CN201688222U - LED bulb with double-layer lampshade - Google Patents
LED bulb with double-layer lampshade Download PDFInfo
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- CN201688222U CN201688222U CN201020216408XU CN201020216408U CN201688222U CN 201688222 U CN201688222 U CN 201688222U CN 201020216408X U CN201020216408X U CN 201020216408XU CN 201020216408 U CN201020216408 U CN 201020216408U CN 201688222 U CN201688222 U CN 201688222U
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 229920003023 plastic Polymers 0.000 claims description 3
- 239000000843 powder Substances 0.000 abstract description 17
- 238000000576 coating method Methods 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000011248 coating agent Substances 0.000 abstract description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 abstract 1
- 238000005286 illumination Methods 0.000 abstract 1
- 230000007423 decrease Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 238000009877 rendering Methods 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 2
- 239000004926 polymethyl methacrylate Substances 0.000 description 2
- 238000004382 potting Methods 0.000 description 2
- 206010014357 Electric shock Diseases 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000010791 quenching Methods 0.000 description 1
- 230000000171 quenching effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/233—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating a spot light distribution, e.g. for substitution of reflector lamps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/64—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using wavelength conversion means distinct or spaced from the light-generating element, e.g. a remote phosphor layer
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Abstract
Description
技术领域technical field
本实用新型涉及一种LED灯泡,尤其涉及一种具有双层灯罩的LED灯泡。The utility model relates to an LED bulb, in particular to an LED bulb with a double-layer lampshade.
背景技术Background technique
LED光源具有使用低压电源、耗能少、适用性强、稳定性高、响应时间短、对环境无污染、多色发光等优点。在LED光源中一般使用荧光粉,其作用在于光色复合,形成白光。如图1所示,传统的荧光粉涂敷方式是将荧光粉与矽胶灌封混合,然后点涂在芯片上。研究表明,随着温度上升,荧光粉量子效率降低,出光减少,辐射波长也会发生变化,从而引起白光LED色温、色度、流明的变化,较高的温度还会加速荧光粉的老化。此外,高温下灌封胶和荧光粉,热稳定性也存在问题。LED light source has the advantages of using low-voltage power supply, less energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color light emission. Phosphor powder is generally used in LED light sources, and its function is to combine light and color to form white light. As shown in Figure 1, the traditional phosphor coating method is to mix the phosphor with silicone potting, and then apply it on the chip. Studies have shown that as the temperature rises, the quantum efficiency of phosphors decreases, the light output decreases, and the radiation wavelength will also change, which will cause changes in the color temperature, chromaticity, and lumens of white LEDs. Higher temperatures will also accelerate the aging of phosphors. In addition, there are also problems with the thermal stability of potting glue and phosphors at high temperatures.
虽然说依蓝光LED加上黄色荧光粉而形成白光,随着白光LED发光效率的逐步提高,将白光LED应用在照明领域的可能性也越来越大,但要达到照明所需要的流明数,无论是使用何种方法,都会因为必须在极小的LED封装中处理极高的热量,若组件无法散去这些热量,除了各种封装材料会由于彼此间膨胀系数的不同而有产品可靠性的问题,芯片的发光效率更会随着温度的上升而有明显地下降,并造成使用寿命明显地缩短及提高流明造价。因此,如何提高LED的发光流明,成为目前LED应用的重要课题。Although it is said that white light is formed by adding yellow phosphor powder to blue LEDs, with the gradual increase in luminous efficiency of white LEDs, it is more and more possible to apply white LEDs in the field of lighting, but to achieve the required lumens for lighting, No matter which method is used, it is necessary to deal with extremely high heat in a very small LED package. If the component cannot dissipate the heat, in addition to various packaging materials, there will be product reliability due to the difference in expansion coefficient between each other. The problem is that the luminous efficiency of the chip will decrease significantly as the temperature rises, which will significantly shorten the service life and increase the cost of lumens. Therefore, how to improve the luminous lumens of LEDs has become an important issue in current LED applications.
另一方面,目前传统的LED灯泡均只有一层灯罩,当灯罩破裂时,LED仍会照常工作,因此使用者可能有直接碰触电路板上之电源而造成触电的风险,尤其是在AC LED运用照明上,更是存在着极大的隐患。On the other hand, the current traditional LED light bulbs only have one layer of lampshade. When the lampshade is broken, the LED will still work as usual, so users may have the risk of electric shock due to direct contact with the power supply on the circuit board, especially in AC LED bulbs. In the use of lighting, there are great hidden dangers.
