CN203351644U - Flip-chip LED support and surface mounted LED - Google Patents
Flip-chip LED support and surface mounted LED Download PDFInfo
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- CN203351644U CN203351644U CN 201320182244 CN201320182244U CN203351644U CN 203351644 U CN203351644 U CN 203351644U CN 201320182244 CN201320182244 CN 201320182244 CN 201320182244 U CN201320182244 U CN 201320182244U CN 203351644 U CN203351644 U CN 203351644U
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- crystal covering
- polarity substrate
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Abstract
The utility model discloses a flip-chip LED support and a surface mounted LED, wherein the flip-chip LED support comprises a pedestal and a support body above the pedestal for installing a flip-chip LED chip, and a positive substrate for connecting the anode of the flip-chip LED chip and a negative substrate for connecting the cathode of the flip-chip LED chip are arranged on a bearing surface of the pedestal. An insulating area is arranged between the positive substrate and the negative substrate, and a support body encloses the bearing surface of the pedestal, wherein the positive substrate and/or the negative substrate has an outer extending portion exceeding the bearing surface of the pedestal. Since the positive substrate and/or the negative substrate has an outer extending portion, the thermal conduction area of the flip-chip LED support is increased, thereby increasing the heat radiation performance of the support, facilitating the entry of external heat, and maintaining the proper temperature for solder paste bonding.
Description
Technical field
The utility model relates to the light-emitting component technical field, is specifically related to a kind of crystal covering type LED support and surface mount LED.
Background technology
Along with LED(Light Emitting Diode, light-emitting diode) lighting technology growing, the application of LED in people's daily life is also more and more extensive.Employing is covered LED(that crystalline substance (Flip Chip) mode encapsulated hereinafter referred to as crystal covering type LED) the die bond mode of more general solid type LED encapsulation is simply many, have higher reliability, and can keep away mixed and disorderly technique, make the volume production feasibility significantly promote, and have the advantages such as the processing procedure time, high yield, the heat-conducting effect that shorten high-temperature baking are good, high amount of light concurrently, then in market, showing one's talent, is the technology that industry does one's utmost to carry out.
At existing surface mount device (Surface Mounted Devices, SMD) in, at crystal covering type LED, be mounted on its special stand (hereinafter referred to as the crystal covering type LED support), Fig. 1 is the heat radiation schematic diagram of existing crystal covering type LED support, as shown in Figure 1, the both positive and negative polarity substrate 12 be connected with LED chip in support 11 is wrapped in the outside of bracket base 13, and heat only can flow out along both positive and negative polarity substrate 12 annulars, area of dissipation is little, and heat-sinking capability is poor.
The utility model content
technical problem
In view of this, to be solved in the utility model is the existing poor problem of crystal covering type LED support heat-sinking capability, and a kind of crystal covering type LED support and surface mount LED are provided, and has larger heat transfer area, perfect heat-dissipating.
technical scheme
In order to address the above problem, first aspect, the utility model embodiment provides a kind of crystal covering type LED support, comprising: pedestal and be positioned at described pedestal top, for installing the rack body of crystal covering type LED chip;
Be provided with the negative polarity substrate of the positive polarity substrate of the positive electrode for connecting described crystal covering type LED chip and negative electrode for being connected described crystal covering type LED chip on the bearing-surface of described pedestal, between described positive polarity substrate and negative polarity substrate, be formed with insulation layer;
Described rack body is around on the bearing-surface of described pedestal;
Wherein, described positive polarity substrate and/or described negative polarity substrate have the epitaxial part of the bearing-surface that exceeds described pedestal.
In conjunction with first aspect, in a kind of possible implementation, the width range of described epitaxial part is 0.1mm～3mm.
In conjunction with first aspect, in a kind of possible implementation, the upper surface of the upper surface of described epitaxial part and described positive polarity substrate and/or negative polarity substrate is in same level.
In conjunction with first aspect, in a kind of possible implementation, described insulation layer is positioned at the centre of the bearing-surface of described pedestal, with the luminous zone center line of described rack body be the same straight line.
In order to address the above problem, second aspect, the utility model embodiment provides a kind of surface mount LED, comprising: the crystal covering type LED support of arbitrary structure and be placed in the crystal covering type LED chip in the rack body of described crystal covering type LED support in the embodiment of the present invention;
Described crystal covering type LED chip is placed in the insulation layer top of described crystal covering type LED support, and the positive electrode of described crystal covering type LED chip contacts with described positive polarity electrical property of substrate, and the negative electrode of described crystal covering type LED chip contacts with described negative polarity electrical property of substrate.
