 3 are configured in a rectangular ring shape, and the shape of the conductive pads 3 matches with the shape of the circuit substrate 1 and the shape of the conductive housing 2, which facilitates the connection of the conductive housing 2 with the circuit substrate 1 through the conductive pads 3.
Referring to fig. 1, in an embodiment, the sensor unit includes a package cover 4, a microphone chip 5, and an ASIC chip 6, where the package cover 4 is connected to a first surface of the circuit substrate 1 and encloses to form a first cavity, the microphone chip 5 and the ASIC chip 6 are located in the first cavity, and both the microphone chip 5 and the ASIC chip 6 are electrically connected to the circuit substrate 1.
In the bone voiceprint sensor, the vibration pickup unit is used for picking up a bone vibration signal of the outside (such as a wearer of an electronic product, or other vibration source) to generate a response vibration signal, and the sensor unit is used for receiving the response vibration signal and generating an electric signal according to the received response vibration signal. The microphone chip 5 and the ASIC chip 6 in the sensor unit are both electrically connected to the circuit substrate 1, specifically, the ASIC chip 6 is directly electrically connected to the circuit substrate 1 through a metal wire, and the microphone chip 5 is electrically connected to the ASIC chip 6 through a metal wire. Specifically, the microphone chip 5 and the ASIC chip 6 are bonded to the first surface of the circuit substrate 1 by adhesive tape. More specifically, the microphone chip 5 is configured to receive the response vibration signal and generate an electrical signal according to the received response vibration signal, and then the microphone chip 5 transfers the generated electrical signal to the ASIC chip 6, and the ASIC chip 6 processes the electrical signal.
Referring to fig. 1-2, in one embodiment, further, a sound hole 101 is opened on the circuit substrate 1 at a position corresponding to the microphone chip 5.
In this specific example, the vibration pickup unit and the sensor unit are communicated through the sound hole 101 provided in the circuit substrate 1, so that a response vibration signal generated by the vibration pickup unit is transmitted to the microphone chip 5 through the sound hole 101.
Referring to fig. 1, in an embodiment, the conductive housing 2 and the circuit substrate 1 enclose to form a second cavity, the vibration pickup unit further includes a vibration component, the vibration component is disposed in the second cavity, and the vibration component is connected to the second surface of the circuit substrate 1.
In this particular example, the conductive housing 2 of the vibration pickup unit may transmit an external bone vibration signal to the vibration assembly, which is configured to pick up the bone vibration signal to vibrate to generate a response vibration signal. The vibration component is installed in the conductive shell 2, and the conductive shell 2 can protect the vibration component.
Referring to fig. 1, in one embodiment, the conductive housing 2 and/or the vibration component is further provided with a pressure relief hole.
In the process of assembling the bone voiceprint sensor, a welding process is generally required, and the gas in the cavity can have pressure change during welding, so that the phenomenon of uneven pressure in the cavity can be caused if an open air leakage port is not formed. Therefore, the pressure relief holes can keep the pressure inside and outside the cavity uniform during welding, so that the product is prevented from being damaged and the quality of the product is prevented from being influenced.
Referring to fig. 1, in one embodiment, the vibration assembly further includes a diaphragm 7 and a mass 8 connected to each other.
In this particular example, the vibration assembly is composed of a diaphragm 7 and a mass 8, wherein a first portion of the diaphragm 7 is fixed to the second surface of the circuit substrate 1, a second portion of the diaphragm 7 is suspended in the second cavity, and the mass 8 is connected to the second portion of the diaphragm 7. When influenced by external vibration, the mass block 8 can drive the diaphragm 7 to vibrate reciprocally in the vibration direction, and the vibration can drive the airflow to flow, and the airflow is detected by the microphone chip 5 after passing through the sound hole 101, so that the airflow is converted into an electric signal.
In one embodiment, the conductive housing 2 is a metal housing.
The conductive shell 2 made of metal material is firm and durable, which is beneficial to improving the overall quality of the product.
According to another embodiment of the present disclosure, there is provided an electronic device including the bone voiceprint sensor as described above.
The electronic device may be, but is not limited to, a headset, an earphone, a smart watch, a smart bracelet, a vehicle noise reduction device, a vibration sensing device, and the like, as is well known to those skilled in the art.
In the above embodiments, the differences between the embodiments are described in emphasis, and different optimization features between the embodiments can be combined to form a better embodiment as long as the differences are not contradictory, and further description is omitted here in consideration of brevity of the text.
Although some specific embodiments of the present disclosure have been described in detail by way of example, it should be understood by those skilled in the art that the foregoing examples are for purposes of illustration only and are not intended to limit the scope of the present disclosure. It will be appreciated by those skilled in the art that modifications may be made to the above embodiments without departing from the scope and spirit of the present disclosure. The scope of the present disclosure is defined by the appended claims.
Claims (10)
1. A bone voiceprint sensor, the bone voiceprint sensor comprising:
the circuit board comprises a circuit substrate (1), wherein the circuit substrate (1) is provided with a first surface and a second surface which are arranged in an opposite mode, and the circuit substrate (1) is provided with a ground wire bonding pad;
a sensor unit connected to a first surface of the circuit substrate (1);
a vibration pickup unit connected to a second surface of the circuit substrate (1);
the vibration pickup unit comprises a conductive shell (2), a conductive bonding pad (3) is arranged on the second surface of the circuit substrate (1), the conductive bonding pad (3) is electrically connected with the ground wire bonding pad, and the conductive shell (2) is connected with the conductive bonding pad (3).
2. The bone vocal print sensor according to claim 1, wherein the conductive pad (3) is provided in a ring shape.
3. The bone vocal print sensor according to claim 2, wherein the conductive pad (3) is provided in a rectangular ring shape.
4. The bone voiceprint sensor according to claim 1, wherein the sensor unit comprises a package cover (4), a microphone chip (5) and an ASIC chip (6), the package cover (4) is connected with a first surface of the circuit substrate (1) and encloses to form a first cavity, the microphone chip (5) and the ASIC chip (6) are located in the first cavity, and the microphone chip (5) and the ASIC chip (6) are both electrically connected with the circuit substrate (1).
5. The bone voiceprint sensor according to claim 4, characterised in that a sound hole (101) is opened in the circuit substrate (1) at a position corresponding to the microphone chip (5).
6. The bone voiceprint sensor according to claim 1, wherein the conductive housing (2) encloses a second cavity with the circuit substrate (1), the vibration pickup unit further comprises a vibration component disposed in the second cavity, and the vibration component is connected to a second surface of the circuit substrate (1).
7. The bone vocal print sensor according to claim 6, wherein the conductive housing (2) and/or the vibration assembly is provided with a pressure relief hole.
8. A bone voiceprint sensor according to claim 6, characterised in that the vibration assembly comprises a diaphragm (7) and a mass (8) connected.
9. The bone voiceprint sensor according to any one of the claims 1 to 8, characterised in that said conductive housing (2) is a metal housing.
10. An electronic device, characterized in that the electronic device comprises a bone voiceprint sensor according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120875981.XU CN214756810U (en) | 2021-04-26 | 2021-04-26 | Bone voiceprint sensor and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202120875981.XU CN214756810U (en) | 2021-04-26 | 2021-04-26 | Bone voiceprint sensor and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214756810U true CN214756810U (en) | 2021-11-16 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202120875981.XU Active CN214756810U (en) | 2021-04-26 | 2021-04-26 | Bone voiceprint sensor and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214756810U (en) |
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2021
- 2021-04-26 CN CN202120875981.XU patent/CN214756810U/en active Active
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