实用新型内容Utility model content
本实用新型的主要目的在于克服现有技术上述之不足,提供一种可以利用双层灯罩来改变色温、提高LED发光流明及提高安全性的一种具有双层灯罩的LED灯泡。The main purpose of the utility model is to overcome the above-mentioned shortcomings of the prior art, and to provide an LED light bulb with a double-layer lampshade that can change the color temperature, increase LED luminous lumens and improve safety by using the double-layer lampshade.
为达到上述目的,本实用新型一种具有双层灯罩的LED灯泡采用如下技术方案。In order to achieve the above purpose, an LED light bulb with a double-layer lampshade of the present invention adopts the following technical solutions.
构造一种具有双层灯罩的LED灯泡,包括一灯罩总体、LED芯片、荧光粉层及底座,其特征在于:所述灯罩总体包括内层灯罩和外层灯罩,内层灯罩处于外层灯罩的罩盖之下,LED芯片、内层灯罩和外层灯罩从内到外依次设置,荧光粉层涂布在内层灯罩靠LED芯片的那一面上。Construct an LED light bulb with double-layer lampshades, including a lampshade as a whole, LED chips, a phosphor layer and a base, characterized in that: the lampshade as a whole includes an inner lampshade and an outer lampshade, and the inner lampshade is located between the outer lampshade Under the cover, the LED chip, the inner lampshade and the outer lampshade are sequentially arranged from the inside to the outside, and the phosphor layer is coated on the side of the inner lampshade close to the LED chip.
对上述技术方案进行进一步阐述:The above-mentioned technical scheme is further elaborated:
内层灯罩与外层灯罩间存在间隙。There is a gap between the inner lampshade and the outer lampshade.
LED芯片与内层灯罩间存在间隙。There is a gap between the LED chip and the inner lampshade.
所述灯罩总体的材质可为任意透光的材料;或是玻璃,或是塑料(如PC、PS等),或是压克力(PMMA)等等,内层灯罩可以是平面的或是圆弧形的;涂布的荧光粉层可根据需求来添加不同比例颜色的荧光粉来达到不同的色温要求(如蓝色LED加黄色荧光粉而产生白光),或增加演色性之百分比。The overall material of the lampshade can be any light-transmitting material; or glass, or plastic (such as PC, PS, etc.), or acrylic (PMMA) or the like, and the inner lampshade can be flat or round. Curved; the coated phosphor layer can be added with different proportions of phosphors according to requirements to achieve different color temperature requirements (such as blue LED plus yellow phosphor to produce white light), or increase the percentage of color rendering.
相对于现有技术,本实用新型具有如下有益效果:Compared with the prior art, the utility model has the following beneficial effects:
1、通过将荧光粉层均匀涂布于内层灯罩的内表面(即靠LED芯片的那一面上),荧光粉层与LED芯片间存在间隙,可使荧光粉层拉开与高热的LED灯芯的距离,避免了传统技术由于荧光粉层贴着高热的LED芯片使散热性能变差、使荧光粉层遭到高温猝灭和老化、导致发光效率降低的问题,从而提高了LED芯片及荧光粉层的可靠性和LED灯泡的出光流明。1. By uniformly coating the phosphor layer on the inner surface of the inner lampshade (that is, on the side close to the LED chip), there is a gap between the phosphor layer and the LED chip, so that the phosphor layer can be pulled apart from the high-heat LED wick It avoids the problem of the traditional technology that the heat dissipation performance is deteriorated due to the phosphor layer being attached to the high-heat LED chip, the phosphor layer is quenched and aged by high temperature, and the luminous efficiency is reduced, thereby improving the LED chip and phosphor. Layer reliability and lumens of light from LED bulbs.
2、内层灯罩的内表面涂有荧光粉,可以通过改变荧光粉的比例来达到不同的色温,进一步满足了使用者对不同色温的LED灯泡的需求(如蓝色LED加黄色荧光粉而产生白光);还可以通过其来增加演色性之百分比。2. The inner surface of the inner lampshade is coated with fluorescent powder, which can achieve different color temperatures by changing the ratio of fluorescent powder, which further meets the needs of users for LED bulbs with different color temperatures (such as blue LED plus yellow fluorescent powder) white light); it can also be used to increase the percentage of color rendering.
3、当LED灯具外层灯罩破裂时,内层灯罩亦可起保护功用,提高了使用的安全性,尤其在交流LED运用照明上,更能发挥其保护功效。3. When the outer lampshade of the LED lamp is broken, the inner lampshade can also play a protective role, which improves the safety of use, especially in the application of AC LED lighting, it can better play its protective role.