In conjunction with second aspect, in a kind of possible implementation,, the positive electrode of described crystal covering type LED chip is connected on described positive polarity substrate by tin cream, and the negative electrode of described crystal covering type LED chip is connected on described negative polarity substrate by tin cream.
beneficial effect
In the utility model crystal covering type LED support and surface mount LED, positive polarity substrate and/or the negative polarity substrate of crystal covering type LED support have epitaxial part, increased the heat transfer area of crystal covering type LED support, can improve the heat dispersion of support, and be conducive to outside heat and enter, keep the bonding preference temperature of tin cream.
The accompanying drawing explanation
Fig. 1 is the heat radiation schematic diagram of existing crystal covering type LED support;
The vertical view of the crystal covering type LED support that Fig. 2 a is the utility model embodiment mono-;
The crystal covering type LED support that Fig. 2 b is the utility model embodiment mono-is along the profile of the A-A direction of Fig. 2 a;
The schematic diagram of the heat conduction scene of the crystal covering type LED support that Fig. 2 c is the utility model embodiment mono-;
The vertical view of pedestal in the crystal covering type LED support that Fig. 3 a is the utility model embodiment bis-;
The stereogram of the crystal covering type LED support that Fig. 3 b is the utility model embodiment bis-;
The overall structure figure of the crystal covering type LED support that Fig. 3 c is the utility model embodiment bis-;
The structure chart of the surface mount LED that Fig. 4 is the utility model embodiment tri-.
description of reference numerals
1: the crystal covering type LED support; 11: support; 12: the both positive and negative polarity substrate;
13: bracket base; 21: pedestal; 22: rack body;
211: the positive polarity substrate; 212: the negative polarity substrate; 213: insulation layer;
214: epitaxial part; 3: the support base plate; 31: pin;
4: the crystal covering type LED chip; 41: positive electrode; 42: negative electrode.
Embodiment
Describe various exemplary embodiments of the present utility model, feature and aspect in detail below with reference to accompanying drawing.The identical same or analogous element of Reference numeral presentation function in accompanying drawing.Although the various aspects of embodiment shown in the drawings, unless otherwise indicated, needn't draw accompanying drawing in proportion.
Here special-purpose word " exemplary " means " as example, embodiment or illustrative ".Here needn't be interpreted as being better than or being better than other embodiment as " exemplary " illustrated any embodiment.
In addition, provided numerous details in embodiment hereinafter by the utility model in order better to illustrate.It will be appreciated by those skilled in the art that and there is no these details, the utility model can be implemented equally.In the other example, the method for knowing for everybody, means, element and circuit are not described in detail, so that highlight purport of the present utility model.
The vertical view of the crystal covering type LED support that Fig. 2 a is the utility model embodiment mono-, the crystal covering type LED support that Fig. 2 b is the utility model embodiment mono-is along the profile of the A-A direction of Fig. 2 a.As shown in Fig. 2 a, Fig. 2 b, this crystal covering type LED support comprise pedestal 21 and be positioned at described pedestal 21 tops, the rack body 22 for installing the crystal covering type LED chip.
Wherein, be provided with the negative polarity substrate 212 of the positive polarity substrate 211 of the positive electrode for connecting described crystal covering type LED chip and negative electrode for being connected described crystal covering type LED chip on the bearing-surface of pedestal 21, between described positive polarity substrate 211 and negative polarity substrate 212, be formed with insulation layer 213.Particularly, the bearing-surface of pedestal 21 refers to the surface for support and bearing support body 22 and LED chip.Wherein, the upper surface of positive polarity substrate 211, negative polarity substrate 212, insulation layer can, on same level, be same level with bearing-surface; The upper surface of positive polarity substrate 211 and negative polarity substrate 212 also can be higher or lower than the upper surface of insulation layer, in this case, supporting surface can not be a horizontal plane, but by the upper surface of positive polarity substrate 211 and negative polarity substrate 212, the upper surface of insulation layer and the structure that the joint face between them forms.In addition, in the utility model figure, the position of positive polarity substrate 211 and negative polarity substrate 212 is only a kind of example, in concrete application process, the two may exchange, shape that also can be to that indicated in the drawings is different, as long as can with the both positive and negative polarity electrical contact of LED chip, specifically do not limit the two shape and position relationship.
