CN204695201U - Cpu integrated heat pipe radiator structure - Google Patents
Cpu integrated heat pipe radiator structure Download PDFInfo
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- CN204695201U CN204695201U CN201520278789.7U CN201520278789U CN204695201U CN 204695201 U CN204695201 U CN 204695201U CN 201520278789 U CN201520278789 U CN 201520278789U CN 204695201 U CN204695201 U CN 204695201U
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- heat pipe
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- flat board
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- board evaporation
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Abstract
The utility model belongs to computer heat radiation technical field, particularly relate to a kind of CPU integrated heat pipe radiator structure, the top of flat board evaporation heat pipe is provided with square-section condensation heat pipe, the below of flat board evaporation heat pipe directly contacts with thermal source, the fiber liquid sucting core structure of layered arrangement is provided with in flat board evaporation heat pipe, square-section inside heat pipe is provided with through hole bracing frame, heat pipe outside, square-section is provided with radiating fin, radiating fin is by flat board evaporation heat pipe, square-section heat pipe is integrated, and by flat board evaporation heat pipe, square-section heat pipe is communicated with formation internal passage type structure, fiber liquid sucting core structure is arranged by the cylindrical metal silk that three circles are tangent and is formed, runner is formed between tinsel and tinsel.The beneficial effects of the utility model are: flat board evaporation heat pipe directly fully contacts with thermal source, and reduce thermal contact resistance, heat power is high, and the heat pipe of square-section ensures the basis that steam fully flows obtains larger condensation area, good heat-transfer.
Description
Technical field
The utility model belongs to computer heat radiation technical field, particularly relates to a kind of CPU integrated heat pipe radiator structure.
Background technology
Along with improving constantly of PC CPU integrated level and performance, the power consumption of CPU is increasing, and CPU surface heat flux sharply increases, and reduces performance and the life-span of chip, have impact on the reliability of system cloud gray model.Very high request be it is also proposed to CPU cooling means simultaneously, make cooling means there occurs many changes.The method of tradition cooling CPU adopts aluminium extrusion heating radiator usually, and this heating radiator shows superiority at unit cost, weight and aspect of performance.But along with computing machine develops towards compactedness, the cooling performance of heating radiator is restricted, and aluminum current extruded heat sinks is tending towards heat transport limitation.Therefore, the heat pipe with the title of superconduction receives the attention of electrical cooling field application, current conventional heat pipe heating radiator is embedded by one or more circular heat pipe on the bottom heat radiation copper billet that contacts with CPU, heat is delivered to the colling end of heat radiator covering by heat pipe, shed by heat, but the backflow efficiency of heat pipe is not high by heat radiator, cost is high, and the surface of contact of heat pipe and thermal source is not high, radiating efficiency is limited, is further improved.
Utility model content
In order to overcome above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of CPU integrated heat pipe radiator structure, flat board evaporation heat pipe directly fully contacts with thermal source, reduce thermal contact resistance, heat power is high, the heat pipe of square-section ensures the basis that steam fully flows obtains larger condensation area, good heat-transfer.
To achieve these goals, the utility model adopts following technical scheme:
A kind of CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe, square-section condensation heat pipe, the top of described flat board evaporation heat pipe is provided with described square-section condensation heat pipe, the below of described flat board evaporation heat pipe directly contacts with thermal source, the fiber liquid sucting core structure of layered arrangement is provided with in described flat board evaporation heat pipe, described square-section inside heat pipe is provided with through hole bracing frame, heat pipe outside, described square-section is provided with radiating fin, described radiating fin is by described flat board evaporation heat pipe, described square-section heat pipe is integrated, and by described flat board evaporation heat pipe, described square-section heat pipe is communicated with formation internal passage type structure, described fiber liquid sucting core structure is arranged by the cylindrical metal silk that three circles are tangent and is formed, runner is formed between described tinsel and described tinsel.
Described fiber liquid sucting core structure comprise connect successively evaporator section, adiabatic section, condensation segment.
Described fiber liquid sucting core structure comprises shell and lower shell, is welded between described upper shell and described lower shell by welded bands.
Described upper shell is provided with dividing plate, and described lower shell is rectangular channel body structure.
The length of described fiber liquid sucting core structure is less than the length of described lower shell.
Described runner is sharp-pointed class triangle runner.