4、内层灯罩和外层灯罩构成的双层灯罩也能一并处理LED灯具常有的炫光及点光源的问题。4. The double-layer lampshade composed of the inner lampshade and the outer lampshade can also solve the problems of glare and point light source that LED lamps often have.
附图说明Description of drawings
图1是传统LED灯泡示意图。Figure 1 is a schematic diagram of a traditional LED light bulb.
图2是本实用新型之内层灯罩为圆弧形的局部剖视图。Fig. 2 is a partial cross-sectional view of the utility model in which the inner lampshade is arc-shaped.
图3是本实用新型之内层灯罩为平面的局部剖视图。Fig. 3 is a partial cross-sectional view of the utility model in which the inner lampshade is a plane.
图4是本实用新型之MR16的剖视图。Fig. 4 is a sectional view of MR16 of the present utility model.
图5是本实用新型之PAR灯的剖视图。Fig. 5 is a cross-sectional view of the PAR lamp of the present invention.
图6是本实用新型之外层灯罩破裂示意图。Fig. 6 is a schematic diagram of the rupture of the outer lampshade of the present invention.
图中:1、灯罩总体;11、内层灯罩;12、外层灯罩;2、LED芯片;3、荧光粉;4、底座。In the figure: 1. Overall lampshade; 11. Inner lampshade; 12. Outer lampshade; 2. LED chip; 3. Phosphor powder; 4. Base.
具体实施方式Detailed ways
以下结合附图和实施例对本发明作进一步详细描述。The present invention will be described in further detail below in conjunction with the accompanying drawings and embodiments.
如图2至图5所示,本实用新型一种具有双层灯罩的LED灯泡,,包括一灯罩总体1,LED芯片2,荧光粉层3及底座4,所述灯罩总体1包括内层灯罩11和外层灯罩12,内层灯罩11处于外层灯罩12的罩盖之下,LED芯片2、内层灯罩11和外层灯罩12从内到外依次设置,荧光粉层3涂布在内层灯罩11靠LED芯片2的那一面上。As shown in Figures 2 to 5, the utility model is a LED light bulb with a double-layer lampshade, which includes a lampshade overall 1,
内层灯罩11与外层灯罩12间存在间隙。There is a gap between the
LED芯片2与内层灯罩11间存在间隙。There is a gap between the
内层灯罩11可以是平面的或是圆弧形的。The
灯罩总体1的材质可为任意透光的材料;或是玻璃,或是塑料(如PC、PS等),或是压克力(PMMA)等等,The material of lampshade overall 1 can be any transparent material; or glass, or plastic (such as PC, PS etc.), or acrylic (PMMA) etc.,
LED芯片2及其电路板、还有灯罩总体1安装在底座4上。The
内层灯罩11可以是平面的或是圆弧形的,且所述的荧光粉层3涂布于内层灯罩11的内表面,并可调配成各种比例及不同颜色来达到各种色温的需求(如蓝色LED加黄色荧光粉而产生白光),或增加演色性之百分比。The
当LED芯片2发光时产生高温,由于所述荧光粉3并不是内掺于LED芯片2的封胶中,而是涂在所述灯罩总体1的内层灯罩11的内表面,避免了荧光粉层2中的荧光粉因直接接触高温的LED芯片而发生温度猝灭和老化、使荧光粉变质而产生发光效率降低的问题,从而提高了荧光粉层2的可靠性和LED的出光流明。When the
当LED灯泡外层灯罩12破裂时(如图6),LED芯片2照常工作,因此使用者可能有直接碰触电路板上之电源之风险,此时内层灯罩11在当外层灯罩12破裂后,亦可起保护消费者之功用,尤其在交流LED运用照明上,更能发挥其保护功效。When the
当然,以上的具有双层灯罩的LED灯泡实施例只是在于说明而不是限制本实用新型,以上所述仅是本实用新型的较佳实施例,凡依本实用新型的技术方案所作出的等效变化或修饰,均属于本实用新型保护范围内。Of course, the above embodiment of the LED light bulb with double-layer lampshade is only to illustrate rather than limit the utility model. The above is only a preferred embodiment of the utility model, and all equivalent Changes or modifications all belong to the protection scope of the present utility model.