Described rack body 22 is around on the bearing-surface of described pedestal 21.Particularly, rack body 22 and pedestal 21 can be the parts that separately produce, and are in use combined, and also can be integrated the structure of making, and the utility model does not limit this.
Wherein, described positive polarity substrate 211 and/or described negative polarity substrate 212 have the epitaxial part 214 of the bearing-surface that exceeds described pedestal 21.Particularly, epitaxial part 214 can adopt identical material one-body molded with positive polarity substrate 211, negative polarity substrate 212, manufactures so more convenient.Certainly epitaxial part 214 is used in combination after also can separating manufacture with polarity substrate 211, negative polarity substrate 212, even adopts different materials, and the utility model does not limit this.
The schematic diagram of the heat conduction scene of the crystal covering type LED support that Fig. 2 c is the utility model embodiment mono-.As shown in Figure 2 c, epitaxial part 214 on positive polarity substrate 211 and/or negative polarity substrate 212, can be so that the heat transfer area of this crystal covering type LED support increases, in the use procedure of crystal covering type LED chip, if produce larger heat, can make heat exhale uniformly along larger radiating surface from the bottom surface of pedestal 21.And, at the crystal covering type LED chip, during in non operating state, if temperature is lower, outside heat can also enter rack body along the rightabout shown in Fig. 2 c arrow, make while in the crystal covering type LED chip is bonded in to support, using tin cream, keep the bonding preference temperature of tin cream.
In the utility model crystal covering type LED support, positive polarity substrate and/or negative polarity substrate have epitaxial part, have increased the heat transfer area of crystal covering type LED support, can improve the heat dispersion of support, and be conducive to outside heat and enter, keep the bonding preference temperature of tin cream.
The vertical view of pedestal in the crystal covering type LED support that Fig. 3 a is the utility model embodiment bis-, the stereogram of the crystal covering type LED support that Fig. 3 b is the utility model embodiment bis-, the overall structure figure of the crystal covering type LED support that Fig. 3 c is the utility model embodiment bis-.Have identical function with the assembly that Fig. 2 a～Fig. 2 c label is identical in Fig. 3 a～Fig. 3 c, on the basis of above-described embodiment, as shown in Fig. 3 a～Fig. 3 c, the scope of the width W of the epitaxial part 214 of this crystal covering type LED support is preferably 0.1mm～3mm.
Preferably, the upper surface of the upper surface of epitaxial part 214 and described positive polarity substrate 211 and/or negative polarity substrate 212 can, in same level, be conducive to improve heat conduction efficiency.
Further, insulation layer 213 can be positioned at the centre of the bearing-surface of described pedestal 21, with the luminous zone center line of described rack body 22 can be the same straight line, as the chain-dotted line in Fig. 3 a, be conducive to improve the light emission rate of support.
In addition, as shown in Figure 3 c, the epitaxial part 214 of crystal covering type LED support can be connected with the pin 31 on support base plate 3.Like this, the crystal covering type LED chip directly with the work of the positive polarity substrate 211 of crystal covering type LED support, driving arrangement control crystal covering type LED chip that negative polarity substrate 212 electrical contacts can be external by the support base plate, can shorten the heat conduction distance of crystal covering type LED chip, further improve heat dispersion.
In the utility model crystal covering type LED support, positive polarity substrate and/or negative polarity substrate have epitaxial part, have increased the heat transfer area of crystal covering type LED support, can improve the heat dispersion of support, and be conducive to outside heat and enter, keep the bonding preference temperature of tin cream.
The structure chart of the surface mount LED that Fig. 4 is the utility model embodiment tri-, have identical function with the assembly that Fig. 2 a～Fig. 2 c, Fig. 3 a～Fig. 3 c label is identical in Fig. 4.As shown in Figure 4, the interior crystal covering type LED chip 4 of rack body 22 that this surface mount LED comprises the crystal covering type LED support 1 of any one structure in above-described embodiment and is placed in described crystal covering type LED support 1.
Wherein, described crystal covering type LED chip 4 is placed in insulation layer 213 tops of described crystal covering type LED support 1, positive electrode 41 and described positive polarity substrate 211 electrical contacts of described crystal covering type LED chip 4, negative electrode 42 and described negative polarity substrate 212 electrical contacts of described crystal covering type LED chip 4.
Further, the positive electrode 41 of described crystal covering type LED chip 4 is connected on described positive polarity substrate 211 by tin cream, and the negative electrode 42 of described crystal covering type LED chip 4 is connected on described negative polarity substrate 212 by tin cream.