The beneficial effects of the utility model are: flat board evaporation heat pipe directly fully contacts with thermal source, reduce thermal contact resistance, and the hot-fluid produced is two-dimentional, raceway groove is multilayer arrangement, and raceway groove quantity in unit area is increased greatly, not by the restriction of existing working ability, in addition sharp-pointed class triangle runner is easy to liquid and forms larger capillary force at sharp corner, thus improve the backflow efficiency of liquid working substance, reduce the possibility that capillary limitation occurs, there is higher heat power; Condensation heat pipe working cavity in square-section, ensureing the basis that steam fully flows obtains larger condensation area, reduces the resistance of flow of external air; Square-section condensation heat pipe peace plate evaporation heat pipe directly communicates, and the heat transfer property of heat pipe can not be reduced; The contact area of radiating fin and radiating surface outside square-section condensation heat pipe is large and contact abundant, improves the heat exchange efficiency of radiating fin, reduces thermal contact resistance; The length of fiber liquid sucting core structure is less than the length of lower shell, making two edges of lower shell reserve space, flowing into for reserving at evaporation ends with liquid at condensation end.The utility model not changing heat pipe apparent volume, do not increase technology difficulty, under the prerequisite that do not improve cost of manufacture, radiating effect meets the cooling requirement of CPU completely, and compared with the heating radiator of initial configuration, volume decreases 20-30%, be applicable to large-scale promotion.
Accompanying drawing explanation
Fig. 1 is structural representation of the present utility model;
Fig. 2 is the structural representation of the utility model flat board evaporation heat pipe;
Fig. 3 is the vertical view of the utility model flat board evaporation heat pipe;
Fig. 4 is the sectional view of the utility model fiber liquid sucting core structure;
Fig. 5 is the utility model runner schematic diagram.
In figure, 1, flat board evaporation heat pipe, 2, square-section condensation heat pipe, 3, radiating fin, 4, fiber liquid sucting core structure, 5, tinsel, 6, runner, 7, upper shell, 8, lower shell, 9, welded bands.
Embodiment
Below in conjunction with accompanying drawing, a kind of embodiment of the present utility model is explained.
As shown in Figure 1, the utility model provides a kind of CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe 1, square-section condensation heat pipe 2, the top of described flat board evaporation heat pipe 1 is provided with described square-section condensation heat pipe 2, the below of described flat board evaporation heat pipe 1 directly contacts with thermal source, the fiber liquid sucting core structure 4 of layered arrangement is provided with in described flat board evaporation heat pipe 1, described square-section inside heat pipe is provided with through hole bracing frame, both can augmentation of heat transfer, heat pipe can be prevented again in interior pressure, larger distortion is produced under external pressure or alternating pressure, enhance the intensity of heat pipe.Heat pipe outside, described square-section is provided with radiating fin 3, described flat board evaporation heat pipe 1, described square-section heat pipe are integrated by described radiating fin 3, and described flat board evaporation heat pipe 1, described square-section heat pipe are communicated with formation internal passage type structure, described fiber liquid sucting core structure 4 is arranged by the tangent cylindrical metal silk 5 of three circles and is formed, runner 6 is formed between described tinsel 5 and described tinsel 5, described runner 6 is sharp-pointed class triangle runner 6, and the cross section of runner 6 as shown in Figure 5.
Described fiber liquid sucting core structure 4 comprise connect successively evaporator section, adiabatic section, condensation segment.Described fiber liquid sucting core structure 4 comprises shell 7 and lower shell 8, as shown in Figure 2, welded by welded bands 9 between described upper shell 7 and described lower shell 8, described upper shell 7 is provided with dividing plate, described lower shell 8 is rectangular channel body structure, and the length of described fiber liquid sucting core structure 4 is less than the length of described lower shell 8.
Flat board evaporation heat pipe 1 inside arranges fiber liquid sucting core structure 4 to the capillary force providing working medium to reflux.
Flat board evaporation heat pipe 1 course of work: when heating at the evaporator section of heating radiator, working medium (the pure water of high vacuum conditions is in pipe, or other fluent meterials) being heated is evaporated to rapidly isothermal saturated vapor, steam flows to square-section condensation heat pipe 2 under small pressure differential, release heat at condensation segment gas and condense into liquid, heat is also delivered in the environment of surrounding by radiating fin 3 by the release heat of transformation, and liquid is back to evaporator section by fiber liquid-sucking core.Condensation working medium to be back in steam cavity and repetitive cycling under capillary force effect.
Treat the filling of liquid-sucking core: will can complete the filling of fiber liquid sucting core structure 4 in shell 8 under being placed on neat for ready fiber liquid-sucking core, but because fiber is very thin, quantity is a lot, is difficult to arranging its rule, adopts the mode of liquid self assembly to place it.First fiber liquid-sucking core is placed in lower shell 8, then on fiber, several ethanol liquid are dripped, because liquid and fiber and lower shell 8 have good wetting state, liquid is evenly distributed in rapidly between fiber, finally slightly shake shell, and above fiber, certain pressure is applied to fiber, make liquid be easy to be uniformly distributed about the surface tension due to liquid, thus enable neat being arranged within shell of fiber.After fiber architecture is neat, upper shell 7 is compressed, prepare welding.
The welding of flat board evaporation heat pipe 1 is by upper shell 7 and the sealing of lower shell 8 firm welding, welded bands 9 is had at the preparation process advance reservation of shell, as shown in Figure 3, the first step of welding in welded bands 9, evenly will plate one deck solder before fiber liquid sucting core structure 4 is filled, adopt scolding tin as solder, namely clean in complete welded bands 9 afterwards at upper and lower shell 8 and evenly plate one deck scolding tin.Second step sends in fixture to clamp after upper shell 7 being built compression after liquid-sucking core filling is complete.
Upper and lower shell 8 adopts copper product, and the thermal resistance between thermal source and working medium is reduced as far as possible.Lower shell 8 is rectangle cell bodies, fiber liquid sucting core structure 4 can be laid in cell body closely, the length of fiber liquid sucting core structure 4 is less than the length of described lower shell 8, making two edges of the two ends of fiber and lower shell 8 reserve certain space, flowing at condensation end with liquid for reserving at evaporation ends.
As shown in Figure 4, the liquid-sucking core of flat board evaporation heat pipe 1 is formed by compact arranged fibre structure, defining many cross sections after the arrangement of these fibre compacts is three runners 6 justifying tangent class triangular structure, and the leg-of-mutton wedge angle of class and sharp-pointed, be easy to liquid and form larger capillary force at sharp corner, be convenient to liquid backflow.In addition because fibre structure can multilayer arrange, the backflow raceway groove of liquid also can multilayer be arranged, even if the quantity of raceway groove is not limited to the width of heat pipe.When the structure of flat board evaporation heat pipe 1 makes to make portion gas flow to condensation segment from evaporator section during its work not with liquid generation high speed convection, decrease high speed convection two-phase fluid produce friction force, reduce entrainment limit produce impact.
Above-described embodiment preferred embodiment of the present utility model, can not be considered to for limiting practical range of the present utility model.All equalizations done according to the utility model application range change and improve, and all should still belong within patent covering scope of the present utility model.
Claims (6)
1. a CPU integrated heat pipe radiator structure, it is characterized in that comprising flat board evaporation heat pipe, square-section condensation heat pipe, the top of described flat board evaporation heat pipe is provided with described square-section condensation heat pipe, the below of described flat board evaporation heat pipe directly contacts with thermal source, the fiber liquid sucting core structure of layered arrangement is provided with in described flat board evaporation heat pipe, described square-section inside heat pipe is provided with through hole bracing frame, heat pipe outside, described square-section is provided with radiating fin, described radiating fin is by described flat board evaporation heat pipe, described square-section heat pipe is integrated, and by described flat board evaporation heat pipe, described square-section heat pipe is communicated with formation internal passage type structure, described fiber liquid sucting core structure is arranged by the cylindrical metal silk that three circles are tangent and is formed, runner is formed between described tinsel and described tinsel.
2. CPU integrated heat pipe radiator structure according to claim 1, it is characterized in that described fiber liquid sucting core structure comprise connect successively evaporator section, adiabatic section, condensation segment.
3. CPU integrated heat pipe radiator structure according to claim 2, be is characterized in that described fiber liquid sucting core structure comprises shell and lower shell, is welded between described upper shell and described lower shell by welded bands.
4. CPU integrated heat pipe radiator structure according to claim 3, it is characterized in that described upper shell is provided with dividing plate, described lower shell is rectangular channel body structure.
5. CPU integrated heat pipe radiator structure according to claim 4, is characterized in that the length of described fiber liquid sucting core structure is less than the length of described lower shell.
6. the CPU integrated heat pipe radiator structure according to any one of claim 1-5, is characterized in that described runner is sharp-pointed class triangle runner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520278789.7U CN204695201U (en) | 2015-04-30 | 2015-04-30 | Cpu integrated heat pipe radiator structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520278789.7U CN204695201U (en) | 2015-04-30 | 2015-04-30 | Cpu integrated heat pipe radiator structure |
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| Publication Number | Publication Date |
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| CN204695201U true CN204695201U (en) | 2015-10-07 |
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| CN201520278789.7U Expired - Fee Related CN204695201U (en) | 2015-04-30 | 2015-04-30 | Cpu integrated heat pipe radiator structure |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN107238029A (en) * | 2017-07-05 | 2017-10-10 | 电子科技大学 | A kind of ground high-power LED spotlight phase-change heat radiating device |
-
2015
- 2015-04-30 CN CN201520278789.7U patent/CN204695201U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105436504A (en) * | 2016-01-12 | 2016-03-30 | 中国电子科技集团公司第二十九研究所 | Thin-wall sealing liquid cooling channel based on metal quick forming technology |
| CN107238029A (en) * | 2017-07-05 | 2017-10-10 | 电子科技大学 | A kind of ground high-power LED spotlight phase-change heat radiating device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20151007 Termination date: 20170430 |