CN205069686U

CN205069686U - LED punctiform formula COB module

Info

Publication number: CN205069686U
Application number: CN201520849021.0U
Authority: CN
Inventors: 王志根; 姜圣祥; 江涛; 林锋; 杨照; 陈祖梁; 孙国鹏; 李义东; 戴亮平
Original assignee: Hangzhou Hengxing Gaohong Optoelectronic Technology Co Ltd
Current assignee: Hangzhou Hengxing Gaohong Optoelectronic Technology Co Ltd
Priority date: 2015-10-29
Filing date: 2015-10-29
Publication date: 2016-03-02
Anticipated expiration: 2025-10-29

Abstract

The utility model discloses a LED punctiform formula COB module, including base plate and printed wire layer, be equipped with at least more than one LED luminous point on the base plate, be equipped with the LED luminescence chip in the LED luminous point, the skin of every the LED luminous point fluorescent glue that has all coated, LED luminescence chip and printed wire layer switch on, and the printed wire layer is equipped with two electrodes. The utility model has the advantages that: through foretell conceptual design, the base plate direct recombination of LED luminescence chip and highly heat -conductive material is in the same place, saved the support, thermal resistance link in the middle of having reduced, LED's life has been guaranteed to the heat dissipation problem of improving LED that can be better.

Description

A kind of LED dot type COB module

Technical field

The utility model relates to a kind of LED dot type COB module.

Background technology

Light-emitting diode (LightEmittinDiode, LED), as solid state light emitter of new generation, has the many merits such as life-span long, energy-efficient, environmental protection, is widely applied to display! Along with development in science and technology in lighting field, advanced technology is constantly applied in semiconductor production, to make the luminous efficiency of LED constantly promote, and cost continuous decrease.

The core of LED is PN junction, electronics and the hole of note people are directly converted to luminous energy at PN junction compound tense electric energy, but the luminous energy of not all conversion is all enough transmitted into outside LED, it can be transformed this heat energy of heat energy at PN junction and epoxy resin/silica gel inside by absorbing sheet is produce huge side effect to light fixture, if can not efficiently radiates heat, LED internal temperature can be made to raise, temperature is higher, the luminous efficiency of LED is lower, and the life-span of LED is shorter, under serious conditions, LED wafer can be caused to lose efficacy at once, so heat dissipation problem is still the huge obstacle of LED overall application.Current technology applies mainly LED paster and COB, by innovation and the research and development of material, decreases thermal resistance, but, by the multiple tracks such as support, substrate thermal resistance barrier, the space that is still significantly improved of dispelling the heat.So the heat dissipation problem that minimizing thermal resistance can improve LED preferably becomes the basis that we research and develop this product.

Utility model content

The purpose of this utility model is to provide a kind of LED dot type COB module, effectively can solve the problem that the thermal resistance of existing LED luminescence chip and substrate is high.

In order to solve the problems of the technologies described above, the utility model is achieved through the following technical solutions: a kind of LED dot type COB module, comprise substrate and be attached to the printed wire layer on substrate, described substrate is provided with at least more than one LED luminous point, one or more LED luminescence chips are provided with in described LED luminous point, the skin of each described LED luminous point is coated with fluorescent glue, and described LED luminescence chip and the conducting of printed wire layer, described printed wire layer is provided with two electrodes.

Preferably, by electroplate or sintered form is attached together between described printed wire layer and substrate, described substrate is the one in metal substrate, ceramic substrate, glass substrate or sapphire substrate; Ensure the heat dispersion that LED luminescence chip is good.

Preferably, described LED luminescence chip is flip-chip; Ensure the luminance of LED luminescence chip.

Preferably, the diameter of each LED luminous point is 1.5mm to 5mm; Ensure uniformity and the specular removal of whole LED luminescence.

Preferably, described LED chip is bonded on substrate by conduction tin cream or conductive silver paste; Bonding being firmly easy to operates.

Compared with prior art, the utility model has the advantages that: by above-mentioned conceptual design, by LED luminescence chip together with the substrate direct combination of highly heat-conductive material, eliminate support, decrease middle thermal resistance link, the heat dissipation problem of LED can be improved preferably, improve optical efficiency, ensure that the useful life of LED.

Accompanying drawing explanation

Fig. 1 is the structural representation of a kind of LED dot type of the utility model COB module;

Fig. 2 is the structural representation of LED luminous point in a kind of LED dot type of the utility model COB module;

Fig. 3 is the structural representation of layer printed circuit board in a kind of LED dot type of the utility model COB module.

Embodiment

Consult Fig. 1, Fig. 3, a kind of LED dot type COB module, comprise substrate 1 and attachment printed wire layer 2 on substrate 1, by to electroplate or sintered form is attached together between described printed wire layer 2 and substrate 1, described substrate is metal substrate, ceramic substrate, one in glass substrate or sapphire substrate, described substrate 1 is provided with at least more than one LED luminous point 3, as shown in Figure 2, one or more LED luminescence chips 4 are provided with in described LED luminous point 3, described LED luminescence chip is flip-chip, the skin of each described LED luminous point 3 is coated with fluorescent glue 5, the diameter of each LED luminous point 3 is 1.5mm to 5mm, described LED luminescence chip 4 and printed wire layer 2 conducting, described printed wire layer 2 is provided with two electrodes 6, described LED chip is bonded on substrate by conduction tin cream or conductive silver paste.

A manufacture method for LED dot type COB module, comprises the following steps successively:

A. the mode by electroplating or sintering arranges printed wire layer 2 on substrate 1, as conductive layer and the articulamentum of LED luminescence chip;

B. the substrate 1 being furnished with printed wire layer 2 is cleaned and drying, then by conduction tin cream or conductive silver paste LED luminescence chip is fixed on by Reflow Soldering mode on the printed wire layer set, Reflow Soldering temperature will experience 210 DEG C, 235 DEG C, 245 DEG C, 250 DEG C and 230 DEG C totally 5 temperature successively, and the time that each temperature value stops is 45 ~ 60 seconds;

C. after fluorescent glue being carried out vacuum defoamation, be coated in the surface of LED luminescence chip by a glue mode and toast sizing, first adopt 80 DEG C of constant temperature 1 hour, then be warmed up to 150 DEG C of constant temperature 3 hours, finally cool to the fluorescent adhesive layer 4 that 110 DEG C of constant temperature form dot type for 1 hour.

By above-mentioned conceptual design, by LED luminescence chip together with the substrate direct combination of highly heat-conductive material, eliminate support, decrease middle thermal resistance link, the heat dissipation problem of LED can be improved preferably, improve optical efficiency, ensure that the useful life of LED.

The foregoing is only specific embodiment of the utility model, but technical characteristic of the present utility model is not limited thereto, any those skilled in the art is in field of the present utility model, and the change done or modification are all encompassed among the scope of the claims of the present utility model.

Claims

1. a LED dot type COB module, it is characterized in that: comprise substrate (1) and be attached to the printed wire layer (2) on substrate (1), described substrate (1) is provided with at least more than one LED luminous point (3), one or more LED luminescence chips (4) are provided with in described LED luminous point (3), the skin of each described LED luminous point (3) is coated with fluorescent glue (5), described LED luminescence chip (4) and printed wire layer (2) conducting, described printed wire layer (2) is provided with two electrodes (6).

2. a kind of LED dot type COB module as claimed in claim 1, it is characterized in that: by electroplate or sintered form is attached together between described printed wire layer (2) and substrate (1), described substrate is the one in metal substrate, ceramic substrate, glass substrate or sapphire substrate.

3. a kind of LED dot type COB module as claimed in claim 1, is characterized in that: described LED luminescence chip is flip-chip.

4. a kind of LED dot type COB module as claimed in claim 1, is characterized in that: the diameter of each LED luminous point (3) is 1.5mm to 5mm.

5. a kind of LED dot type COB module as claimed in claim 1, is characterized in that: described LED chip is bonded on substrate by conduction tin cream or conductive silver paste.