Adopt the crystal covering type LED support of above-described embodiment in the utility model surface mount LED, positive polarity substrate and/or negative polarity substrate in the crystal covering type LED support have epitaxial part, increased the heat transfer area of crystal covering type LED support, can improve the heat dispersion of support, and be conducive to outside heat and enter, keep the bonding preference temperature of tin cream, thereby improve the heat dispersion of surface mount LED, extended the useful life of surface mount LED.
It should be noted that, in the crystal covering type LED support and surface mount LED of the utility model embodiment, the suitable concrete size of each part of adjusting pole, to adapt to the different size of crystal covering type LED chip, the material of each part and shape be not also as the restriction to the utility model embodiment.
Claims (6)
1. a crystal covering type LED support, is characterized in that, comprising: pedestal (21) and be positioned at described pedestal (21) top, the rack body (22) for installing the crystal covering type LED chip;
Be provided with the negative polarity substrate (212) of the positive polarity substrate (211) of the positive electrode for connecting described crystal covering type LED chip and negative electrode for being connected described crystal covering type LED chip on the bearing-surface of described pedestal (21), between described positive polarity substrate (211) and negative polarity substrate (212), be formed with insulation layer (213);
Described rack body (22) is around on the bearing-surface of described pedestal (21);
Wherein, described positive polarity substrate (211) and/or described negative polarity substrate (212) have the epitaxial part (214) of the bearing-surface that exceeds described pedestal (21).
2. crystal covering type LED support according to claim 1, is characterized in that, the width range of described epitaxial part (214) is 0.1mm～3mm.
3. crystal covering type LED support according to claim 1 and 2, is characterized in that, the upper surface of the upper surface of described epitaxial part (214) and described positive polarity substrate (211) and/or negative polarity substrate (212) is in same level.
4. crystal covering type LED support according to claim 1 and 2, is characterized in that, described insulation layer (213) is positioned at the centre of the bearing-surface of described pedestal (21), with the luminous zone center line of described rack body (22) be the same straight line.
5. a surface mount LED, is characterized in that, comprising:
The described crystal covering type LED support of any one (1) and be placed in the crystal covering type LED chip (4) in the rack body (22) of described crystal covering type LED support (1) in claim 1-4;
Described crystal covering type LED chip (4) is placed in insulation layer (213) top of described crystal covering type LED support (1), the positive electrode (41) of described crystal covering type LED chip (4) and described positive polarity substrate (211) electrical contact, the negative electrode (42) of described crystal covering type LED chip (4) and described negative polarity substrate (212) electrical contact.
6. surface mount LED according to claim 5, it is characterized in that, it is upper that the positive electrode (41) of described crystal covering type LED chip (4) is connected to described positive polarity substrate (211) by tin cream, and the negative electrode (42) of described crystal covering type LED chip (4) is connected on described negative polarity substrate (212) by tin cream.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320182244 CN203351644U (en) | 2013-04-11 | 2013-04-11 | Flip-chip LED support and surface mounted LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320182244 CN203351644U (en) | 2013-04-11 | 2013-04-11 | Flip-chip LED support and surface mounted LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203351644U true CN203351644U (en) | 2013-12-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201320182244 Expired - Fee Related CN203351644U (en) | 2013-04-11 | 2013-04-11 | Flip-chip LED support and surface mounted LED |
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| CN (1) | CN203351644U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653989A (en) * | 2016-12-29 | 2017-05-10 | 木林森股份有限公司 | Uniformly-packaged LED support and LED light source thereof |
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
-
2013
- 2013-04-11 CN CN 201320182244 patent/CN203351644U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9954151B2 (en) | 2015-11-30 | 2018-04-24 | Nichia Corporation | Package, package intermediate body, light emitting device, method for manufacturing same |
| US10580947B2 (en) | 2015-11-30 | 2020-03-03 | Nichia Corporation | Package and package intermediate body |
| US10079332B2 (en) | 2015-12-09 | 2018-09-18 | Nichia Corporation | Package manufacturing method, light emitting device manufacturing method, package, and light emitting device |
| US10490705B2 (en) | 2015-12-09 | 2019-11-26 | Nichia Corporation | Package and light emitting device |
| CN106653989A (en) * | 2016-12-29 | 2017-05-10 | 木林森股份有限公司 | Uniformly-packaged LED support and LED light source thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20131218 Termination date: 20160411 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |