CN202041110U - Superconductivity microcirculation flat heat pipe with capillary core being additionally arranged - Google Patents
Superconductivity microcirculation flat heat pipe with capillary core being additionally arranged Download PDFInfo
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- CN202041110U CN202041110U CN2011200354667U CN201120035466U CN202041110U CN 202041110 U CN202041110 U CN 202041110U CN 2011200354667 U CN2011200354667 U CN 2011200354667U CN 201120035466 U CN201120035466 U CN 201120035466U CN 202041110 U CN202041110 U CN 202041110U
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Abstract
The utility model relates to the technical field of heat exchanging, in particular to a superconductivity microcirculation flat heat pipe with a capillary core being additionally arranged. For the superconductivity microcirculation flat heat pipe, the used material is aluminum or copper; more than one supporting structures are arranged inside a hollow shell; the supporting structures are vertically connected with the upper wall surface and the lower wall surface of the flat heat pipe; the supporting structures run through the interior of the flat heat pipe and are formed by integrally extruding, so that the internal part of the flat heat pipe is divided into more than two through holes that are arrayed in the flat heat pipe side by side; the through holes are internally provided with at least one metal capillary core; and working medium is injected into the through holes; and the two ends of the through holes are sealed so as to form the integral flat heat pipe. Therefore, the superconductivity microcirculation flat heat pipe has the characteristics of small thermal resistance, fast thermal response, large capacity of heat transmission, simple structure, big structure strength and the like and is simple to form by extrusion.
Description
Technical field
The utility model relates to the heat transfer technology field, relates in particular to a kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick.
Background technology
Along with the develop rapidly of industries such as IT, communication, LED, solar energy, wherein the heating power of used electronic element is also improving constantly, and utilizes traditional radiating subassembly to be difficult to well solve relevant hot arraign topic.
Now heat-transferring assembly is mainly based on heat pipe in the radiating module, and the general structure of conventional heat pipe is, has the pipe of certain diameter, and is sealed at both ends after the inner can working medium.Heat pipe has the heat exchange efficiency height, characteristics such as volume is little, cost is low, reliability height for other heat exchange structure.
And traditional heat pipe is in order to increase and the contacting or welding effect of thermal source or other assembly, generally to flatten processing, and the heat pipe after flattening, again output little, the transmission range of hot transmission quantity short, flatten problems such as yielding, that structural strength is low, especially flattening 2.0mm when following, heat conveyance performance significantly decays.The application provides a kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick for this reason, has that thermal resistance is little, thermal response is quick, heat output is big, simple in structure, characteristics such as structural strength is big, and extrusion modling is simple and easy.
The utility model content
The utility model provides a kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick, and technical problem to be solved is after conventional heat pipe is flattened, and the hot transmission quantity that is produced is little, transmission range short, flatten defectives such as yielding, that structural strength is low.
The technical solution of the utility model is:
A kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick, include one therein in the empty capsid with upper support structure, used material is aluminium or copper, be vertically connected at the last lower wall surface of flat-plate heat pipe, and should go up the used material of lower wall surface is aluminium or copper, run through flat-plate heat pipe inside, wherein said supporting construction and flat-plate heat pipe structure are that the one extruding forms, thereby make flat-plate heat pipe inside be divided into two above through holes, be arranged side by side in described flat-plate heat pipe, in described through hole, be provided with at least one metal capillary wick, and each relatively independent through hole is marked with working medium successively, thereby forms whole flat-plate heat pipe with dull and stereotyped flat tube is sealed at both ends.And then form a plurality of independently seal chambers, to constitute multichannel microcirculation heat pipe structure.
Technique effect of the present utility model is:
Absorb heat at the evaporation ends flat-plate heat pipe, Working fluid phase changing is a gas, and each different independent through-hole by its inside, the working medium gas that contains heat is transferred to colling end, after colling end is condensed into liquid state, capillary force by network structure copper mesh core or multiply copper stranded conductor capillary structure is back to evaporation ends with heat-transfer working medium liquid, thereby forms the heat transfer microcirculation in through hole.The metal capillary wick can provide extraordinary capillary force for working medium, to guarantee the vapour-liquid exchange cycles of working medium, promotes the heat transfer property of the superconduction microcirculation flat-plate heat pipe of this additional capillary wick from face.