Claims (5)
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CN201020216408XU CN201688222U (en) | 2010-06-04 | 2010-06-04 | LED bulb with double-layer lampshade |
PCT/CN2011/073802 WO2011150734A1 (en) | 2010-06-04 | 2011-05-09 | Led bulb with double-layer lampshade |
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WO2011150734A1 (en) * | 2010-06-04 | 2011-12-08 | Shen Lihao | Led bulb with double-layer lampshade |
CN102384382A (en) * | 2011-05-09 | 2012-03-21 | 厦门立明光电有限公司 | LED (Light-Emitting Diode) illumination lamp |
CN102721007A (en) * | 2012-06-18 | 2012-10-10 | 南京汉德森科技股份有限公司 | Remote phosphor structure applicable to LED lighting and production method thereof |
CN102734663A (en) * | 2011-03-31 | 2012-10-17 | 罗姆股份有限公司 | Led bulb |
CN102865517A (en) * | 2012-09-29 | 2013-01-09 | 苏州新里程电控系统有限公司 | LED lighting lamp set |
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CN104254904A (en) * | 2011-10-31 | 2014-12-31 | 登森·西尔 | Led light source |
WO2015109481A1 (en) * | 2014-01-23 | 2015-07-30 | 正屋(厦门)电子有限公司 | Led lamp provided with double layers of bulb housings |
WO2015110086A1 (en) * | 2014-01-27 | 2015-07-30 | 上海三思电子工程有限公司 | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus |
CN105841006A (en) * | 2011-01-26 | 2016-08-10 | 罗姆股份有限公司 | LED light bulb |
CN105972462A (en) * | 2016-03-11 | 2016-09-28 | 浙江英特来光电科技有限公司 | Color-temperature-adjustable LED bulb lamp |
CN108692198A (en) * | 2017-02-22 | 2018-10-23 | 威力旸电子股份有限公司 | laser lighting device |
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US9657916B2 (en) * | 2015-05-28 | 2017-05-23 | Technical Consumer Products, Inc. | Lighting device including multiple diffusers for blending light |
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JP2006156187A (en) * | 2004-11-30 | 2006-06-15 | Mitsubishi Electric Corp | Led light source device and led electric bulb |
CN201081160Y (en) * | 2007-04-14 | 2008-07-02 | 鹤山丽得电子实业有限公司 | LED lighting bulb |
CN201093221Y (en) * | 2007-08-29 | 2008-07-30 | 慧坦科技股份有限公司 | LED bulb construction |
CN201462517U (en) * | 2009-09-08 | 2010-05-12 | 重庆长星光电子制造有限公司 | LED bulb featuring different white light excitation modes |
CN201688222U (en) * | 2010-06-04 | 2010-12-29 | 沈李豪 | LED bulb with double-layer lampshade |
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2010
- 2010-06-04 CN CN201020216408XU patent/CN201688222U/en not_active Expired - Fee Related
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2011
- 2011-05-09 WO PCT/CN2011/073802 patent/WO2011150734A1/en active Application Filing
Cited By (15)
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WO2011150734A1 (en) * | 2010-06-04 | 2011-12-08 | Shen Lihao | Led bulb with double-layer lampshade |
CN105841006B (en) * | 2011-01-26 | 2019-05-07 | 罗姆股份有限公司 | LED bulb |
CN105841006A (en) * | 2011-01-26 | 2016-08-10 | 罗姆股份有限公司 | LED light bulb |
CN102734663A (en) * | 2011-03-31 | 2012-10-17 | 罗姆股份有限公司 | Led bulb |
CN102384382A (en) * | 2011-05-09 | 2012-03-21 | 厦门立明光电有限公司 | LED (Light-Emitting Diode) illumination lamp |
CN104254904A (en) * | 2011-10-31 | 2014-12-31 | 登森·西尔 | Led light source |
CN102721007A (en) * | 2012-06-18 | 2012-10-10 | 南京汉德森科技股份有限公司 | Remote phosphor structure applicable to LED lighting and production method thereof |
CN103672484A (en) * | 2012-09-25 | 2014-03-26 | 昆山开威电子有限公司 | LED lamp wick module and LED bulb with the same |
CN102865517A (en) * | 2012-09-29 | 2013-01-09 | 苏州新里程电控系统有限公司 | LED lighting lamp set |
CN103148437B (en) * | 2013-02-14 | 2014-04-09 | 林婧瑛 | Lamp component |
CN103148437A (en) * | 2013-02-14 | 2013-06-12 | 韩少卿 | Lamp component |
WO2015109481A1 (en) * | 2014-01-23 | 2015-07-30 | 正屋(厦门)电子有限公司 | Led lamp provided with double layers of bulb housings |
WO2015110086A1 (en) * | 2014-01-27 | 2015-07-30 | 上海三思电子工程有限公司 | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus |
CN105972462A (en) * | 2016-03-11 | 2016-09-28 | 浙江英特来光电科技有限公司 | Color-temperature-adjustable LED bulb lamp |
CN108692198A (en) * | 2017-02-22 | 2018-10-23 | 威力旸电子股份有限公司 | laser lighting device |
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