And the supporting construction of the certain wall thickness in the flat tube, wherein said supporting construction and flat-plate heat pipe structure are that the one extruding forms, and itself and last lower wall surface connect as one.Supporting construction becomes relatively independent a plurality of little flat tube space with a big flat tube space segmentation, thereby form a plurality of independently microcirculation heat pipe structures, supporting construction can well strengthen the structural strength of flat tube simultaneously, improve general heat pipe owing to flatten the top and bottom depression that shaping causes, or because the not strong problem of structural strength that hollow structure caused.Supporting construction can also increase the evaporation surface of flat intraductal working medium, can strengthen the exchange heat and the conduction efficiency of lower wall surface on the superconduction microcirculation flat-plate heat pipe that adds capillary wick simultaneously.
So can satisfy in the backflow capillary force under the prerequisite of condensate liquid backflow requirement, the superconduction microcirculation flat-plate heat pipe of additional capillary wick can effectively improve maximum defeated heat, and can satisfy the heat dissipation problem of multiple spot thermal source, have uniformity of temperature profile, thermal resistance is little, thermal response is quick, heat output is big, simple in structure, characteristics such as structural strength is big, and extrusion modling is simple and easy.
Description of drawings
Fig. 1 is the profile of the utility model first embodiment.
Fig. 2 is the profile of the utility model second embodiment.
Wherein, each Reference numeral representative is as follows: 1-flat-plate heat pipe upper wall surface 2-flat-plate heat pipe lower wall surface 3-supporting construction 4-through hole 5-capillary wick
The specific embodiment
Relevant detailed description of the present utility model and technology contents, conjunction with figs. is described as follows.
As shown in Figure 1, first embodiment of the present utility model.A kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick, used material is heat-conductive characteristic aluminium or a copper preferably, include some supporting constructions 3 in the hollow housing by described flat-plate heat pipe, used material is aluminium or copper, be vertically connected at the upper wall surface 1 and the lower wall surface 2 of flat-plate heat pipe, and should go up the used material of lower wall surface is aluminium or copper, run through flat-plate heat pipe inside, wherein said supporting construction 3 is that the one extruding forms with the flat-plate heat pipe structure, thereby make flat-plate heat pipe inside be divided into some through holes 4, be arranged side by side in described flat-plate heat pipe, according to through hole 4 width, in through hole 4, be provided with two metal capillary wick 5, being preferably network structure copper mesh core, is 100～250 purposes braiding copper mesh by grid, is rolled into one or more layers pipe shape and forms, and in described through hole 4, be marked with working medium, thereby sealed at both endsly form whole flat-plate heat pipe.Network structure copper mesh core can provide extraordinary capillary force for working medium, to guarantee that worker quality liquid can be back to evaporation ends from condensation end, simultaneously can also be with the pipeline internal channel of network structure copper mesh core as the steam flow cavity, thus the heat transfer property of superconduction microcirculation slot type flat-plate heat pipe promoted.
As shown in Figure 2, second embodiment of the present utility model.A kind of superconduction microcirculation flat-plate heat pipe of additional capillary wick, used material is heat-conductive characteristic aluminium or a copper preferably, include some supporting constructions 3 in the hollow housing by described flat-plate heat pipe, used material is aluminium or copper, be vertically connected at the upper wall surface 1 and the lower wall surface 2 of flat-plate heat pipe, and should go up the used material of lower wall surface is aluminium or copper, run through flat-plate heat pipe inside, wherein said supporting construction 3 is that the one extruding forms with the flat-plate heat pipe structure, thereby make flat-plate heat pipe inside be divided into some through holes 4, be arranged side by side in described flat-plate heat pipe, according to through hole 4 width, in through hole 4, be provided with two metal capillary wick 5, be preferably the multiply copper stranded conductor, by the solid wire of 0.05～0.08mm directly the branch multiply be woven to the copper stranded conductor that an external diameter is approximately 1.0～1.5mm and form, and in described through hole 4, be marked with working medium, thereby sealed at both endsly form whole flat-plate heat pipe.The multiply copper stranded conductor is as the capillary structure of flat-plate heat pipe, the multiply copper stranded conductor can with through-hole wall, form capillary structure between per share copper cash and the copper cash, thereby the capillary force of backflow well be provided for working medium.
Claims (5)
1. the superconduction microcirculation flat-plate heat pipe of an additional capillary wick, it is characterized in that, include one in the hollow housing of described flat-plate heat pipe with upper support structure, be vertically connected at the last lower wall surface of flat-plate heat pipe, run through flat-plate heat pipe inside, thereby make flat-plate heat pipe inside be divided into two above through holes, be arranged side by side in described flat-plate heat pipe, in described through hole, be provided with at least one metal capillary wick, and in described through hole, be marked with working medium, thereby sealed at both endsly form whole flat-plate heat pipe.
2. the superconduction microcirculation flat-plate heat pipe of a kind of additional capillary wick as claimed in claim 1 is characterized in that, the used material of the last lower wall surface of described supporting construction and flat-plate heat pipe is aluminium or copper.
3. the superconduction microcirculation flat-plate heat pipe of a kind of additional capillary wick as claimed in claim 1 is characterized in that, described supporting construction and flat-plate heat pipe structure are that the one extruding forms.
4. as the superconduction microcirculation flat-plate heat pipe of claim 1 or 2 or 3 described a kind of additional capillary wick, it is characterized in that described metal capillary wick is a network structure copper mesh core, is 100～250 purposes braiding copper mesh by grid, is rolled into one or more layers pipe shape and forms.
5. as the superconduction microcirculation flat-plate heat pipe of claim 1 or 2 or 3 described a kind of additional capillary wick, it is characterized in that, described metal capillary wick is the multiply copper stranded conductor, by the solid wire of 0.05～0.08mm directly the branch multiply be woven to the copper stranded conductor that an external diameter is approximately 1.0～1.5mm and form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200354667U CN202041110U (en) | 2011-02-10 | 2011-02-10 | Superconductivity microcirculation flat heat pipe with capillary core being additionally arranged |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200354667U CN202041110U (en) | 2011-02-10 | 2011-02-10 | Superconductivity microcirculation flat heat pipe with capillary core being additionally arranged |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202041110U true CN202041110U (en) | 2011-11-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011200354667U Expired - Lifetime CN202041110U (en) | 2011-02-10 | 2011-02-10 | Superconductivity microcirculation flat heat pipe with capillary core being additionally arranged |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401588A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Composite micro-array flat heat pipe |
| CN102401594A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Flat heat pipe applied to intelligent refrigerator radiation component |
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigeration chip radiating assembly of refrigerator |
| CN102427071A (en) * | 2011-11-18 | 2012-04-25 | 苏州雪林电器科技有限公司 | Novel heat dissipation component of intelligent refrigerator control chip |
| CN104209718A (en) * | 2013-06-04 | 2014-12-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method of multi-cavity heat exchanger |
| CN109738483A (en) * | 2019-01-23 | 2019-05-10 | 重庆理工大学 | Solder joint thermophoresis experimental provision and method under the conditions of extreme temperature gradient |
| CN109860948A (en) * | 2019-01-22 | 2019-06-07 | 重庆交通大学 | Battery solenoid heat management device |
-
2011
- 2011-02-10 CN CN2011200354667U patent/CN202041110U/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102401588A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Composite micro-array flat heat pipe |
| CN102401594A (en) * | 2011-11-18 | 2012-04-04 | 苏州雪林电器科技有限公司 | Flat heat pipe applied to intelligent refrigerator radiation component |
| CN102410658A (en) * | 2011-11-18 | 2012-04-11 | 苏州雪林电器科技有限公司 | Semiconductor refrigeration chip radiating assembly of refrigerator |
| CN102427071A (en) * | 2011-11-18 | 2012-04-25 | 苏州雪林电器科技有限公司 | Novel heat dissipation component of intelligent refrigerator control chip |
| CN104209718A (en) * | 2013-06-04 | 2014-12-17 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacturing method of multi-cavity heat exchanger |
| CN109860948A (en) * | 2019-01-22 | 2019-06-07 | 重庆交通大学 | Battery solenoid heat management device |
| CN109738483A (en) * | 2019-01-23 | 2019-05-10 | 重庆理工大学 | Solder joint thermophoresis experimental provision and method under the conditions of extreme temperature gradient |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111116 |
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| CX01 | Expiry of patent term |